WO2006065813A1 - Surface acoustic wave sensor methods and systems - Google Patents

Surface acoustic wave sensor methods and systems Download PDF

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Publication number
WO2006065813A1
WO2006065813A1 PCT/US2005/045068 US2005045068W WO2006065813A1 WO 2006065813 A1 WO2006065813 A1 WO 2006065813A1 US 2005045068 W US2005045068 W US 2005045068W WO 2006065813 A1 WO2006065813 A1 WO 2006065813A1
Authority
WO
WIPO (PCT)
Prior art keywords
saw
sensor chip
sensor
sensing elements
etched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2005/045068
Other languages
English (en)
French (fr)
Inventor
Steven J. Magee
James Z. Lio
James D. Cook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Priority to EP05853886A priority Critical patent/EP1825240A1/en
Priority to JP2007546828A priority patent/JP2008524590A/ja
Publication of WO2006065813A1 publication Critical patent/WO2006065813A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/16Measuring force or stress, in general using properties of piezoelectric devices
    • G01L1/162Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators
    • G01L1/165Measuring force or stress, in general using properties of piezoelectric devices using piezoelectric resonators with acoustic surface waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L3/00Measuring torque, work, mechanical power, or mechanical efficiency, in general
    • G01L3/02Rotary-transmission dynamometers
    • G01L3/04Rotary-transmission dynamometers wherein the torque-transmitting element comprises a torsionally-flexible shaft
    • G01L3/10Rotary-transmission dynamometers wherein the torque-transmitting element comprises a torsionally-flexible shaft involving electric or magnetic means for indicating
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0001Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
    • G01L9/0008Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
    • G01L9/0022Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element
    • G01L9/0025Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a piezoelectric element with acoustic surface waves

Definitions

  • FIGS. 2-4 therefore illustrate varying embodiments in which the mechanical strain is concentrated in a single component, such as a diaphragm, in order to promote increased sensor sensitivity, while providing for ease of manufacturing and permitting designs more choices in the selection of diaphragm diameters.
  • FIG. 6 illustrates a block diagram of an etched sensor system 601 , which can be implemented in accordance with a preferred embodiment.
  • System 601 generally includes a sensor chip 600, upon which at least two surface acoustic wave (SAW) sensing elements 610 and 612 are centrally located on a first side (e.g., front side) of the sensor chip 600.
  • the SAW sensing elements 610, 612 occupy a common area on the first side of the sensor chip.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Measuring Fluid Pressure (AREA)
PCT/US2005/045068 2004-12-18 2005-12-12 Surface acoustic wave sensor methods and systems Ceased WO2006065813A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05853886A EP1825240A1 (en) 2004-12-18 2005-12-12 Surface acoustic wave sensor methods and systems
JP2007546828A JP2008524590A (ja) 2004-12-18 2005-12-12 表面弾性波検知方法およびシステム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/017,171 2004-12-18
US11/017,171 US7165455B2 (en) 2004-12-18 2004-12-18 Surface acoustic wave sensor methods and systems

Publications (1)

Publication Number Publication Date
WO2006065813A1 true WO2006065813A1 (en) 2006-06-22

Family

ID=36088574

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/045068 Ceased WO2006065813A1 (en) 2004-12-18 2005-12-12 Surface acoustic wave sensor methods and systems

Country Status (5)

Country Link
US (1) US7165455B2 (https=)
EP (1) EP1825240A1 (https=)
JP (1) JP2008524590A (https=)
CN (1) CN101120237A (https=)
WO (1) WO2006065813A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009109495A (ja) * 2007-10-29 2009-05-21 Schott Ag ひずみセンサ用パッケージ
GB2459411B (en) * 2007-02-16 2012-01-11 Flowserve Man Co Non-contact torque sensing for valve actuators
US8479590B2 (en) 2010-11-18 2013-07-09 Honeywell International Inc. System for monitoring structural assets
US8710083B2 (en) 2006-01-31 2014-04-29 Synta Pharmaceuticals Corp. Pyridylphenyl compounds for inflammation and immune-related uses
EP2997340B1 (de) * 2013-05-17 2018-10-10 Robert Bosch GmbH Motorisch und mit muskelkraft betreibbares fahrzeug mit verbessertem drehmomentsensor

