WO2006022072A1 - Procede de fabrication d’un composant electronique - Google Patents

Procede de fabrication d’un composant electronique Download PDF

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Publication number
WO2006022072A1
WO2006022072A1 PCT/JP2005/011443 JP2005011443W WO2006022072A1 WO 2006022072 A1 WO2006022072 A1 WO 2006022072A1 JP 2005011443 W JP2005011443 W JP 2005011443W WO 2006022072 A1 WO2006022072 A1 WO 2006022072A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
conductive adhesive
substrate
component element
electrode
Prior art date
Application number
PCT/JP2005/011443
Other languages
English (en)
Japanese (ja)
Inventor
Masachika Takata
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Publication of WO2006022072A1 publication Critical patent/WO2006022072A1/fr

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/177—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of the energy-trap type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a method for manufacturing an electronic component, and more particularly relates to a method for manufacturing an electronic component including a step of mounting an electronic component element such as a piezoelectric resonant element on a substrate using a conductive adhesive. .
  • Patent Document 1 discloses an electronic component shown in FIG.
  • electrode lands 103 and 104 are formed on an insulating substrate 102 having an insulating ceramic force.
  • the electronic component element 105 is bonded onto the substrate 102 using the conductive adhesives 106 and 107.
  • the electronic component element 105 has a structure in which excitation electrodes 105b and 105c are formed on both main surfaces of an electronic component element 105a that also has a piezoelectric ceramic force.
  • the excitation electrode 105 c is bonded to the electrode land 103 by the conductive adhesive 106.
  • the excitation electrode 105b formed on the upper surface is connected to an electrode extension portion 105d that reaches the lower surface through the end surface of the electronic component body 105a.
  • the electrode extension 105d is joined to the electrode land 104 through the conductive adhesive 107.
  • a cap 108 having an opening opened downward is fixed to the base plate 102 so as to surround the electronic component element 105.
  • Patent Document 1 Japanese Patent Laid-Open No. 11-265955
  • the thermal expansion coefficient of the insulating ceramic constituting the substrate 102 and the thermal expansion coefficient of the piezoelectric ceramic constituting the electronic component body 105 a are different.
  • the electronic component body 105a was forced to generate stress due to the difference in thermal expansion coefficient.
  • the difference in thermal expansion coefficient is large, the electronic component body 105a may be destroyed by the thermal stress generated in the electronic component body 105a.
  • the conductive adhesives 106 and 107 having excellent elasticity may be used.
  • the conventional joint structure using the conductive adhesives 106 and 107 has not been able to sufficiently reduce the stress caused by the difference in thermal expansion coefficient. For this reason, cracks occurred at the bonding interface between the conductive adhesives 106 and 107 and the electronic component element 105, and the bonding reliability was not sufficient.
  • characteristics such as the elastic modulus of the conductive adhesives 106 and 107 changed with the ambient temperature, and the electrical characteristics of the electronic component 105 tended to fluctuate accordingly.
  • An object of the present invention is to solve the above-described drawbacks of the prior art, and in an electronic component having a structure in which an electronic component element is bonded on a substrate using a conductive adhesive, when the ambient temperature changes Even so, it is an object of the present invention to provide a method for manufacturing an electronic component that has excellent bonding reliability, in particular, cracks at the bonding interface between the conductive adhesive and the electronic component element, and has little variation in characteristics.
  • the present invention is a method for manufacturing an electronic component in which an electronic component element is fixed using a conductive adhesive on a substrate on which at least one main surface is provided with a plurality of electrode lands.
  • the step of preparing the substrate formed on one main surface and the electronic component element, and the portion of the electronic component element bonded to the electrode land of the substrate larger than the area bonded to the electrode land Applying and curing the first conductive adhesive to an area, and after the first conductive adhesive is cured, the first conductive adhesive is bonded to the electrode land.
