WO2005116448A1 - 真空ポンプ - Google Patents
真空ポンプ Download PDFInfo
- Publication number
- WO2005116448A1 WO2005116448A1 PCT/JP2005/009148 JP2005009148W WO2005116448A1 WO 2005116448 A1 WO2005116448 A1 WO 2005116448A1 JP 2005009148 W JP2005009148 W JP 2005009148W WO 2005116448 A1 WO2005116448 A1 WO 2005116448A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- heat shield
- shield plate
- vacuum chamber
- vacuum
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
- F04D29/5853—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps heat insulation or conduction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D19/00—Axial-flow pumps
- F04D19/02—Multi-stage pumps
- F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
- F04D19/042—Turbomolecular vacuum pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/70—Suction grids; Strainers; Dust separation; Cleaning
- F04D29/701—Suction grids; Strainers; Dust separation; Cleaning especially adapted for elastic fluid pumps
Definitions
- the present invention relates to a vacuum pump for performing a vacuum exhaust process of a vacuum device used in, for example, a surface analyzer or a fine processing device.
- a vacuum device that performs an exhaust process using a vacuum pump and maintains the inside of the vacuum device in a vacuum includes a chamber for a semiconductor manufacturing device, a measurement room of an electron microscope, a surface analysis device, and a fine processing device. and so on.
- a turbo molecular pump is often used to realize a high vacuum environment.
- the turbo molecular pump is configured such that a rotor rotates at high speed inside a casing having an inlet and an outlet. On the inner peripheral surface of the casing, fixed blades are arranged in multiple stages, while on the rotor, rotating blades are arranged radially and in multiple stages.
- the action of the rotating wings and the fixed wings causes the gas to be sucked into the intake loca- tion and the exhaust force to be exhausted.
- the turbo molecular pump performs exhaust processing by rotating the turbine at a high speed
- the turbo molecular pump may be heated to a high temperature state by the heat of collision of gas molecules or heat generated from a motor.
- Patent Document 1 Japanese Patent Laid-Open No. 2002-227765
- Patent Document 1 discloses that a vacuum pump and a vacuum device are joined via a member (pipe) having a high thermal conductivity, and the member is cooled using a cooling method such as water cooling or air cooling. Discloses a technique for suppressing the propagation of heat to a vacuum device.
- an object of the present invention is to provide a vacuum pump that can efficiently reduce radiant heat of a vacuum pump that propagates to a vacuum device with a simple configuration.
- the casing provided with the intake port and the exhaust port, and the gas provided from the vacuum device through the intake port and transferred through the intake port to the exhaust port.
- a gas transfer mechanism, a heat shield plate disposed upstream of the gas transfer mechanism and having an emissivity greater on a surface facing the gas transfer mechanism than on a surface facing the vacuum device; and
- the heat shield plate of the invention according to claim 1 has, for example, a low emissivity V on the surface facing the vacuum device (the surface facing the upstream direction when viewed from the flow of the gas to be evacuated).
- U which has been subjected to surface treatment, preferably.
- the surface treatment in this case is preferably, for example, an electrolytic polishing treatment, a gold plating treatment, an aluminum plating treatment, or the like so that the emissivity becomes 0.1 or less.
- the heat shield plate of the invention according to claim 1 is, for example, a surface facing the gas transfer mechanism (a surface facing the downstream direction when viewed from the flow of the gas to be exhausted, or the exhaust port direction of the vacuum pump). It is preferable that a surface treatment having a large emissivity is applied to the surface opposite to the surface.
- the surface treatment in this case, for example, has an emissivity of 0.8 or less. It is preferable to use an alumite coating treatment, a ceramic coating treatment or the like as described above.
- the fixing means of the invention described in claim 1 is preferably, for example, a member formed of a member having high thermal conductivity. Further, it is preferable that the fixing means is formed integrally with the heat shield plate, for example.
- the heat shield plate according to the first aspect of the present invention is preferably provided, for example, near the gas transfer mechanism.
- the invention according to claim 2 is the invention according to claim 1, further comprising a cooling mechanism for cooling the heat shield plate.
