CN1950541A - Method and apparatus for vacuum deposition by vaporizing metals and metal alloys - Google Patents
Method and apparatus for vacuum deposition by vaporizing metals and metal alloys Download PDFInfo
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- CN1950541A CN1950541A CNA2005800146727A CN200580014672A CN1950541A CN 1950541 A CN1950541 A CN 1950541A CN A2005800146727 A CNA2005800146727 A CN A2005800146727A CN 200580014672 A CN200580014672 A CN 200580014672A CN 1950541 A CN1950541 A CN 1950541A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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Abstract
The invention relates to a method and device for vacuum deposition by thermal evaporation of metals and alloys. The offered device (figure 1) contains a melting crucible (1) with molten material (liquid metal) (2), one or several crucibles (3) of evaporation device (4) in a vacuum chamber (5), a heated liquid-metal pipe (6), connecting the said melting crucible to the said evaporation crucibles through a magnetohydrodynamic (MHD) circuit (7) of static melt pressure. The circuit (7) is provided with an MHD pump (8) and incorporates the liquid-metal pipe (6) sectors, which are adjacent to the MHD pump, heated liquid-metal pipes (9, 10) and (11), a heated reservoir (13), connected to the liquid-metal pipe (6) sector before the MHD pipe through the liquid-metal pipe (11) and to an expander (12), installed in the said pipe (9), through the liquid-metal pipe (10). Spaces above the melt in the expander and reservoir are interlinked with a pipe (14), connected to a vacuum pumping system (not shown). Two electrical sensors (15) of the melt level L are installed in the expander. The melt level L in the expander and in the evaporator is delta h high relative the melt level L0 in the MHD circuit reservoir, i.e. the MHD pump should provide pressure delta h. The present technical solution allows increasing the stability of metals and alloys evaporation in long-run processes and thus increasing the productivity. The solution may be used for the deposition of various functional coatings in electronics, metallurgy, mechanical engineering. It is possible to evaporate zinc, magnesium, cadmium, lithium, zinc-magnesium alloy with this method.
Description
Technical field
The present invention relates to vacuum deposition technique, be mainly used in the business machine of operation or semicontinuous operation continuously and plated film carried out in the drum substrate by the thermal evaporation of metal and alloy.
Background technology
Come the method and apparatus of the various functional coatings in active coating, electronics and the other technologies field in the manufacturing of anti-corrosion coating, chemical power source in the deposit metallurgical technology to obtain deep research by evaporated metal.General main use metal and alloy such as zinc, magnesium, cadmium, zinc magnesium alloy are realized these purposes.
In industrial treatment, need these a large amount of materials of consecutive evaporation, be tens kilograms sometimes, be the hundreds of kilogram sometimes.It is inconvenient keeping so a large amount of evaporating materials that is in vaporization temperature (usually, this temperature is not less than 500 ℃) in the vacuum chamber.Therefore, not having to supply with evaporating materials to vacuum chamber continuously under the prerequisite of vacuum break in the very long cycle is a difficult problem.
The method of the known described material of feeding such as shaft-like, wire, particle or powder are invalid substantially to addressing the above problem.Problem is, when these materials such as powder and particle directly entered evaporation equipment, described material just was heated to vaporization temperature fast, is accompanied by the release of gas, adsorbs and dissolves in powder particle and particulate surface and inner.This quality to coating has retroaction, especially for reactive metal lithium for example.Supply with the release that wire or shaft-like material are attended by gas equally, just the amount that discharges is smaller.In addition, in order to replenish the deposit of wire or shaft-like material, unavoidably to interrupt deposition process.
The method of supplying with the material of molten state in evaporation equipment has overcome above-mentioned defective fully.Can realize the advantage that the use liquid metal carries out the vaporizer supply in fullest ground by the magnesium of the low-melting metal of evaporation such as lithium, indium, zinc, cadmium and part.
