WO2006049302A1 - 液処理装置及びその運転方法 - Google Patents
液処理装置及びその運転方法 Download PDFInfo
- Publication number
- WO2006049302A1 WO2006049302A1 PCT/JP2005/020459 JP2005020459W WO2006049302A1 WO 2006049302 A1 WO2006049302 A1 WO 2006049302A1 JP 2005020459 W JP2005020459 W JP 2005020459W WO 2006049302 A1 WO2006049302 A1 WO 2006049302A1
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- WO
- WIPO (PCT)
- Prior art keywords
- liquid
- processing
- seal structure
- fluid
- intermediate space
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Definitions
- the present invention relates to a liquid processing apparatus that supplies a processing liquid to a target object such as a semiconductor wafer and a glass substrate for LCD to perform processing, and particularly relates to a seal structure of a rotating mechanism thereof.
- the present invention further relates to a method for operating the liquid processing apparatus.
- a target object such as a semiconductor wafer and a glass substrate for LCD is accommodated in a processing tank, and a processing liquid such as a chemical solution and a rinsing liquid is supplied to the processing tank.
- a liquid processing method is widely employed in which a target object is processed while the target object is immersed in a processing liquid.
- the liquid processing apparatus includes a plurality of rotating rods that support lower portions of a plurality of objects to be processed in a processing tank in which the processing liquid is stored and rotate the objects to be processed in an upright state.
- One of the rotating rods is connected to the motor via a power transmission mechanism having a crank and a connecting rod.
- the other rotating rods are connected to the one connecting rod via a driving force transmission gear, and all the rotating rods rotate in the same direction around the center axis. As a result, the workpiece to be in contact with the rotating rod rolls on the rotating rod.
- both ends of the rotating rod are considered to be rotatably supported by bearings.
- a seal member will be provided to prevent the processing liquid from entering the bearing and protect the bearing with the processing liquid force.
- a dynamic seal member that seals the rotating shaft while allowing its rotation
- a perfect seal is Have difficulty.
- the processing liquid may enter the gap or the bearing between the seal member and the rotating rod. This invading processing liquid may later flow back into the processing tank and contaminate the processing liquid in the processing tank.
- there is a risk that particles generated in the bearing portion may enter the treatment tank together with the treatment liquid flowing backward.
- the present invention has been made in view of the above circumstances, and an object of the present invention is to prevent particles generated in the bearing portion of the rotating shaft of the holder of the object to be processed from flowing into the processing chamber. In addition, the treatment liquid is prevented from staying in a narrow gap around the rotating shaft.
- the present invention provides a holding body capable of holding an object to be processed, a rotating shaft connected to the holding body, a motor for rotationally driving the rotating shaft, A processing container that defines a processing chamber for storing a holder, a processing liquid discharge port that supplies a processing liquid into the processing chamber, and at least a part of the processing container, and stores the rotating shaft.
- a shaft housing that defines a space communicating with the processing chamber; a bearing that rotatably supports a rotating shaft in the shaft housing; and a shaft closer to the processing chamber than the bearing.
- a first seal structure that seals a gap between the rotation shaft and the rotation shaft while allowing rotation; and a position closer to the processing chamber than the first seal structure; Clearance between rotating shaft
- a second seal structure that can take a first state in which a gap between the shaft housing and the rotary shaft is sealed and a second state in which the seal is not sealed.
- a liquid processing apparatus comprising: a seal structure;
- the liquid processing apparatus is connected to an intermediate space between the shaft housing and the rotary shaft between the first seal structure and the second seal structure, and fluid is supplied to the intermediate space.
- a supply path that can be supplied and a discharge path that can discharge the fluid from the intermediate space can be provided.
- the cleaning liquid supply source and the dry gas supply source connected to the supply path, and the deviation between the cleaning liquid supply source and the dry gas supply source communicate with the intermediate space via the supply path.
- a switching valve can be further provided.
- An intermediate space between the shaft housing and the rotating shaft between the first seal structure and the second seal structure is partially formed on the inner surface of the shaft housing or the outer peripheral surface of the rotating shaft. A narrowing shape can be provided.
- the second seal structure may include a flexible annular hollow seal member that expands to a first state by supplying a working gas to the internal space thereof.
- the first seal structure includes a pair of seal members arranged at an interval in an axial direction of the rotary shaft, and the shaft housing is interposed between the pair of seal members.
- a seal space is defined between the rotary shaft and the rotary shaft, and a supply path for supplying fluid to the seal space and a discharge path for discharging fluid from the seal space are connected to the seal space.
- a drying gas supply source can be connected to the supply path.
- the liquid processing apparatus supplies a cleaning liquid to an intermediate space between the shaft housing and the rotating shaft between the first seal structure and the second seal structure.
