WO2006009138A1 - Dispositif laser semi-conducteur et dispositif de detection optique equipe dudit dispositif - Google Patents

Dispositif laser semi-conducteur et dispositif de detection optique equipe dudit dispositif Download PDF

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Publication number
WO2006009138A1
WO2006009138A1 PCT/JP2005/013241 JP2005013241W WO2006009138A1 WO 2006009138 A1 WO2006009138 A1 WO 2006009138A1 JP 2005013241 W JP2005013241 W JP 2005013241W WO 2006009138 A1 WO2006009138 A1 WO 2006009138A1
Authority
WO
WIPO (PCT)
Prior art keywords
holder
semiconductor laser
tilt
slide holder
optical base
Prior art date
Application number
PCT/JP2005/013241
Other languages
English (en)
Japanese (ja)
Inventor
Toshiaki Takasu
Yukihiro Iwata
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Publication of WO2006009138A1 publication Critical patent/WO2006009138A1/fr

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/22—Apparatus or processes for the manufacture of optical heads, e.g. assembly
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
    • G11B7/127—Lasers; Multiple laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC

Definitions

  • the present invention relates to a semiconductor laser device.
  • the present invention relates to a semiconductor laser device mounted on an optical pickup device for recording or reproducing an information signal on an optical information recording medium, and an optical pickup device including the semiconductor laser device.
  • An optical pickup device is a device that records and reproduces information signals such as audio signals, character signals, and video signals on an optical disc that is an optical information recording medium.
  • the optical pickup device records information signals by irradiating a signal recording surface such as an optical disk with laser light to fill in a recording mark.
  • the optical pickup device performs reproduction by irradiating the signal recording surface with laser light and receiving the reflected light of the laser light with a photodetector.
  • the optical pickup device includes a semiconductor laser device that defines the emission direction of the laser light, and a semiconductor laser element that emits the laser light is mounted on the semiconductor laser device.
  • optical pickup devices such as those used in thin notebook personal computers, have been reduced in size and density. As a result, the entire optical pickup device is also affected by the heat generated by the semiconductor laser element, and may operate under high temperature conditions.
  • the semiconductor laser element is further deteriorated due to an increase in driving current in addition to deterioration due to high temperature, and the element life is further shortened. It is also used in optical pickup devices or semiconductor laser devices due to high temperatures.
  • the adhesive for fixing each component softens, and the fixing position of each component varies. As a result, the performance of the semiconductor laser device and the optical pickup device may be deteriorated.
  • Patent Document 1 discloses a method of bringing a casing or frame structure of a semiconductor laser element having a resin or ceramic power into contact with a metal body or the like (heat sink) having a large heat capacity.
  • a movable bobbin housing an optical system including a semiconductor laser element, a light receiving element, a prism, a lens, and the like and a heat radiating plate are integrally molded.
  • Patent Document 2 also discloses a method of promoting heat dissipation using a heat sink.
  • a method using a heat sink is expensive because a separate heat sink is provided and the structure is complicated, and the number of steps in the manufacturing process increases.
  • Patent Document 4 discloses a conventional semiconductor laser device that holds an optical axis direction by pressing an optical unit including a semiconductor laser element against an optical base.
  • FIG. 42 is an exploded perspective view showing a configuration of a conventional semiconductor laser device. As shown in FIG. 42, in a conventional semiconductor laser device, an optical unit 210 including a semiconductor laser element 206 is fitted into a mounting portion 218 of an optical base 202. At that time, the protruding section 212 of the holding metal plate 217 attached to the optical base 202 comes into contact with the semiconductor laser element 206, and the pressing bent piece 216 presses the optical unit 210 against the optical base 202.
  • FIG. 43 is a side view schematically showing the configuration of a conventional semiconductor laser device
  • FIG. 44 is a perspective view schematically showing the configuration of a conventional semiconductor laser device. As shown in FIGS.
  • an optical unit including a slide holder 204 and a tilt holder 203 is installed inside an optical base 202.
  • the slide holder 204 is in contact with the inner surface of the optical base 202, and the tilt holder 203 is installed in contact with the slide holder 204.
  • the slide holder 204 has a concave portion 204a that is substantially spherical.
  • the cavity holder 203 has a convex portion 203a having a substantially spherical shape, and a semiconductor package 205 which is a space is formed therein.
  • a semiconductor laser element 206 is installed!
  • a heat radiating plate 212 is installed on a surface opposite to the convex portion 203 a via heat radiating grease 211.
  • the heat radiating plate 212 is connected to the optical base 202 and dissipates heat by transferring the heat generated by the semiconductor laser element 206 to the optical base 202.
  • the heat generated by the semiconductor laser element 206 is also radiated to the optical base 202 through the tilt holder 203 and the slide holder 204.
  • a method for adjusting the optical axis of the laser beam 207 emitted from the semiconductor laser element 206 in the semiconductor laser device 201 will be described.
  • the heat dissipation grease 211 and the heat dissipation plate 212 are not installed.
  • the X-axis is the left-right direction
  • the Y-axis is the up-down direction
  • the Z-axis is the direction perpendicular to the page.
  • the tilt holder 203 and the slide holder 204 are pressed against the optical base 202.
  • the slide holder 204 can be slid along the optical base 202, and can be moved freely along the ZX plane with force S.
  • a tilt holder 203, a slide holder 204, and an optical base 202 are sequentially arranged in the direction in which the laser beam 207 of the semiconductor laser element 206 is emitted. These include through-holes 213, 214 and 21 that are the optical path of the laser beam 207. 5 is formed.
  • the tilt holder 203 and the slide holder 204, and the slide holder 204 and the optical base 202 are fixed so that the optical axis does not fluctuate.
  • an adhesive is filled between the tilt holder 203 and the slide holder 204 and between the slide holder 204 and the optical base 202, and they are fixed so that they are not powered.
  • the heat radiating plate 212 is installed in the tilt holder 203, and the heat radiating grease 215 is filled in the gap between the heat radiating plate 212 and the tilt holder 203.
  • the thermal power generated from the semiconductor laser element 206 is emitted from the optical holder 203 to the optical base 202 through the slide holder 204.
  • heat is dissipated to the optical base 202 from the surface where the heat dissipating grease 211 and the heat dissipating plate 212 are installed in the tilt holder 203.
  • Patent Document 1 JP-A-8-287499
  • Patent Document 2 Japanese Patent Laid-Open No. 11-16202
  • Patent Document 3 Japanese Patent Laid-Open No. 2003-22555
  • Patent Document 4 Japanese Unexamined Patent Publication No. 2003-123297
  • the position where the tilt holder 203 is in contact with the slide holder 204 is only the convex portion 203a, and its area is small. Further, since the plane parallel to the XY plane and the plane parallel to the YZ plane of the holder 120 are not connected to the optical base 202, heat is not radiated from these planes. In addition, when heat is radiated to the optical base 202 through the heat radiating grease 211 and the heat radiating plate 212, the thermal resistance is higher than when heat is radiated to the optical base 202 through the tilt holder 203 and the slide holder 204.
  • the heat dissipation from the heat sink 212 side is smaller than the heat dissipation from the slide holder 204 side.
  • the semiconductor laser device 201 will run out of temperature as soon as the semiconductor laser device 201 reaches a high temperature due to heat generated by the semiconductor laser element 206 having low heat dissipation efficiency.
  • the present invention has been made in view of the above-described problems, and is a semiconductor laser having high heat dissipation efficiency. It is an object to provide a single device and an optical pickup device.
  • the first semiconductor laser device includes a slide holder having a space in which a semiconductor laser element is installed, a slide holder into which the slide holder is fitted, a tilt holder having a groove larger than the outer shape of the slide holder, and the tilt holder is fitted into the slide holder.
  • An optical base having a hole, the tilt holder is fitted and fixed in the hole of the optical base, and the slide holder is fitted and fixed in a groove of the tilt holder.
  • the second semiconductor laser device includes a tilt holder having a space in which a semiconductor laser element is installed, a slide holder having a hole into which the tilt holder is fitted, and the slide holder into which the slide holder is fitted. Larger than the outer shape! And an optical base having a gutter groove, wherein the slide holder is fitted and fixed in the groove of the optical base, and the tilt holder is fitted and fixed in the hole of the slide holder.
  • an optical pickup device including the first or second semiconductor laser device.
  • FIG. 1 is a plan view showing a configuration of a semiconductor laser device according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view taken along the line AA in FIG.
  • FIG. 3 is an exploded perspective view of the semiconductor laser device according to the first embodiment of the present invention.
