WO2005116290A1 - Method and apparatus for vacuum deposition by vaporizing metals and metal alloys - Google Patents
Method and apparatus for vacuum deposition by vaporizing metals and metal alloys Download PDFInfo
- Publication number
- WO2005116290A1 WO2005116290A1 PCT/LV2005/000005 LV2005000005W WO2005116290A1 WO 2005116290 A1 WO2005116290 A1 WO 2005116290A1 LV 2005000005 W LV2005000005 W LV 2005000005W WO 2005116290 A1 WO2005116290 A1 WO 2005116290A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- evaporator
- melt
- mhd
- metal
- circuit
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Definitions
- the invention relates to vacuum deposition technique, mainly for coating roll substrates by thermal evaporation of metals and alloys in the commercial equipment of continuous or semicontinuous operation.
- BACKGROUND OF THE INVENTION Methods and devices for vaporizing materials for the deposition of corrosion-resistant coatings in metallurgy, active layers in manufacture of chemical current sources, various functional coatings in electronics and other technical fields are intensively investigated.
- Mainly metals and alloys, such as zinc, magnesium, cadmium, indium, zinc-magnesium, are used for these purposes. Continuous evaporation of a great amount of these metals, measured dozens and sometimes hundred kilograms, is necessary in industrial processes.
- Feeding the substance as wire or rods is also accompanied by release of gases, though to a lesser degree. Apart from that, the deposition process should inevitably be interrupted for replenishment of the reserve of wire or rods.
- Methods of feeding the substance in a molten state into the evaporation device are substantially devoid of the above-mentioned drawbacks.
- Advantages of the evaporator replenishment with liquid metal are most fully implemented in vaporizing low-melting-point metals, such as lithium, indium, zinc, cadmium and partly magnesium.
- a Russian patent application of G. Goncharov 93026154 of 27.12.1996 discloses an apparatus for liquid metal feeding into the evaporation device.
- the said apparatus contains a metal melting furnace, located outside the vacuum chamber, an evaporation device, located inside the vacuum chamber, and a pipeline, connecting the said furnace and evaporation device.
- the molten metal in the furnace is under atmospheric pressure. Feeding the molten metal into the evaporator is accomplished by the pressure difference between the vacuum chamber and the environment.
- the metal level in the evaporator is determined by the balance between, first, sum of atmospheric pressure and pressure of the metal column in the melting furnace, and second, pressure of the metal column in the feeding pipeline and the evaporator.
- the melt level is decreasing both in the furnace crucible and the evaporation device.
- melt level difference in the melting crucible and the evaporation device should be not less than 2.0....2.5 meters, for magnesium it should be 6 meters, while for lithium it will be 19 meters (!).
- contact of any metal with atmosphere is undesirable because of its oxidation and accumulation of slag, but for lithium it is totally inadmissible owing to its instant ignition.
- Another solution of the problem of feeding liquid metals is based on elimination of the contact of the molten metal with atmospheric air in the furnace crucible by its sealing and pumping out. It allows minimizing overall dimensions of the feeding system and improving purity of the melt in the melting crucible.
- a device is described in the paper of E. Yadin "Deposition of Coatings or Free Foils of Sublimating Metals", SVC 40th annual Technical Conference Proceedings, 1997, p. 69.
- the molten magnesium is fed from the melting furnace into the evaporation device by cutting the pump-down of the space above the melt in the melting furnace and controlled admission of inert gas into the said space.
- the prior art device contains the melting crucible, liquid metal pipeline, evaporator, installed in the vacuum chamber, instrumentation of measurement of the melt level in the evaporator, a body, immersed into the melting crucible melt, facilities of the evaporator melt level control, facilities of controlling the depth of the said body immersion.
- the said body is immersing into the melt by the signals of the said measurement instrumentation, thus the melt level in the melting crucible and, correspondingly, in the evaporator, connected to it with the liquid metal pipeline, remains stable.
- One more drawback of the prior art is preconditioned by the procedure, when both melting and feeding of metal are made from the same vessel, namely the melting crucible. It means that some impurity substances, such as oxides, nitrides and other compounds, may be accumulated because of multiple loading the melting crucible with metal to be evaporated. The said impurity substances together with the melt can come in the evaporator and further onto the substrate, what depresses the coating quality.
- the object of the present invention is to avoid the above said drawbacks and provide vacuum deposition at constant productivity due to constancy of the melt level in the evaporator irrespective of the evaporated substance amount.
- a magnetohydrodynamic (MHD) circuit including at least one reservoir, a system of pipelines and an MHD pump, is arranged between the melting crucible and evaporator.
- Figure 2 presents the alternative simplified embodiment of the technical solution when deposition cycles are relatively short and there is no necessity of periodical replenishment of the system with molten metal.
- the suggested device contains a melting crucible 1 with molten material (liquid metal) 2 to be evaporated, one or several crucibles 3 of an evaporation device 4 in a vacuum chamber 5, a heated liquid-metal pipe 6, connecting the said melting crucible to the said evaporation crucibles through an MHD circuit 7 of static melt pressure.
