WO2006082180A1 - Bauteil mit einer beschichtung zur verringerung der benetzbarkeit der oberfläche und verfahren zu dessen herstellung - Google Patents
Bauteil mit einer beschichtung zur verringerung der benetzbarkeit der oberfläche und verfahren zu dessen herstellung Download PDFInfo
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- WO2006082180A1 WO2006082180A1 PCT/EP2006/050543 EP2006050543W WO2006082180A1 WO 2006082180 A1 WO2006082180 A1 WO 2006082180A1 EP 2006050543 W EP2006050543 W EP 2006050543W WO 2006082180 A1 WO2006082180 A1 WO 2006082180A1
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- WIPO (PCT)
- Prior art keywords
- coating
- metal
- component
- microstructure
- nanostructure
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
- B08B17/06—Preventing deposition of fouling or of dust by giving articles subject to fouling a special shape or arrangement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
- B08B17/06—Preventing deposition of fouling or of dust by giving articles subject to fouling a special shape or arrangement
- B08B17/065—Preventing deposition of fouling or of dust by giving articles subject to fouling a special shape or arrangement the surface having a microscopic surface pattern to achieve the same effect as a lotus flower
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12611—Oxide-containing component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24364—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] with transparent or protective coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24372—Particulate matter
- Y10T428/2438—Coated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24372—Particulate matter
- Y10T428/24413—Metal or metal compound
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
- Y10T428/315—Surface modified glass [e.g., tempered, strengthened, etc.]
Definitions
- the invention relates to a component, comprising a substrate with a coating, which has a surface with a low wettability in comparison to the uncoated substrate.
- Elevations and depressions with a radius of 5 to 100 ⁇ m must have the wettability for water as well as dirt ⁇ particle lowers. As a result, contamination of the corresponding surface can be counteracted.
- the object of the invention is to provide a component with egg ⁇ ner coating to reduce the wettability of the surface of the component is available, which also ensures a comparatively good resistance to contamination by micro-organisms in addition to a low wettability of the surface.
- This object is achieved with the component specified in the introduction according to the invention in that a metal with antimicrobial properties is located under the coating, which is not completely covered by the coating.
- a metal with antimicrobial properties can in particular silver USAGE be det ⁇ , whose antimicrobial effect is known.
- alternative metals but also, for example, palladium or platinum in question.
- the invention makes use of the fact that the timikrobiellen to ⁇ properties, so the properties or an increase. to prevent the settlement of micro-organisms or viruses on the surface of the component, and then come into play when the metal surface is not a closed upper ⁇ forms of the component, but in part by the loading ⁇ coating to reduce the wettability is covered.
- a component having such a layer structure can thus be a low wettability of surface che ensure and antimicrobial effect before ⁇ geous simultaneously.
- ⁇ sondere are thereby guaranteed the properties of the low wettability of the surface over a longer period of time as a surface contamination by micro-organisms ⁇ and the like is prevented.
- the antimicrobial activity of the surface of the component is pre ⁇ set. Namely, microorganisms can form a film-like layer on components which is very stable and would reduce or even abolish the surface properties of a wetting-reducing coating.
- the metal strat an intermediate layer between the sub ⁇ and the coating is formed.
- the metal can thus be applied as a thin coating, so that it is not necessary for the antimicrobial effect that the entire component consists of the metal.
- the choice of material ⁇ of the metal is arbitrary, the coating is applied, for example, electrochemically or by vapor deposition on the substrate of the component.
- the material is ⁇ consumption of the metal in the preparation of antimikro- biellen properties of the component advantageously low, resulting in economical solutions.
- the metal with the antimicrobial effect consists of a biaxially textured, epitaxial layer.
- These layers can be preferably formed by coating on an equally biaxially tex-structured substrate, with this structure ⁇ texture during the coating onto the layer of the Me ⁇ tall transmits (this, for example, J. C. Moore et al., Fabrication of cube -textured Ag-buffered Ni substrates by electroepitaxial deposition, Supercond, Sei., Technol., 14, 124-129, (2001)).
