WO2005124787A3 - Dispositif electrique et procede de fabrication de ce dispositif - Google Patents
Dispositif electrique et procede de fabrication de ce dispositif Download PDFInfo
- Publication number
- WO2005124787A3 WO2005124787A3 PCT/IB2005/051893 IB2005051893W WO2005124787A3 WO 2005124787 A3 WO2005124787 A3 WO 2005124787A3 IB 2005051893 W IB2005051893 W IB 2005051893W WO 2005124787 A3 WO2005124787 A3 WO 2005124787A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrical device
- layer
- punch
- diode
- series
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 5
- 239000004065 semiconductor Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0011—RRAM elements whose operation depends upon chemical change comprising conductive bridging RAM [CBRAM] or programming metallization cells [PMCs]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
- H10N70/026—Formation of switching materials, e.g. deposition of layers by physical vapor deposition, e.g. sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/061—Shaping switching materials
- H10N70/063—Shaping switching materials by etching of pre-deposited switching material layers, e.g. lithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/24—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies
- H10N70/245—Multistable switching devices, e.g. memristors based on migration or redistribution of ionic species, e.g. anions, vacancies the species being metal cations, e.g. programmable metallization cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8416—Electrodes adapted for supplying ionic species
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8825—Selenides, e.g. GeSe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007516106A JP2008503085A (ja) | 2004-06-16 | 2005-06-09 | 電気デバイスおよびその製造方法 |
EP05745512A EP1759392A2 (fr) | 2004-06-16 | 2005-06-09 | Dispositif electrique et procede de fabrication de ce dispositif |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04102744 | 2004-06-16 | ||
EP04102744.2 | 2004-06-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005124787A2 WO2005124787A2 (fr) | 2005-12-29 |
WO2005124787A3 true WO2005124787A3 (fr) | 2006-03-16 |
Family
ID=34979040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2005/051893 WO2005124787A2 (fr) | 2004-06-16 | 2005-06-09 | Dispositif electrique et procede de fabrication de ce dispositif |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1759392A2 (fr) |
JP (1) | JP2008503085A (fr) |
KR (1) | KR20070049139A (fr) |
CN (1) | CN101006517A (fr) |
TW (1) | TW200614234A (fr) |
WO (1) | WO2005124787A2 (fr) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8159856B2 (en) | 2009-07-07 | 2012-04-17 | Seagate Technology Llc | Bipolar select device for resistive sense memory |
US8866121B2 (en) | 2011-07-29 | 2014-10-21 | Sandisk 3D Llc | Current-limiting layer and a current-reducing layer in a memory device |
US8895949B2 (en) | 2012-02-17 | 2014-11-25 | Sandisk 3D Llc | Nonvolatile memory device using a varistor as a current limiter element |
US8901530B2 (en) | 2012-01-19 | 2014-12-02 | Sandisk 3D Llc | Nonvolatile memory device using a tunnel oxide as a passive current steering element |
US8912524B2 (en) | 2011-09-01 | 2014-12-16 | Sandisk 3D Llc | Defect gradient to boost nonvolatile memory performance |
US9472301B2 (en) | 2013-02-28 | 2016-10-18 | Sandisk Technologies Llc | Dielectric-based memory cells having multi-level one-time programmable and bi-level rewriteable operating modes and methods of forming the same |
US9583701B1 (en) | 2012-08-14 | 2017-02-28 | Crossbar, Inc. | Methods for fabricating resistive memory device switching material using ion implantation |