- the cooling mechanism according to the second aspect of the present invention preferably employs, for example, a water cooling (liquid cooling) system in which a coolant, which is a heat medium flowing in the cooling pipe, absorbs heat.
- a water cooling (liquid cooling) system in which a coolant, which is a heat medium flowing in the cooling pipe, absorbs heat.
- the air transfer mechanism includes a rotor portion including a rotating shaft and a rotor fixed to the rotating shaft;
- the outer peripheral surface force of the rotor portion has radially arranged rotor blades, and the heat shield plate has a region projected on the gas transfer mechanism side and a region facing the intake port of the rotor portion. Almost equal.
- the heat shield plate is arranged, for example, such that the region where the rotor blades are projected on the intake port side does not overlap with the region where the heat shield plate is projected on the intake port side.
- the heat shield plate is arranged such that the region where the heat shield plate is projected on the inlet side and the region where the inlet side end surface region of the rotor portion is projected on the inlet side overlap. , Prefer to.
- the emissivity of the surface facing the vacuum device is such that the emissivity of the rotor blade located on the most upstream side is the emissivity of another surface. It is formed smaller.
- the rotor blade located at the most upstream side has a low emissivity in a region facing the vacuum device, for example, and is subjected to a surface treatment! / Preferably.
- the surface treatment having a small emissivity is preferably, for example, an electrolytic polishing treatment, a gold plating treatment, an aluminum plating treatment, or the like so that the emissivity is 0.1 or less. Yes.
- the heat shield plate has a concave shape on a surface facing the gas transfer mechanism.
- Bay A curved surface is formed.
- the concavely curved surface in the invention according to claim 5 is preferably, for example, a parabolic curved surface having a rotational axis of a vacuum pump as a symmetric axis and a focal point provided downstream from the upper surface of the rotor section.
- the concavely curved surface in the invention described in claim 5 is preferably provided, for example, in multiple stages.
- a turbo molecular pump is described as an example of a vacuum pump.
- FIG. 1 is a diagram showing a schematic configuration of a turbo-molecular pump 1 including a radiation heat reduction structure according to the first embodiment.
- FIG. 1 is a sectional view of the turbo molecular pump 1 in the axial direction.
- FIG. 1 also shows a part of the vacuum chamber 30 connected to the turbo-molecular pump 1.
- the vacuum chamber 30 connected to the turbo molecular pump 1 will be described.
- the vacuum chamber 30 forms a vacuum device used as, for example, a chamber of a surface analysis device or a fine processing device.
- the vacuum chamber 30 is a vacuum vessel constituted by the vacuum chamber wall 31 and having a connection port with the turbo-molecular pump 1.
- the turbo molecular pump 1 is a vacuum pump for performing an exhaust process of the vacuum chamber 30. This The turbo molecular pump 1 is a so-called compound blade type molecular pump including a turbo molecular pump section and a screw groove type pump section.
- the casing 2 forming the outer body of the turbo-molecular pump 1 has a substantially cylindrical shape, and the casing of the turbo-molecular pump 1 is formed together with the base 3 provided at the lower part of the casing 2 (on the side of the exhaust port 6). Make up.
- This gas transfer mechanism is roughly composed of a rotating part rotatably supported on a rotatable part and a fixed part cap fixed to the housing.
- an intake port 4 for introducing gas to the turbo molecular pump 1 is formed. Further, a flange portion 5 protruding toward the outer peripheral side is formed on the end face of the casing 2 on the side of the intake port 4.
- the turbo-molecular pump 1 and the vacuum chamber wall 31 are connected to each other by being fixed via a flange portion 5 using a fastening member such as a bolt.
- the base 3 has an exhaust port 6 for exhausting gas from the turbo-molecular pump 1.
- the rotating part is provided on a shaft 7, which is a rotating shaft, a rotor 8 disposed on the shaft 7, a rotating wing 9 provided on the rotor 8, and an exhaust port 6 side (screw groove type pump part). Forces such as the stator column 10 are also configured. Note that a rotor section is constituted by the shaft 7 and the rotor 8.
- the rotary wing 9 is a blade extending radially from the shaft 7 with a plane force perpendicular to the axis of the shaft 7 inclined at a predetermined angle.
