WO2006035908A1 - Formulation de pâte d’argent - Google Patents

Formulation de pâte d’argent Download PDF

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Publication number
WO2006035908A1
WO2006035908A1 PCT/JP2005/018030 JP2005018030W WO2006035908A1 WO 2006035908 A1 WO2006035908 A1 WO 2006035908A1 JP 2005018030 W JP2005018030 W JP 2005018030W WO 2006035908 A1 WO2006035908 A1 WO 2006035908A1
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Prior art keywords
silver
paste composition
thin film
weight
organic
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Application number
PCT/JP2005/018030
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English (en)
Japanese (ja)
Inventor
Naosuke Ochiai
Original Assignee
Nippon Kin-Eki Co., Ltd.
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Application filed by Nippon Kin-Eki Co., Ltd. filed Critical Nippon Kin-Eki Co., Ltd.
Priority to JP2006537826A priority Critical patent/JPWO2006035908A1/ja
Publication of WO2006035908A1 publication Critical patent/WO2006035908A1/fr

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • G02F1/136295Materials; Compositions; Manufacture processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007Filters, e.g. additive colour filters; Components for display devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0047Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Definitions

  • the present invention relates to a silver paste composition for forming a silver thin film used for a thin film conductor (resistor thin film electrode) of various electronic components and a wiring material of a display device.
  • the present invention also relates to a method for producing a silver thin film from the silver paste composition.
  • the present invention further provides a thin film conductor for electronic parts including the silver thin film and a wiring material for display.
  • the thinning of the terminal electrode is difficult to obtain with a so-called thick film electrode mixed with metal powder and an organic vehicle, and it is difficult to stably obtain a film thickness of 2.5 microns or less.
  • a photoresist pattern is formed, and the opening is removed by an etching method.
  • a method of obtaining a thin film mainly composed of gold by printing a paste with a thick film pattern and then baking the paste.
  • the formation of thin film electrodes by a vacuum technique requires expensive equipment such as a vacuum apparatus and an exposure apparatus, resulting in high equipment costs.
  • the thin-film electrode pattern formation method using gold metal organics is used in some high-end devices because the pattern formation process itself uses power gold, which is an inexpensive thick film technique, and its material cost is extremely high. Stays on.
  • the bus line conductor on the front panel of a PDP (plasma display panel) is an electrode thin film for improving the reliability of the dielectric formed on the bus line conductor. ⁇ is required.
  • reducing the thickness of the electrode leads to a significant cost reduction (reduction of precious metal consumption), so it has been realized even though it is extremely useful.
  • Patent Document 1 JP-A-6-45118
  • Patent Document 2 Japanese Patent Laid-Open No. 4-326791
  • An object of the present invention is to provide a dense and stable silver thin film having a small sheet resistance value of 2.5 microns or less, which is useful as a thin film conductor (resistor thin film electrode) for various electronic components and a wiring material for a display device. It is to provide a new silver paste composition to obtain.
  • a silver paste composition containing inorganic acid silver and Z or organic acid silver, an organic noder, and a solvent is inorganic from the viewpoint of paste viscosity.
  • the printing properties of this silver-based composition on the substrate are excellent, and 0.2% by heat drying and low-temperature sintering.
  • a stable and dense silver thin film can be formed within a thickness range of ⁇ 2.5 microns, and solved the above problems.
  • the inventors of the present invention have also found that the above-described silver thin film is useful for a thin film conductor (resistor thin film electrode) of various electronic components and a wiring material of a display device, thereby completing the present invention. .
  • the present invention provides the following.
  • a silver paste composition comprising:
  • a silver paste composition wherein the silver content based on component A) is from 10 to 50% by weight, based on the total weight of the composition.
  • Silver paste composition strength according to item (1) Obtained thin silver film having a thickness of 0.2 to 2.5 m (10) A thin film conductor for electronic parts, comprising the silver thin film according to item (9).