  • FIG. 4 is a perspective view showing the configuration of the semiconductor laser device according to the first embodiment of the present invention.
  • FIG. 5 is a plan view showing a configuration of a semiconductor laser device according to Embodiment 2 of the present invention.
  • FIG. 6 is a cross-sectional view taken along the line BB in FIG. 7]
  • FIG. 7 is an exploded perspective view of the semiconductor laser device according to the second embodiment of the present invention. 8]
  • FIG. 8 is a perspective view showing the configuration of the semiconductor laser device according to the second embodiment of the present invention.
  • FIG. 9 is a plan view showing the configuration of the semiconductor laser device according to the third embodiment of the present invention.
  • FIG. 10 is a cross-sectional view taken along the arrow CC in FIG.
  • FIG. 11 is an exploded perspective view of the semiconductor laser device according to the third embodiment of the present invention.
  • FIG. 12 is a perspective view showing the configuration of the semiconductor laser device according to the third embodiment of the present invention. .
  • FIG. 13 is a plan view showing the configuration of the semiconductor laser device according to the fourth embodiment of the present invention.
  • FIG. 14 is a cross-sectional view taken along the arrow D-D in FIG.
  • FIG. 15 is an exploded perspective view of the semiconductor laser device according to the fourth embodiment of the present invention.
  • FIG. 16 is a perspective view showing the configuration of the semiconductor laser device according to the fourth embodiment of the present invention. .
  • FIG. 17 is a plan view showing the configuration of the semiconductor laser device according to the fifth embodiment of the present invention.
  • FIG. 18 is a cross-sectional view taken along the line EE in FIG.
  • FIG. 19 is an exploded perspective view of the semiconductor laser device according to the fifth embodiment of the present invention.
  • FIG. 20 is a perspective view showing the configuration of the semiconductor laser device according to the fifth embodiment of the present invention. .
  • FIG. 21 is a plan view showing the configuration of the semiconductor laser device according to the sixth embodiment of the present invention.
  • FIG. 22 is a cross-sectional view taken along the line FF in FIG.
  • FIG. 23 is an exploded perspective view of the semiconductor laser device according to the sixth embodiment of the present invention.
  • FIG. 24 is a perspective view showing the configuration of the semiconductor laser device according to the sixth embodiment of the present invention.
  • FIG. 25 is a plan view showing the configuration of the semiconductor laser device according to the seventh embodiment of the present invention.
  • FIG. 26 is a cross-sectional view taken along the line GG in FIG.
  • FIG. 27 is an exploded perspective view of the semiconductor laser device according to the seventh embodiment of the present invention.
  • FIG. 28 is a perspective view showing the configuration of the semiconductor laser device according to the seventh embodiment of the present invention. .
  • FIG. 29 is a plan view showing the configuration of the semiconductor laser device according to the eighth embodiment of the present invention.
  • FIG. 30 is a cross-sectional view taken along arrows H—H in FIG.
  • FIG. 31 is an exploded perspective view of the semiconductor laser device according to the eighth embodiment of the present invention.
  • FIG. 32 is a perspective view showing the configuration of the semiconductor laser device according to the eighth embodiment of the present invention. .
  • FIG. 33 is a plan view showing the configuration of the semiconductor laser device according to the ninth embodiment of the present invention.
  • FIG. 34 is a cross-sectional view taken along the line II of FIG.
  • FIG. 35 is an exploded perspective view of the semiconductor laser device according to the ninth embodiment of the present invention.
  • FIG. 36 is a perspective view showing the configuration of the semiconductor laser device according to the ninth embodiment of the present invention. .
  • FIG. 37 is a plan view showing the configuration of the semiconductor laser device according to the tenth embodiment of the present invention.
  • FIG. 38 is a cross-sectional view taken along the arrow J J in FIG.
  • FIG. 39 is an exploded perspective view of the semiconductor laser device according to the tenth embodiment of the present invention.
  • FIG. 40 is a perspective view showing the configuration of the semiconductor laser apparatus according to the tenth embodiment of the present invention.
  • FIG. 41 is a plan view showing the configuration of the optical pickup device according to the eleventh embodiment of the present invention.
  • FIG. 42 is an exploded perspective view showing a configuration of a conventional semiconductor laser device.
  • FIG. 43 is a side view schematically showing a configuration of a conventional semiconductor laser device.
  • FIG. 44 is a perspective view schematically showing a configuration of a conventional semiconductor laser device. BEST MODE FOR CARRYING OUT THE INVENTION
  • the first or second semiconductor laser device has a high heat dissipation efficiency, and the temperature rise is small. Therefore, it is possible to reduce the cost without using a heat sink or the like. In addition, it has a long service life with little deterioration due to heat. In addition, since the structure is simple and the optical axis can be easily adjusted, the manufacturing cost is low.
  • the fitting portion between the hole of the optical base and the tilt holder has a shape that allows the tilt holder to rotate about at least one axis with respect to the optical base.
  • the slide holder is fitted in a groove of the tilt holder, and the tilt holder and the slide holder are fixed to! /, NA! /.
  • the fitting portion between the slide holder and the groove of the tilt holder has a shape that allows the slide holder to move parallel to at least one surface with respect to the tilt holder.
  • the fitting portion between the hole of the optical base and the tilt holder has a shape in which the tilt holder can rotate around at least one axis with respect to the optical base, and the groove is formed in the groove of the tilt holder.
  • the slide holder fits in and When the slider and the slide holder are fixed to form a small ridge, the fitting portion between the slide holder and the groove of the tilt holder is parallel to at least one surface of the slide holder with respect to the tilt holder.
  • the fitting portion between the hole of the optical base and the tilt holder is a state in which the tilt holder is fitted into the hole of the optical base.
  • the tilt holder has a shape rotatable around at least one axis with respect to the optical base, and after the optical axis is adjusted, the optical base and the tilt holder are fixed.
  • the fitting portion between the slide holder and the groove of the tilt holder is in a state where the slide holder is fitted in the groove of the tilt holder.
  • the slide holder has a shape that can move in parallel to at least one surface with respect to the tilt holder, and after the optical axis is adjusted, the tilt holder and the slide holder are fixed.
  • the fitting portion between the hole of the optical base and the tilt holder is a state in which the tilt holder is fitted into the hole of the optical base.
  • the tilt holder has a shape rotatable around at least one axis with respect to the optical base, and a fitting portion between the slide holder and the groove of the tilt holder has the slide in the groove of the tilt holder.
  • the slide holder has a shape that can move in parallel to at least one surface with respect to the tilt holder, and the optical base and the tilt holder are fixed after the optical axis is adjusted. The tilt holder and the slide holder are fixed.
  • the tilt holder has a shape obtained by dividing a substantially spherical body by a plane, and an inner surface of the hole of the optical base is substantially spherical.
  • the substantially spherical convex portion of the tilt holder is fitted in the hole of the optical base.
  • the tilt holder has a substantially cylindrical shape having a substantially spherical concave portion on a bottom surface, and a hole portion of the optical base is substantially on a bottom surface. It has a convex portion that is spherical, the side surface is substantially cylindrical, and the convex portion fits into the concave portion. It is crowded.
  • the tilt holder has a substantially columnar shape, and the inner surface of the hole of the optical base has a substantially cylindrical surface shape.
  • the slide holder has a shape obtained by dividing a substantially circular cylinder by a plane parallel to a plane including the axis thereof, and an inner surface of the groove of the tilt holder includes: A convex portion that is substantially cylindrical and has a substantially cylindrical side surface of the slide holder is fitted in the groove of the tilt holder.
  • the slide holder has a concave portion having a substantially cylindrical shape on a bottom surface, and the groove of the tilt holder has a substantially cylindrical side surface shape on the bottom surface. It has a certain convex part, and the convex part is fitted in the concave part.
  • the slide holder is fitted in a groove of the optical base, and the optical base and the slide holder are not fixed.
  • the fitting portion between the groove of the optical base and the slide holder has a shape in which the slide holder can move in parallel to at least one surface with respect to the optical base.
  • the tilt holder is fitted into the hole of the slide holder, and the slide holder and the tilt holder are fixed to form a small bowl.
  • the fitting portion between the hole of the slide holder and the tilt holder has a shape that allows the tilt holder to rotate about at least one axis with respect to the slide holder.
  • the slide holder is fitted in a groove of the optical base, and the optical base and the slide holder are not fixed.
  • the fitting portion between the groove of the optical base and the slide holder has a shape in which the slide holder can move in parallel to at least one surface with respect to the optical base, and the slide holder
  • the fitting portion between the hole portion of the slide holder and the tilt holder is the The slide holder has a shape that can rotate around at least one axis.