- stator column 10 is formed of a cylindrical member having a cylindrical shape concentric with the rotation axis of the rotor 8.
- a motor unit 11 for rotating the shaft 7 at high speed is provided in the middle of the shaft 7 in the axial direction.
- a fixed portion is formed on the inner peripheral side of the housing.
- the fixed portion is constituted by a fixed blade 15 provided on the intake port 4 side (turbo molecular pump portion) and a thread groove spacer 16 provided on the inner peripheral surface of the casing 2.
- the fixed wing 15 is composed of a blade extending from the inner peripheral surface of the housing toward the shaft 7 with a plane force perpendicular to the axis of the shaft 7 inclined at a predetermined angle.
- the fixed wings 15 of each stage are separated from each other by cylindrical spacers 17.
- the fixed blade 15 is formed in a plurality of stages in the axial direction and alternately with the rotating blade 9.
- a spiral groove is formed in the screw groove spacer 16 on the surface facing the stator column 10.
- the thread groove spacer 16 faces the outer peripheral surface of the stator column 10 with a predetermined clearance (gap) therebetween.
- the direction of the spiral groove formed in the thread groove spacer 16 is a direction in which the gas is transported in the spiral groove in the rotation direction of the rotor 8 toward the exhaust port 6.
- the depth of the spiral groove becomes shallower as approaching the exhaust port 6, and the gas transported through the spiral groove is compressed as it approaches the exhaust port 6!
- the turbo molecular pump 1 configured as described above performs the exhaust process by rotating the rotating part at a high speed, so that the heat of collision of gas (gas) molecules and the heat generated from the motor 11 May be heated to a high temperature state.
- the radiant heat of the turbo-molecular pump 1 is transmitted to the vacuum chamber 30 via the suction port 4, and if the inside of the vacuum chamber 30 is in a high temperature state, it affects devices, samples, and the like handled in the vacuum chamber 30. There is a risk.
- the turbo molecular pump 1 is provided with a radiant heat reducing structure for reducing the influence of radiant heat received by the vacuum chamber 30.
- This radiation heat reduction structure is provided upstream of the gas transfer mechanism (on the side of the intake port 4).
- the radiation heat reduction structure is roughly divided into a heat shielding mechanism and a cooling mechanism. Sprout First, the heat shield mechanism will be described with reference to FIG. 1 and FIG.
- FIG. 2 is a diagram showing a schematic configuration of the heat shielding mechanism according to the first embodiment.
- the heat shield mechanism is shown in a plan view with respect to the force on the intake port 4 side.
- the heat shield mechanism according to (1) has a structure that immediately absorbs the electromagnetic wave radiated from the high-temperature portion of the turbo-molecular pump 1 and is hardly radiated to the vacuum chamber 30 side.
- the heat shield mechanism according to the first embodiment includes a heat shield plate 18, a support portion 19, and a top spacer 17a.
- the heat shield plate 18 is a disc-shaped member and functions as a baffle plate (baffle plate) for blocking heat radiated from the turbo-molecular pump 1 to the vacuum chamber 30.
- Radiated heat is so affected by the blades (rotating blades 9 and fixed blades 15) that are inclined to the plane perpendicular to the axis of the shaft 7, which has the strongest radiation in the direction perpendicular to the plane. Not something.
- the heat shield plate 18 is arranged so as to absorb the heat (electromagnetic waves) radiated in the vertical direction from the vertical direction.
- the heat shield plate 18 is arranged near the rotor 9. By arranging it near the rotor 9, it is possible to reduce the radiation of heat that goes around the outer edge of the heat shield plate 18.
- the size (diameter) of the heat shield plate 18 is equal to the end face area of the rotor 8 on the side of the intake port 4 in order to minimize the influence on the exhaust performance. That is, the area projected on the intake port 4 side of the area where the gas transfer path is formed (the area where the rotating blades 9 and the fixed blades 15 are arranged), and the heat shield plate 18 is projected on the intake port 4 side. Area does not overlap Yes.