- a cleaning liquid supply system capable of supplying a drying gas
- a drying gas supply system capable of supplying a drying gas to the intermediate space
- a fluid discharge system capable of discharging a fluid from the intermediate space, and the second seal structure
- a controller capable of controlling the cleaning liquid supply system, the drying gas supply system, and the fluid discharge system, wherein the rotating shaft rotates and the object to be processed is rotated in the processing chamber by the processing liquid;
- the second sealing structure is in the second state, and the second liquid is discharged from the processing liquid that has entered the intermediate space through the fluid discharge system.
- the second seal structure is controlled when the structure and the fluid discharge system are controlled, and the object to be processed is processed by the processing fluid in a stationary state in the processing chamber without the rotation shaft rotating.
- the cleaning liquid is supplied to the intermediate space via the cleaning liquid supply system and the cleaning liquid is discharged from the intermediate space via the fluid discharge system.
- a controller for controlling the cleaning liquid supply system and the fluid discharge system.
- the processing liquid is a chemical liquid and the processing fluid is a drying gas.
- the controller moves the intermediate space through the cleaning liquid supply system when the object to be processed is processed in a stationary state in the processing chamber without rotating the rotating shaft.
- the drying gas is supplied to the intermediate space via the drying gas supply system and the fluid The drying gas supply system and the fluid discharge system are controlled so that the drying gas is discharged from the intermediate space via a discharge system.
- the controller has a discharge rate of the cleaning liquid through the fluid discharge system when the object to be processed is processed by a processing fluid in a stationary state in the processing chamber.
- the fluid discharge system is configured to be controlled to be larger than a discharge rate of the treatment liquid through the fluid discharge system when the body is being processed by the treatment liquid while rotating in the treatment chamber. I'm going.
- the holding body has a rotating base connected to the rotating shaft and a pair of holding rods for holding the object to be processed.
- a holding rod moving mechanism for moving the holding rod in a direction in which the holding rods are close to each other and a direction in which the holding rods are separated from each other in a radial direction of the shaft;
- a cylinder actuator for moving the holding rod;
- a spring member for urging the holding rod in a direction in which the holding rods are close to each other or in a direction away from each other; and the holding rod against the spring member.
- a working fluid passage for supplying a working fluid to the cylinder actuator for movement, and an internal space of the rotating shaft and a pipe formed in the rotating base include the working fluid passage. Is part of .
- the processing container has an opening through which the object to be processed can pass at one end, the other end is closed, and a cylindrical processing container whose axis is substantially in the horizontal direction.
- the shaft housing is coupled to the lid.
- the present invention further includes a holding body capable of holding an object to be processed, and a combination of the holding body and the holding body.
- a rotating shaft a processing container that defines a processing chamber that houses the holding body, and a space that is coupled to at least a part of the processing container and that accommodates the rotating shaft and communicates with the processing chamber.
- a first seal structure that seals while allowing rotation of the rotary shaft; and a gap between the shaft housing and the rotary shaft that is provided closer to the processing chamber than the first seal structure.
- a second seal structure that can take a first state in which a gap between the shaft housing and the rotary shaft is sealed and a second state in which the seal is not sealed.
- Liquid processing with a sealing structure To provide a method of operating a location. In this method, the processing object is rotated in a state where the object to be processed is held by the holding body in the processing chamber, and a processing liquid is supplied into the processing chamber, thereby liquid processing the processing object with the processing liquid. And a fluid processing step of supplying a processing fluid into the processing chamber in a state where rotation of the processing target is stopped after the liquid processing step, thereby processing the processing target with the processing fluid.
- the second seal structure When the liquid treatment step is performed, the second seal structure is in the second state, and the gap between the first seal structure and the second seal structure is When the processing liquid that has entered the intermediate space from the processing chamber is discharged from the intermediate space between the shaft housing and the rotating shaft and the fluid processing step is being performed, the second seal structure is 1 state and The intermediate space is cleaned by discharging the cleaning liquid supplied while supplying the cleaning liquid to the intermediate space, and then the drying gas supplied while supplying the drying gas to the intermediate space is supplied to the intermediate space. By discharging from the intermediate space, the intermediate space is dried.
- the discharge rate of the processing liquid discharged from the intermediate space when the fluid processing step is performed is discharged from the intermediate space force when the liquid processing step is performed. It is higher than the discharge rate of the cleaning liquid.
- the processing liquid used in the liquid processing step is a chemical solution
- the processing fluid used in the fluid processing step is a drying gas for drying the object to be processed.
- FIG. 1 is a plan view schematically showing an example of a processing system including a liquid processing apparatus according to the present invention.
- FIG. 2 is a longitudinal sectional view schematically showing a main part of the processing system shown in FIG.
- FIG. 3 is a perspective view schematically showing a processing container main body and a lid that constitute a processing container of the liquid processing apparatus, and parts related thereto.
- FIG. 4 is a piping system diagram of the liquid processing apparatus.
- FIG. 5 is a longitudinal sectional view of a processing container of a liquid processing apparatus.
- FIG. 6 is a longitudinal sectional view along the axial direction of the liquid processing apparatus.