- the properties of the metal layer can be advantageously influenced.
- the biaxially textured epitaxial metal layer offers greater resistance to corrosive attack.
- Such a layer such as silver thus has increased compared to the literature values of silver standard potential compared to what ⁇ serstoff (hereafter standard potential) in the electrochemical series of metals.
- DC ⁇ time the antimicrobial property of the metal ⁇ layer can be affected because this antimicrobial effect is caused on the film due to not yet fully clarified electrochemical processes.
- a further embodiment of the invention provides that the coating on the metal is metallic and forms a biaxially textured, epitaxial layer on the layer of antimicrobial metal.
- the coating is preferably made of copper.
- other metals such as iron used who ⁇ the.
- the biaxially textured, epitaxial production of the coating can also be advantageously used selectively in order to change the electrochemical properties of the coating.
- the coating is metallic
- the area of application in which the component is to be used must be taken into account in the production of the component.
- the antimicrobial, partially exposed metal layer and the metallic coating form local elements, which can promote a corrosive attack of the component.
- the standard potentials of the coating and the underlying metal layer must not be too far apart.
- the selection of metals for the coating and the underlying antimicrobial metal layer thus depends on the A ⁇ rate case and must for. B. be appropriate experiments he ⁇ averages.
- the choice of suitable metals as the influencing parameter, as well as the possibility of providing the coating or the like, are available to the person skilled in the art.
- the underlying layer is biaxially textured, epitaxially formed.
- the decrease the wettability of the surface of the component ⁇ de effect can be advantageously improved when the upper surface of the coating has a lotus effect favoring microstructure.
- the microstructure with its elevations and depressions, as already mentioned is designed such that the effect of leaves of the lotus flower is imitated. Production methods for such a microstructure on the surface are described in the initially mentioned DE 100 15 855 A1.
- the microstructure can be produced by pulse plating.
- a component is obtained in which the microstructure is superimposed on a nanostructure produced by pulse plating.
- This nanostructure advantageously also forms finer elevations and depressions (for example nanotubes), which further reduce the wettability of the surface of the component.
- a further improvement for the component results if the structural elements of the nanostructure (for example the needle needles) consist of a metal oxide.
- the electrochemical properties of the structural elements of the nanostructure to beeinflus ⁇ sen, since the metal oxides (such as copper) in my general ⁇ have a higher standard potential.
- a coating of copper can be essentially converted into copper oxide, whereby the standard ⁇ electrode potential approaches that of the antimicrobial, partially exposed layer.
- the invention relates to a method for
- the coating (lotus effect surface) can take the form of a layer separation from solutions.
- a further object of the invention is therefore to specify a method for producing a coating on a component having a wettability-reducing surface, which ensures a comparatively long-lasting effect with regard to reduced wettability.
- This object is according to the invention ren with said procedural ⁇ achieved in that the coating is produced on a metal having antimicrobial properties, in particular silver in such a way that the metal processing by the Beschich ⁇ is not completely covered, wherein the surface by electrochemical pulse plating is treated with a the Benetz ⁇ bility reducing microstructure of the surface is manufactured. It has been found that is supported by the s ⁇ Pul se Plating an irregular layer growth, then a microstructure that can develop, which decreases the wettability by forming elevations and depressions in the micrometer range.
- the inventive method is therefore advantageous adapted to provide solely by means of electrochemical method, a hard wettable surface on a component and to place the same time, for example, by an incomplete coating of the metal with at ⁇ timikrobiellen properties a surface available on the colonization of microorganisms or viruses is made difficult.
- the pulse plating is carried out of the ⁇ art as reverse pulse plating, the s a, this overlapping, the wettability further reducing nano structure is produced with the microstructure.