- the heat shield plate 18 is configured such that the region where the heat shield plate 18 is projected on the intake port 4 side and the region where the end face region of the rotor 8 on the intake port 4 side is projected on the intake port 4 side are overlapped. Are located in
- the heat shield plate 18 increases the exhaust resistance of the gas transferred by the action of the gas transfer mechanism only at the upper portion of the cylindrical portion of the rotor 8 (the portion excluding the region where the rotor 9 is disposed). By arranging it so as not to cover the region, it is possible to suppress a decrease in the exhaust performance of the turbo-molecular pump 1 due to the provision of the heat shield plate 18.
- the downstream side of the heat shield plate 18 (the surface on the exhaust port 6 side), that is, the surface facing the gas transfer mechanism composed of the rotating blades 9 and the fixed blades 15 is subjected to high emissivity surface treatment.
- the emissivity indicates the absorptance of heat energy (electromagnetic waves), and indicates that the higher the emissivity, the higher the heat absorptivity and the lower the emissivity, the lower the emissivity.
- Examples of the surface treatment having a high emissivity provided on the downstream side surface of the heat shield plate 18 include an alumite coating treatment and a ceramic coating treatment so that the emissivity becomes 0.8 or more.
- the upstream side surface of the heat shield plate 18, that is, the surface facing the vacuum chamber 30 is subjected to a high emissivity and surface treatment.
- Examples of the surface treatment with a low emissivity applied to the upstream side surface of the heat shield plate 18 include an electrolytic polishing treatment, a gold plating treatment, and an aluminum plating treatment so that the emissivity becomes 0.1 or less.
- the electropolishing treatment is a method of obtaining a polishing effect by dissolving a metal surface by flowing a direct current through an electrolytic solution with a metal object to be polished as a + (plus) electrode of an electrode. is there.
- the amount of heat radiated from the heat shield plate 18 toward the vacuum chamber 30 can be reduced. That is, the amount of heat that is absorbed by the heat shield plate 18 and then radiated again to the vacuum chamber 30 can be reduced.
- the support portion 19 is a member for supporting the heat shield plate 18, and is constituted by four belt-like member forces extending in the radial direction at intervals of 90 degrees from the heat shield plate 18.
- the support portion 19 guides the heat of the heat shield plate 18, which only functions as a support member, to the housing (casing 2) of the turbo molecular pump 1, and also radiates the force to the outside of the turbo molecular pump 1. Also serves as a heat conduction path.
- the support portion 19 is formed of a thin band-shaped member in order to suppress a decrease in the exhaust performance of the turbo-molecular pump 1.
- the support 19 may be formed of a member having a high thermal conductivity in order to improve the thermal conductivity.
- a member having high thermal conductivity for example, carbon fiber or the like is used.
- the uppermost spacer 17a is provided to fix the stationary blades 15 of each stage with an interval provided in the axial direction, and is disposed at the uppermost stage of the spacer 17, that is, at the most upstream side. It is a thing.
- the heat shield plate 18, the support portion 19, and the uppermost spacer 17a are integrally formed in order to suppress an increase in thermal resistance at each joint (connection portion). It is preferable that the heat shield mechanism has a seamless integral structure formed by, for example, IJ projection.
- the heat shield mechanism can be easily arranged by incorporating the uppermost spacer 17a in the same manner as the other spacers 17.
- the heat is transmitted to the uppermost spacer 17 a via the thermal power support 19 absorbed by the heat shield plate 18.
- a cooling mechanism is provided for efficiently cooling the heat shielding mechanism.
- the cooling mechanism is configured by a water cooling (liquid cooling) system including a cooling pipe 20 and a cooling pipe jacket 21.
- a cooling pipe jacket 21 is provided on the outer peripheral portion of the uppermost spacer 17a via the casing 2 so as to surround the casing 2 in the circumferential direction.
- a cooling pipe 20 is disposed inside the cooling pipe jacket 21 so that the casing 2 is inscribed therein.
- the cooling pipe 20 is also a tubular (tubular) member.
- a coolant as a heat medium is flown inside the cooling pipe 20, and the coolant is cooled by absorbing heat.
- the cooling pipe 20 is configured separately from the casing 2, but the configuration method of the cooling pipe 20 is not limited to this.