- FIG. 7 is an enlarged view of a part of FIG.
- FIG. 8 is a perspective view schematically showing a main part of a wafer holding mechanism of a liquid processing apparatus.
- FIG. 9 is a cross-sectional view taken along the axial direction of the nozzle shown in FIG.
- the processing system is located between the carry-in / carry-out unit 1, the pitch conversion / carrying unit 3, and the carrier carry-in / carry-out unit 1 and the pitch change / carry unit 3. And a processing unit including the liquid processing apparatus 6 according to the present invention.
- Semiconductor wafer W that is, carrier C that accommodates the object to be processed. And will be paid out from this processing system.
- the carrier C a plurality of, for example, 25 semiconductor wafers W are horizontally held at a predetermined interval, for example, 1 Omm, in the vertical direction.
- Two wafer holders 2a and 2b are disposed in the pitch converting / conveying section 3.
- Each of the wafer holders 2a and 2b is configured to hold a plurality of, for example, 25 wafers W upward and downward with a predetermined interval, for example, 3 mm.
- the wafer transfer unit 5 is provided with a wafer transfer arm 4 that can move in the horizontal direction (X and Y directions) and the vertical direction (Z direction) and that can rotate around the vertical axis ( ⁇ ).
- the wafer transfer arm 4 can transfer the wafer W in the carrier C in the loading / unloading section 1 to the wafer holders 2a and 2b or vice versa.
- a processing container main body 12 is disposed in the processing section, and the processing container main body 12 is combined with a lid 11 disposed in the pitch conversion / conveyance section 3 to form a sealed processing container 10.
- the lid body 11 disposed in the pitch converting / conveying section 3 is positioned in the middle of the two wafer holders 2a and 2b arranged in the Y direction (see FIG. 1). As shown in FIG. 3, the lid 11 is attached to the posture changing / moving mechanism 7.
- the lid 11 is provided with a wafer holder 30 which will be described in detail later.
- the wafer holder 30 can hold a plurality of, for example, 25 wafers W at regular intervals, for example, 3 mm intervals (same as the wafer holding intervals of the wafer holders 2a, 2b).
- the posture changing / moving mechanism 7 is operated to bring the wafer W and the lid body 11 upright, and the lid body 11 is the processing vessel body 12.
- the opening 13 of the processing container main body 12 can be closed by proceeding toward.
- the liquid processing apparatus 6 is a hermetically sealed processing container having a wafer holder 30 that can hold the wafer W in an upright state and a processing chamber 10a that accommodates the wafer W held by the wafer holder 30. 10, a processing liquid supply nozzle 40 (see FIG. 5) that forms part of the processing liquid supply system that supplies the processing liquid into the processing container 10, and a nozzle rotation motor 50 that can rotate the processing liquid supply nozzle 40 forward and backward. (See FIG. 9) and a wafer rotation motor 20 (see FIG. 6) for rotating the wafer holder 30.
- the wafer rotation motor 20 can rotate the rotation shaft 21 of the wafer holder 30 to rotate the wafer W held by the wafer holder 30 around the center of the wafer W as the rotation center.
- the processing vessel main body 12 has a cylindrical shape whose central axis faces the horizontal direction.
- One side surface (that is, the bottom surface of the cylinder) of the processing container main body 12 is closed by a side wall, and the other side surface is opened to form an opening 13.
- a storage portion 14 for storing the processing liquid supply nozzle 40 is provided from one side (left side in FIG. 5) of the peripheral wall of the processing container main body 12 to the bottom.
- the internal space of the accommodating portion 14 communicates with the processing chamber 10a through the communication port 16.
- a rapid drainage port 17A is provided at the lower end of the peripheral wall of the processing vessel body 12.
- An air vent 18 and a drying gas supply port 19 are provided in the upper part of the peripheral wall of the processing container body 12.
- the lid 11 is formed in a disk shape so as to close the opening 13 of the processing container body 12.
- An O-ring 11 a is attached to the surface of the lid 11 that faces the opening 13. Therefore, the lid 11 is pressed against the open end of the processing container main body 12 by the posture change 'moving mechanism 7, so that the lid 11 is air-tightly engaged with the processing container main body 12, and thereby the sealed processing chamber 10 a is formed. It is formed.
- the wafer holder 30 has a rotating base 31 connected to a rotating shaft 21 that penetrates the lid 11.
- the rotating base 31 has a substantially rectangular parallelepiped shape, and extends in a direction orthogonal to the rotating shaft 21, that is, in the radial direction of the wafer W.
- a movable member 35 that can move in the radial direction of the wafer W is connected to both ends of the rotating base 31, and a holding rod 32 extends in parallel with the rotating shaft 21 from the tip of each movable member 35.
- a plurality of holding grooves 33 are formed on the inner surface of each holding bar 32 at a predetermined interval.
- the wafer holder 30 is provided with an expansion / contraction moving mechanism 60, that is, a holding rod moving mechanism.