  • a display device wiring material comprising the silver thin film according to item (9).
  • a method for producing a silver thin film is a method for producing a silver thin film.
  • step a) is performed by screen printing.
  • step b) is performed at 90 to 150 ° C.
  • step c) is performed at 450 to 700 ° C.
  • a silver thin film having excellent conductivity can be patterned by a thick film technique such as screen printing, and a silver thin film of about 0.2 to 2.5 m can be formed on various substrates by firing. It is possible to obtain good adhesion.
  • the heat resistance of the film can be ensured by adding a sintering inhibitor as appropriate so that it can withstand baking at temperatures as low as 450 ° C or as high as 850 ° C.
  • a silver thin film electrode can be provided.
  • the “silver paste composition” means that silver is the most among the metal components contained in the composition, and a film is formed when applied on a “substrate” defined below. Can As long as it means a paste-like composition and satisfies the above requirements, the type and amount of each component constituting the composition are not particularly limited.
  • the term “silver paste composition” is used herein interchangeably with the term “silver paste”.
  • inorganic acid silver means a silver salt of an inorganic acid (an acid group formed by combining an acid group containing a nonmetal such as Cl, S, N, and P with hydrogen), Typical examples include silver carbonate and silver oxide.
  • the “organic acid silver” is a term for the above “inorganic acid silver”, and an organic acid containing one or more carboxyl groups (—COOH) in the molecule (for example, fatty acid, aromatic Acid or hydroxy acid).
  • fatty acid refers to an R—COOH having one carboxyl group (where R represents a hydrophobic chain) having a linear or branched, saturated or unsaturated chain structure.
  • R represents a hydrophobic chain
  • the carbon number of the fatty acid used in the present invention is not particularly limited, but C to C fatty acids generally used industrially are the present invention.
  • aromatic acid in the present invention is a general term for compounds in which one or more carboxyl groups are substituted on the aromatic ring. Typical examples include benzoic acid.
  • Hydrophilic acid in the present invention is a general term for organic compounds having —OH group and —COOH in the molecule, and typical examples include lactic acid.
  • the “organic binder” is used in the silver paste composition for the purpose of ensuring the stability and strength of a film formed by coating the silver paste composition of the present invention on a substrate.
  • solvent means that the components constituting the silver paste composition of the present invention are completely or at least partially dissolved, and the paste is added to the “silver paste composition” of the present invention. It refers to all organic solvents commonly used in the industry that give moderate viscosity as.
  • the “organic vehicle” means a solution in which an organic binder is dissolved in a solvent.
  • the term "silver content based on (component A))” refers to component A), that is, silver derived from inorganic acid silver and Z or organic acid silver as defined above. In this specification, Unless otherwise specified, it is not intended to be included in the silver paste composition of the present invention, and is not silver derived from other silver components (silver powder, silver particles, silver fine particles, silver pieces, etc.) or silver compounds, Means the silver content.
  • silver powder is not intended to be included in the silver paste composition of the present invention unless otherwise specified in the present specification, and is a conventional silver paste for forming a conductive thin film. It means a silver component having a relatively large particle diameter (for example, silver powder, silver particles, silver fine particles, silver pieces, etc., although the shape is not particularly limited).
  • substantially does not contain (silver powder) means that when a silver thin film is formed from the “silver paste composition” of the present invention, silver atoms are stabilized. It means that the silver paste composition of the present invention does not contain the above “silver powder” in an amount that inhibits the formation of a dense film or has an adverse effect.
  • the “silver thin film” means a stable and dense silver thin film having a thickness of 2.5 ⁇ m or less formed from the “silver paste composition” of the present invention by the method of the present invention. . Unless otherwise stated in this specification, it is distinguished from conventional silver thin films.
  • the "substrate” is anything that is compatible with the “silver paste composition” in terms of the applicability of the “silver paste composition” of the present invention applied thereon.