  • the fitting portion between the groove of the optical base and the slide holder is a state in which the slide holder is fitted in the groove of the optical base.
  • the slide holder has a shape movable in parallel to at least one surface with respect to the optical base, and the optical base and the slide holder are fixed after the optical axis is adjusted.
  • the fitting portion between the hole portion of the slide holder and the tilt holder is in a state where the tilt holder is fitted in the hole portion of the slide holder.
  • the tilt holder has a shape rotatable about at least one axis with respect to the slide holder, and after the optical axis is adjusted, the slide holder and the tilt holder are fixed.
  • the fitting portion between the groove of the optical base and the slide holder is a state in which the slide holder is fitted in the groove of the optical base.
  • the slide holder has a shape that can move in parallel to at least one surface with respect to the optical base, and the fitting portion between the hole of the slide holder and the tilt holder is a hole of the slide holder.
  • the tilt holder has a shape rotatable around at least one axis with respect to the slide holder in a state in which the tilt holder is fitted in a portion, and the optical base and the slide are adjusted after the optical axis is adjusted. A holder is fixed, and the slide holder and the tilt holder are fixed.
  • the tilt holder has a shape obtained by dividing a substantially spherical body by a plane, and an inner surface of the hole of the slide holder is substantially spherical, A convex portion having a substantially spherical shape of the tilt holder is fitted in the hole of the slide holder.
  • the tilt holder has a substantially columnar shape, and an inner surface of the hole of the slide holder has a substantially cylindrical surface shape.
  • the tilt holder has a substantially cylindrical shape having a substantially spherical concave portion on a bottom surface, and the hole portion of the slide holder is substantially on the bottom surface.
  • a convex portion having a spherical shape is provided, a side surface is substantially cylindrical, and the convex portion is fitted in the concave portion.
  • the tilt holder is substantially cylindrical, and the hole of the slide holder has a depth equal to or greater than a thickness of the tilt holder, Is substantially cylindrical.
  • the slide holder has a shape obtained by dividing a substantially circular cylinder by a plane parallel to a plane including the axis thereof, and an inner surface of a groove of the optical base Is a substantially cylindrical surface, and is a convex portion which is a substantially cylindrical side surface of the slide holder. The force is fitted in the groove of the optical base.
  • the slide holder has a concave portion having a substantially cylindrical surface shape on a bottom surface, and the groove of the optical base has a substantially cylindrical side surface shape on the bottom surface. And the convex portion is fitted into the concave portion.
  • the optical pickup device since the optical pickup device includes the first or second semiconductor laser device, the optical pickup device has high heat dissipation efficiency and little temperature rise. Therefore, malfunction due to temperature rise does not occur.
  • FIG. 1 is a plan view showing the configuration of the semiconductor laser device according to the first embodiment of the present invention.
  • 2 is a cross-sectional view taken along the line AA in FIG.
  • FIG. 3 is an exploded perspective view of the semiconductor laser device according to the first embodiment of the present invention.
  • FIG. 4 is a perspective view showing the configuration of the semiconductor laser apparatus according to Embodiment 1 of the present invention.
  • the X-axis is the left-right direction
  • the Y-axis is the up-down direction
  • the Z-axis is the direction perpendicular to the page.
  • the semiconductor laser device 1 includes an optical base 2, a tilt holder 3, and a slide holder 4.
  • a semiconductor package 5 which is a space is formed in the slide holder 4. Inside the semiconductor package 5, electronic components such as the semiconductor laser element 6 are installed. The semiconductor laser element 6 emits laser light 7. Laser light 7 emitted from the semiconductor laser element 6 is emitted to the outside of the optical base 2.
  • the optical base 2 is formed with a hole 2a whose inner surface is substantially spherical.
  • the rudder 3 has a shape that is obtained by dividing a substantially spherical body by a plane, and includes a convex portion 3a that is substantially spherical.
  • the groove holder 3 is formed with a substantially rectangular groove 3b.
  • the convex portion 3 a of the tilt holder 3 is fitted and fixed in the hole 2 a of the optical base 2, and the slide holder 4 is fitted and fixed in the groove 3 b of the tilt holder 3.
  • the groove 3b is larger than the outer shape of the slide holder 4. That is, the length of the groove 3b in the X-axis direction is longer than the length of the slide holder 4 in the X-axis direction.
  • the length (depth) of the groove 3b in the Z-axis direction is longer than the length (thickness) of the slide holder 4 in the Z-axis direction.
  • the semiconductor laser device 1 transmits heat from the semiconductor laser element 6 that generates heat by emitting the laser light 7 to the slide holder 4 and the tilt holder 3 in this order, and heat radiation grease. Directly transmitted from the tilt holder 3 to the optical base 2 without using a heat sink or the like. With this configuration, the semiconductor laser device 1 can achieve high heat dissipation efficiency. In addition, since the majority of the surface area of the holder holder 3 is in contact with the optical base 2, the amount of heat released to the optical base 2 is large.
  • the laser beam 7 emitted from the semiconductor laser element 6 installed inside the semiconductor package 5 is emitted to the outside of the optical base 2.
  • the slide holder 4, the tilt holder 3 and the optical base 2 are respectively formed with through holes (not shown) which are optical paths of the laser light 7.
  • the convex portion 3 a of the tilt holder 3 is fitted into the hole portion 2 a of the optical base 2. Then, the protrusion 3a can be slid with respect to the hole 2a, and the tilt holder 3 can be rotated about the X-axis, Y-axis, and Z-axis directions in the figure. Thereby, since the semiconductor laser element 6 also rotates, the direction of the optical axis of the laser light 7 can be changed. In this way, when the direction of the optical axis of the laser beam 7 becomes a desired direction, the rotation of the tilt holder 3 is stopped.
  • the contact area between the protrusion 3a and the hole 2a is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the slide holder 4 is fitted in the groove 3 b of the tilt holder 3. Then, the length of the groove 3b and the slide holder 4 in the Y-axis direction are almost equal.
  • the length of the groove 3b in the X-axis and Z-axis directions is larger than the length of the slide holder 4 in the X-axis and Z-axis directions. Therefore, the slide holder 4 can be moved in the direction parallel to the ZX plane along the inner surface of the groove 3b. Thereby, the position of the optical axis of the laser beam 7 can be changed. In this way, when the direction of the optical axis of the laser beam 7 becomes a desired direction, the movement of the slide holder 4 is stopped.
  • the contact area between the slide holder 4 and the groove 3b is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the optical base 2, the tilt holder 3, the tilt holder 3, and the slide holder 4 And are fixed respectively.
  • the semiconductor laser device 1 according to the first embodiment has an effect that the emission direction of the laser light 7 can be easily adjusted and the heat dissipation efficiency is high. .
  • FIG. 5 is a plan view showing the configuration of the semiconductor laser device according to the second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view taken along the line BB in FIG.
  • FIG. 7 is an exploded perspective view of the semiconductor laser device according to the second embodiment of the present invention.
  • FIG. 8 is a perspective view showing the configuration of the semiconductor laser device according to Embodiment 2 of the present invention.
  • the X-axis is the left-right direction
  • the Y-axis is the up-down direction
  • the Z-axis is the direction perpendicular to the page.
  • the same reference numerals are given to the same configurations as those of the semiconductor laser device 1 described in the first embodiment, and the description thereof is omitted.
  • the semiconductor laser device 11 includes an optical base 12, a tilt holder 13, and a slide holder 4.
  • the optical base 12 is formed with a hole 12a whose inner surface is substantially cylindrical. Further, the tilt holder 13 has a substantially cylindrical shape, and is formed with a substantially rectangular groove 13a.
  • the tilt holder 13 is fitted and fixed in the hole 12 a of the optical base 12, and the slide holder 4 is fitted and fixed in the groove 13 a of the tilt holder 13.
  • the groove 13a is larger than the outer shape of the slide holder 4. That is, the length of the groove 13a in the X-axis direction is longer than the length of the slide holder 4 in the X-axis direction. Further, the length (depth) of the groove 13a in the Z-axis direction is longer than the length (thickness) of the slide holder 4 in the Z-axis direction.
  • the semiconductor laser device 11 transmits heat from the semiconductor laser element 6 that generates heat by emitting the laser light 7 to the slide holder 4 and the tilt holder 13 in this order, and heat radiation grease. It is transmitted directly from the tilt holder 13 to the optical base 12 without using a heat sink or the like. With this configuration, the semiconductor laser device 11 can achieve high heat dissipation efficiency. Furthermore, since most of the surface area of the tilt holder 13 is in contact with the optical base 12, the heat radiation to the optical base 12 is large.