  • the electronic component element has first and second end portions facing each other, and is mounted on the substrate of the electronic component element. On the surface, the electronic component element is bonded to the electrode land of the substrate in the vicinity of the first end portion and the vicinity of the second end portion.
  • the first conductive adhesive is used for removing unnecessary portions after curing the first conductive adhesive. Along with the unnecessary part, a part of the electronic component element connected to the unnecessary part of the conductive adhesive is also removed by the cutting jig.
  • the electronic component element is connected to the first and second main surfaces facing each other and the first and second main surfaces.
  • An electronic component main body having first and second end faces, and a plurality of electrodes to be connected to a plurality of electrode lands on the substrate are provided on the first main surface.
  • the electronic component main body is a piezoelectric body, and faces the first and second main surfaces via the piezoelectric body.
  • the first and second excitation electrodes are formed, whereby a piezoelectric resonator is obtained.
  • a cap is fixed to the substrate so as to cover the electronic component element.
  • a process is further provided.
  • the first conductive property is formed so that the area bonded to the electrode land on the substrate of the electronic component element has a larger area than the area bonded to the electrode land.
  • Apply adhesive Then, after the first conductive adhesive is cured, an unnecessary portion of the first conductive adhesive is formed so that the first conductive adhesive has the above-described area to be bonded to the electrode land. Is removed by cutting. Thereafter, the first conductive adhesive and the electrode land of the substrate are fixed by joining via the second conductive adhesive. Therefore, after the first conductive adhesive is cured, the internal stress in the cured first conductive adhesive can be sufficiently reduced by cutting and removing unnecessary portions of the first conductive adhesive.
  • the first conductive adhesive with reduced internal stress and the electrode land of the substrate are joined via the second conductive adhesive. Accordingly, the electronic component element is bonded to the electrode land of the substrate by two-stage curing of the first conductive adhesive and the second conductive adhesive. Moreover, in the cured product of the first conductive adhesive, the internal stress is reduced by cutting and removing the unnecessary portion. Therefore, since it is possible to effectively reduce the internal stress at the joint portion due to the conductive adhesive, cracks are hardly generated at the joint interface between the conductive adhesive and the electronic component element. Therefore, it is possible to provide an electronic component excellent in the reliability of electrical connection and mechanical joining regardless of changes in ambient temperature.
  • the electronic component element has first and second end portions facing each other, and the first component portion vicinity portion and the second end portion vicinity portion on the surface of the electronic component element mounted on the substrate.
  • the electronic component is supported in the vicinity of both ends, and is reliable in electrical connection and mechanical bonding with a conductive adhesive.
  • An electronic component having excellent properties can be provided.
  • an electronic component main body having first and second main surfaces facing each other and first and second end surfaces connecting the first and second main surfaces, and a first main
  • the first main surface side force electronic component element that can be surface mounted on the substrate is provided. Electronic parts can be provided.
  • the electronic component main body is a piezoelectric body and the first and second excitation electrodes are formed on the first and second main surfaces so as to face each other with the piezoelectric body interposed therebetween, According to the present invention, an electronic component having a piezoelectric resonator mounted on a substrate and excellent in electrical connection and mechanical bonding reliability can be provided.
  • the electronic component element is further bonded to the substrate after the electronic component element is bonded to the substrate, the electronic component element is internally formed by the substrate and the cap according to the present invention. It is possible to provide an electronic component sealed in the container.
  • FIGS. 1 (a) and 1 (b) show a method of manufacturing an electronic component according to an embodiment of the present invention, wherein unnecessary portions are cut after the first conductive adhesive is cured. It is the cross-sectional view and top view for demonstrating the process to remove.
  • FIG. 2 is a perspective view showing a mother piezoelectric plate prepared in the first embodiment.
  • FIG. 3 is a cross-sectional view for explaining the mother piezoelectric plate after curing and removing unnecessary portions after curing the first insulating adhesive.