- the pulse length in the method step for producing the nanostructure is advantageously less than 500 ms.
- ge deposition parameters can be set on the surface to be generated, so that the nanostructure generated sufficiently different in their dimensions of the microstructure produced in this process step günsti ⁇ .
- the interaction between the microstructure and the nanostructure superimposed on the microstructure leads to a considerable reduction in the wettability of the surface of the electrochemically produced coating.
- the current pulses are generated by jewei ⁇ celled reversing the polarity of Abscheidestroms, so that advantageously a strong temporal gradient in the La ⁇ dung displacements at the surface can be achieved.
- the individual current pulses are in the range between 10 and 250 ms in terms of their length. It has ge ⁇ shows that with the above parameters, the nanostructure of the surface strongly expresses particularly advantageous.
- the cathodic pulses may have at least three times the length of the anodic pulses. As a cathodic pulses who construed ⁇ those pulses arrives at the dung it to a Abschei ⁇ on the surface, while the anodic pulses cause dissolution of the surface.
- the needle-like basic elements of the nanostructure Na ⁇ advantageously be produced structure with a high density on the micro ⁇ , which favors the Lotus effect to be achieved.
- the deposition rate of the cathodic pulses is increased compared to the removal rate of the anodic pulses.
- the pulse length for generating a microstructure in an upstream process step may be at least one second. With pulse lengths in the range of seconds the required microstructure can the surface be made on time low elekt ⁇ rochemischem way.
- a microstructure forms simultaneously with the nanostructure of the surface when the mentioned process parameters for generating the nanostructure of the surface are set.
- a further reverse pulse plating is carried out, such that the nanostructure elements are oxidized.
- the reverse pulse plating for the oxidation of the nanostructure elements can be ⁇ vorzugt the following process parameters performed advertising to:
- the pulse-called follow the growth of the layer with cathodic and anodic pulse is supplemented by a third potential-controlled pulse, whereby the Oxidationspro- process of the nanostructure elements be hail becomes.
- the oxidation process of the nanostructure elements it accommodates that the nanostructure elements consist of elevations with preferably nadelarti ⁇ ger structure whose tips are exposed to an electrochemical attack stronger than the areas around the Na ⁇ no Jardin around. Therefore, an oxidation reaction will preferably take place on the nanostructure elements.
- unoxidized parts of the coating can then be electrochemically dissolved while exposing the metal.
- This is for example by applying a DC potential to the coating, since the oxidized nanostructure elements have a higher standard potential than the non-oxidizing parts of the coating.
- the coating has been produced from copper, for example, then this copper will dissolve faster than the copper oxide nanostructure elements.
- this also has a higher standard potential than copper, so that this is largely retained.
- a Nachbear ⁇ processing the surface with reduced wetting and antimicrobial properties at the same time is not necessary.
- the coating may also be applied using, for example, a mask which covers portions of the layer of antimicrobial metal underlying the coating.
- This mask the example ⁇ may be made of photoresist, may be dissolved by means of a geeigne ⁇ th solvent once the coating has been completed. In this way, a part of the layer of the antimicrobial material can be released again to an inventive antimicrobial and simultaneously reducing the wettability of the surface to he ⁇ testify.
- FIG. 2 shows the surface profile of a lotus effect surface with antimicrobial properties as an exemplary embodiment of the surface according to the invention in section and FIGS. 3 and 4 show perspective views of the lotus effect surface with antimicrobial properties according to FIG.
- FIG. 1 shows a component 11 with a surface whose wettability is reduced.
- the surface 12 can be described schematically by a superimposition of a macrostructure 12 (which, for example, may also be predetermined by the component geometry) with a microstructure 13 and a nanostructure 14.
- the microstructure produces a waviness of the surface.
- the microstructure is indicated by hemispherical ⁇ shaped elevations on the wavelength macrostructure 12th
- the nanostructure 14 is illustrated in FIG. 1 by nubs which are located on the hemispherical elevations (microstructure) and partly in the parts located between the elevations of the macrostructure 12 which form the depressions of the microstructure 13.