- a groove may be formed on the outer peripheral surface of the casing 2, and a coolant may be flowed into the groove to have the function of the cooling pipe 20.
- the coolant can directly absorb heat from the casing 2, so that the cooling efficiency can be improved.
- solder and heat transfer paste are attached to the gap between the cooling pipe jacket 21 and the cooling pipe 20 and the contact between the cooling pipe 20 and the casing 2 to further improve the heat exchange efficiency in the cooling pipe 20. You can make it happen.
- the cooling mechanism by providing the cooling mechanism, the heat transmitted from the heat shield plate 18 to the uppermost spacer 17a is effectively cooled, that is, the heat is quickly discharged to the outside. Can be issued.
- the amount of heat radiated from the turbo molecular pump 1 to the vacuum chamber 30 can be reduced.
- FIG. 3 (a) is a diagram showing a schematic configuration of a turbo-molecular pump 1 having a radiation heat reducing structure according to the second embodiment, and FIG. 3 (b) is a part A in FIG. 3 (a).
- FIG. 3 is an enlarged view of FIG.
- FIG. 3 is a sectional view of the turbo molecular pump 1 in the axial direction.
- FIG. 3 also shows a part of the vacuum chamber 30 connected to the turbo-molecular pump 1.
- a radiated heat reduction structure for reducing the effect of radiated heat on the vacuum chamber 30 is provided.
- the radiation heat reduction structure according to the second embodiment is provided in a vacuum chamber 30.
- the radiant heat reducing structure is roughly divided into a heat shielding mechanism and a cooling mechanism.
- the heat shield mechanism will be described with reference to FIGS. 3 (a) and 3 (b).
- the heat shield mechanism according to the second embodiment has a connection port for the vacuum chamber 30 in order to suppress the electromagnetic wave radiated from the high-temperature portion of the turbo-molecular pump 1 from being radiated to the inside of the vacuum chamber 30.
- the structure In the vicinity of the heat port (exhaust port), the structure is designed to block radiant heat (electromagnetic waves).
- the heat shield mechanism according to the second embodiment includes a heat shield plate 22 and a support part 23.
- the heat shield plate 22 is a disc-shaped plate member whose diameter is larger than the diameter of the intake port 4 of the turbo-molecular pump 1, and is a baffle plate for blocking heat radiated from the turbo-molecular pump 1. It functions as a notch plate.
- the heat shield plate 22 is disposed so as to be parallel to the mounting surface of the turbo-molecular pump 1 so as to face the surface of the turbo-molecular pump 1 where the intake port 4 is formed.
- the surface of the heat shield plate 22 facing the turbo-molecular pump 1, ie, the surface facing the gas transfer mechanism, has a concavely curved surface (hereinafter referred to as a curved surface).
- annular groove is formed such that the surface facing the gas transfer mechanism is a concavely curved surface.
- the annular groove is concentrically formed in a plurality (multi-stages). By forming such a curved surface, it is possible to appropriately reflect radiant heat (electromagnetic waves) to the turbo molecular pump 1 side. Alternatively, of the heat (electromagnetic waves) radiated from the heat shield plate 22, the amount of heat (electromagnetic waves) radiated toward the turbo molecular pump 1 can be increased.
- the annular groove formed in the heat shield plate 22 has an axial cross section of a surface facing the turbo-molecular pump 1 among the surfaces forming the groove.
- Shaft (shaft 7) Is defined as a symmetric axis, and a quadratic curve (parabola) having a focal point in the! / ⁇ direction provided with a gas transfer mechanism. That is, the annular groove formed in the heat shield plate 22 is formed such that, of the surfaces forming the groove, the surface facing the gas transfer structure of the turbo molecular pump 1 has a parabolic surface.
- the focus of the parabolic curved surface is set downstream of the upper surface of the rotor 8 in detail.
- the parabolic curved surface has a characteristic that, when an electromagnetic wave collides (radiates) with this surface, the electromagnetic wave is reflected in a direction parallel to the target axis direction of the paraboloid.
- a groove having a predetermined angle that is, a groove in which the angle of the groove is set based on the parabolic surface described above, is formed on the surface of the heat shield plate 22 facing the turbo molecular pump 1.