US9590013B2 (en) | 2010-08-23 | 2017-03-07 | Crossbar, Inc. | Device switching using layered device structure |
US9601692B1 (en) | 2010-07-13 | 2017-03-21 | Crossbar, Inc. | Hetero-switching layer in a RRAM device and method |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008135659A (ja) * | 2006-11-29 | 2008-06-12 | Sony Corp | 記憶素子、記憶装置 |
KR100911473B1 (ko) * | 2007-06-18 | 2009-08-11 | 삼성전자주식회사 | 상변화 메모리 유닛, 이의 제조 방법, 이를 포함하는상변화 메모리 장치 및 그 제조 방법 |
JP2009199695A (ja) * | 2008-02-25 | 2009-09-03 | Toshiba Corp | 抵抗変化メモリ装置 |
US7869258B2 (en) * | 2008-06-27 | 2011-01-11 | Sandisk 3D, Llc | Reverse set with current limit for non-volatile storage |
US9030867B2 (en) | 2008-10-20 | 2015-05-12 | Seagate Technology Llc | Bipolar CMOS select device for resistive sense memory |
JP4778117B2 (ja) | 2009-05-28 | 2011-09-21 | パナソニック株式会社 | メモリセルアレイ、メモリセルアレイの製造方法、不揮発性記憶装置、および、クロスポイント型のメモリセルアレイを構成するメモリセル |
US8208285B2 (en) * | 2009-07-13 | 2012-06-26 | Seagate Technology Llc | Vertical non-volatile switch with punchthrough access and method of fabrication therefor |
US8274130B2 (en) | 2009-10-20 | 2012-09-25 | Sandisk 3D Llc | Punch-through diode steering element |
US8017433B2 (en) * | 2010-02-09 | 2011-09-13 | International Business Machines Corporation | Post deposition method for regrowth of crystalline phase change material |
US9570678B1 (en) | 2010-06-08 | 2017-02-14 | Crossbar, Inc. | Resistive RAM with preferental filament formation region and methods |
US8569172B1 (en) | 2012-08-14 | 2013-10-29 | Crossbar, Inc. | Noble metal/non-noble metal electrode for RRAM applications |
JP5566217B2 (ja) * | 2010-07-30 | 2014-08-06 | 株式会社東芝 | 不揮発性記憶装置 |
JP5075959B2 (ja) | 2010-09-14 | 2012-11-21 | 株式会社東芝 | 抵抗変化メモリ |
USRE46335E1 (en) | 2010-11-04 | 2017-03-07 | Crossbar, Inc. | Switching device having a non-linear element |
US8502185B2 (en) * | 2011-05-31 | 2013-08-06 | Crossbar, Inc. | Switching device having a non-linear element |
US8462580B2 (en) * | 2010-11-17 | 2013-06-11 | Sandisk 3D Llc | Memory system with reversible resistivity-switching using pulses of alternatrie polarity |
JP5442876B2 (ja) | 2010-12-03 | 2014-03-12 | パナソニック株式会社 | 不揮発性記憶素子ならびに不揮発性記憶装置及びそれらの製造方法 |
CN102623045B (zh) * | 2011-01-27 | 2014-10-29 | 中国科学院微电子研究所 | 阻变型随机存储单元及存储器 |
CN102750979B (zh) * | 2011-04-21 | 2015-05-13 | 中国科学院微电子研究所 | 阻变存储器单元 |
US9620206B2 (en) | 2011-05-31 | 2017-04-11 | Crossbar, Inc. | Memory array architecture with two-terminal memory cells |
WO2013046217A2 (fr) * | 2011-06-13 | 2013-04-04 | Indian Institute Of Technology Bombay | Dispositif de sélection pour mémoire rram bipolaire |
US8619459B1 (en) | 2011-06-23 | 2013-12-31 | Crossbar, Inc. | High operating speed resistive random access memory |
US8946669B1 (en) | 2012-04-05 | 2015-02-03 | Crossbar, Inc. | Resistive memory device and fabrication methods |
US9564587B1 (en) | 2011-06-30 | 2017-02-07 | Crossbar, Inc. | Three-dimensional two-terminal memory with enhanced electric field and segmented interconnects |
US9627443B2 (en) | 2011-06-30 | 2017-04-18 | Crossbar, Inc. | Three-dimensional oblique two-terminal memory with enhanced electric field |
US9166163B2 (en) | 2011-06-30 | 2015-10-20 | Crossbar, Inc. | Sub-oxide interface layer for two-terminal memory |
JP5763004B2 (ja) | 2012-03-26 | 2015-08-12 | 株式会社東芝 | 不揮発性半導体記憶装置 |
US9685608B2 (en) | 2012-04-13 | 2017-06-20 | Crossbar, Inc. | Reduced diffusion in metal electrode for two-terminal memory |
US8658476B1 (en) | 2012-04-20 | 2014-02-25 | Crossbar, Inc. | Low temperature P+ polycrystalline silicon material for non-volatile memory device |
US9741765B1 (en) | 2012-08-14 | 2017-08-22 | Crossbar, Inc. | Monolithically integrated resistive memory using integrated-circuit foundry compatible processes |