  • the laser light 7 emitted from the semiconductor laser element 6 installed inside the semiconductor package 5 is emitted outside the optical base 12.
  • the slide holder 4, the tilt holder 13, and the optical base 12 are each formed with a through hole (not shown) that is an optical path of the laser beam 7.
  • the tilt holder 13 is fitted into the hole 12 a of the optical base 12. Then, the tilt holder 13 can be slid with respect to the hole 12a, and the tilt holder 13 can be rotated about the Z-axis direction in the figure. Thereby, since the semiconductor laser element 6 also rotates, the direction of the optical axis of the laser light 7 can be changed. In this way, when the direction of the optical axis of the laser beam 7 becomes a desired direction, the rotation of the tilt holder 13 is stopped.
  • the contact area between the tilt holder 13 and the hole 12a is relatively large, the desired frictional force between the two is desired. It is easy to stop at the position.
  • the slide holder 4 is fitted into the groove 13 a of the tilt holder 13. Then, the lengths of the groove 13a and the slide holder 4 in the Y-axis direction are almost equal.
  • the length of the groove 13a in the X-axis and Z-axis directions is longer than the length of the slide holder 4 in the X-axis and Z-axis directions. Therefore, the slide holder 4 can be moved in a direction parallel to the ZX plane along the inner surface of the groove 13a. Thereby, the position of the optical axis of the laser beam 7 can be changed. In this manner, when the direction of the optical axis of the laser beam 7 becomes a desired direction, the movement of the slide holder 4 is stopped.
  • the contact area between the slide holder 4 and the groove 13a is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the optical base 12, the tilt holder 13, the tilt holder 13 and the slide holder 4 are fixed respectively.
  • an adhesive may be filled between the optical base 12 and the tilt holder 13 and between the tilt holder 13 and the slide holder 4, respectively.
  • the semiconductor laser device 11 according to the second embodiment has an effect that the emission direction of the laser light 7 can be easily adjusted and the heat dissipation efficiency is high. .
  • FIG. 9 is a plan view showing the configuration of the semiconductor laser device according to the third embodiment of the present invention.
  • FIG. 10 is a cross-sectional view taken along the line CC in FIG.
  • FIG. 11 is an exploded perspective view of the semiconductor laser device according to the third embodiment of the present invention.
  • FIG. 15 is a perspective view showing the configuration of the semiconductor laser apparatus according to Embodiment 3 of the present invention.
  • the X-axis is the left-right direction
  • the Y-axis is the up-down direction
  • the Z-axis is the direction perpendicular to the page.
  • the same reference numerals are given to the same configurations as those of the semiconductor laser device 1 described in the first embodiment, and the description thereof is omitted.
  • the semiconductor laser device 21 includes an optical base 22, a tilt holder 23, and a slide holder 4.
  • the laser beam 7 emitted from the semiconductor laser element 6 installed inside the semiconductor package 5 formed on the slide holder 4 is emitted to the outside of the optical base 22.
  • the optical base 22 is formed with a hole 22a having a substantially spherical surface on the bottom surface and a substantially cylindrical surface on the side surface. Further, the tilt holder 23 has a substantially cylindrical shape having a substantially spherical concave portion 23a on the bottom surface. Furthermore, the hollow holder 23 is formed with a substantially rectangular groove 23b.
  • a tilt holder 23 is fitted and fixed in the hole 22 a of the optical base 22.
  • the convex portion 22 b of the optical base 22 is fitted into the concave portion 23 a of the tilt holder 23.
  • the slide holder 4 is fitted and fixed in the groove 23b of the air holder 23.
  • the groove 23b is larger than the outer shape of the slide holder 4. That is, the length of the groove 23b in the X-axis direction is longer than the length of the slide holder 4 in the X-axis direction. Also, the length (depth) of the groove 23b in the Z-axis direction is longer than the length (thickness) of the slide holder 4 in the Z-axis direction!
  • the semiconductor laser device 21 of the third embodiment transmits heat from the semiconductor laser element 6 that generates heat by emitting the laser light 7 to the slide holder 4 and the tilt holder 23 in this order, Directly transmitted from the tilt holder 23 to the optical base 22 without using a heat sink or the like.
  • the semiconductor laser device 21 can achieve high heat dissipation efficiency.
  • the majority of the surface area of the tilt holder 23 is in contact with the optical base 22, the amount of heat radiation to the optical base 22 is large.
  • the laser light 7 emitted from the semiconductor laser element 6 installed inside the semiconductor package 5 is emitted to the outside of the optical base 22.
  • the slide holder 4, the tilt holder 23 and the optical base 22 are each formed with a through hole (not shown) which is an optical path of the laser beam 7.
  • a method for adjusting the optical axis of the laser beam 7 emitted from the semiconductor laser element 6 in the semiconductor laser device 21 having such a configuration will be described.
  • the optical base 22 and the tilt holder 23, and the tilt holder 23 and the slide holder 4 are not fixed, respectively.
  • the convex portion 22 b of the optical base 22 is fitted into the concave portion 23 a of the tilt holder 23.
  • the concave portion 23a is slid with respect to the convex portion 22b, and the tilt holder 23 is moved to the X-axis, Y-axis, and And can be rotated around the Z-axis direction.
  • the semiconductor laser element 6 also rotates, so that the direction of the optical axis of the laser light 7 can be changed.
  • the rotation of the tilt holder 23 is stopped.
  • the contact area between the convex portion 22b and the concave portion 23a is relatively large, it is easy to stop at a desired position by the frictional force between them.
  • the slide holder 4 is fitted into the groove 23b of the tilt holder 23. Then, the lengths of the groove 23b and the slide holder 4 in the Y-axis direction are almost equal.
  • the length of the groove 23b in the X-axis and Z-axis directions is longer than the length of the slide holder 4 in the X-axis and Z-axis directions. Therefore, in the groove 23b, the slide holder 4 can be moved in a direction parallel to the ZX plane. As a result, the position of the optical axis of the laser beam 7 can be changed. In this way, the movement of the slide holder 4 is stopped when the direction of the optical axis of the laser beam 7 becomes a desired direction.
  • the contact area between the slide holder 4 and the groove 23b is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the optical axis of the semiconductor laser device 21 is adjusted by the above-described method so that the laser beam 7 reaches a desired position, and then the optical base 22 and the tilt holder 23, the tilt holder 23 and the slide holder 4 Are fixed respectively.
  • an adhesive may be filled between the optical base 22 and the tilt holder 23 and between the tilt holder 23 and the slide holder 4, respectively.
  • the semiconductor laser device 21 according to the third embodiment has an effect that the emission direction of the laser light 7 can be easily adjusted and the heat dissipation efficiency is high. .
  • FIG. 13 is a plan view showing the configuration of the semiconductor laser device according to the fourth embodiment of the present invention.
  • 14 is a cross-sectional view taken along the line DD in FIG.
  • FIG. 15 is an exploded perspective view of the semiconductor laser device according to Embodiment 4 of the present invention.
  • FIG. 16 is a perspective view showing the configuration of the semiconductor laser apparatus according to Embodiment 4 of the present invention.
  • the X-axis is the left-right direction
  • the Y-axis is the up-down direction
  • the Z-axis is the direction perpendicular to the page.
  • the semiconductor laser device 31 according to the fourth embodiment includes an optical base 32, a tilt holder 33, and a slide holder 34! /.
  • a semiconductor package 35 that is a space is formed in the air holder 33. Inside the semiconductor package 35, electronic components such as the semiconductor laser element 36 are installed. The semiconductor laser element 36 emits laser light 37. Laser light 37 emitted from the semiconductor laser element 36 is emitted to the outside of the optical base 32.
  • the optical base 32 is formed with a substantially rectangular groove 32a. Further, the slide holder 34 is formed with a hole 34a whose inner surface is substantially spherical.
  • the hollow holder 33 has a shape obtained by dividing a substantially spherical body by a plane, and includes a convex portion 33a having a substantially spherical shape.
  • the slide holder 34 is fitted and fixed in the groove 32 a of the optical base 32.
  • the groove 32 a is larger than the outer shape of the slide holder 34. That is, the length of the groove 32a in the X-axis direction is longer than the length of the slide holder 34 in the X-axis direction. Further, the length (depth) of the groove 32a in the Z-axis direction is longer than the length (thickness) of the slide holder 34 in the Z-axis direction. Further, the projection 33a of the tilt holder 33 is fitted and fixed in the hole 34a of the slide holder 34.