  • FIG. 4 is a cross-sectional view of a mother piezoelectric plate showing a state where an electrode is formed by applying and curing a conductive paste following cutting and removal.
  • FIG. 5 is a perspective view for explaining a process of cutting individual piezoelectric plates to obtain individual electronic component elements.
  • FIG. 6 is a perspective view showing an electronic component element as a piezoelectric resonator obtained in the first embodiment.
  • FIG. 7 is an exploded perspective view for explaining a process of mounting the electronic component element of the first embodiment on a substrate.
  • FIG. 8 is a front sectional view showing a structure in which an electronic component element is fixed on a substrate using a second conductive adhesive in the first embodiment.
  • FIG. 9 is a front sectional view showing an example of a conventional electronic component.
  • a mother electronic component element 1 shown in FIG. 2 is prepared.
  • the mother electronic component element 1 includes a rectangular plate-like mother piezoelectric plate 2.
  • the mother piezoelectric plate 2 is made of piezoelectric ceramics polarized in the direction indicated by the arrow P! Examples of such piezoelectric ceramics include lead titanate ceramics. At the same time, other piezoelectric ceramics may be used, or a piezoelectric single crystal such as quartz may be used.
  • a first mother excitation electrode 3 is formed on the upper surface of the mother piezoelectric plate 2.
  • the excitation electrode 3 has one side surface 2 a side force extended toward the other side surface 2 b side.
  • the excitation electrode 3 is opposed to the connection electrode 4 with a gap.
  • the connection electrode 4 is extended on the upper surface of the piezoelectric plate 2 from the edge formed by the upper surface and the side surface 2b toward the side surface 2a.
  • the second excitation electrode 5 is formed on the lower surface of the piezoelectric plate 2.
  • the second excitation electrode 5 is extended from the edge formed by the side surface 2b and the lower surface toward the side surface 2a.
  • the excitation electrode 5 of the second mother is opposed to the center of the width direction connecting the excitation electrode 3 of the first mother and the side surfaces 2a and 2b of the piezoelectric plate 2 with the piezoelectric plate 2 therebetween.
  • a connection electrode 6 is formed on the lower surface of the piezoelectric plate 2 with a gap from the second excitation electrode 5.
  • the connection electrode 6 is extended from the edge formed by the side surface 2a and the lower surface toward the side surface 2b.
  • the excitation electrodes 3 and 5 and the connection electrodes 4 and 6 can be formed of a conductive material such as Ag or an Ag alloy.
  • the conductive material is not limited to Ag or Ag alloy, but may be other metals or alloys such as Cu or A1.
  • the electrode forming method is not particularly limited, and a suitable method such as thin film forming method such as vapor deposition, sputtering or plating, or applying and curing of conductive paste can be used.
  • the first conductive adhesives 7 and 8 are applied to the upper surface of the above-mentioned piezoelectric plate 2 of the mother as shown in the cross-sectional view and the plan view in FIGS. 1 (a) and 1 (b). And cure.
  • the first conductive adhesives 7 and 8 are formed on the upper surface of the mother piezoelectric plate 2, respectively, on the edge and side surfaces formed by the side surface 2a and the upper surface. It extends along the edge formed by 2b and the upper surface.
  • the first conductive adhesives 7 and 8 have a trapezoidal cross section.
  • the length of the bottom base of the trapezoid in the cross section of the other first conductive adhesive 8 is made equal to the dimension in the width direction of the connection electrode 4.
  • the dimension in the width direction refers to the dimension along the width direction of the above-described mother piezoelectric plate 2, that is, the direction connecting the side surfaces 2a and 2b.
  • the shape of the cross section of the first conductive adhesive 7 is also the same as the shape of the cross section of the other first conductive adhesive 8.
  • the application area of the first conductive adhesives 7, 8 is made larger than the area of the joint portion between the piezoelectric resonator and the conductive adhesive finally obtained by the present embodiment. .