- FIG. 1 shows a contact angle ⁇ of more than 140 °, so that the surface shown schematically is a so-called superhydrophobic surface.
- the component 11 according to FIG. 1 is made of silver, with the macrostructure 12 forming part of the overall surface of the component 11.
- This part of the surface is characterized by the fact that silver can come into direct contact with the environment, with the antimicrobial properties of silver being used.
- z. B. causes microorganisms that would cause a reduction in the contact angle ⁇ can not fix on the surface, whereby the low wettability of the surface can be obtained even over a longer period of use of the component 11.
- Reverse Pulse Plating can be used to produce a lotus effect surface by depositing copper on a surface of silver smoothed by electropolishing.
- the following process parameters can be selected.
- Pulse length (reverse pulse): 240 ms at 10 A / dm 2 cathodic, 40 ms at 8 A / dm 2 anodic
- Electrolyte contained 50 g / l Cu, 20 g / l free cyanide, 5 g / l KOH (alternatively following composition: 72 g / l CuCN, 125 g / l KCN, 5 g / l KOH)
- the electrochemically generated surface can be examined below by means of an SPM (Scanning Probe Microscope - also called AFM or Atomic Force Microscope). With an SPM, surface structures down to the nanometer range can be determined and displayed. A section of the mi- partly producible the experimental parameters above surface is shown in Figure 2 in section schematically where ⁇ is excessive at the profile (diagram on the model of SPM examinations).
- SPM Sccanning Probe Microscope - also called AFM or Atomic Force Microscope
- the microstructure 13 is due to the elevation as a sequence needle-like Er- increases 19 and depressions 20 shown. Furthermore, in certain areas, the nanostructure 14 has been indicated, which results from a narrow sequence of elevations and depressions, which are no longer to be resolved in the scale shown in Figure 2 and therefore can only be seen as a thickening of the profile line of the surface profile.
- FIG. 3 shows a perspective view of the copper surface. It is a square area of 100x100 ⁇ m as
- the coating consisting of the elevations 19 and depressions 20 does not cover the entire surface of the substrate, ie. H .
- the silver is exposed as the surface of the component 11.
- These areas 21 are in the Figure 3 by more o less the "smooth" Ariale to recognize the form of the "needle park ⁇ " "clearings".
- the surface formed by the silver may be the component which for silver develop typical anitmicrobial properties.
- the bracket always comprises only a section of the respective structure, which contains an elevation and a depression, so that the brackets allow one another in each case within a figure a comparison of the orders of magnitude of the structures in relation to one another.
- contact angle of 150 ° and more can be achieved for what.
- the superhydrophobic properties of the illustrated copper layer, which cause a lotus effect, is achieved by an interaction of at least the microstructure 13 and the nanostructure 14, wherein the superimposition of a macrostructure 12 can still improve the observed effects. By selecting suitable process parameters such lotus effect surfaces can be produced for different layer materials and for liquids with different wetting behavior.