  • the semiconductor laser device 31 of the fourth embodiment transmits heat from the semiconductor laser element 36, which generates heat by emitting the laser light 37, to the tilt holder 33 and the slide holder 34 in this order, and dissipates heat.
  • the light is transmitted directly from the slide holder 34 to the optical base 32 without using grease or a heat sink.
  • the semiconductor laser device 31 can achieve high heat dissipation efficiency. Furthermore, since most of the surface area of the slide holder 34 is in contact with the optical base 32, the amount of heat released to the optical base 32 is large.
  • the laser light 37 emitted from the semiconductor laser element 36 installed inside the semiconductor package 35 is emitted outside the optical base 32.
  • a through-hole (not shown) that is an optical path of the laser beam 37 is formed in each of the tilt holder 33, the slide holder 34, and the optical base 32.
  • a method of adjusting the optical axis of the laser light 37 emitted from the semiconductor laser element 36 in the semiconductor laser device 31 having the above configuration will be described.
  • the optical base 32 and the slide holder 34, and the slide holder 34 and the tilt holder 33 are not fixed, respectively.
  • the convex portion 33 a of the tilt holder 33 is fitted into the hole 34 a of the slide holder 34.
  • the convex portion 33a can be slid with respect to the hole portion 34a, and the tilt holder 33 can be rotated about the X-axis, Y-axis, and Z-axis directions in the figure.
  • the semiconductor laser element 36 since the semiconductor laser element 36 also rotates, the direction of the optical axis of the laser light 37 can be changed. In this way, when the direction of the optical axis of the laser beam 37 becomes a desired direction, the rotation of the tilt holder 33 is stopped.
  • the contact area between the convex portion 33a and the hole portion 34a is relatively large, it is easy to stop at a desired position due to the frictional force therebetween.
  • the slide holder 34 is fitted into the groove 32 a of the optical base 32. Then, the length in the Y-axis direction of each of the groove 32a and the slide holder 34 is almost equal.
  • the length in the X-axis and Z-axis direction of the groove 32a is larger than the length of the slide holder 34 in the X-axis and Z-axis direction. Since it is long, the slide holder 34 can be moved in the direction parallel to the ZX plane in the groove 32a. Thereby, the position of the optical axis of the laser beam 37 can be changed. In this way, when the direction of the optical axis of the laser beam 37 becomes a desired direction, the movement of the slide holder 34 is stopped.
  • the contact area between the slide holder 34 and the groove 32a is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the optical axis of the semiconductor laser device 31 is adjusted by the above-described method so that the laser light 37 reaches a desired position, and then the optical base 32 and the slide holder 34, the slide holder 34, and the tilt holder 33. And are fixed respectively.
  • an adhesive may be filled between the optical base 32 and the slide holder 34 and between the slide holder 34 and the tilt holder 33, respectively.
  • the semiconductor laser device 31 according to the fourth embodiment has the effects that the emission direction of the laser light 37 can be easily adjusted and the heat dissipation efficiency is high.
  • FIG. 17 is a plan view showing the configuration of the semiconductor laser device according to the fifth embodiment of the present invention.
  • 18 is a cross-sectional view taken along the line E-E in FIG.
  • FIG. 19 is an exploded perspective view of the semiconductor laser device according to Embodiment 5 of the present invention.
  • FIG. 20 shows an embodiment of the present invention.
  • FIG. 6 is a perspective view showing a configuration of a semiconductor laser device according to mode 5.
  • the X axis is the left-right direction
  • the Y axis is the up-down direction
  • the Z-axis is the direction perpendicular to the page.
  • the same reference numerals are given to the same components as those of the semiconductor laser device 31 described in the fourth embodiment, and the description thereof is omitted.
  • the semiconductor laser device 41 includes an optical base 32, a tilt holder 43, and a slide holder 44.
  • a semiconductor package 35 that is a space is formed in the air holder 43. Inside the semiconductor package 35, electronic components such as the semiconductor laser element 36 are installed. The semiconductor laser element 36 emits laser light 37. Laser light 37 emitted from the semiconductor laser element 36 is emitted to the outside of the optical base 32.
  • the optical base 32 is formed with a substantially rectangular groove 32a.
  • Slide holder 4
  • the hollow holder 43 has a substantially cylindrical shape.
  • a slide holder 44 is fitted and fixed in the groove 32a of the optical base 32.
  • the groove 32 a is larger than the outer shape of the slide holder 44. That is, the length of the groove 32a in the X-axis direction is longer than the length of the slide holder 44 in the X-axis direction.
  • the length (depth) of the groove 32a in the Z-axis direction is longer than the length (thickness) of the slide holder 44 in the Z-axis direction.
  • the tilt holder 43 is fitted and fixed in the hole 44 a of the slide holder 44.
  • the semiconductor laser device 41 of the fifth embodiment transmits heat from the semiconductor laser element 36, which generates heat by emitting the laser light 37, to the tilt holder 43 and the slide holder 44 in this order, and dissipates heat.
  • the light is transmitted directly from the slide holder 44 to the optical base 32 without using grease or a heat sink.
  • the semiconductor laser device 41 can achieve high heat dissipation efficiency. Furthermore, since most of the surface area of the slide holder 44 is in contact with the optical base 32, the amount of heat radiation to the optical base 32 is large.
  • the laser light 37 emitted from the semiconductor laser element 36 installed inside the semiconductor package 35 is emitted outside the optical base 32.
  • the hollow holder 43, the slide holder 44, and the optical base 32 have through holes (not shown) that are optical paths of the laser light 37. Are formed respectively.
  • the tilt holder 43 is fitted into the hole 44 a of the slide holder 44. Then, the tilt holder 43 can be slid with respect to the slide holder 44 and the tilt holder 33 can be rotated around the Z-axis direction in the figure. Thereby, the semiconductor laser element 36 also rotates, so that the direction of the optical axis of the laser light 37 can be changed. In this way, when the direction of the optical axis of the laser beam 37 becomes a desired direction, the rotation of the tilt holder 43 is stopped.
  • the contact area between the tilt holder 43 and the hole 44a is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the slide holder 44 is fitted into the groove 32 a of the optical base 32. Then, the length in the Y-axis direction of each of the groove 32a and the slide holder 44 is almost equal.
  • the length in the X-axis and Z-axis direction of the groove 32a is larger than the length of the slide holder 44 in the X-axis and Z-axis direction. Since it is long, the slide holder 44 can be moved in the direction parallel to the ZX plane in the groove 32a. Thereby, the position of the optical axis of the laser beam 37 can be changed. In this way, the movement of the slide holder 44 is stopped when the optical axis direction of the laser beam 37 becomes a desired direction.
  • the contact area between the slide holder 44 and the groove 32a is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the optical axis of the semiconductor laser device 41 is adjusted by the above-described method so that the laser beam 37 reaches a desired position, and then the optical base 32 and the slide holder 44, and the slide holder 44 and the tilt holder 43 And are fixed respectively.
  • an adhesive may be filled between the optical base 32 and the slide holder 44 and between the slide holder 44 and the tilt holder 43, respectively.
  • the semiconductor laser device 41 according to the fifth embodiment has an effect that the emission direction of the laser light 37 can be easily adjusted and the heat dissipation efficiency is high.
  • FIG. 21 is a plan view showing the configuration of the semiconductor laser device according to the sixth embodiment of the present invention. 22 is a cross-sectional view taken along the line FF in FIG.
  • FIG. 23 is an exploded perspective view of the semiconductor laser device according to Embodiment 6 of the present invention.
  • FIG. 24 is a perspective view showing the configuration of the semiconductor laser apparatus according to Embodiment 6 of the present invention.
  • the X axis is the left-right direction
  • the Y axis is the up-down direction
  • the Z-axis is the direction perpendicular to the page.
  • the same reference numerals are given to the same components as those of the semiconductor laser device 31 described in the fourth embodiment, and the description thereof is omitted.
  • the semiconductor laser device 51 includes an optical base 32, a tilt holder 53, and a slide holder 54! /.
  • a semiconductor package 35 as a space is formed in the air holder 53. Inside the semiconductor package 35, electronic components such as the semiconductor laser element 36 are installed. The semiconductor laser element 36 emits laser light 37. Laser light 37 emitted from the semiconductor laser element 36 is emitted to the outside of the optical base 32.
  • the optical base 32 is formed with a substantially rectangular groove 32a.
  • Slide holder 5
  • the tilt holder 53 has a concave portion 53a having a substantially spherical shape on the bottom surface.