The Russ P application 93026154 of G.Goncharov (on December 27th, 1996) discloses and a kind of liquid metal has been supplied to device in the evaporation equipment.Described device comprises the melting of metal stove that is positioned at the vacuum chamber outside, the pipeline that is positioned at the evaporation equipment of vacuum chamber and connects described smelting furnace and described evaporation equipment.Molten metal in described smelting furnace is under the normal atmosphere.Give vaporizer by the pressure difference between the vacuum chamber and the external world with described feeding molten metal.Determine metal amount of height in the vaporizer by these two kinds of balances: the first, the summation of the pressure of metal column and atmospheric pressure in the smelting furnace; The second, the pressure of the metal column in service and the vaporizer.
In evaporation operation, when not having the supply of material in fusion crucible, the melt height in cupola well and the evaporation equipment all descends.In equipment, this situation can cause the decline of vaporizer output, because a part of vapor condenses that is produced does not directly arrive in the substrate to the furnace wall of vaporizer.Therefore, along with the consumption of metal and the variation of the melt height in the vaporizer, rate of evaporation will descend, and for example the thickness of film or paper tinsel can be different for the coating of different zones in the substrate.
Though the contriver of foregoing invention mentions the stabilizer of fusion height in a kind of evaporation equipment, the performance of this stabilizer looks like quite limited.
It is emphasized that the restriction that seriously is subjected to the density of used molten metal based on the system of feeding of normal atmosphere.Therefore, for the zinc of feeding, indium and every, the melt height difference in cupola well and the evaporation equipment should be not less than 2.0-2.5 rice; For magnesium, described melt height difference should be not less than 6 meters; And, should be not less than 19 meters for lithium! In addition, because the accumulation of the oxidation of metal and slag does not contact with air so do not wish any metal; But,, be not allow fully to contact, because lithium can burn immediately with air for lithium.
The feed another kind of method of liquid metal of solution is to contact with the atmospheric of cupola well to eliminate molten metal, by the sealing and the evacuate air realization of cupola well.This method can minimize the overall size of the system of feeding, and the thawing purity that improves smelting furnace.For example, the 69th page of paper " the free paper tinsel of distillation metal or the deposit of coating " (E.Yadin that goes up E.Yadin write down in SVC 40 anniversary technical conference in 1997, " Deposition of Coating or Free Foils of Sublimating Metals ", SVC 40
ThAnnualTechnical Conference Proceedings, 1997, P.69) a kind of like this equipment has just been described.In this equipment, enter described spatial rare gas element by find time space and the control that reduces melts top in the smelting furnace, fused magnesium is fed into the evaporation equipment from smelting furnace.The applicant of present patent application shows that to the operating experience of this equipment the tube wall of liquid metal pipeline and the wettability of evaporation element change along with the relative little temperature variation of described tube wall and described element.Therefore, need high accuracy ground to adjust and keep the pressure of rare gas element in the cupola well, to avoid the evaporation equipment overfill.This requires to make and use the regulation system of relative complex, and this is a shortcoming.
Other solutions are based at vaporizer with dissolve crucible when interconnection, keep melt height in the described cupola well so that the height of the fusion in the described vaporizer to be provided by using mechanical apparatus.Therefore, Sekiguchi Yasuaki has described by improving the method for feeding that smelting furnace carries out molten metal in the Japanese patent application 62-267470 of application on November 20th, 1987, and this method is used the metal height in the transmitter control vaporizer.Usually, smelting furnace should have a large amount of metal deposits, enough carries out secular vaporization cycle, for example, can carry out during one or several job rotating.Conversely, the weight of smelting furnace causes the problem of smelting furnace lifting driving mechanism again, and the problem of regulating and keep the melt height in the vaporizer.
People such as Fukui Yasushi disclose to use mechanical apparatus to keep the technology solution of the melt height in the vaporizer in the Japanese patent application 09-053173 " method of the evaporating materials of stably feeding " (Method of Stably Feeding EvaporatingMaterial) of application on February 25th, 1997.Can think that this technology is a technology formerly.