  • alternate long and short dash lines A and B in FIG. 1 (a) indicate cutting lines, and cutting is performed along cutting lines A and B in a later step. Then, by cutting the first conductive adhesives 7 and 8 along the cutting lines A and B, the unnecessary portions 7a and 8a outside the cutting lines A and B are removed. The area of the bonded portion between the remaining cured portions 7b and 8b from which the unnecessary portions 7a and 8a are removed and the finally obtained piezoelectric resonator is naturally larger than the bonding interface before the unnecessary portions 7a and 8a are removed. It will be smaller.
  • the first conductive adhesives 7, 8 generate stress during curing, and the cured product has a large internal stress. While cutting along the cutting lines A and B, the unnecessary portions 7a and 8a are removed, so that the remaining portions of the first conductive adhesive portions 7b and 8b have an internal stress. Will be reduced.
  • a thermosetting adhesive containing conductive particles such as Ag can be used. Such conductive particles are not limited to Ag powder, and appropriate metal or alloy powders such as Cu powder and A1 powder can be used. The conductive particles may be spherical or flat! /. You can use a mixed powder of spherical conductive particles and flat conductive particles!
  • thermosetting resin examples include epoxy resin and Z or phenol resin, but are not particularly limited thereto.
  • the conductive adhesive may contain a photocurable resin that is not a thermosetting resin, in which case the first conductive adhesive 7, 8 can be cured by light irradiation. Good.
  • the first conductive adhesives 7, 8 have a trapezoidal cross-sectional shape in which the upper base is smaller than the lower base. It may be a rectangle or an inverted trapezoidal shape.
  • the first conductive adhesive 7 may be first applied so as to have a larger area than after cutting. That is, regardless of the cross-sectional shape, the internal stress acting on the bonding interface can be similarly reduced by cutting along the cutting line A and reducing the bonding area with the excitation electrode 3.
  • the mother electronic component element 1A shown in FIG. 3 is obtained.
  • a cutting jig such as a cutting blade as described above.
  • the cutting may be performed so that only the unnecessary portions 7a and 8a of the first conductive adhesives 7 and 8 are cut. That is, cut the first conductive adhesive 7 and 8 so that a part of the piezoelectric plate 2 is not cut!
  • the outer end surface of the electrode 3 and the connection electrode 6 and the first conductive adhesive portion 7b Apply and paste a conductive paste to cover the side exposed in the same direction as side 2a of the Form 9.
  • the electrode 10 is formed on the other side surface 2b by applying and curing the conductive paste. The electrode 10 extends from the side surface 2b to the end surface of the connection electrode 4 and the excitation electrode 5 on the side surface 2b side and the surface exposed by cutting along the cutting line B of the first conductive adhesive portion 8b.
  • an appropriate conductive paste such as an Ag paste can be used.
  • the electrodes 9 and 10 may be formed not only by applying and curing the conductive paste but also by a thin film forming method such as vapor deposition, sputtering or plating.
  • the electronic component element 1C has a piezoelectric plate 2A obtained by the above cutting.
  • the piezoelectric plate 2A is polarized in the direction of arrow P as described above.
  • An excitation electrode 3A is formed on the upper surface of the piezoelectric plate 2A, and an excitation electrode 5A is formed on the lower surface.
  • the excitation electrodes 3A and 5A are formed by cutting the excitation electrodes 3 and 5 of the mother.
  • the excitation electrodes 3A and 5A are opposed to each other via the piezoelectric plate 2A at the longitudinal center of the piezoelectric plate 2A. Therefore, the electronic component element 1C is an energy-confined piezoelectric resonator using the thickness shear mode.
  • connection electrode 4A is formed with a gap from the excitation electrode 3A
  • a connection electrode 6A is formed with a gap from the excitation electrode 5A on the lower surface of the piezoelectric plate 2A.
  • the connection electrodes 4A and 6A are formed by cutting the connection electrodes 4 and 6 described above.