  • a slide holder 54 is fitted and fixed in the groove 32a of the optical base 32.
  • the groove 32a is larger than the outer shape of the slide holder 54. That is, the length of the groove 32a in the X-axis direction is longer than the length of the slide holder 54 in the X-axis direction. Further, the length (depth) of the groove 32a in the Z-axis direction is longer than the length (thickness) of the slide holder 54 in the Z-axis direction.
  • a tilt holder 53 is fitted and fixed in the hole 54a of the slide holder 54. At this time, the convex portion 54 b of the slide holder 54 is fitted into the concave portion 53 a of the tilt holder 53.
  • the semiconductor laser device 51 of the sixth embodiment transmits heat from the semiconductor laser element 36, which generates heat by emitting the laser light 37, in the order of the tilt holder 53 and the slide holder 54.
  • the semiconductor laser device 51 can achieve high heat dissipation efficiency.
  • the heat radiation to the optical base 32 is large.
  • the laser light 37 emitted from the semiconductor laser element 36 installed inside the semiconductor package 35 is emitted to the outside of the optical base 32.
  • a through-hole (not shown) that is an optical path of the laser beam 37 is formed in each of the tilt holder 53, the slide holder 54, and the optical base 32.
  • a method of adjusting the optical axis of the laser beam 37 emitted from the semiconductor laser element 36 in the semiconductor laser device 51 having such a configuration will be described.
  • the optical base 32 and the slide holder 54, and the slide holder 54 and the tilt holder 53 are not fixed, respectively.
  • the recess 53 a of the tilt holder 53 is fitted into the projection 54 b of the slide holder 54.
  • the concave portion 53a can be slid with respect to the convex portion 54b, and the carrier holder 53 can be rotated about the X-axis, Y-axis, and Z-axis directions in the figure.
  • the semiconductor laser element 36 since the semiconductor laser element 36 also rotates, the direction of the optical axis of the laser light 37 can be changed. In this way, when the direction of the optical axis of the laser beam 37 becomes a desired direction, the rotation of the tilt holder 53 is stopped.
  • the contact area between the convex portion 54b and the concave portion 53a is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the slide holder 54 is fitted into the groove 32a of the optical base 32. Then, the lengths of the groove 32a and the slide holder 54 in the Y-axis direction are almost equal.
  • the length of the groove 32a in the X-axis and Z-axis directions is larger than the length of the slide holder 54 in the X-axis and Z-axis directions. Since it is long, the slide holder 54 can be moved in the direction parallel to the ZX plane in the groove 32a. Thereby, the position of the optical axis of the laser beam 37 can be changed. In this way, when the direction of the optical axis of the laser beam 37 becomes a desired direction, the movement of the slide holder 54 is stopped.
  • the contact area between the slide holder 54 and the groove 32a is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the optical axis of the semiconductor laser device 51 is adjusted by the method described above, and the laser is placed at a desired position. After the light 37 reaches, the optical base 32 and the slide holder 54, and the slide holder 54 and the tilt holder 53 are fixed, respectively. For example, an adhesive may be filled between the optical base 32 and the slide holder 54 and between the slide holder 54 and the tilt holder 53, respectively.
  • the semiconductor laser device 51 according to the sixth embodiment has an effect that the emission direction of the laser light 37 can be easily adjusted and the heat dissipation efficiency is high.
  • FIG. 25 is a plan view showing the configuration of the semiconductor laser device according to the seventh embodiment of the present invention.
  • FIG. 26 is a cross-sectional view taken along line GG in FIG.
  • FIG. 27 is an exploded perspective view of the semiconductor laser device according to the seventh embodiment of the present invention.
  • FIG. 28 is a perspective view showing the configuration of the semiconductor laser apparatus according to Embodiment 7 of the present invention.
  • the X-axis is the left-right direction
  • the Y-axis is the up-down direction
  • the Z-axis is the direction perpendicular to the page.
  • the semiconductor laser device 61 includes an optical base 62, a tilt holder 63, and a slide holder 64! /.
  • the slide holder 64 has a shape obtained by dividing a substantially circular cylinder by a plane parallel to a plane including its axis, and includes a convex portion 64a that is a side surface of the substantially cylindrical shape.
  • a semiconductor package 65 that is a space is formed in the slide holder 64. Inside the semiconductor package 65, electronic components such as a semiconductor laser element 66 are installed. The semiconductor laser element 66 emits laser light 67. Laser light 67 emitted from the semiconductor laser element 66 is emitted outside the optical base 62.
  • the optical base 62 is formed with a hole 62a whose inner surface is substantially cylindrical. Further, the tilt holder 63 has a substantially cylindrical shape. A groove 63a is formed in the tilt holder 63. The inner surface of the groove 63a is substantially cylindrical.
  • the tilt holder 63 is fitted and fixed in the hole 62a of the optical base 62, and the convex portion 64a of the slide holder 64 is fitted and fixed in the groove 63a of the tilt holder 63.
  • the groove 63a is larger than the outer shape of the slide holder 64. That is, the length of the groove 63a in the X-axis direction is It is longer than the length of the holder 64 in the X-axis direction. Further, the inner surface of the groove 63a and the slide holder 64 are substantially in contact with each other.
  • the semiconductor laser device 61 of the seventh embodiment transmits heat from the semiconductor laser element 66, which generates heat by emitting the laser light 67, to the slide holder 64 and the tilt holder 63 in this order, and thus heat radiation grease. Then, the light is directly transmitted from the tilt holder 63 to the optical base 62 without using a heat sink or the like.
  • the semiconductor laser device 61 can achieve high heat dissipation efficiency. Furthermore, since most of the surface area of the tilt holder 63 is in contact with the optical base 62, the amount of heat released to the optical base 62 is large.
  • the laser beam 67 emitted from the semiconductor laser element 66 installed inside the semiconductor package 65 is emitted outside the optical base 62.
  • the slide holder 64, the tilt holder 63, and the optical base 62 are formed with through holes (not shown) that are optical paths of the laser light 67, respectively.
  • a method of adjusting the optical axis of the laser beam 67 emitted from the semiconductor laser element 66 in the semiconductor laser device 61 having such a configuration will be described.
  • the optical base 62 and the tilt holder 63, and the tilt holder 63 and the slide holder 64 are not fixed, respectively.
  • the tilt holder 63 is fitted into the hole 62 a of the optical base 62. Then, the hollow roller 63 can be slid against the hole 62a, and the hollow roller 63 can be rotated around the Z-axis direction in the figure. As a result, the semiconductor laser element 66 also rotates, so that the direction of the optical axis of the laser light 67 can be changed. In this way, when the direction of the optical axis of the laser beam 67 becomes a desired direction, the rotation of the tilt holder 63 is stopped.
  • the contact area between the tilt holder 63 and the hole 62a is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the slide holder 64 is fitted into the groove 63a of the tilt holder 63. Then, since the length of the groove 63a in the X-axis direction is longer than the length of the slide holder 64 in the X-axis direction, the slide holder 64 can be slid in the X-axis direction in the groove 63a. Further, the slide holder 64 can be rotated about the X-axis direction by sliding the convex portion 64a of the slide holder 64 against the inner surface of the groove 63a. As a result, the semiconductor laser element 66 is also rotated and linearly Since it moves, the position and direction of the optical axis of the laser beam 67 can be changed.
  • the optical axis of the semiconductor laser device 61 is adjusted by the above-described method so that the laser beam 67 reaches a desired position, and then the optical base 62 and the tilt holder 63, the tilt holder 63 and the slide holder 64 are connected. Fix each one.
  • an adhesive may be filled between the optical base 62 and the holder 69 and between the holder 63 and the slide holder 64, respectively.
  • the semiconductor laser device 61 according to the seventh embodiment has an effect that the emission direction of the laser light 67 can be easily adjusted and the heat dissipation efficiency is high.
  • FIG. 29 is a plan view showing the configuration of the semiconductor laser device according to the eighth embodiment of the present invention.
  • FIG. 30 is a cross-sectional view taken along line HH in FIG.
  • FIG. 31 is an exploded perspective view of the semiconductor laser device according to Embodiment 8 of the present invention.
  • FIG. 32 is a perspective view showing the configuration of the semiconductor laser apparatus according to Embodiment 8 of the present invention.
  • the X-axis is the left-right direction
  • the Y-axis is the up-down direction
  • the Z-axis is the direction perpendicular to the page.
  • the same reference numerals are given to the same configurations as those of the semiconductor laser device 61 described in the seventh embodiment, and the description thereof is omitted.
