JPS55128578A - Method and apparatus for vacuum deposition plating of metal - Google Patents

Method and apparatus for vacuum deposition plating of metal

Info

Publication number
JPS55128578A
JPS55128578A JP3597079A JP3597079A JPS55128578A JP S55128578 A JPS55128578 A JP S55128578A JP 3597079 A JP3597079 A JP 3597079A JP 3597079 A JP3597079 A JP 3597079A JP S55128578 A JPS55128578 A JP S55128578A
Authority
JP
Japan
Prior art keywords
metal
furnace
gas
pipe
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3597079A
Other languages
Japanese (ja)
Other versions
JPS6139393B2 (en
Inventor
Seiji Nishikawa
Heizaburo Furukawa
Daizo Yamazaki
Yoshikiyo Nakagawa
Tetsuyoshi Wada
Shigeo Itano
Jusaburo Imamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP3597079A priority Critical patent/JPS55128578A/en
Publication of JPS55128578A publication Critical patent/JPS55128578A/en
Publication of JPS6139393B2 publication Critical patent/JPS6139393B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material

Abstract

PURPOSE:To eliminate the lowering of performance of plating film and the splash phenomenon of plated metal by eliminating the oxidation of metal by the procedure in which gas, e.g., N2, O2, etc., contained in molten metal is replaced with H2 gas and then degassed and the molten metal thus treated is used in vacuum deposition. CONSTITUTION:The melting replacement furnace 4 is provided in the gas replacement chamber 1, the molten plating metal 7 is housed and heated in the furnace 4, and then a necessary amount of a wiry solid metal is supplied from the supplier 10 into the chamber 1 into which N2 gas is flowed from the pipe 11. And waste gas is discharged from the pipe 12. And, N2 is blown into the metal 7 through the blower 13 to replace N2, O2, etc., in the metal 7 with H2, and then the metal is sent to the melting depassing furnace 5 inside the vacuum degassing chamber 2 through the pipe 20 where H2 present in the metal 8 is released until H2 of a partial pressure equal to the ambient pressure in left behind. Then, the metal 8 is sent to the deposition furnace 6 inside the vacuum deposition chamber 3 through the pipe 21, where metal vapor from the metal 9 surface in the furnace 6 is scattered in the direction of the arrow mark and deposited on the base plate 18 for plating.
JP3597079A 1979-03-27 1979-03-27 Method and apparatus for vacuum deposition plating of metal Granted JPS55128578A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3597079A JPS55128578A (en) 1979-03-27 1979-03-27 Method and apparatus for vacuum deposition plating of metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3597079A JPS55128578A (en) 1979-03-27 1979-03-27 Method and apparatus for vacuum deposition plating of metal

Publications (2)

Publication Number Publication Date
JPS55128578A true JPS55128578A (en) 1980-10-04
JPS6139393B2 JPS6139393B2 (en) 1986-09-03

Family

ID=12456775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3597079A Granted JPS55128578A (en) 1979-03-27 1979-03-27 Method and apparatus for vacuum deposition plating of metal

Country Status (1)

Country Link
JP (1) JPS55128578A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0622628A (en) * 1993-06-29 1994-02-01 Iseki & Co Ltd Operating device of combine
JP2008500454A (en) * 2004-05-27 2008-01-10 ズィードラーベ インコーポレイテッド Vacuum deposition method and apparatus by evaporation of metal and alloy
JP2010522272A (en) * 2007-03-20 2010-07-01 アルセロールミタル・フランス Process for coating substrate and metal alloy vacuum deposition apparatus
CN112323022A (en) * 2021-01-04 2021-02-05 度亘激光技术（苏州）有限公司 Vapor deposition method for semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4871321A (en) * 1971-12-28 1973-09-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4871321A (en) * 1971-12-28 1973-09-27

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0622628A (en) * 1993-06-29 1994-02-01 Iseki & Co Ltd Operating device of combine
JP2008500454A (en) * 2004-05-27 2008-01-10 ズィードラーベ インコーポレイテッド Vacuum deposition method and apparatus by evaporation of metal and alloy
JP2010522272A (en) * 2007-03-20 2010-07-01 アルセロールミタル・フランス Process for coating substrate and metal alloy vacuum deposition apparatus
CN112323022A (en) * 2021-01-04 2021-02-05 度亘激光技术（苏州）有限公司 Vapor deposition method for semiconductor device
CN112323022B (en) * 2021-01-04 2021-03-19 度亘激光技术（苏州）有限公司 Vapor deposition method for semiconductor device

Also Published As

Publication number Publication date
JPS6139393B2 (en) 1986-09-03

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