- an expansion / contraction moving mechanism 60 By operating the expansion / contraction moving mechanism 60, the pair of holding rods 32 are moved closer to each other to hold the wafer W and separated from each other to release the wafer W. It can be moved between positions.
- the rotating shaft 21 of the wafer holder 30 is hollow.
- the rotating shaft 21 is accommodated in an internal space of a shaft housing 22 configured by connecting a plurality of components in the axial direction of the rotating shaft 21.
- the end of the shaft housing 22 on the lid 11 side is connected around a through-hole rib provided in the lid 11 so that the internal space of the shaft housing 22 communicates with the processing chamber 10a.
- the packing 22a It is tightly sealed.
- the rotary shaft 21 is rotatably supported on the shaft housing 22 via a bearing 23 at the end of the rotary shaft 21 far from the lid 11.
- a driven pulley 21b is attached to the end of the rotary shaft 21 on the side far from the lid 11.
- a timing belt 20c is stretched between the driven pulley 21b and the drive pulley 20b attached to the drive shaft 20a of the wafer rotation motor 20.
- the wafer rotation motor 20 can be moved together with the lid body 11 and the wafer holder 30 by the attitude conversion / movement mechanism 7.
- the wafer rotation motor 20 is electrically connected to a controller displayed as CPU 110 (Central Processing Unit) in FIG. Based on the CPU 110 force and other control signals, the rotation direction of the wafer rotation motor 20 and the rotation speed (for example, 1 to 60 rpm) of the wafer rotation motor 20 are controlled.
- CPU 110 Central Processing Unit
- the shaft housing 22 is provided with a first seal structure including a pair of ring-shaped seal members 24 arranged at intervals.
- the seal member 24 hermetically seals the peripheral surface of the rotation shaft 21 while allowing the rotation of the rotation shaft 21, so that the space closer to the processing chamber 10 a than the seal member 24 in the shaft housing 22 and the seal member Isolate the space closer to the bearing 23 than 24.
- a peripheral protrusion 25 is provided on the inner peripheral surface of the shaft housing 22, and the peripheral protrusion and the peripheral surface of the rotary shaft 21 A narrow gap is defined between them.
- This narrow gap acts like a “throttle”, restricts the flow of fluid through it, and reduces the burden on the seal member 24.
- the narrow gap is preferably provided at a position close to a second seal structure 26 described later. If manufacturing is possible, a circumferential protrusion may be provided on the rotating shaft 21 in order to define a narrow gap.
- a variable seal structure 26, that is, a second seal structure is provided in the shaft housing 22 at a position closer to the processing chamber 10a than the narrow gap. Seal structure 26 It is possible to take an isolation state in which the laboratory 10a and the inner space of the shaft housing 22 are separated from each other in a gas-tight manner and a communication state in which fluid flow between the two is allowed.
- the rotating shaft 21 and the shaft housing 22 are made of a material having high chemical resistance and corrosion resistance, for example, a synthetic resin such as polytetrafluoroethylene (PTFE).
- PTFE polytetrafluoroethylene
- the second seal structure 26 includes a flexible annular hollow seal member 26a attached to the shaft housing 22, and a working gas such as nitrogen (N (N) in the internal space 26b of the seal member 26a.
- a working gas such as nitrogen (N (N) in the internal space 26b of the seal member 26a.
- Working gas supply system is N gas supply
- a communication path 26c provided in the shaft housing 22 for connecting the internal space 26b is provided.
- the hollow seal member 26a is formed of a soft material having a high chemical resistance and corrosion resistance, for example, a fluorine resin.
- the on-off valve VI is opened to supply N gas from the N gas supply source 27 into the hollow seal member 26a.
- the hollow seal member 26a When supplied into the partial space 26b, the hollow seal member 26a expands. As a result, the hollow seal member 26a is in close contact with the outer peripheral surface of the rotating shaft 21, and the internal space of the shaft housing 22 that is farther away from the processing chamber 10a than the hollow seal member 26a can be isolated from the processing chamber 10a (first step). 2 “seal condition” of seal structure 26). On the other hand, when the on-off valve VI is closed, N gas is not supplied into the internal space 26b of the hollow seal member 26a, so that the hollow seal member 26a is deflated.
- An intermediate space 26d is defined between the inner surface of the shaft housing 22 and the peripheral surface of the rotary shaft 21 between the seal member 24 (first seal structure) and the hollow seal member 26a (second seal structure). It is done.
- the shaft housing 22 is provided with a supply path 26e and a discharge path 26f that open at the top and bottom of the intermediate space 26d, respectively.
- the supply path 26e has a pure water supply source 27A as a cleaning liquid supply source and an N gas supply source 27 as a dry gas supply source through a supply pipe line 28c provided with a switching valve V0 as a switching means. It is connected.
- the pure water supply source 27A, the supply line 28c, the switching valve V0 and the supply path 26e form a cleaning liquid supply system for the intermediate space 26d
- the switching valve VO and the supply path 26e form a drying gas supply system for the intermediate space.