  • the material and shape of the “substrate” are not particularly limited.
  • the “film (of silver paste composition)” means a film formed by applying the “silver paste composition” of the present invention on a “substrate”.
  • drying the film means volatilizing at least a part of the solvent from the “film (of the silver paste composition)” defined above.
  • baking (dry) film means heating the dry film from the “silver paste composition” of the present invention to a temperature required to form a “silver thin film”. Means.
  • the present invention provides a silver paste composition containing A) inorganic acid silver and Z or organic acid silver; B) an organic binder; and C) a solvent.
  • the silver paste composition of the present invention has a silver content power based on the total weight of the composition based on the total weight of the component A), regardless of what combination of component A) is inorganic acid silver and organic acid silver.
  • this silver paste composition has excellent printing characteristics on a substrate, and a stable and dense silver thin film is formed within a thickness range of 0.2 to 2.5 microns by heat drying and low temperature sintering. be able to.
  • the silver thin film thus obtained is useful as a thin film conductor for various electronic components (thin film electrodes of resistors) and a wiring material for display devices.
  • component A) when component A) is an inorganic acid silver alone, the silver content based on component A) is preferably 10 to 50% by weight based on the total weight of the composition. If the concentration of silver contained in the inorganic acid silver is 10% by weight or less, the film thickness after pyrolysis becomes too thin, and it is not preferable because the film density cannot be obtained. In addition, it is preferable to add a compound having a silver concentration exceeding 50% by weight because the ratio of the organic binder and the solvent to the inorganic acid silver is too small to be a paste suitable for screen printing.
  • the silver content based on the component is preferably 10 to 30% by weight based on the total weight of the composition.
  • the silver concentration in the organic acid silver is 10% by weight or less, the film thickness after thermal decomposition becomes too thin, and the film density cannot be obtained.
  • component A) is a mixture of inorganic acid silver and organic acid silver.
  • the printing characteristics on the substrate of the silver paste composition are excellent compared to the case of each of the inorganic acid silver or organic acid silver alone, and heat drying and After sintering, a very stable and dense silver thin film can be formed.
  • the amount of inorganic acid silver and organic acid silver can be freely combined depending on the materials used. From the viewpoint of the viscosity of a silver paste composition suitable for forming a silver thin film, inorganic acid silver is used.
  • the ratio of the weight of the organic acid silver to the total weight of the organic acid silver is 2 to 60 More preferably, it is 5% to 30%.
  • component A) is a mixture of inorganic acid silver and organic acid silver
  • the content power of silver based on component A) is 10 to 45% by weight based on the total weight of the composition. I like it. If the silver content in the paste is less than 10% by weight, the film thickness after pyrolysis becomes too thin, and the denseness of the film cannot be obtained. In addition, it is not preferable that the silver concentration exceeds 45% by weight because the ratio of the organic binder and the solvent in the paste is too small and the paste is not suitable for screen printing.
  • the silver paste composition of the present invention is substantially free of silver powder.
  • the metal silver particles of about 1 ⁇ m or less can be appropriately freed.
  • Examples of the inorganic acid silver used in the present invention include acid silver and silver carbonate.
  • a fatty acid As the organic acid silver used in the present invention, a fatty acid, an aromatic acid or a hydroxy acid is preferably used. In particular, when a fatty acid is used, C to C
  • Typical examples of silver include silver acetate, silver lactate, silver benzoate, silver 2-ethylhexanoate, silver oleate, and silver dodecyl mercaptan. Even in the form of powdered organic acid silver that does not necessarily need to be in a liquid state, it can be used because it can ensure dispersion stability.
  • the organic binder of component B) used in the present invention includes, but is not limited to, for example, ethyl cellulose resin, nitrocellulose resin, acrylic resin, terpene resin, and asphaltite.
  • asphaltite when asphaltite is included as a resin for organic binders, inorganic acid silver, or in particular, organic acid silver and asphaltite can be subjected to a chemical cross-linking reaction in the dispersion process by heating and mixing, and the dispersion stability of the paste Can be increased.