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- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
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- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06707915A EP1843864B1 (de) | 2005-02-04 | 2006-01-31 | Bauteil mit einer beschichtung zur verringerung der benetzbarkeit der oberfläche und verfahren zu dessen herstellung |
DK06707915.2T DK1843864T3 (da) | 2005-02-04 | 2006-01-31 | Komponent med en coating til reduktion af overfladens fugtningevne og fremgangsmåde til produktion deraf |
MX2007009397A MX2007009397A (es) | 2005-02-04 | 2006-01-31 | Componente con un recubrimiento para reducir la capacidad de humectacion de la superficie y procedimiento para su fabricacion. |
BRPI0607111-2A BRPI0607111A2 (pt) | 2005-02-04 | 2006-01-31 | componente com um revestimento para reduzir a capacidade de umedecimento da superfìcie e método de produção do mesmo |
US11/883,729 US7935428B2 (en) | 2005-02-04 | 2006-01-31 | Component with a coating for reducing the wettability of the surface and method for production thereof |
CN2006800041490A CN101119811B (zh) | 2005-02-04 | 2006-01-31 | 带有用于降低表面可润湿性的镀层的构件及其制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005006014A DE102005006014A1 (de) | 2005-02-04 | 2005-02-04 | Bauteil mit einer Beschichtung zur Verringerung der Benetzbarkeit der Oberfläche und Verfahren zu dessen Herstellung |
DE102005006014.5 | 2005-02-04 |
Publications (1)
Publication Number | Publication Date |
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WO2006082180A1 true WO2006082180A1 (de) | 2006-08-10 |
Family
ID=36217018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2006/050543 WO2006082180A1 (de) | 2005-02-04 | 2006-01-31 | Bauteil mit einer beschichtung zur verringerung der benetzbarkeit der oberfläche und verfahren zu dessen herstellung |
Country Status (8)
Country | Link |
---|---|
US (1) | US7935428B2 (de) |
EP (1) | EP1843864B1 (de) |
CN (1) | CN101119811B (de) |
BR (1) | BRPI0607111A2 (de) |
DE (1) | DE102005006014A1 (de) |
DK (1) | DK1843864T3 (de) |
MX (1) | MX2007009397A (de) |
WO (1) | WO2006082180A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102007030586A1 (de) | 2007-06-27 | 2009-01-08 | Siemens Ag | Substrat mit einer katalytisch wirksamen Oberfläche und Verfahren zu dessen Herstellung |
EP3421552B1 (de) * | 2008-12-16 | 2022-05-25 | Dow Global Technologies LLC | Eine beschichtungszusammensetzung mit polymerumhüllten metalloxiddeckpigmenten und verfahren zur herstellung derselben |
US9546280B2 (en) * | 2012-12-07 | 2017-01-17 | Hrl Laboratories, Llc | Structural coatings with dewetting and anti-icing properties, and coating precursors for fabricating same |
US20170183101A1 (en) * | 2014-03-20 | 2017-06-29 | Arizona Board Of Regents On Behalf Of Arizona State University | Pagophobic coating compositions, method of manufacture and methods of use |
DE102014006739B3 (de) * | 2014-05-12 | 2015-06-25 | Albert-Ludwigs-Universität Freiburg | Verfahren zur Beschichtung von Oberflächen mit Nanostrukturen, nach dem Verfahren her- gestelltes Bauteil und Verwendung des Bauteils |
US20170014111A1 (en) | 2015-07-17 | 2017-01-19 | Hoowaki, Llc | Microstructured Surface |
US10064273B2 (en) | 2015-10-20 | 2018-08-28 | MR Label Company | Antimicrobial copper sheet overlays and related methods for making and using |
US11207478B2 (en) * | 2016-03-25 | 2021-12-28 | Rai Strategic Holdings, Inc. | Aerosol production assembly including surface with micro-pattern |
US10501640B2 (en) | 2017-01-31 | 2019-12-10 | Arizona Board Of Regents On Behalf Of Arizona State University | Nanoporous materials, method of manufacture and methods of use |