- a drain line 29a for drainage and exhaust is connected to the discharge path 26f.
- the drain pipe 29a is provided with an opening / closing valve V2.
- a branch line 29b that bypasses the opening / closing valve V2 is connected to the drain line 29a on the upstream side and the downstream side of the opening / closing valve V2, and the opening / closing valve V3 is interposed in the branch line 29b. .
- These form a fluid discharge system for the intermediate space 26d.
- the switching valve VO is switched to supply pure water and N gas into the intermediate space 26d.
- a space is defined between the pair of seal members 24, and this space is referred to as a seal space 24a.
- the shaft housing 22 is provided with an air supply passage 24b and an exhaust passage 24c that open to the upper and lower portions of the seal space 24a, respectively.
- An N gas supply source 27 is connected to the air supply path 24b via a second N gas supply pipe 28b provided with an open / close valve V4.
- a drain pipe line 29c having an open / close valve V5 is connected to the exhaust path 24c.
- the rotating shaft 21 can be quickly dried.
- the telescopic movement mechanism 60 will be described in detail with reference to FIGS. 6 and 8.
- the expansion / contraction moving mechanism 60 urges the cylinder body 61 provided on the rotating base 31 of the wafer holder 30, the piston rod 62 slidably provided on the cylinder body 61, and the piston rod 62 in the shortening direction.
- Cylinder actuator 64 having a spring 63 and an air supply system 65 for supplying a working fluid, for example air, to the cylinder body 61 of the cylinder actuator 64, that is, a working flow A body supply system.
- a telescopic member 34 such as a bellows surrounds each cylinder actuator 64, and both ends of each telescopic member 34 are connected to the rotating base 31 and the movable member 35 in a gas-tight manner. The telescopic member 34 protects the cylinder actuator 64 from the processing liquid while allowing the relative displacement of the rotating base 31 and the movable member 35, and particles that can be generated in the cylinder actuator 64 are treated in the processing chamber 10a. To prevent intrusion.
- the air supply path for supplying air from the air supply source 67 to the cylinder body 61 includes a first air supply pipe 66a provided in the rotating base 31, and the first air.
- An internal space 21a of the rotary shaft 21 connected to the supply pipeline 66a, and a second air supply pipeline 66b connected to the internal space 21a and provided with an open / close valve V6 are configured in force. .
- the spring 63 may urge the holding bars 32 so as to be separated from each other.
- the cylinder actuator 64 is configured to act to bring the holding rods 32 close to each other when air is supplied.
- the cylinder actuator 64 is incorporated in the rotating base 31, and the air supply path for supplying the working air to the cylinder actuator 64 is a rotating base. 31 and the rotary shaft 21 contribute to the downsizing of the liquid processing apparatus 6 with a small occupied space.
- the holding rod 32 is moved outward in the wafer W radial direction by the expansion / contraction moving mechanism 60.
- the wafer holder 2 a holding the wafer W is inserted between the pair of holding bars 32.
- the holding bar 32 grips the wafer W.
- the wafer holder 2 a separates the wafer W and moves away from the wafer holder 30.
- the attitude conversion 'movement mechanism 7 Thus, after the wafer W stands up and assumes a vertical posture, the wafer W is accommodated in the processing container main body 12.
- the wafer W processed in the processing container 10 is returned to the wafer holder 2b (2a) in the reverse procedure. That is, the processed wafer W is brought into a horizontal posture after being taken out of the processing container main body 12 by the posture changing / moving mechanism 7.
- the wafer holder 2 b (2 a) is inserted between the pair of holding bars 32, and the holding bar 32 is moved outward in the wafer W radial direction by the expansion / contraction moving mechanism 60. As a result, the wafer W is transferred to the wafer holder 2.
- the nozzle 40 has a substantially slit-shaped nozzle body 42 having a processing liquid supply passage 41 in the center, and a single slit-like discharge port 43 extending in the axial direction of the nozzle body 42 that opens to the peripheral surface thereof. Alternatively, it is formed by providing a plurality of discharge ports 43 arranged in a line at intervals in the axial direction of the nozzle body 42.
- the nose 40 is accommodated in the nozzle accommodating part 14 of the nose case 44 attached to the processing container main body 12.
- a gap 15 is provided between the inner surface of the nozzle accommodating portion 14 and the outer peripheral surface of the nozzle body 42.
- a nozzle rotation shaft 53 projects from one side surface of the nozzle body 42.
- the nose rotary shaft 53 is inserted in a guide tube 45 integral with the nozzle case 44 with a gap.
- the nozzle rotation motor 50 By driving the nozzle rotation motor 50, the nozzle 40 can rotate and / or swing in a non-contact manner with respect to the processing container main body 12 (actually, the nozzle housing portion 14 of the nozzle case 44).
- the nozzle rotation motor 50 includes a bottomed cylindrical nozzle motor main body 50 a fitted to the outer peripheral surface of the guide cylinder 45, that is, a stator portion.