US9576616B2 (en) | 2012-10-10 | 2017-02-21 | Crossbar, Inc. | Non-volatile memory with overwrite capability and low write amplification |
US10290801B2 (en) | 2014-02-07 | 2019-05-14 | Crossbar, Inc. | Scalable silicon based resistive memory device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4254427A (en) * | 1978-02-10 | 1981-03-03 | U.S. Philips Corporation | Semiconductor device having a compact read-only memory |
US4646266A (en) * | 1984-09-28 | 1987-02-24 | Energy Conversion Devices, Inc. | Programmable semiconductor structures and methods for using the same |
US6130835A (en) * | 1997-12-02 | 2000-10-10 | International Business Machines Corporation | Voltage biasing for magnetic RAM with magnetic tunnel memory cells |
EP1381054A1 (fr) * | 2002-07-12 | 2004-01-14 | Pioneer Corporation | Dispositif mémoire organique |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002541682A (ja) * | 1999-04-08 | 2002-12-03 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | パンチスルーダイオード及び同ダイオードを製造する方法 |
-
2005
- 2005-06-09 EP EP05745512A patent/EP1759392A2/fr not_active Withdrawn
- 2005-06-09 KR KR1020077001141A patent/KR20070049139A/ko not_active Application Discontinuation
- 2005-06-09 WO PCT/IB2005/051893 patent/WO2005124787A2/fr active Application Filing
- 2005-06-09 JP JP2007516106A patent/JP2008503085A/ja not_active Withdrawn
- 2005-06-09 CN CNA2005800276523A patent/CN101006517A/zh active Pending
- 2005-06-13 TW TW094119530A patent/TW200614234A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4254427A (en) * | 1978-02-10 | 1981-03-03 | U.S. Philips Corporation | Semiconductor device having a compact read-only memory |
US4646266A (en) * | 1984-09-28 | 1987-02-24 | Energy Conversion Devices, Inc. | Programmable semiconductor structures and methods for using the same |
US6130835A (en) * | 1997-12-02 | 2000-10-10 | International Business Machines Corporation | Voltage biasing for magnetic RAM with magnetic tunnel memory cells |
EP1381054A1 (fr) * | 2002-07-12 | 2004-01-14 | Pioneer Corporation | Dispositif mémoire organique |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8159856B2 (en) | 2009-07-07 | 2012-04-17 | Seagate Technology Llc | Bipolar select device for resistive sense memory |
US9601692B1 (en) | 2010-07-13 | 2017-03-21 | Crossbar, Inc. | Hetero-switching layer in a RRAM device and method |
US9590013B2 (en) | 2010-08-23 | 2017-03-07 | Crossbar, Inc. | Device switching using layered device structure |
US8866121B2 (en) | 2011-07-29 | 2014-10-21 | Sandisk 3D Llc | Current-limiting layer and a current-reducing layer in a memory device |
US8912524B2 (en) | 2011-09-01 | 2014-12-16 | Sandisk 3D Llc | Defect gradient to boost nonvolatile memory performance |
US8901530B2 (en) | 2012-01-19 | 2014-12-02 | Sandisk 3D Llc | Nonvolatile memory device using a tunnel oxide as a passive current steering element |
US8895949B2 (en) | 2012-02-17 | 2014-11-25 | Sandisk 3D Llc | Nonvolatile memory device using a varistor as a current limiter element |
US9583701B1 (en) | 2012-08-14 | 2017-02-28 | Crossbar, Inc. | Methods for fabricating resistive memory device switching material using ion implantation |
US9472301B2 (en) | 2013-02-28 | 2016-10-18 | Sandisk Technologies Llc | Dielectric-based memory cells having multi-level one-time programmable and bi-level rewriteable operating modes and methods of forming the same |
Also Published As
Publication number | Publication date |
---|---|
JP2008503085A (ja) | 2008-01-31 |
EP1759392A2 (fr) | 2007-03-07 |
KR20070049139A (ko) | 2007-05-10 |
WO2005124787A2 (fr) | 2005-12-29 |
TW200614234A (en) | 2006-05-01 |
CN101006517A (zh) | 2007-07-25 |
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