US11297876B2 (en) * | 2017-05-17 | 2022-04-12 | Rai Strategic Holdings, Inc. | Aerosol delivery device |
US11078589B2 (en) * | 2019-08-28 | 2021-08-03 | Saudi Arabian Oil Company | Hydrophobic stainless-steel copper-coated mesh and method of synthesizing same |
US20220240588A1 (en) * | 2021-01-29 | 2022-08-04 | 2792684 Ontario Inc. | Nanotextured Airflow Passage |
Citations (4)
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EP0903389A1 (de) | 1996-05-31 | 1999-03-24 | Toto Ltd. | Antifouling elemente und antifouling überzugzusammensetzung |
US6071398A (en) | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
EP1138362A2 (de) | 2000-03-30 | 2001-10-04 | Basf Aktiengesellschaft | Anwendung des Lotus-Effekts in der Verfahrenstechnik |
WO2003013748A1 (de) | 2001-08-10 | 2003-02-20 | Creavis Gesellschaft Für Technologie Und Innovation Mbh | Erhalt des lotus-effektes durch verhinderung des mikrobenwachstums nach beschädigung der selbstreinigenden oberfläche |
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US5326454A (en) * | 1987-08-26 | 1994-07-05 | Martin Marietta Corporation | Method of forming electrodeposited anti-reflective surface coatings |
US5320908A (en) * | 1989-05-04 | 1994-06-14 | Ad Tech Holdings Limited | Deposition of an extremely thin silver layer on a nonconducting substrate |
CA2033107C (en) * | 1990-12-24 | 2001-06-12 | Robert Edward Burrell | Actively sterile surfaces |
US7074498B2 (en) * | 2002-03-22 | 2006-07-11 | Borealis Technical Limited | Influence of surface geometry on metal properties |
NZ539925A (en) * | 2002-11-19 | 2007-11-30 | Univ Danmarks Tekniske | Biologically inhibiting material a method of producing said material as well as the use of said material for inhibiting live cells |
US7527832B2 (en) * | 2005-04-27 | 2009-05-05 | Ferro Corporation | Process for structuring self-cleaning glass surfaces |
CN101184512B (zh) * | 2006-04-07 | 2012-09-05 | 防菌公司 | 新型抗微生物基底及其应用 |
-
2005
- 2005-02-04 DE DE102005006014A patent/DE102005006014A1/de not_active Withdrawn
-
2006
- 2006-01-31 BR BRPI0607111-2A patent/BRPI0607111A2/pt not_active IP Right Cessation
- 2006-01-31 US US11/883,729 patent/US7935428B2/en not_active Expired - Fee Related
- 2006-01-31 WO PCT/EP2006/050543 patent/WO2006082180A1/de active Application Filing
- 2006-01-31 DK DK06707915.2T patent/DK1843864T3/da active
- 2006-01-31 CN CN2006800041490A patent/CN101119811B/zh not_active Expired - Fee Related
- 2006-01-31 MX MX2007009397A patent/MX2007009397A/es unknown
- 2006-01-31 EP EP06707915A patent/EP1843864B1/de not_active Not-in-force
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0903389A1 (de) | 1996-05-31 | 1999-03-24 | Toto Ltd. | Antifouling elemente und antifouling überzugzusammensetzung |
US6071398A (en) | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
EP1138362A2 (de) | 2000-03-30 | 2001-10-04 | Basf Aktiengesellschaft | Anwendung des Lotus-Effekts in der Verfahrenstechnik |
DE10015855A1 (de) | 2000-03-30 | 2001-10-11 | Basf Ag | Anwendung des Lotus-Effekts in der Verfahrenstechnik |
WO2003013748A1 (de) | 2001-08-10 | 2003-02-20 | Creavis Gesellschaft Für Technologie Und Innovation Mbh | Erhalt des lotus-effektes durch verhinderung des mikrobenwachstums nach beschädigung der selbstreinigenden oberfläche |
Also Published As
Publication number | Publication date |
---|---|
EP1843864B1 (de) | 2012-06-13 |
US7935428B2 (en) | 2011-05-03 |
EP1843864A1 (de) | 2007-10-17 |
DE102005006014A1 (de) | 2006-08-10 |
MX2007009397A (es) | 2007-09-21 |
BRPI0607111A2 (pt) | 2009-08-11 |
US20080118772A1 (en) | 2008-05-22 |
DK1843864T3 (da) | 2012-08-20 |
CN101119811B (zh) | 2012-05-23 |
CN101119811A (zh) | 2008-02-06 |
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