- the circuit 7 is provided with an MHD pump 8 and incorporates the liquid-metal pipeline 6 sectors, which are adjacent to the MHD pump, liquid-metal pipelines 9, 10 and 11, a heated reservoir 12, connected with the liquid-metal pipe 11 to the Mquid-metal pipe 6 sector before the MHD pump and with the liquid-metal pipe 10 to an expansion tank 13, installed in the pipeline 9.
- melt level L Spaces above the melts in the reservoir 12 and expansion tank 13 are connected through a pipe 14 to the vacuum pumping system (not shown).
- Two electrical sensors 15 of a melt level L are installed in the expansion tank.
- the melt level L in the expansion tank and in the evaporator is ⁇ h high relative the melt level L 0 in the MHD circuit reservoir, i.e. ⁇ h is the operating pressure of the MHD pump.
- a substrate holder 16 is in the form of a cooled rotatable drum, while a substrate 17, to be coated, is roll material, e.g. polymeric film or metal foil, though the present invention is applicable also for other types of the substrate with another design embodiment of its fixation and/or transportation during the deposition process.
- the melting crucible 1 is connected to the vacuum pumping system (not shown) through a branch pipe 18 and to an inert gas (e.g. argon) feeding system (not shown) through a branch pipe 19 and provided with a gage 20 to measure pressure in the space above the melt, as well as with a sensor 21 to measure the melt level.
- an inert gas e.g. argon
- the liquid metal pipe 6 may be equipped with a U - form elbow 22 and controlled system of emergency cooling (not shown) as an additional safety means.
- the simplified embodiment may be used, as shown on figure 2.
- the heated reservoir 12 of the static pressure circuit 7 is excluded and the melting crucible 1 with its sensors is installed directly in the said circuit 7 instead of the reservoir 12.
- the expansion tank 13 is connected directly to the melting crucible 1 though the liquid metal pipeline 10, while the pipe 14 connects the spaces above the melt in the melting crucible and expansion tank to the vacuum pumping system.
- the melting crucible 1, reservoir 12 (when it is used) and liquid metal pipelines 9, 10 and 11 are heated electrically by common methods.
- the said assemblies are provided with cooling channels, preferably with air coiled pipes.
- the said channels may be also fluidic, yet manufacture of such channels is more complicated and sometimes absolutely unacceptable for reasons of safety (e.g. in lithium evaporation).
- Using the cooling channels provides the possibility to increase the productivity due to reducing run-to-run operations. For simplification the heating and cooling systems are not shown on figures 1 and 2.
- a cross section AA (figure 1 and 2) of the system of electrical heating and air cooling the melting crucible 1 and the reservoir 12 is presented on figure 3.
- the system includes walls 23 of the melting crucible 1 or reservoir 12, a resistive heater 24, electrically insulated from the said walls, thermal insulation 25 and air cooling pipes 26.
- a cross section BB (figure 1 and 2) of the system of electrical heating and air cooling the liquid metal pipelines 9, 10 and 11 is shown on figure 4.
- the system includes liquid metal 2, walls of the liquid metal pipelines 27, a heater 28, thermal insulation 29, air cooling pipes 30, elements 31 of bonding the air cooling pipes to the liquid metal pipelines (e.g. welds).
- the device operates in the following way.
- the deposition cycle starts after filling-up the MHD circuit 7 and its reservoir 12 with metal 2 from the melting crucible 1. Meanwhile it is possible to cool the melting crucible 1, open it and load next portion of metal without interrupting the deposition process. Of course, it is necessary to cool the pipeline section between the melting crucible and MHD circuit below the metal melting point beforehand.
- the melt level in the evaporator 4 is monitored by the melt level in the MHD circuit 7, where the melt temperature is above the metal melting point only by 30...50 °C and practically there are no metal vapours, in that way operation reliability of the melt level sensors and the system in general is provided.
- the reservoir 12 of the MHD circuit 7 is filled with liquid metal 2 by any known method. For example, filling-up the circuit by displacement of the melt from the melting crucible 1 due to pressure difference, generated by admittance of inert gas (e.g. argon) through the branch pipe 19 into the space above the melt (figure 1).
- inert gas e.g. argon
- the MHD pump starts, filling the liquid metal pipeline 6 and expansion tank 13 begins. If pressure is insufficient, the pipeline may be filled only at the part of its height. In this case there is no melt circulation.
- the melt starts to fill the significant part of the expansion tank 13 gradually.
- the melt runs up to the level L, its flow starts along the liquid metal pipeline 10 into the reservoir 12.
- the melt circulation in the static pressure circuit 7 is set in.
- the melt flow speed in the expansion tank 13, connected to the liquid metal pipeline 6, decreases drastically, approaching to the speed, characteristic for laminar flow.
- the sensors 15 of the melt column height in the static pressure circuit provide the signal of pressure, developed by the MHD pump, so that the expansion tank 13 and the whole circuit 7 were not overfilled in case of excessive pressure.
- the said sensors presence directly in the circuit 7 together with common aids allows providing constancy of the pressure, developed by the MHD pump, and, consequently, the melt level in the circuit. If now to heat the liquid metal pipeline 6 sector, connecting the circuit 7 to the crucible 3 of the evaporator 4 to the corresponding temperature, the melt starts to fill the crucibles, at that the melt levels both in the circuit and evaporator will be equal, because operating pressure of the MHD pump in the liquid metal pipelines 6 and 9 is the same.