- a levitation electromagnet 51 is embedded in the distal end portion and the base end portion of the nozzle motor main body 50 a, and a rotating electromagnet 52 is supported between the levitation electromagnets 51.
- a magnet 54 is embedded in the rotary shaft 53.
- the outer peripheral surface of the nozzle rotating shaft 53 can be separated from the inner peripheral surface of the guide tube 45, and by energizing and energizing the rotating electromagnet 52, nozzle rotation Rotate the shaft 53 and the main body 42 connected to it You can make it S.
- the nozzle motor main body 50a and the nozzle rotating shaft 53 are formed of a synthetic resin such as polytetrafluoroethylene (PTFE) having high chemical resistance and corrosion resistance.
- PTFE polytetrafluoroethylene
- a piping system attached to the liquid processing apparatus 6 will be described with reference to FIG.
- One end of a main supply pipe line 70 is connected to the processing liquid supply path 41 (see FIG. 5) of the nozzle 40 via a first opening / closing valve V7 for supplying the processing liquid.
- a pure water supply source 71 is connected to the other end of the main supply line 70.
- the main supply line 70 is provided with a second opening / closing valve V8, a filter Fl, a flow meter FM1, and a heating mechanism H for adjusting the temperature of the processing liquid to a predetermined processing temperature in order from the pure water supply source 71 side. ing.
- the branch pipe 72 is provided with a third on-off valve V9, a filter F2 and a flow meter FM2 in order from the pure water supply side.
- chemical liquid tanks 74a, 74b, 74d, 73d, 73b, 73d, 73d are respectively provided with chemical supply lines 73a, 73b, 73c, 73d provided with switching supply valves Va, Vb, Vc, Vd.
- 74c and 74d are connected to each other.
- Chemical tanks 74a, 74b, 74c, and 74d store different types of chemical liquids, such as ammonia (NH OH), hydrochloric acid (HC1), and hydrofluoric acid (HF).
- one of the switching supply valves Va, Vb, Vc, Vd is opened, so that one of the chemicals is mixed with the pure water flowing in the main supply line 70, and from the nozzle 40 It is supplied into the processing container 10.
- a drainage port 76 (see FIG. 5) is provided in the nose housing part 14 of the nose case 44.
- the drain port 76 is connected to a drain line 75 having an open / close valve V10.
- the drain line 75 is connected to the drain line 78A.
- a drainage pipe 78 having an open / close valve VI I is connected to the drainage port 17 (see Fig. 5) of the processing container body 12.
- the drainage pipe 78 includes a pure water drain valve DV1 and 4 drain lines with drain valves DV2, DV3, DV4 for chemicals
- An opening / closing valve VI whose opening degree can be adjusted is provided at the air vent 18 (see Fig. 5) of the processing container body 12.
- An exhaust pipe 80 with 2 interposed is connected. For example, bubbles that may be contained in the processing liquid filled in the processing chamber 10a can be discharged through the air vent 18.
- the exhaust line 80 is connected to the drain line 78.
- the drying gas supply port 19 (see Fig. 5) of the processing container body 12 is connected to a drying gas (medium) supply line, such as a cool N gas supply line 81, hot N, via an on-off valve V13.
- a drying gas (medium) supply line such as a cool N gas supply line 81, hot N
- IPA isopropyl alcohol
- a branch pipe is connected to the supply pipe 84 connected to the supply pipes 81, 82, 83, and the sealing member 24 described above is connected from the branch pipe through the switching vanolev V0 (see FIG. 6).
- the drying gas may be supplied into the intermediate space 26d formed between the seal structure 26 and the seal structure 26.
- a large-diameter drainage pipe line 78A with an open / close valve V14 is connected to the rapid drainage port 17A (see Fig. 5) of the processing container body 12.
- the processing liquid used for the liquid processing in the processing container 10 is discharged in a short time by opening the on-off valve V13.
- the liquid can be discharged out of the processing container 10 through the liquid pipe 78A.
- the drainage line 78A is also provided with a separate and independent drainage line 78B.
- a drainage pipe 78 and a return pipe 84 are connected to the drainage pipe 78B.
- the return pipe 84 is provided with a switching valve VA.
- a fall prevention mechanism 90 is provided at two locations on the left and right of the upper portion of the processing chamber 10a of the processing container 10.
- the fall prevention mechanism 90 prevents adjacent wafers W held by the wafer holder 30 from coming into contact with each other, particularly when the liquid is discharged from the rapid liquid discharge port 17A.
- the fall prevention mechanism 90 includes a fall prevention member 92 having a plurality of support pieces 91 arranged in a comb shape, and a rotating machine (not shown) that changes the angular position of the fall prevention member 92. Structure. By driving the rotation mechanism, the position of the fall-preventing member 92 is adjusted to each support piece 9
- An engagement position where 1 is inserted into a gap between adjacent wafers W and engages with the wafer W, and a non-engagement position where each support piece 91 is separated from the gap between the wafers W as shown in FIG. Can be switched between.