The equipment of described technology formerly comprises smelting furnace, liquid metal pipeline, be installed in vaporizer in the vacuum chamber, measure the instrument of the melt height in the vaporizer, the equipment that is immersed in the melt height of main body in the melt of fusion crucible, control vaporizer, the equipment of the described main body immersion depth of control.When deposit was consumed, the signal by described surveying instrument allowed described main body immerse in the melt, like this, kept stable to the melt height in the vaporizer of described smelting furnace in the smelting furnace and by the liquid metal pipe connection.
The technology solution of described technology formerly has great defective.
Clearly, the serviceability of this system volume that immersed main body limits.
After described main body immerses described melt fully, must stop to handle, described main body is risen to starting position, cooling has the fusion crucible of molten metal residue, allows air admission and new metal be loaded in the described crucible.
In vaporizer the melt height transmitter being installed is another defective of described technology formerly.The working temperature of vaporizer is higher than melting temperature metal, and wherein has been full of metallic vapor, directly monitor the melt height in the vaporizer, needs to use certain material as the material of resisting this condition transmitter to be done special protection.
Formerly another defective of technology is to be to make deposite metal and the preprocessing process when feeding metal the fusion crucible from identical container.As if because repeatedly load the metal that will evaporate in dissolving crucible, for example oxide compound, nitride and other mixtures also can deposits for some impure materials.Described impurity and melt can enter vaporizer together, also can fall in the substrate, and quality of coating is descended.
Summary of the invention
The objective of the invention is to avoid defective recited above, a kind of vacuum deposition technique with constant productivity is provided, because the amount of melt height in the vaporizer and evaporant is irrelevant.For realizing described purpose, magneto hydrodynamic (magnetohydrohynamic is hereinafter to be referred as MHD) loop is installed between smelting furnace and vaporizer, described MHD loop comprises at least one reservoir, tubing system and MHD pump.
Fusing, partly refining evaporated metal and the independence that keeps constant these several operations of melt height in the vaporizer crucible, permission is combined into the loop of constant pressure with several fusion crucibles, described several fusion crucibles periodically shut-down operation to clear up the foreign material of slag and accumulation fully.Like this, the operation of vapo(u)rization system just can not interrupted.
Description of drawings
The basic element of character of the present invention and some embodiment have been shown among Fig. 1 and Fig. 2, and Fig. 3 and Fig. 4 illustrate in greater detail some parts of the technical program.
Fig. 1 is the preferred embodiments of the present invention;
Fig. 2 shows the interchangeable simplified embodiment of the technical program, and wherein deposition cycle is short relatively, does not need to use molten metal that system is carried out periodicity and feeds;
Fig. 3 and Fig. 4 show the heating and cooling system of liquid metal pipeline and corresponding container.
Embodiment
Equipment of the present invention comprises fusion crucible 1, vacuum chamber 5, hot liquid metallic conduit 6 and has the MHD loop 7 of static fusing pressure.Wherein, have the melting material (liquid metal) 2 that will be evaporated in the fusion crucible 1, the evaporation equipment 4 in the vacuum chamber 5 has one or more crucibles 3, and described hot liquid metallic conduit 6 is connected to described evaporator crucible by MHD loop 7 with described fusion crucible.
MHD loop 7 has MHD pump 8, and includes a part, liquid metal pipeline 9,10 and 11, the heating reservoir 12 of the liquid metal pipeline 6 that closes on the MHD pump.Heating reservoir 12 is connected to the part before the MHD pump in the liquid metal pipeline 6 by liquid metal pipeline 11, is connected to the trunk for expansion (expansion tank) 13 that is installed in the pipeline 9 by liquid metal pipeline 10.The space of melt top is connected by pipeline 14 and is connected to the vacuum pump system (not shown) in reservoir 12 and the trunk for expansion 13.The electronic sensor 15 of two melt height L is installed in trunk for expansion.In the trunk for expansion and vaporizer in melt water body L than the melt height L in the reservoir of MHD loop
0High Δ h.That is, Δ h is the operating pressure of MDH pump.