- pressure F in the MHD pump channel which is required for sustaining the necessary melt level, is determined by the expression: F > p'g ⁇ h, where p is melt density, g is gravitational acceleration, ⁇ h is operating pressure of the MHD pump.
- a distinctive feature of the MHD pump which may be inverted to reversal pressure practically in a moment, is an additional advantage of the offered technical solution. This feature becomes useful in evaporation with alkaline metals, whose melt contact with air is dangerous. Therefore in emergency situations, caused by pressure increase in the deposition chamber, it is possible to empty the evaporator crucibles quickly by corresponding commutation of the MHD pump 8.
- the device shown graphically on figure 1, was embodied in the design of the vacuum machine for lithium coating polymeric film by the method of lithium thermal evaporation.
- the evaporator of four steel crucibles has been installed in the vacuum chamber of the machine.
- the Hthium melting crucible has been installed outside the vacuum chamber and connected to the evaporator with the liquid metal pipeline.
- the circuit of liquid metal static pressure consisting of the MHD pump, reservoir and system of pipes, has been arranged on the above said liquid metal pipeline. In its upper part the circuit had the expansion tank, where two ground-insulated thin rods were inserted and connected to the power and control unit of the MHD pump. The rods could travel vertically at the range of 10-15 mm.
- the circuit was manufactured in such a way that the middle of the horizontal liquid metal pipeline, coming out from the expansion tank, was at the level, equal to the desired level of filling-up the evaporator crucibles with lithium melt. In its lower part the circuit is connected to the Hthium melting crucible with the liquid metal pipeline.
- All members of the evaporator feeding system had sectioned heaters of indirect electrical heating and wall temperature sensors.
- the melting crucible was located in the room, adjacent to the vacuum machine, where relative air humidity was sustained not higher than 2%.
- the temperature setpoint was achieved, filling-up the evaporator crucibles with the melt was observed through the viewing device on the vacuum chamber.
- the cycle was started for lithium deposition onto PET film 25 micron thick, pre-coated with "Inconel 400" underlayer 40 nm thick. The process continued 5 hours without interruption; 300 m of the coated product was manufactured. It was observed periodically that hthium level in the evaporator crucibles remained invariable.
- the U-shaped elbow on the pipeline of Hthium feeding into the evaporator was constantly filled with metal and after cooling the Hquid metal pipeline before air admittance into the chamber the elbow functioned as a valve, preventing air penetration into the hot circuit,
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112005001190.9T DE112005001190B4 (en) | 2004-05-27 | 2005-05-26 | Device for vacuum coating by metal or alloy evaporation and method with such device |
JP2007514934A JP2008500454A (en) | 2004-05-27 | 2005-05-26 | Vacuum deposition method and apparatus by evaporation of metal and alloy |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LVP-04-63 | 2004-05-27 | ||
LV040063A LV13383B (en) | 2004-05-27 | 2004-05-27 | Method and device for vacuum vaporization metals or alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005116290A1 true WO2005116290A1 (en) | 2005-12-08 |
Family
ID=34970051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/LV2005/000005 WO2005116290A1 (en) | 2004-05-27 | 2005-05-26 | Method and apparatus for vacuum deposition by vaporizing metals and metal alloys |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2008500454A (en) |
CN (1) | CN1950541A (en) |
DE (1) | DE112005001190B4 (en) |
LV (1) | LV13383B (en) |
WO (1) | WO2005116290A1 (en) |
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WO2008040329A1 (en) * | 2006-09-29 | 2008-04-10 | Von Ardenne Anlagentechnik Gmbh | Vacuum coating method, and arrangement for carrying out said method |
EP1967604A1 (en) * | 2007-03-08 | 2008-09-10 | Applied Materials, Inc. | Evaporation crucible and evaporation apparatus with directional evaporation |
WO2009010468A1 (en) * | 2007-07-19 | 2009-01-22 | Applied Materials, Inc. | Vacuum evaporation apparatus for solid materials |
EP2048261A1 (en) | 2007-10-12 | 2009-04-15 | ArcelorMittal France | Industrial steam generator for depositing an alloy coating on a metal band |
WO2010126254A2 (en) * | 2009-04-27 | 2010-11-04 | Snu Precision Co., Ltd | Source supplying unit, thin film depositing apparatus, and method for depositing thin film |
EP2369033A1 (en) * | 2010-03-26 | 2011-09-28 | Saint-Gobain Glass France | Method for refilling an evaporation chamber |
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WO2009047333A1 (en) * | 2007-10-12 | 2009-04-16 | Arcelormittal France | Industrial vapour generator for the deposition of an alloy coating onto a metal strip |
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Also Published As
Publication number | Publication date |
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DE112005001190B4 (en) | 2014-02-13 |
JP2008500454A (en) | 2008-01-10 |
CN1950541A (en) | 2007-04-18 |
LV13383B (en) | 2006-02-20 |
DE112005001190T5 (en) | 2007-04-19 |
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