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004090740A1 (en) 2003-04-03 2004-10-21 Commvault Systems, Inc. System and method for dynamically sharing media in a computer network
DE102005001097A1 (de) * 2005-01-08 2006-07-27 Abb Patent Gmbh Drucksensor (I)
US7347106B2 (en) * 2005-04-26 2008-03-25 Honeywell International Inc. Torque sensor with inverted sensing element and integral shaft housing
GB2426336A (en) * 2005-05-20 2006-11-22 Transense Technologies Plc SAW based torque and temperature sensor
GB2426590B (en) * 2005-05-26 2009-01-14 Transense Technologies Plc Pressure sensor
AT501760B1 (de) * 2005-06-14 2006-11-15 Electrovac Anordnung zur druckmessung
US20070028692A1 (en) * 2005-08-05 2007-02-08 Honeywell International Inc. Acoustic wave sensor packaging for reduced hysteresis and creep
US20070028700A1 (en) * 2005-08-08 2007-02-08 Liu James Z Acoustic wave torque sensor
US7434989B2 (en) * 2005-09-07 2008-10-14 Applied Sensor Research & Development Corporation SAW temperature sensor and system
EP1764597B1 (en) * 2005-09-16 2011-03-23 STMicroelectronics Srl Surface acoustic wave pressure sensor
US7302864B2 (en) * 2005-09-23 2007-12-04 Honeywell International Inc. Torque sensor
US7377168B2 (en) * 2005-12-13 2008-05-27 Honeywell International Inc. Wireless sensor antenna configuration
US20070188054A1 (en) * 2006-02-13 2007-08-16 Honeywell International Inc. Surface acoustic wave packages and methods of forming same
US20080084135A1 (en) * 2006-10-10 2008-04-10 Honeywell International Inc. Universal platform for surface acoustic wave (SAW) based sensors
GB2450168B (en) * 2007-06-15 2012-03-07 Transense Technologies Plc A SAW torque and temperature sensor with improved temperature sensitivity
US7843363B2 (en) * 2007-07-12 2010-11-30 Rosemount Aerospace Inc. Mechanical latch locking detection sensors
US7661321B2 (en) * 2007-09-25 2010-02-16 Rosemount Aerospace Inc. Force sensing clevis insert
FR2922305B1 (fr) * 2007-10-12 2010-02-26 Senseor Procede de fabrication collective de capteurs de temperature et de pression sans calibrage a base de dispositifs a ondes acoustiques
EP2056084A1 (en) 2007-10-29 2009-05-06 Schott AG Package for a strain sensor
FR2965050B1 (fr) 2010-09-22 2013-06-28 Senseor Capteur de pression et de temperature bas cout comportant des resonateurs saw et son procede de fabrication
DE102010056053B4 (de) * 2010-12-23 2014-12-18 Epcos Ag Drehmomentsensor und Anordnung mit einem Gegenstand und einem Drehmomentsensor
CN102288339A (zh) * 2011-05-04 2011-12-21 北京理工大学 温度、振动自补偿的无源无线声表面波扭矩传感器
WO2014002416A1 (ja) * 2012-06-25 2014-01-03 パナソニック株式会社 歪センサ
CN103565425B (zh) * 2012-08-09 2016-01-27 广州三星通信技术研究有限公司 人体体征测量方法及应用此的便携式终端
US9372111B2 (en) 2012-08-21 2016-06-21 Board Of Regents, The University Of Texas System Acoustic sensor
JP5983493B2 (ja) * 2013-03-26 2016-08-31 株式会社デンソー 圧力センサ
US9429486B2 (en) 2013-05-11 2016-08-30 Mnemonics, Inc. Strain sensor using saw technology
WO2015089175A1 (en) 2013-12-11 2015-06-18 The Board Of Regents Of The University Of Texas System Devices and methods for parameter measurement
US9702772B2 (en) 2014-03-26 2017-07-11 Mnemonics, Inc. Surface acoustic wave (SAW) based strain sensor
US10432168B2 (en) 2015-08-31 2019-10-01 General Electric Company Systems and methods for quartz wafer bonding
CN105784189B (zh) * 2016-05-05 2018-12-25 厦门纵能电子科技有限公司 硅-玻璃-硅结构声表面波温度和压力集成传感器及制备
US10450863B2 (en) 2016-06-02 2019-10-22 General Electric Company Turbine engine shaft torque sensing
GB201616090D0 (en) * 2016-09-21 2016-11-02 Imp Innovations Ltd Method and apparatus
CN109204443A (zh) * 2017-07-09 2019-01-15 东北林业大学 一种汽车eps系统有线无源式扭矩测量装置
CN107289883B (zh) * 2017-07-25 2019-09-03 中国科学院声学研究所 一种差分式谐振器型的无线无源声表面波应变传感器
CN108802433B (zh) * 2018-03-15 2020-12-22 中国科学院苏州纳米技术与纳米仿生研究所 基于声表面波的原子力显微镜探针、制备方法及表征方法
FR3079053B1 (fr) * 2018-03-16 2020-03-27 Frec'n'sys Substrats composites pour les dispositifs d'etiquette a ondes acoustiques de surface pour applications de rfid et de capteurs
CN108917668B (zh) * 2018-06-12 2024-07-05 重庆大学 一种差分式双谐振器声波拉伸应变传感器芯片
US11835414B2 (en) 2018-12-05 2023-12-05 Murata Manufacturing Co., Ltd. Passive pressure sensor with a piezoelectric diaphragm and a non-piezoelectric substrate
US11143561B2 (en) * 2018-12-05 2021-10-12 Resonant Inc. Passive microphone/pressure sensor using a piezoelectric diaphragm
FR3094484B1 (fr) * 2019-03-29 2021-07-16 Frecnsys Dispositif résonateur
CN110307811A (zh) * 2019-06-21 2019-10-08 中国科学院声学研究所 基于AlN压电薄膜的无线无源声表面波高温应变传感器
US11209398B2 (en) 2019-09-13 2021-12-28 Applied Materials, Inc. High quality factor embedded resonator wafers