  • an alkali-soluble resin, a photocurable monomer, and photopolymerization start in an organic binder
  • an agent By including an agent, photo pattern formation by imparting photosensitivity is possible.
  • Examples of the solvent of component C) used in the present invention include, for example, relatively high boiling alcohol solvents (for example, terbineol and benzyl alcohol) and esters (for example, butyl) that dissolve at least part of the above components. Forces including, but not limited to, carbitol and trimethylpentanediol isomonobutyrate (abbreviation: TMP I).
  • relatively high boiling alcohol solvents for example, terbineol and benzyl alcohol
  • esters for example, butyl
  • TMP I trimethylpentanediol isomonobutyrate
  • the silver paste composition of the present invention is excellent in sinterability, the silver paste composition of the present invention needs to be fired at a high temperature of 500 ° C or higher (for example, when formed as an electrode of a resistor on an alumina substrate).
  • the firing temperature of the resistor is usually about 850 ° C, so the electrode formed prior to the resistor naturally passes through a thermal process of about 850 ° C.) It is necessary to control.
  • the silver paste composition of the present invention may contain a silver sintering inhibitor, if necessary, as such a silver sintering inhibitor, rhodium, noradium, platinum and ruthenium.
  • Group powers including, but not limited to, metal organic compounds or metal organic sulforesinates of at least one or more selected metals.
  • a sintering inhibitor based on the total weight of the silver paste composition in terms of sintering suppression effect. Addition of a content higher than this is not preferable because it causes an increase in resistance value and an increase in material cost, and is generally not desired as an electrode. If it is desired to control the sheet resistance of the electrode to be intentionally high, it is naturally possible to contain 1% by weight or more. In particular, palladium may be designed with a silver concentration of 5% by weight or more to prevent migration.
  • the conventional silver paste contains 1 to 2 glass powders.
  • the electrode thickness after firing may be around 1 m at most
  • glass powder having a particle distribution of about 1 to 5 ⁇ m is usually mixed and dispersed.
  • the particles are too large to form a dense film. Therefore, it is preferable to contain a metal organic material of at least one metal selected from bismuth, silicon, boron, lead, chromium, copper, and vanadium force.
  • These metal organic substances are generally liquid substances. Therefore, it can be easily dispersed in the paste and has excellent adhesion to substrates for typical electronic components such as glass substrates and alumina substrates.
  • inorganic acid silver and a solvent are blended in a predetermined amount and pre-stirred with a stirrer. After completion of stirring, an organic binder is added, and then dispersed with a three-roll roller or the like, and a solvent is added so as to obtain a predetermined viscosity characteristic.
  • the silver paste composition thus obtained is printed on a substrate.
  • a screen printing method, a nod printing method, a spray method, a dating method, a spin coating method, a brush coating method, and the like can be used, but not limited thereto.
  • screen printing for example, printing on a substrate with a screen of 325 mesh, emulsion thickness 10 ⁇ m, etc.
  • the thickness of the print coating film can be appropriately set in consideration of the silver concentration and the paste viscosity.
  • substrates to be printed and applied include, but are not limited to, glass substrates and ceramics.
  • a dry film having a predetermined thickness can be obtained by drying for a predetermined time at a temperature of about 90 to 150 ° C, preferably about 100 to 120 ° C. it can.
  • a sintered silver thin film can be obtained by further firing the dried film at a temperature of about 450 to 600 ° C, preferably about 500 ° C.
  • ceramic is used for the substrate, it is fired at a temperature of 550 to 900 ° C. At this time, for example, when the silver concentration in the silver paste composition is 30% by weight, a silver thin film having a thickness of about 1 ⁇ m is obtained.
  • the solvent contained in the silver paste composition according to the present invention has a boiling point of usually around 200 ° C, but most of the solvent component evaporates at the vapor pressure in the drying step after printing.