- the support portion 23 is a member for supporting the heat shield plate 22, and is constituted by a plurality of columnar member forces that extend perpendicularly in the direction of the turbo-molecular pump 1 at the outer peripheral end of the heat shield plate 22.
- the adjacent support portions 23 are arranged with a sufficient interval so as not to affect the exhaust performance of the vacuum chamber 30.
- the support portion 23 also functions as a heat conduction path for guiding the heat of the heat shield plate 22, which is not only a function as a support member, to the vacuum chamber wall 31 and dissipating the heat to the outside. Therefore, the support portion 23 is preferably formed of a member having high thermal conductivity in order to improve the thermal conductivity.
- One end of the support portion 23 is joined to the outer peripheral end of the heat shield plate 22, and the other end is fixed to the vacuum chamber wall 31.
- the attachment of the heat shield plate 22 to the vacuum chamber wall 31 is performed, for example, by press-fitting the support portion 23 into a mounting hole provided in the vacuum chamber wall 31.
- the method of disposing the support portion 23 for fixing the heat shield plate 22 is not limited to the direction perpendicular to the heat shield plate 22.
- the heat shield plate 22 may be arranged in the horizontal direction, that is, in the radial direction, and fixed to the vacuum chamber wall 31.
- a cooling mechanism which will be described later, is provided near the connection between the support portion 23 and the vacuum chamber wall 31.
- a cooling mechanism is provided for effectively cooling the heat transmitted to the vacuum chamber wall 31 or for efficiently cooling the heat shielding mechanism! / Puru.
- the cooling mechanism is constituted by a water cooling (liquid cooling) system in which cooling pipes 24 and 25 are formed or arranged directly inside the vacuum chamber wall 31.
- a cooling medium as a heat medium flows inside the cooling pipes 24 and 25, and the cooling is performed by absorbing the heat. .
- the cooling mechanism by providing the cooling mechanism, the heat transmitted from the heat shield plate 22 to the vacuum chamber wall 31 via the support portion 23 is effectively cooled, or the heat shield The structure can be cooled efficiently. As a result, electromagnetic waves radiated from the high-temperature portion of the turbo-molecular pump 1 can be blocked in the vicinity of the exhaust port of the vacuum chamber 30, so that the amount of heat radiated to the inside of the vacuum chamber 30 can be reduced. .
- the support portion 19 in the first embodiment is subjected to a high emissivity surface treatment on the downstream side surface of the support portion 19, and has a low emissivity on the upstream side surface of the support portion 19.
- Surface treatment may be applied! ⁇ .
- the radiation rate is high on the downstream side surface (the surface facing the turbo molecular pump 1) of the heat shield plate 22 in the second embodiment.
- a surface treatment may be performed, and a surface treatment having a low emissivity may be performed on the upstream side surface (the surface facing the center of the vacuum chamber 30) of the heat shield plate 22.
- the heat shield plate 18 in the first embodiment may be formed with an annular groove formed in the heat shield plate 22 in the second embodiment.
- the same surface treatment as the surface treatment having a high emissivity applied to the upstream side surface of the heat shield plate 18 in the first embodiment, that is, the surface facing the vacuum chamber 30 is performed in the first embodiment and the second embodiment.
- a member located on the most upstream side of the gas transfer mechanism and a region facing the vacuum chamber 30, for example, an end face of the suction port 4 of the rotor 8 or a face of the rotating blade 9 facing the suction port 4 may be applied. It may be.
- the surface located at the most upstream side of the gas transfer mechanism and the area facing the vacuum chamber 30 are subjected to a surface treatment with a low emissivity, so that the amount of heat radiated from this area to the vacuum chamber 30 side Can be reduced.
- a surface treatment similar to the surface treatment having a high emissivity applied to the upstream side surface of the heat shield plate 18 in the first embodiment, that is, the surface facing the vacuum chamber 30 is performed in the first embodiment.
- the force of this region is also reduced to a vacuum.
- the amount of heat radiated toward the chamber 30 can be reduced.
- the gas transfer path of the member located on the most upstream side of the gas transfer mechanism is formed.