  • the semiconductor laser device 71 includes an optical base 62, a tilt holder 73, and a slide holder 74! /.
  • a recess 74a is formed on the bottom surface of the slide holder 74.
  • the recess 74a has a substantially cylindrical surface shape.
  • a semiconductor package 65 that is a space is formed in the slide holder 74. Inside the semiconductor package 65, electronic components such as a semiconductor laser element 66 are installed.
  • the semiconductor laser element 66 emits laser light 67. From semiconductor laser element 66 The emitted laser beam 67 is emitted to the outside of the optical base 62.
  • the optical base 62 is formed with a hole 62a whose inner surface is substantially cylindrical. Further, the tilt holder 73 is substantially cylindrical. A groove 73a is formed in the tilt holder 73. On the bottom surface of the groove 73a, a convex portion 73b having a substantially cylindrical side surface shape is formed.
  • a tilt holder 73 is fitted and fixed in the hole 62a of the optical base 62.
  • a slide holder 74 is fitted and fixed in the groove 73a of the carrier holder 73.
  • the convex portion 73b formed on the bottom surface of the groove 73a fits into the concave portion 74a of the slide holder 74.
  • the groove 73a is larger than the outer shape of the slide holder 74. That is, the length of the groove 73a in the X-axis direction is longer than the length of the slide holder 74 in the X-axis direction.
  • the semiconductor laser device 71 of the eighth embodiment transmits heat from the semiconductor laser element 66, which generates heat by emitting the laser light 67, to the slide holder 74 and the tilt holder 73 in this order, and thus heat radiation grease. Then, the light is transmitted directly from the tilt holder 73 to the optical base 62 without using a heat sink or the like.
  • the semiconductor laser device 71 can achieve high heat dissipation efficiency. Furthermore, since most of the surface area of the tilt holder 73 is in contact with the optical base 62, the amount of heat released to the optical base 62 is large.
  • the laser beam 67 emitted from the semiconductor laser element 66 installed inside the semiconductor package 65 is emitted outside the optical base 62.
  • the slide holder 74, the tilt holder 73, and the optical base 62 are formed with through holes (not shown) that are optical paths of the laser light 67, respectively.
  • a method of adjusting the optical axis of the laser beam 67 emitted from the semiconductor laser element 66 in the semiconductor laser device 71 having such a configuration will be described.
  • the optical base 62 and the tilt holder 73, and the tilt holder 73 and the slide holder 74 are not fixed, respectively.
  • the tilt holder 73 is fitted into the hole 62 a of the optical base 62. Then, the tilt holder 73 can be slid with respect to the hole 62a and rotated around the Z-axis direction in the figure. As a result, the semiconductor laser element 66 also rotates, so that the direction of the optical axis of the laser light 67 can be changed. In this way, when the direction of the optical axis of the laser beam 67 becomes a desired direction, the rotation of the tilt holder 73 is stopped. Where Since the contact area of the hole 62a is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the slide holder 74 is fitted into the groove 73 a of the tilt holder 73. Then, since the length of the groove 73a in the X-axis direction is longer than the length of the slide holder 74 in the X-axis direction, the slide holder 74 can be slid in the X-axis direction in the groove 73a. Further, the slide holder 74 can be rotated about the X-axis direction by sliding the recess 74a of the slide holder 74 with respect to the projection 73b on the bottom surface of the groove 73a. As a result, the semiconductor laser element 66 also rotates and linearly moves, so that the position and direction of the optical axis of the laser light 67 can be changed.
  • the optical axis of the semiconductor laser device 71 is adjusted by the above-described method so that the laser beam 67 reaches a desired position, and then the optical base 62, the tilt holder 73, the tilt holder 73, and the slide holder 74 are moved. Fix each one.
  • an adhesive may be filled between the optical base 62 and the carrier holder 73 and between the carrier holder 73 and the slide holder 74, respectively.
  • the semiconductor laser device 71 according to the eighth embodiment has the effect that the emission direction of the laser light 67 can be easily adjusted and the heat dissipation efficiency is high.
  • FIG. 33 is a plan view showing the configuration of the semiconductor laser device according to the ninth embodiment of the present invention.
  • FIG. 34 is a cross-sectional view taken along the line II in FIG.
  • FIG. 35 is an exploded perspective view of the semiconductor laser device according to the ninth embodiment of the present invention.
  • FIG. 36 is a perspective view showing the configuration of the semiconductor laser apparatus according to the ninth embodiment of the present invention.
  • the X-axis is the left-right direction
  • the Y-axis is the up-down direction
  • the Z-axis is the direction perpendicular to the page.
  • a semiconductor laser device 81 according to the ninth embodiment includes an optical base 82, a tilt holder 83, and a slurry. Id holder 84!
  • the slide holder 84 has a shape obtained by dividing a substantially circular cylinder by a plane parallel to a plane including its axis, and includes a convex portion 84b that is a side surface of the substantially circular cylinder. Further, the slide holder 84 is formed with a hole 84a having an inner surface that is substantially cylindrical.
  • the hollow holder 83 is substantially cylindrical.
  • the cavity holder 83 is formed with a semiconductor package 85 which is a space. Inside the semiconductor package 85, electronic components such as the semiconductor laser element 86 are installed. The semiconductor laser element 86 emits laser light 87. Laser light 87 emitted from the semiconductor laser element 86 is emitted to the outside of the optical base 82.
  • a groove 82a is formed in the optical base 82.
  • the inner surface of the groove 82a is substantially cylindrical.
  • the convex portion 84b of the slide holder 84 is fitted and fixed in the groove 82a of the optical base 82, and the tilt holder 83 is fitted and fixed in the hole portion 84a of the slide holder 84.
  • the groove 82a is larger than the outer shape of the slide holder 84. That is, the length of the groove 82a in the X-axis direction is longer than the length of the slide holder 84 in the X-axis direction.
  • the semiconductor laser device 81 of the ninth embodiment transmits heat from the semiconductor laser element 86, which generates heat by emitting the laser light 87, to the tilt holder 83 and the slide holder 84 in this order, and dissipates heat. Then, the light is transmitted directly from the slide holder 84 to the optical base 82 without using a heat sink or the like.
  • the semiconductor laser device 81 can achieve high heat dissipation efficiency. Furthermore, since most of the surface area of the slide holder 84 is in contact with the optical base 82, the heat radiation to the optical base 82 is large.
  • the laser light 87 emitted from the semiconductor laser element 86 installed inside the semiconductor package 85 is emitted outside the optical base 82.
  • the slide holder 84, the tilt holder 83, and the optical base 82 are formed with through holes (not shown) that are optical paths of the laser light 87, respectively.
  • the tilt holder 83 is fitted into the hole 84 a of the slide holder 84. Then The holder 83 can be rotated about the Z-axis direction in the figure by sliding the holder 83 with respect to the hole 84a. Further, the length (depth) of the hole portion 84a in the Z-axis direction is longer than the length (thickness) of the tilt holder 83 in the Z-axis direction. Therefore, the tilt holder 83 can be slid in the Z-axis direction with respect to the hole 84a. As a result, the semiconductor laser element 86 also rotates and linearly moves, so that the direction and position of the optical axis of the laser light 87 can be changed.
  • the slide holder 84 is fitted into the groove 82a of the optical base 82. Then, since the length of the groove 82a in the X-axis direction is longer than the length of the slide holder 84 in the X-axis direction, the slide holder 84 can be slid in the X-axis direction in the groove 82a. Further, the slide holder 84 can be rotated around the X-axis direction by sliding the convex portion 84b of the slide holder 84 with respect to the groove 82a. As a result, the semiconductor laser element 86 also rotates and linearly moves, so that the position and direction of the optical axis of the laser light 87 can be changed.
  • the optical axis of the semiconductor laser device 81 is adjusted by the above-described method so that the laser beam 87 reaches a desired position, and then the optical base 82 and the slide holder 84, and the slide holder 84 and the tilt holder 83 are used. And are fixed respectively.
  • an adhesive may be filled between the optical base 82 and the slide holder 84 and between the slide holder 84 and the tilt holder 83, respectively.
  • the semiconductor laser device 81 according to the ninth embodiment has the effect that the emission direction of the laser light 87 can be easily adjusted and the heat dissipation efficiency is high.
  • FIG. 37 is a plan view showing the configuration of the semiconductor laser device according to the tenth embodiment of the present invention. is there.
  • FIG. 38 is a cross-sectional view taken along the line JJ in FIG.
  • FIG. 39 is an exploded perspective view of the semiconductor laser device according to the tenth embodiment of the present invention.