  • the first conductive adhesive portions 7bA and 8bA are respectively formed on the excitation electrode 3A and the connection electrode 4A on the surface end side of the piezoelectric plate 2A.
  • an electrode 9A is formed on one end side of the piezoelectric plate 2A, and an electrode 10A is formed on the other end side.
  • the electrodes 9A and 10A are formed by cutting the electrodes 9 and 10.
  • a substrate 12 having a plurality of electrode lands 11a and l ib on its upper surface is prepared.
  • the substrate 12 also has an insulating ceramic force such as a dielectric or alumina.
  • the electronic component element 1C is turned over and fixed on the substrate 12 via the second conductive adhesives 13 and 14. To do.
  • the insulating adhesive 16 is applied in a rectangular frame shape and the cap 17 is joined.
  • the cap 17 has an opening that opens downward, and is provided to surround the electronic component element 1C. In this manner, a cap-type electronic component in which the electronic component element 1C is sealed in the package constituted by the substrate 12 and the cap 17 can be obtained.
  • the second conductive adhesives 13 and 14 have fluidity before curing. Therefore, if the electronic component element 1C is pressed against the second conductive adhesive 13, 14 from the first conductive adhesive portion 7bA, 8bA side, an excessive amount of the second conductive adhesive 13, 14 Is pushed to the side. In other words, as shown in FIG. 8, the lower surfaces and side surfaces of the first conductive adhesive portions 7bA and 8bA are joined to the electrode lands 11a and lib via the second conductive adhesives 13 and 14. Will be. As the second conductive adhesives 13 and 14 are cured, the electronic component element 1C is joined and fixed to the electrode lands 11a and ib.
  • the first conductive adhesive portions 7bA and 8bA are cured in advance, and the internal stress is remarkably reduced by removing the unnecessary portions 7a and 8a. Since there is a two-stage curing process using the first and second conductive adhesives, the stress due to curing can be reduced. Therefore, even if the ambient temperature changes, cracks at the bonding interface between the first conductive adhesive portions 7bA and 8bA, the excitation electrode 3A, and the connection electrode 4A are unlikely to occur. Therefore, the reliability of electrical connection and the reliability of mechanical joining can be effectively increased.
  • a piezoelectric plate having a lead titanate-based ceramic force was prepared, an Ag film was formed, patterned, and then cut to obtain the mother piezoelectric plate 2 shown in FIG.
  • a piezoelectric plate 2 having a width of 3 mm, a thickness of 0.3 mm, and a length of 20 mm was prepared.
  • the first conductive adhesive 7, 8 was applied and cured on the upper surface of the piezoelectric plate 2 of the mother.
  • the first conductive adhesive 7, 8 consists of a spherical Ag powder with a particle size of 1 to 3 111 and length Glass transition with 83% by weight of Ag powder containing 20 to 80 weight ratio of flat Ag powder of 4 to 8 ⁇ m, width of 2 to 4 ⁇ m and thickness of 0.1 to 0.2 ⁇ m It was prepared by mixing 14% by weight of a mixture of epoxy resin and phenol resin having a Tg of 130 ° C and 3% by weight of an additive such as a dispersant and kneading them using a three-roll.
  • the conductive adhesive was applied by a dispense method, maintained at a temperature of 150 ° C for 0.5 hours, and cured by heating.
  • the width direction dimension of the first conductive adhesive 7 and 8 was 800 m, and the height dimension after curing was 200 m. During heating, the temperature was maintained at 200 ° C. for 60 minutes.
  • the first conductive adhesive 7, 8 is cut along the cutting lines A, B, and the first conductive adhesive 7, 8 is the remaining portion of the first conductive adhesive 7, 8.
  • the width direction dimension of the interface bonded to the electrodes of the conductive adhesive portions 7b and 8b was set to 500 m. That is, the dimension in the width direction of the piezoelectric plate 2 after cutting was set to 2.2 mm.