- an ultrasonic vibrator 100 may be attached to the upper peripheral surface of the processing container body 12.
- the wafer W can be ultrasonically cleaned by applying ultrasonic vibration to the processing liquid filling the processing chamber 10a by the ultrasonic vibrator 100.
- the switching valve V0 and the opening / closing valves V1 to V14 are electrically connected to the CPU 110, that is, the controller, and are switched or opened / closed based on a control signal from the CPU 110.
- the transfer arm 4 takes out the wafer W from the carrier C placed on the loading / unloading section 1 and transfers it to the wafer holder 2a. By repeating this, a plurality of wafers in the carrier C are transferred to the wafer holder 2a.
- the carrier C is configured to hold the wafer W so that the interval between adjacent wafers W is 10 mm
- the wafer holder 2 a is set so that the interval between adjacent wafers W is 3 mm. Since the wafer W is configured to be held, when the wafer W is transferred from the carrier C to the wafer holder 2a by the transfer arm 4, the pitch of the wafer W is converted (from 10 mm to 3 mm) as a result.
- the plurality of wafers W held by the wafer holder 2 a are transferred to the holding rod 32 of the wafer holder 30 attached to the lid 11.
- the wafer holder 2 a is retracted from the wafer holder 30.
- the posture change / movement mechanism 7 operates to change the posture of the wafer W held by the lid 11 and the wafer holder 30 from the horizontal posture to the vertical posture and move toward the processing container main body 12. As a result, the wafer W is carried into the processing container body 12 and the lid 11 seals the opening 13 of the processing container body 12.
- the on-off valve V8 is opened to flow pure water adjusted to the processing temperature from the pure water supply source 71 to the main supply line 70. Open the selected one of the switching on / off valves Va, Vb, Vc, Vd to make the chemical solution pure water. Mix and supply the temperature-controlled diluted chemical solution to the nozzle 40. At the start of the supply of the diluted chemical, the discharge port 43 of the nozzle 40 faces the lower space of the processing chamber 10a.
- the nozzle rotation motor 50 After starting the supply of the diluted chemical solution, the nozzle rotation motor 50 is rotated so that the discharge port 43 of the nozzle 40 gradually faces upward, preventing the spray of the diluted chemical solution from splashing on the wafer W, Supply the mixed chemical solution. Simultaneously with the supply of the chemical solution, the wafer rotation motor 20 slowly rotates around the center of the wafer holder 30 and the wafer W force held by the wafer holder 30.
- the open / close valve VI2 provided in the exhaust pipe 80 connected to the air vent 18 is opened. For this reason, the liquid flow of the chemical solution supplied to the processing chamber 10a becomes smooth.
- the nozzle 40 is rotated from the discharge port 43 toward the rotating wafer W.
- the chemical solution is evenly distributed over the entire surface of the wafer W, and a uniform chemical solution process such as an etching process is performed.
- peripheral portion of the wafer W can be etched more by increasing the time during which the direction of the discharge port 43 is in the direction of the two-dot chain line in FIG.
- the processing chamber 10a is filled with the chemical, and the chemical is supplied from the nozzle 40 to the processing chamber 10a. At the same time, the chemical is drained from the processing chamber 10a through the drain port 17.
- the chemical liquid staying in the gap 15 is discharged by discharging the chemical liquid from the discharge port 43 into the gap 15 between the inner surface of the accommodating portion 14 and the outer peripheral surface of the nozzle 40 while rotating the nozzle 40 360 degrees. Can be expelled with new chemicals. For this reason, there is no adverse effect on the liquid processing due to the old chemical liquid staying in the gap 15.
- the chemical solution that fills the processing chamber 10a passes through the gap between the seal structure 26 and the rotating shaft 21, and the shaft housing 22 and the rotating shaft between the seal structure 26 and the seal member 24 (first seal structure). It enters the intermediate space 26d between 21 and 21. At this time, only one of the on-off valves V2 and V3 is open, and the chemical liquid that has entered the intermediate space 26d is drained through the drain line 29a. For this reason, the chemical solution must stay in the intermediate space 26d. Does not adversely affect the chemical treatment that can occur. Further, the chemical solution is prevented from entering the seal space 24a through the seal surface between the seal member 24 on the processing chamber 10a side of the two seal members 24 and the rotary shaft 21.
- the on-off valve V4 is also opened, and the N gas supply source 27
- the first seal structure including the two seal members 24 allows the chemical solution to enter the bearing 23 side and particles generated in the bearing 23 to enter the processing vessel 10 side. Is prevented.
- the open / close valve V9 is closed, the supply of pure water is stopped, the drive of the nozzle rotation motor 50 is stopped, and the wafer is further rotated. The drive of the motor 20 is stopped. Thereafter, the open / close valves V14 and V10 are opened, and the pure water in the processing container 10 is discharged from the quick drain port 17A and the drain port 76 via the drain line 78A. Simultaneously with the drainage of this pure water, a drying gas such as N gas or a mixed gas of N gas and IPA is supplied from the drying gas supply port 19 over a predetermined time.