  • FIG. 40 is a perspective view showing the configuration of the semiconductor laser apparatus according to Embodiment 10 of the present invention.
  • the X axis is the left-right direction
  • the Y axis is the up-down direction
  • the Z-axis is the direction perpendicular to the page.
  • the same reference numerals are given to the same configurations as those of the semiconductor laser device 81 described in the ninth embodiment, and the description thereof is omitted.
  • the semiconductor laser device 91 includes an optical base 92, a tilt holder 83, and a slide holder 94.
  • a concave portion 94a having a substantially cylindrical surface shape is formed on the bottom surface of the slide holder 94. Further, the slide holder 94 is formed with a hole 94b whose inner surface is substantially cylindrical.
  • the air holder 83 is substantially cylindrical.
  • the cavity holder 83 is formed with a semiconductor package 85 which is a space. Inside the semiconductor package 85, electronic components such as a semiconductor laser element 86 are installed. The semiconductor laser element 86 emits laser light 87. Laser light 87 emitted from the semiconductor laser element 86 is emitted to the outside of the optical base 92.
  • the optical base 92 is formed with a groove 92a in which a convex portion 92b having a substantially cylindrical side surface is formed on the bottom surface.
  • a slide holder 94 is fitted and fixed in the groove 92a of the optical base 92. At that time, the convex portion 92b fits into the concave portion 94a.
  • a tilt holder 83 is fitted and fixed in the hole 94b of the slide holder 94.
  • the groove 92a is larger than the outer shape of the slide holder 94. That is, the length of the groove 92a in the X-axis direction is longer than the length of the slide holder 94 in the X-axis direction.
  • the semiconductor laser device 91 of the tenth embodiment transmits heat from the semiconductor laser element 86, which generates heat by emitting the laser light 87, to the tilt holder 83 and the slide holder 94 in this order, and dissipates heat.
  • the light is transmitted directly from the slide holder 94 to the optical base 92 without using a heat sink or the like.
  • the semiconductor laser device 91 can achieve high heat dissipation efficiency.
  • the amount of heat released to the optical base 92 is large.
  • the laser beam 87 emitted from the semiconductor laser element 86 installed inside the semiconductor package 85 is emitted outside the optical base 92.
  • the slide holder 94, the tilt holder 83, and the optical base 92 are formed with through holes (not shown) that are optical paths of the laser light 87, respectively.
  • the tilt holder 83 is fitted into the hole 94b of the slide holder 94. Then, the tilt holder 83 can be slid with respect to the hole 94b, and the tilt holder 83 can be rotated around the Z-axis direction in the figure. Further, the length (depth) of the hole 94b in the Z-axis direction is longer than the length (thickness) of the tilt holder 83 in the Z-axis direction. Therefore, the tilt holder 83 can be slid in the Z-axis direction with respect to the hole 94b. As a result, the semiconductor laser element 86 also rotates and linearly moves, so that the direction and position of the optical axis of the laser light 87 can be changed.
  • the slide holder 94 is fitted into the groove 92a of the optical base 92. Then, since the length in the X-axis direction of the groove 92a is longer than the length in the X-axis direction of the slide holder 94, the slide holder 94 can be slid in the X-axis direction in the groove 92a. Further, since the convex portion 92b is fitted in the concave portion 94a, the concave portion 94a of the slide holder 94 can be rotated about the X-axis direction by sliding the concave portion 94a with respect to the convex portion 92b.
  • the semiconductor laser element 86 also rotates and linearly moves, so that the position and direction of the optical axis of the laser light 87 can be changed. In this way, when the direction of the optical axis of the laser beam 87 becomes a desired direction, the rotation and linear motion of the slide holder 94 are stopped.
  • the contact area between the concave portion 94a and the convex portion 92b is relatively large, it is easy to stop at a desired position due to the frictional force between them.
  • the optical axis of the semiconductor laser device 91 is adjusted by the above-described method, and the laser is moved to a desired position. After the light 87 reaches, the optical base 92 and the slide holder 94, and the slide holder 94 and the tilt holder 83 are fixed, respectively. For example, an adhesive may be filled between the optical base 92 and the slide holder 94 and between the slide holder 94 and the tilt holder 83, respectively.
  • the semiconductor laser device 91 according to the tenth embodiment has the effect that the emission direction of the laser light 87 can be easily adjusted and the heat dissipation efficiency is high.
  • FIG. 41 is a plan view showing the configuration of the optical pickup device according to the eleventh embodiment of the present invention.
  • an optical pickup device includes a semiconductor laser device 101, an optical lens 106 and an optical base 104 having an actuator 105, a heat radiating plate 103 for radiating the heat of the optical base 104 to the outside, an optical lens 106, and the like. And a guide shaft 107 for driving in the tracking direction.
  • FIG. 41 shows a state where an optical disc 100 which is an optical information recording medium is loaded.
  • any one of the semiconductor laser devices shown in the first embodiment to L0 may be used.
  • the semiconductor laser device 101 emits laser light.
  • Laser light emitted from the semiconductor laser device 101 is incident on the optical lens 106 through an optical element (not shown) such as a reflecting mirror or a diffraction grating.
  • the actuator 105 drives the optical lens 106 in the focus direction or the tracking direction. As a result, the laser beam is focused on the optical disc 100.
  • a laser beam emitted from the semiconductor laser device 101 is irradiated to a predetermined portion of the optical disc 100 through the optical lens 106.
  • a recording mark is written at the location irradiated with the laser beam.
  • Information is reproduced by detecting the reflected light of the laser light irradiated to the optical disc 100 through the optical lens 106 by a detection element (not shown).
  • any one of the embodiments 1 to 10 used in the optical pickup device is used.
  • the semiconductor laser device 101 has high heat generation efficiency. Therefore, while the optical pickup device is being driven, the temperature rise is small although the laser beam is constantly emitted from the semiconductor laser device 101. As a result, the semiconductor laser device 101 and the optical pickup device do not run out of temperature and are less deteriorated!
  • Embodiments 1 to 11 are merely examples, and the present invention is not limited to these specific examples.
  • the semiconductor laser device and the optical pickup device of the present invention can be used for an optical information recording / reproducing apparatus or the like that enables recording medium having a large capacity and high-speed recording.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

L’invention porte sur un dispositif laser semi-conducteur (1) pourvu d’un support coulissant (4) avec un espace (5) où un élément laser semi-conducteur (6) est disposé, un support de mécanisme d’oscillation/d’inclinaison (3) ayant une gorge (3b) destinée à la pose du support coulissant (4) et plus grande que la forme externe du support coulissant (4) et une base optique (2) ayant une partie trouée pour la réception du support de mécanisme d’oscillation/d’inclinaison (3). Dans la partie trouée de la base optique (2), le support de mécanisme d’oscillation/d’inclinaison (3) est posé et fixé, et le support coulissant (4) est posé et fixé dans la gorge (3b) du support de mécanisme d’oscillation/d’inclinaison (3). On peut ainsi améliorer l’efficacité de dissipation de chaleur du dispositif laser semi-conducteur et d’un dispositif de détection optique.
PCT/JP2005/013241 2004-07-20 2005-07-19 Dispositif laser semi-conducteur et dispositif de detection optique equipe dudit dispositif WO2006009138A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-212071 2004-07-20
JP2004212071 2004-07-20

Publications (1)

Publication Number Publication Date
WO2006009138A1 true WO2006009138A1 (fr) 2006-01-26

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794938A (en) * 1980-12-01 1982-06-12 Mitsubishi Electric Corp Semiconductor laser light source device
JPS6057151U (ja) * 1983-09-26 1985-04-20 富士電気化学株式会社 半導体レ−ザ素子の支持構造
JPH01117615U (fr) * 1988-01-30 1989-08-09
JPH11185281A (ja) * 1997-12-18 1999-07-09 Toshiba Corp 光ヘッド装置及び調整方法
JP2003022542A (ja) * 2001-07-10 2003-01-24 Nec Corp 半導体レーザの固定機構および光ヘッド装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794938A (en) * 1980-12-01 1982-06-12 Mitsubishi Electric Corp Semiconductor laser light source device
JPS6057151U (ja) * 1983-09-26 1985-04-20 富士電気化学株式会社 半導体レ−ザ素子の支持構造
JPH01117615U (fr) * 1988-01-30 1989-08-09
JPH11185281A (ja) * 1997-12-18 1999-07-09 Toshiba Corp 光ヘッド装置及び調整方法
JP2003022542A (ja) * 2001-07-10 2003-01-24 Nec Corp 半導体レーザの固定機構および光ヘッド装置

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