- the heat transmitted from the turbo-molecular pump 1 to the vacuum chamber 30 can be attenuated (reduced), so that the internal temperature of the vacuum chamber 30 can be appropriately increased. Can be suppressed. As a result, it is possible to realize a more precise pumping and a higher accuracy in the vacuum chamber 30.
- FIG. 1 is a diagram showing a schematic configuration of a turbo-molecular pump provided with a radiation heat reduction structure according to a first embodiment.
- FIG. 2 is a diagram showing a schematic configuration of a heat shielding mechanism according to the first embodiment.
- FIG. 3 (a) is a diagram showing a schematic configuration of a turbo-molecular pump provided with a radiation heat reducing structure according to a second embodiment, and (b) is an enlarged view of a portion A in (a).
- FIG. 3 (a) is a diagram showing a schematic configuration of a turbo-molecular pump provided with a radiation heat reducing structure according to a second embodiment, and (b) is an enlarged view of a portion A in (a).
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Non-Positive Displacement Air Blowers (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004-155060 | 2004-05-25 | ||
JP2004155060A JP4671624B2 (ja) | 2004-05-25 | 2004-05-25 | 真空ポンプ |
Publications (1)
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WO2005116448A1 true WO2005116448A1 (ja) | 2005-12-08 |
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Family Applications (1)
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PCT/JP2005/009148 WO2005116448A1 (ja) | 2004-05-25 | 2005-05-19 | 真空ポンプ |
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JP (1) | JP4671624B2 (ja) |
WO (1) | WO2005116448A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103671138A (zh) * | 2012-09-10 | 2014-03-26 | 株式会社岛津制作所 | 涡轮分子泵 |
US11549515B2 (en) * | 2017-07-14 | 2023-01-10 | Edwards Japan Limited | Vacuum pump, temperature adjustment controller used for vacuum pump, inspection tool, and method of diagnosing temperature-adjustment function unit |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102597527B (zh) * | 2009-08-26 | 2015-06-24 | 株式会社岛津制作所 | 涡轮分子泵及转子的制造方法 |
JP5796948B2 (ja) * | 2010-11-09 | 2015-10-21 | エドワーズ株式会社 | 真空ポンプ |
US9879684B2 (en) | 2012-09-13 | 2018-01-30 | Kla-Tencor Corporation | Apparatus and method for shielding a controlled pressure environment |
Citations (3)
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JPH0732956Y2 (ja) * | 1987-08-13 | 1995-07-31 | セイコー精機株式会社 | タ−ボ分子ポンプ |
JPH11247790A (ja) * | 1998-03-04 | 1999-09-14 | Shimadzu Corp | 真空ポンプ |
JP2002227765A (ja) * | 2001-02-01 | 2002-08-14 | Stmp Kk | 真空ポンプ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0334699A (ja) * | 1989-06-30 | 1991-02-14 | Nec Corp | 低周波水中超音波送受波器 |
JP2000161286A (ja) * | 1998-11-25 | 2000-06-13 | Shimadzu Corp | ターボ分子ポンプ |
JP2001193686A (ja) * | 2000-01-14 | 2001-07-17 | Shimadzu Corp | 真空ポンプ |
-
2004
- 2004-05-25 JP JP2004155060A patent/JP4671624B2/ja not_active Expired - Lifetime
-
2005
- 2005-05-19 WO PCT/JP2005/009148 patent/WO2005116448A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0732956Y2 (ja) * | 1987-08-13 | 1995-07-31 | セイコー精機株式会社 | タ−ボ分子ポンプ |
JPH11247790A (ja) * | 1998-03-04 | 1999-09-14 | Shimadzu Corp | 真空ポンプ |
JP2002227765A (ja) * | 2001-02-01 | 2002-08-14 | Stmp Kk | 真空ポンプ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103671138A (zh) * | 2012-09-10 | 2014-03-26 | 株式会社岛津制作所 | 涡轮分子泵 |
US11549515B2 (en) * | 2017-07-14 | 2023-01-10 | Edwards Japan Limited | Vacuum pump, temperature adjustment controller used for vacuum pump, inspection tool, and method of diagnosing temperature-adjustment function unit |
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