- a drying gas such as N gas or a mixed gas of N gas and IPA is supplied from the drying gas supply port 19 over a predetermined time.
- the open / close valve VI is opened based on the control signal from the CPU 110, and the hollow seal member 26a of the seal structure 26 from the N gas supply source 27 is opened.
- the processing chamber 10a and the intermediate space 26d are isolated from each other in close contact with the outer peripheral surface of the rotary shaft 21. In this state, the surfaces of the intermediate space 26d and the members (shaft housing 22, rotating shaft 21, seal member 24, hollow seal member 26a) facing the intermediate space 26d are cleaned.
- the switching valve V0 is switched to the pure water supply source 27A side, and the sealing member
- the surface of the member facing the intermediate space 26d is dried. During this cleaning and drying, the opening and closing valves V2 and V3 are open, and pure water and N gas are flowed from the intermediate space 26d at a large flow rate.
- a series of liquid treatments is performed by drying the wafer W and completing the cleaning and drying of the intermediate space 26d. The process ends.
- the attitude conversion / movement mechanism 7 is driven, the lid 11 is pulled away from the processing container main body 12, the wafer W held by the wafer holder 30 is taken out from the processing container main body 12, and the wafer Convert W posture from vertical posture to horizontal posture.
- the processed wafer W in the horizontal posture is received by another wafer holder 2b that is not the wafer holder 2a that handles the unprocessed wafer W, and is then accommodated in the empty carrier C by the wafer transfer arm 4, and the other wafer holder 2b. It is conveyed to the processing device.
- the power exemplifying a badge type liquid processing apparatus that processes a plurality of wafers W simultaneously as the liquid processing apparatus according to the present invention is a single wafer type liquid processing that processes only one wafer W at a time. It can be a device.
- the wafer holder 30 is attached to the lid body 11, but it is also possible to provide the wafer holder 30 on the processing container main body 12. In this case, it is necessary to have a structure in which the wafer can be transferred to and from the processing mechanism body 12.
- the object to be processed is a semiconductor wafer.
- the object to be processed may be, for example, an LCD glass substrate or a disk substrate.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006542470A JP4451451B2 (ja) | 2004-11-08 | 2005-11-08 | 液処理装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004-323300 | 2004-11-08 | ||
JP2004323300 | 2004-11-08 |
Publications (1)
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WO2006049302A1 true WO2006049302A1 (ja) | 2006-05-11 |
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Family Applications (1)
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PCT/JP2005/020459 WO2006049302A1 (ja) | 2004-11-08 | 2005-11-08 | 液処理装置及びその運転方法 |
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JP (1) | JP4451451B2 (ja) |
WO (1) | WO2006049302A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011216608A (ja) * | 2010-03-31 | 2011-10-27 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US8501025B2 (en) | 2010-03-31 | 2013-08-06 | Dainippon Screen Mfg. Co., Ltd. | Substrate treatment apparatus and substrate treatment method |
KR20230122954A (ko) * | 2022-02-15 | 2023-08-22 | 사이언테크 코포레이션 | 웨이퍼 처리 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0722377A (ja) * | 1993-06-30 | 1995-01-24 | Dainippon Screen Mfg Co Ltd | 基板回転乾燥装置の排気装置 |
JP2002093770A (ja) * | 2000-07-03 | 2002-03-29 | Tokyo Electron Ltd | シール機構付処理装置 |
-
2005
- 2005-11-08 JP JP2006542470A patent/JP4451451B2/ja not_active Expired - Fee Related
- 2005-11-08 WO PCT/JP2005/020459 patent/WO2006049302A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0722377A (ja) * | 1993-06-30 | 1995-01-24 | Dainippon Screen Mfg Co Ltd | 基板回転乾燥装置の排気装置 |
JP2002093770A (ja) * | 2000-07-03 | 2002-03-29 | Tokyo Electron Ltd | シール機構付処理装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011216608A (ja) * | 2010-03-31 | 2011-10-27 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US8501025B2 (en) | 2010-03-31 | 2013-08-06 | Dainippon Screen Mfg. Co., Ltd. | Substrate treatment apparatus and substrate treatment method |
US9899240B2 (en) | 2010-03-31 | 2018-02-20 | SCREEN Holdings Co., Ltd. | Substrate treatment apparatus |
KR20230122954A (ko) * | 2022-02-15 | 2023-08-22 | 사이언테크 코포레이션 | 웨이퍼 처리 장치 |
KR102670303B1 (ko) | 2022-02-15 | 2024-05-28 | 사이언테크 코포레이션 | 웨이퍼 처리 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP4451451B2 (ja) | 2010-04-14 |
JPWO2006049302A1 (ja) | 2008-08-07 |
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