  • the organic vehicle is added to impart viscosity to the paste, but it is also thermally decomposed at a temperature of about 300 ° C to 400 ° C and disappears.
  • thermal decomposition starts from about 200 ° C., and thermal decomposition ends at about 360 ° C.
  • silver carbonate precipitates due to pyrolysis, and atomic silver particles are deposited. These particles start to sinter rapidly, but since silver sintering occurs in conjunction with the thermal decomposition of the organic binder and the thermal decomposition of silver carbonate, a thin film can be stably obtained. Also normal
  • the silver concentration of the silver paste composition is about 32 wt%, Pd concentration of about 0.4 wt%, Rh concentration of about 0.01 wt%, Bi concentration 0.045 Weight 0 / 0 .
  • the silver paste composition thus obtained was printed on a glass substrate with a stainless steel 325 mesh and an emulsion thickness of 10 ⁇ m, a high-definition electrode pattern with a pattern width of 80 ⁇ m and a space of 50 ⁇ could be printed. This is presumably because oleic acid and gyrsonite, a type of asphaltite, chemically cross-linked, resulting in a paste composition that does not bleed easily.
  • the film thickness after drying was 8 ⁇ m. Next, when this dried film was baked at 550 ° C, a 1.2 m silver thin film was obtained. The sheet resistance value of this electrode film was 25 ⁇ . The force of the peel test using a scotch tape on the silver thin film electrode obtained here did not peel at all. Furthermore, as a heat resistance test, the rate of change in the force resistance value after repeated baking at 600 ° C for 5 times was 5% or less, which was within the measurement error range.
  • the effects of the Rh and Pd metal organic substances are exemplified as the material for improving the heat resistance, but the effects are the same even when the platinum and Ru metal organic substances are used.
  • the same effect can also be obtained by adding force B or Pb metal organics that illustrate the effects of Bi, Si, Cr metal organic materials as materials to ensure adhesion to the substrate. Needless to say, you can do it.
  • inorganic silver 50 parts by weight of silver carbonate (silver concentration: 79.8% by weight) was used.
  • silver carbonate is a powdery substance, there are scattered lumps of agglomerated powder. Premixing is performed beforehand with a mixing and grinding machine, and the agglomerated powder is crushed, and then the terpene compound is used as an organic vehicle.
  • the silver paste composition according to the present invention was left to stand at room temperature of about 23 ° C for 1 week, and then printed and baked in the same manner. Concavities and convexities were observed on the film surface and the film surface after firing as compared with that immediately after kneading. As for the surface roughness, the force Rz immediately after kneading was about 0.2 m, whereas the one after one week had Rz of about 0.2. This is presumed to be due to reagglomeration of silver carbonate in the paste. By adding fatty acids such as stearic acid and oleic acid, reaggregation of silver carbonate could be suppressed.
  • fatty acids such as stearic acid and oleic acid
  • Example 2 a silver paste composition in which 1 part by weight of silver carbonate in Example is replaced with silver oleate will be described.
  • Silver carbonate (silver concentration: 79.8% by weight) as inorganic acid silver was reduced from 50 parts by weight to 44 parts by weight, and organic oleate (silver concentration: 27.7% by weight) 18 Part by weight was added. (The silver concentration after calcination is about 40% by weight as in Example 2.) Since both silver carbonate and silver oleate are powders, they are premixed in advance with a mixing grinder to break up the agglomerated powder, and then terpene abietic acid is used as an organic vehicle in the same manner as in Example 2.
  • Example 2 The strength of the paste composition after printing and baking after being left at about 23 ° C for 1 week. For this paste, no significant difference was observed in the surface roughness immediately after kneading and after standing for 1 week. . It is estimated that silver oleate contributed to the dispersion stability of the silver paste composition. The same effect is observed in common with organic acid silver such as silver acetate, silver lactate, silver dodecyl mercaptan, etc., but the molecular weight constituting the organic acid! / Silver oleate is most excellent in dispersion stability.