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4326423A (en) * 1979-04-18 1982-04-27 Thomson-Csf Pressure transducer with elastic surface waves and ignition system for internal combustion engine utilizing this transducer
US5189914A (en) * 1988-02-29 1993-03-02 The Regents Of The University Of California Plate-mode ultrasonic sensor
DE10054198A1 (de) * 2000-03-10 2001-09-13 Siemens Ag Verfahren und Vorrichtung zur Messung eines an einem Bauteil wirkenden Moments
WO2003034013A1 (en) * 2001-10-16 2003-04-24 Transense Technologies Plc Temperature stable saw sensor with third-order elastic constants
US20040216526A1 (en) * 2003-04-30 2004-11-04 Cook James D Surface acoustic wave pressure sensor with microstructure sensing elements

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4100811A (en) * 1977-03-18 1978-07-18 United Technologies Corporation Differential surface acoustic wave transducer
US4454440A (en) * 1978-12-22 1984-06-12 United Technologies Corporation Surface acoustic wave (SAW) pressure sensor structure
US4216401A (en) * 1978-12-22 1980-08-05 United Technologies Corporation Surface acoustic wave (SAW) pressure sensor structure
US4361026A (en) * 1980-06-24 1982-11-30 Muller Richard S Method and apparatus for sensing fluids using surface acoustic waves
US5471723A (en) * 1993-08-20 1995-12-05 Endress + Hauser Gmbh + Co. Methods of manufacturing thin-film absolute pressure sensors
US5637802A (en) * 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US6484585B1 (en) * 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
US5821425A (en) * 1996-09-30 1998-10-13 The United States Of America As Represented By The Secretary Of The Army Remote sensing of structural integrity using a surface acoustic wave sensor
US6327590B1 (en) * 1999-05-05 2001-12-04 Xerox Corporation System and method for collaborative ranking of search results employing user and group profiles derived from document collection content analysis
US6300706B1 (en) * 1999-07-14 2001-10-09 The United States Of America As Represented By The Secretary Of The Army Compound semiconductor monolithic frequency sources and actuators
JP2001041838A (ja) * 1999-08-03 2001-02-16 Yamatake Corp 圧力センサおよびその製造方法
US6550337B1 (en) * 2000-01-19 2003-04-22 Measurement Specialties, Inc. Isolation technique for pressure sensing structure
WO2001058016A1 (en) * 2000-02-02 2001-08-09 Rutgers, The State University Of New Jersey Programmable saw filter
US6571638B2 (en) * 2000-06-30 2003-06-03 Sawtek, Inc. Surface-acoustic-wave pressure sensor and associated methods
CN100338451C (zh) 2002-03-21 2007-09-19 传感技术有限公司 结合有表面声波器件的压力监测器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4326423A (en) * 1979-04-18 1982-04-27 Thomson-Csf Pressure transducer with elastic surface waves and ignition system for internal combustion engine utilizing this transducer
US5189914A (en) * 1988-02-29 1993-03-02 The Regents Of The University Of California Plate-mode ultrasonic sensor
DE10054198A1 (de) * 2000-03-10 2001-09-13 Siemens Ag Verfahren und Vorrichtung zur Messung eines an einem Bauteil wirkenden Moments
WO2003034013A1 (en) * 2001-10-16 2003-04-24 Transense Technologies Plc Temperature stable saw sensor with third-order elastic constants
US20040216526A1 (en) * 2003-04-30 2004-11-04 Cook James D Surface acoustic wave pressure sensor with microstructure sensing elements