In a preferred embodiment, substrate frame 16 employings are through the form of refrigerative rotatable drum.And will be cylindrical material by the substrate 17 of coating, for example, polymer thin film or tinsel, however, the present invention also is suitable for other types in deposition process substrate with and other embodiment of fixing and/or transfer designs.
Fusion crucible 1 is connected to the vacuum pump system (not shown) by arm 18, be connected to rare gas element (as argon gas) plenum system (not shown) by arm 19, and have the gauger 20 of the spatial pressure that is used to measure the melt top and measure the transmitter 21 of melt height.
Liquid metal pipeline 6 has the bending part 22 of U type, and has the quenching Controlling System (not shown) as additional safety device.
When deposition cycle short relatively in, in this cycle, do not need aforesaidly periodically to present to hydrostatic circuit 7 by loading evaporated metal to fusion crucible.Under this situation, can use simplified embodiment as shown in Figure 2.In this embodiment, hydrostatic circuit 7 does not comprise heating reservoir 12.Fusion crucible 1 and transmitter thereof are directly installed in the described loop 7, substitute reservoir 12.In this case, trunk for expansion 13 is directly connected to fusion crucible 1 by liquid metal pipeline 10.Pipeline 14 connect in the fusion crucibles and in the trunk for expansion melt top the space and be connected to vacuum pump system.
Fusion crucible 1, reservoir 12 (when using it) and liquid metal pipeline 9,10 and 11 carry out electrically heated by ordinary method.In addition, described device is provided with the cooling channel, preferably is provided with cooling air channel.Described cooling channel can be the fluid cooling channel also, but it is complicated more to make this passage, sometimes also can not accept (for example, in the lithium evaporation) fully because of safety factors.Use above-mentioned cooling channel, might increase productivity, because (run to run) operation between having reduced batch.In order to simplify, the heating and cooling system is not shown among Fig. 1 and Fig. 2.
Fig. 3 shows the cross section AA (Fig. 1 and Fig. 2) of the system of electrically heated and air cooling fusion crucible 1 and reservoir 12.Described system comprise fusion crucible 1 or reservoir 12 wall body 23, with described wall body insulating resistance heater 24, heat insulator 25 and air cooling pipeline 26.
Fig. 4 shows the cross section BB (Fig. 1 and Fig. 2) of the system of electrically heated and air cooling liquid metal pipeline 9,10 and 11.The parts 31 (for example, welding) that described system comprises the tube wall 27, well heater 28, heat insulator 29, air cooled tube 30 of liquid metal 2, liquid metal pipeline, air cooled tube is engaged with the liquid metal pipeline.
Equipment moves in the following way.
After melt 2 in using fusion crucible 1 was filled MHD loop 7 and reservoir 12 thereof, deposition cycle began.Simultaneously, can cool off fusion crucible 1, open fusion crucible and the metal of the next section of packing into and do not interrupt deposition process.Certainly, need in advance the pipe section between fusion crucible and the MHD loop to be cooled to below the melting point metal.
Melt height in the vaporizer 4 is monitored by the melt height in the MHD loop 7, melt temperature in the MHD loop 7 only is higher than 30 to 50 ℃ of melting point metals, in fact, does not wherein have metallic vapor, therefore, total assurance the operational reliability of melt height transmitter and system.
In the reservoir 12 in MHD loop 7 by any known method liquid metal 2 of packing into.For example, can be by the space injecting inert gas of lateral 19 (Fig. 1) melt top in fusion crucible 1, consequent pressure difference shifts the melt of fusion crucible 1 to fill up MHD loop 7.When the MHD pump is started working, beginning filling liquid metallic conduit 6 and trunk for expansion 13.If pressure is not enough, part height that may can only fill pipe.Under this situation, there is not the melt circulation.When MHD pressure increases, melt will begin little by little to fill the significant part of trunk for expansion 13.When melt arrives at height L, just begin to flow into reservoir 12 along liquid metal pipeline 10.Like this, just begun the melt circulation in the hydrostatic circuit 7.Melt flow in the trunk for expansion 13 that is connected with melt metallic conduit 6 will sharply descend, and arriving at the laminar flow is the speed of feature.