  • organic acid silver such as silver acetate, silver lactate, silver dodecyl mercaptan, etc.
  • a fine pattern printability was confirmed by printing on a glass substrate (PD200 manufactured by Asahi Glass) with a screen of 325 stainless mesh and emulsion thickness of 10 microns.
  • Pattern width Z space is the force that can print up to 75 microns. Where space is narrower than that, -Jimi partially connected the lines.
  • the viscosity characteristics of this paste were 420 pa's at one revolution of Brookfield rotary viscometer, 80.8 pa's at 10 revolutions, and the rotational viscosity ratio (viscosity of one revolution Z10 revolutions) was about 5. .
  • Viscosity characteristics of exactly what was heated and stirred at 150 ° C for 60 minutes is 2240 pa's for one revolution of Brookfield rotary viscometer, 188 pa's for 10 revolutions, and the rotational viscosity ratio (viscosity for one revolution Z10 viscosity for one revolution) Becomes about 12 and becomes a very thixotropic paste.
  • a paste with this viscosity characteristic is printed on a glass substrate (PD200 made by Asahi Glass) using a screen of 325 stainless mesh and emulsion thickness of 10 microns, and if the fine pattern printability is confirmed, the pattern width Z space can be printed up to 40 microns. did it.
  • the paste containing abietic acid or gilsonite has an excellent characteristic that the viscosity characteristic can be easily changed by a crosslinking reaction depending on the superheated stirring condition of the paste.
  • the dry film thickness was 8 microns. Furthermore, when fired at 600 ° C for 10 minutes, a silver thin film of about 1 micron was obtained.
  • the sheet resistance value was about 35 ⁇ ⁇ (specific resistance about 4 ⁇ ′cm).
  • the mixture was stirred for 150 minutes at 150 degrees with a stirrer. After cooling, about 11 parts by weight of terbinol was added as a viscosity adjusting solvent to adjust the viscosity of the paste. After printing on a glass substrate (PD200 manufactured by Asahi Glass Co., Ltd.) with a 400 stainless mesh, 8 micron emulsion screen, and drying at 120 ° C for 10 minutes, the dry film thickness was 6 microns.
  • PD200 manufactured by Asahi Glass Co., Ltd.
  • Orein silver as the organic acid silver (silver concentration: 27.7 wt 0/0) 15 parts by weight, 7.5 parts by weight of Girusoraito 35% solution dissolved in rosemary oil and an organic vehicle, sintering inhibitors and to Rh metal organic: metal organic substances (Rh concentration: 5 wt%) of 0.45 parts by weight of Pd (Pd concentration: 9. 55 weight 0/0) 1.
  • Rh concentration: 5 wt% 0.45 parts by weight of Pd (Pd concentration: 9. 55 weight 0/0) 1.
  • 46 wt parts, bismuth resinate as the glass component 1 part by weight of Bi concentration: 3.00% by weight was added. After all of these were blended, they were heated and stirred with a stirrer at 150 degrees for 30 minutes.
  • the viscosity of the paste was adjusted by adding about 3 parts by weight of terneol as a solvent for adjusting the viscosity.
  • This silver paste composition was printed on a glass substrate (PD200 manufactured by Asahi Glass) using a 325 stainless steel mesh, 10-micron emulsion screen, and dried at 120 ° C for 10 minutes, resulting in a dry film thickness of 8 microns. It was. Further, when fired at 600 ° C. for 10 minutes, a silver thin film of about 0.4 microns was obtained.
  • the sheet resistance value was about 420 m ⁇ (specific resistance: about 17 ⁇ ′ cm), and the film had a very high resistance value.
  • the fired film was refired at 600 ° C, it was disconnected in the second time. This is because the silver concentration of the silver paste composition in this comparative example is as low as about 17% by weight, and the film is separated into islands by accelerating the sintering of the film by firing, and eventually the disconnection state is reached. It is thought.