  • the mother piezoelectric plate 2 obtained as described above was cut at 0.5 mm intervals in the length direction to produce the electronic component element 1C shown in FIG.
  • the same conductive adhesive as described above was applied so as to have a width of 500 m and a height dimension after curing of 200 m, and was heated and cured in the same manner.
  • the mother piezoelectric plate thus obtained was cut in the same manner as in the example to obtain an electronic component element of a comparative example.
  • the electronic component elements of Examples and Comparative Examples obtained as described above were mounted on a substrate 12 having an alumina force using a second conductive adhesive.
  • the second conductive adhesive the same one as the first conductive adhesive was used.
  • the thermal shock cycle test was done about the electronic component of the Example and the comparative example. In the thermal shock cycle test, the process of maintaining electronic components at -55 ° C for 15 minutes and then maintaining at + 125 ° C for 15 minutes was defined as one cycle, and this was repeated 500 cycles.
  • a thermal shock cycle test was performed using 20 electronic parts of Examples and Comparative Examples, and the impedance was measured after the test. If the impedance is 100 ⁇ or more as a result of impedance measurement after the thermal shock cycle test, poor connection may occur at the joint with the conductive adhesive. Judged to be bad. The results are shown in Table 1 below.
  • the method of manufacturing an electronic component using a thickness-slip type piezoelectric resonator has been described.
  • the present invention relates to an electronic component using various electronic component elements other than the piezoelectric resonator. It can be applied to the manufacturing method.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

L’invention concerne un procédé de fabrication d’un composant électronique comportant un élément de composant électronique collé et immobilisé sur un substrat à l’aide d’adhésif conducteur. Le composant électronique ainsi obtenu offre une connexion électrique et une adhésion mécanique d’une grande fiabilité au niveau du joint, et ce indépendamment des écarts de température ambiante. Dans le procédé de fabrication d’un composant électronique dans lequel un élément (1C) de composant électronique est collé et immobilisé sur un substrat (12) comportant une pluralité de pastilles d’électrode (11a, 11b) à l’aide d’adhésif conducteur, un premier adhésif conducteur (7, 8) est appliqué sur une région plus grande que la surface de l’interface d’adhésion au niveau du joint de l’élément (1C) de composant électronique, puis il est durci. Le résidu du premier adhésif conducteur (7, 8) est ensuite éliminé et l’élément (1C) de composant électronique est collé sur les pastilles d’électrode (11a, 11b) à l’aide d’un deuxième adhésif conducteur (14, 15).
PCT/JP2005/011443 2004-08-27 2005-06-22 Procede de fabrication d’un composant electronique WO2006022072A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004248746A JP2008021664A (ja) 2004-08-27 2004-08-27 電子部品の製造方法
JP2004-248746 2004-08-27

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WO2006022072A1 true WO2006022072A1 (fr) 2006-03-02

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06191887A (ja) * 1992-10-29 1994-07-12 Nec Kansai Ltd ガラス−セラミック複合体およびそれを用いたフラットパッケージ型圧電部品
JPH0730357A (ja) * 1993-07-07 1995-01-31 Murata Mfg Co Ltd チップ型圧電共振子
JP2001127578A (ja) * 1999-10-25 2001-05-11 Tdk Corp 圧電振動部品及びその製造方法
JP2002057544A (ja) * 2000-08-09 2002-02-22 Murata Mfg Co Ltd 圧電発振子

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06191887A (ja) * 1992-10-29 1994-07-12 Nec Kansai Ltd ガラス−セラミック複合体およびそれを用いたフラットパッケージ型圧電部品
JPH0730357A (ja) * 1993-07-07 1995-01-31 Murata Mfg Co Ltd チップ型圧電共振子
JP2001127578A (ja) * 1999-10-25 2001-05-11 Tdk Corp 圧電振動部品及びその製造方法
JP2002057544A (ja) * 2000-08-09 2002-02-22 Murata Mfg Co Ltd 圧電発振子

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