The transmitter 15 of detection melt height provides the signal about the pressure that is produced by the MHD pump in the hydrostatic circuit, therefore can excess not load trunk for expansion 13 and whole loop 7 owing to excessive pressure.By the described transmitter and the common technology that are arranged in loop 7, can guarantee the constant of pressure that the MHD pump produces, thereby guarantee the constant of melt height in the loop.If the part between the crucible 3 in link circuit 7 in the liquid metal pipeline 6 and the vaporizer 4 is heated to corresponding temperature, melt begins to fill this crucible, like this, melt height in described loop and the described vaporizer will equate, because the operation pressure of MHD pump in liquid metal pipeline 6 and 9 is the same.
According to applicant's of the present invention experience as can be known, the pressure F in the MHD pump channel is used to keep essential melt height, and this F is determined by following formula:
F≥ρ·gΔh
Wherein, ρ is a fusant density, and g is a universal gravity constant, and Δ h is the operating pressure of MHD pump.
Because the liquid metal height descends (Fig. 1 and Fig. 2) melt height L because of evaporation in the system
0Trend reduces consistently.But transmitter 15 can increase the reduction that pressure compensates described melt height by signaling to the MHD pump.This process can realize automatically by known technology.
The MHD pump can transfer this distinguishing characteristics that reverse pressure is provided at once in the practice, is another advantage of technical solution of the present invention.Of great use, it is dangerous that alkali-metal melt contacts with air to this feature when evaporation basic metal.
So, under the emergency situation that the pressure increase causes in because of deposition chamber, can empty evaporator crucible apace by the commutation of MHD pump 8.
When using the basic metal operation, the sealing failure of the melt circulation and the system of feeding also is dangerous.A large amount of melts can be full of vacuum chamber.Therefore, advise being equipped with U type bending part, and have the Emergency Cooling System (not shown) to minimize above-mentioned ultimate effect into the pipeline 6 of supplying with melt for vaporizer 4.Under the order of system, this parts can use solid melt blocking pipe apace.
For example, equipment shown in Figure 1 can be embodied as the vacuum machine of carrying out the polymerization plated film of lithium by the method for lithium thermal evaporation.Vaporizer with four Steel Crucibles is installed in the vacuum chamber of this machine.The lithium fusion crucible is installed in outside the vacuum chamber, and is connected with vaporizer by the liquid metal pipeline.The liquid metal hydrostatic circuit that comprises MHD pump, reservoir and tubing system is arranged on above-mentioned liquid metal pipeline top.The top in this loop is provided with trunk for expansion, wherein is inserted with two thin bars of ground insulating, and these two thin bars are connected with control unit with the power supply of MHD pump.Described thin bar can vertically move in the scope of 10-15mm.
Making described loop by this way: the height at the middle part of the horizontal liquid metal pipeline that comes out from trunk for expansion, the use lithium melt that equals to be wanted is filled the height of evaporator crucible.The liquid metal pipe connection is passed through to the lithium fusion crucible in the bottom in described loop.
Feed all parts of system of vaporizer all have indirect electrically heated subsection heater and wall body temperature sensor.Fusion crucible is arranged in the space of closing on vacuum machine, and the atmospheric moisture in it keeps being no more than 2%.Each lithium ingot weighs 840 grams, under 2% relative air humidity each lithium ingot is loaded in the fusion crucible.The original volume of lithium approximately is 6.3 liters.