  • thinning of wiring electrodes and terminal electrodes of various electronic components can be formed with high accuracy and at low cost, which contributes to miniaturization and high accuracy of electronic components.
  • a thin film layer of a bus line electrode of a display portion called a front panel of a flat display panel or the like typified by a PDP is required.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
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Abstract

La présente invention a pour objet une formulation de pâte d’argent qui comprend A) un sel d’argent d’un acide inorganique et/ou un sel d’argent d’un acide organique, B) un liant organique, et C) un solvant, la teneur en argent apporté par le composant A) dans ladite formulation étant comprise entre 10 et 50 % en masse vis-à-vis de la quantité totale de ladite formulation. Ladite formulation de pâte d’argent est originale et peut servir à fabriquer une couche mince d’argent d'épaisseur inférieure ou égale à 2,5 microns. Elle est de plus dense, stable et présente une faible résistance de couche, ce qui la rend utilisable en tant que matériau conducteur couche mince pour des applications variées dans le domaine des composants électroniques (par exemple l'électrode couche mince d'une résistance), ainsi que comme matériau de câblage pour un dispositif d'affichage.
PCT/JP2005/018030 2004-09-29 2005-09-29 Formulation de pâte d’argent WO2006035908A1 (fr)

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JP2006537826A JPWO2006035908A1 (ja) 2004-09-29 2005-09-29 銀ペースト組成物

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JP2004284293 2004-09-29
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US7875214B2 (en) 2007-10-02 2011-01-25 The Yokohama Rubber Co., Ltd. Electroconductive composition, method for forming electroconductive film, and electroconductive film
JP2012094518A (ja) * 2010-10-27 2012-05-17 Samsung Electronics Co Ltd 導電性ペーストおよび太陽電池
KR20140007862A (ko) 2011-01-26 2014-01-20 나믹스 가부시끼가이샤 도전성 페이스트 및 그 제조 방법
WO2015064567A1 (fr) 2013-10-31 2015-05-07 昭和電工株式会社 Composition conductrice de l'électricité pour impression de couches minces, et procédé de formation d'une impression conductrice en couche mince
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US10214657B2 (en) * 2017-03-13 2019-02-26 Eastman Kodak Company Silver-containing compositions containing cellulosic polymers

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KR101382361B1 (ko) * 2013-05-03 2014-04-09 강원대학교산학협력단 복합 분리막을 포함하는 염료감응 태양전지 및 그의 제조방법

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US7875214B2 (en) 2007-10-02 2011-01-25 The Yokohama Rubber Co., Ltd. Electroconductive composition, method for forming electroconductive film, and electroconductive film
JP2012094518A (ja) * 2010-10-27 2012-05-17 Samsung Electronics Co Ltd 導電性ペーストおよび太陽電池
KR20140007862A (ko) 2011-01-26 2014-01-20 나믹스 가부시끼가이샤 도전성 페이스트 및 그 제조 방법
WO2015064567A1 (fr) 2013-10-31 2015-05-07 昭和電工株式会社 Composition conductrice de l'électricité pour impression de couches minces, et procédé de formation d'une impression conductrice en couche mince
US9845404B2 (en) 2013-10-31 2017-12-19 Showa Denko K.K. Conductive composition for thin film printing and method for forming thin film conductive pattern
WO2018169672A1 (fr) * 2017-03-13 2018-09-20 Eastman Kodak Company Compositions contenant de l'argent contenant des polymères cellulosiques et leurs utilisations
US10214657B2 (en) * 2017-03-13 2019-02-26 Eastman Kodak Company Silver-containing compositions containing cellulosic polymers
CN110494805A (zh) * 2017-03-13 2019-11-22 伊斯曼柯达公司 含有纤维素聚合物的含银组合物和用途

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