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
BENES E ET AL: "PIEZOELEKTRISCHE RESONATOREN ALS SENSORELEMENTE", ELEKTROTECHNIK UND INFORMATIONSTECHNIK, SPRINGER VERLAG, WIEN, AT, vol. 112, no. 9, September 1995 (1995-09-01), pages 471 - 483, XP000528890, ISSN: 0932-383X *
BUFF W ET AL: "Universal pressure and temperature SAW sensor for wireless applications", ULTRASONICS SYMPOSIUM, 1997. PROCEEDINGS., 1997 IEEE TORONTO, ONT., CANADA 5-8 OCT. 1997, NEW YORK, NY, USA,IEEE, US, vol. 1, 5 October 1997 (1997-10-05), pages 359 - 362, XP010271311, ISBN: 0-7803-4153-8 *
BULST W-E ET AL: "State of the art in wireless sensing with surface acoustic waves", INDUSTRIAL ELECTRONICS SOCIETY, 1998. IECON '98. PROCEEDINGS OF THE 24TH ANNUAL CONFERENCE OF THE IEEE AACHEN, GERMANY 31 AUG.-4 SEPT. 1998, NEW YORK, NY, USA,IEEE, US, vol. 4, 31 August 1998 (1998-08-31), pages 2391 - 2396, XP010308404, ISBN: 0-7803-4503-7 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8710083B2 (en) 2006-01-31 2014-04-29 Synta Pharmaceuticals Corp. Pyridylphenyl compounds for inflammation and immune-related uses
GB2459411B (en) * 2007-02-16 2012-01-11 Flowserve Man Co Non-contact torque sensing for valve actuators
US8096523B2 (en) 2007-02-16 2012-01-17 Flowserve Management Company Non-contact torque sensing for valve actuators
GB2482633A (en) * 2007-02-16 2012-02-08 Flowserve Man Co Measuring torque and thrust in a rotatable component of an electric valve system
GB2482633B (en) * 2007-02-16 2012-04-04 Flowserve Man Co Non-contact torque sensing for valve actuators
US8608128B2 (en) 2007-02-16 2013-12-17 Flowserve Management Company Non-contact torque sensing for valve actuators
US9500542B2 (en) 2007-02-16 2016-11-22 Flowserve Management Company Non-contact torque sensing for valve actuators
JP2009109495A (ja) * 2007-10-29 2009-05-21 Schott Ag ひずみセンサ用パッケージ
US8479590B2 (en) 2010-11-18 2013-07-09 Honeywell International Inc. System for monitoring structural assets
EP2997340B1 (de) * 2013-05-17 2018-10-10 Robert Bosch GmbH Motorisch und mit muskelkraft betreibbares fahrzeug mit verbessertem drehmomentsensor

Also Published As

Publication number Publication date
JP2008524590A (ja) 2008-07-10
US7165455B2 (en) 2007-01-23
EP1825240A1 (en) 2007-08-29
CN101120237A (zh) 2008-02-06
US20060130585A1 (en) 2006-06-22

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