Gas in the fusion crucible begins to find time after sealing.In the fusion crucible of finding time, also find time vacuum chamber and hydrostatic circuit.When the pressure in the fusion crucible reaches 2Pa (pascal), begin heating and last till 250 ℃.By the temperature of monitoring fusion crucible wall body, can determine the moment that lithium begins to melt; And the degree that melt is filled in the crucible is determined by the signal of position sensor.
After the lithium fusing is finished, continue fusion crucible is bled, till removing the gas that dissolves in the lithium.Simultaneously, this loop is heated to 250 ℃, and starts the power supply of MHD pump.After three hours find time, close the pipeline of finding time of fusion crucible, and begin to inject argon gas by the fine tuning inlet valve.The moment that the signal record lithium of the position sensor by fusion crucible begins to arrive at the loop.The height that position sensor is reduced to design can determine that lithium fills the moment that finish in this loop.The pressure of MHD pump increases gradually, when the transmitter in being installed in the loop trunk for expansion works till.Then, cut off fusion crucible and the heating that is connected to the liquid metal pipeline of hydrostatic circuit; Begin the pipeline of the lithium of feeding to vaporizer is heated, continue to be heated to 250 ℃.Reach in the temperature value of setting,, can be observed the filling of melt in evaporator crucible by the display equipment on the vacuum chamber.
The crucible that fills up lithium is heated to after 580 ℃, and the plated film cycle begins.Lithium begins to be deposited to the PET film of 25 micron thickness, and this PET film is coated with " Inconel 400 " bottom of 40 nanometer thickness in advance.This process was not interrupted in lasting 5 hours, can produce 300 meters plated film product.Can find that by periodic observation the lithium height in the evaporator crucible remains unchanged.
After the deposit of lithium is finished, cut off heating, and lithium is cooled to 300 ℃ crucible.Then, MHD pump reverse operating was back in the loop lithium in one minute.Further, cut off the liquid metal pipeline of link circuit and vaporizer, and provide pressurized air that its tube wall and crucible are cooled off.After temperature reaches 50-60 ℃, dry air is injected vacuum chamber, unload into the plated film product of drum, and the new reel of packing into, begin the new cycle.
The U type bending part that lithium is fed into the pipeline of vaporizer is full of metal consistently.After the liquid metallic conduit of cooling, before vacuum chamber injected air, described bending part played the function of valve, prevented that air infiltration from going in the thermal loop.
Load a lithium and can carry out general five deposition cycle, produce the plated film product that is used for chemical power source of 1500m.Thickness along all plated film reels measurement lithiums shows that the thickness extension of lithium is no more than 5%, and this is representative for any vacuum deposition processes.In whole process, do not observe because melt height descends and causes the dullness of thickness to reduce in the crucible.
Claims
(according to the modification of the 19th of treaty)
1, a kind ofly carry out the method for vacuum deposition by evaporated metal and alloy, vacuum deposition is outdoor and melt deposit by the liquid metal pipe connection in the fusion crucible that is installed in the vaporizer in the described vacuum chamber being installed in; Described deposit melt is fed in the described vaporizer; Monitoring is also kept height constant of solution described in the described vaporizer; It is characterized in that: provide liquid metal flow by the magneto hydrodynamic suction along described fluent metal loop, stablize the height of liquid metal in the described loop; From described loop described liquid metal is fed in the described vaporizer, and guarantees the constant of liquid metal height in the described vaporizer by liquid metal height stable in the described loop.
2, a kind of equipment that carries out vacuum deposition by evaporated metal and alloy, comprise vacuum chamber with air extractor, be positioned at the vaporizer of described vacuum chamber, be positioned at the outer fusion crucible of described vacuum chamber, stablize the device of the melt height in the described vaporizer, described vaporizer comprises one or more evaporator crucibles, described fusion crucible arrives described vaporizer by the liquid metal pipe connection, it is characterized in that fluent metal loop, described fluent metal loop comprises the induction type magnetic fluid driven pump, the closed system of water back and trunk for expansion, position sensor in the described trunk for expansion, described fluent metal loop is connected to described vaporizer by water back.
3, equipment according to claim 2 is characterized in that, described fluent metal loop comprises the reservoir of the metal that storage is used to evaporate, and described fusion crucible is installed in described fluent metal loop outside.
4, equipment according to claim 2 is characterized in that, described fusion crucible is installed in the described fluent metal loop.
6, equipment according to claim 2 is characterized in that, the wall body that holds each parts of liquid metal is provided with cooling air channel.
7, equipment according to claim 2 is characterized in that, the liquid metal pipeline between described vaporizer and the described fluent metal loop comprises the U type bending part that has the quenching Controlling System.
Claims (7)
1, a kind ofly carry out the method for vacuum deposition by evaporated metal and alloy, comprising: vacuum deposition is outdoor and melt deposit by the liquid metal pipe connection in the fusion crucible that is installed in the vaporizer in the described vacuum chamber being installed in; Described deposit melt is fed in the described vaporizer; Monitoring is also kept height constant of solution described in the described vaporizer; It is characterized in that: when stablizing the melt height in the described vaporizer in use static pressure MHD loop, by the MHD pump described melt is fed into described vaporizer, and monitors and keep the constant of melt height in the described vaporizer by the signal that is installed in the transmitter in the described loop.
2, a kind of equipment that carries out vacuum deposition by evaporated metal and alloy, comprise vacuum chamber, the vaporizer that is arranged in described vacuum chamber, be positioned at the equipment of melt height of fusion crucible, measurement and the described vaporizer of adjusting of described vacuum chamber outside with air extractor, described vaporizer comprises one or more evaporator crucibles, described fusion crucible to described vaporizer, is characterized in that melt static pressure MHD loop by the liquid metal pipe connection.
3, equipment according to claim 2, it is characterized in that, described melt static pressure MHD loop comprises the reservoir of the metal that induction type MHD pump, fluid pipeline system and storage are used to evaporate, and described reservoir is installed between described fusion crucible and the described vaporizer.
4, equipment according to claim 2 is characterized in that, described melt static pressure MHD loop comprises described fusion crucible, induction type MHD pump and fluid pipeline system.
5, equipment according to claim 2 is characterized in that, but described MHD pump reverse operating.
6, equipment according to claim 2 is characterized in that, the wall body of described smelting furnace, reservoir and liquid metal pipeline is provided with cooling air channel.
7, equipment according to claim 2 is characterized in that, the part of described liquid metal pipeline between described vaporizer and described MHD pump comprises the U type bending part that has the quenching Controlling System.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LV040063A LV13383B (en) | 2004-05-27 | 2004-05-27 | Method and device for vacuum vaporization metals or alloys |
| LVP0463 | 2004-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1950541A true CN1950541A (en) | 2007-04-18 |
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ID=34970051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005800146727A Pending CN1950541A (en) | 2004-05-27 | 2005-05-26 | Method and apparatus for vacuum deposition by vaporizing metals and metal alloys |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2008500454A (en) |
| CN (1) | CN1950541A (en) |
| DE (1) | DE112005001190B4 (en) |
| LV (1) | LV13383B (en) |
| WO (1) | WO2005116290A1 (en) |
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Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2664852A (en) * | 1950-04-27 | 1954-01-05 | Nat Res Corp | Vapor coating apparatus |
| US3581766A (en) * | 1968-08-02 | 1971-06-01 | Jones & Laughlin Steel Corp | Supplying liquid to a vacuum chamber |
| CH610013A5 (en) * | 1975-11-19 | 1979-03-30 | Battelle Memorial Institute | |
| JPS55128578A (en) * | 1979-03-27 | 1980-10-04 | Mitsubishi Heavy Ind Ltd | Method and apparatus for vacuum deposition plating of metal |
| JPS55154537A (en) * | 1979-05-18 | 1980-12-02 | Mitsubishi Heavy Ind Ltd | Method and apparatus for carrying molten metal |
| JPS5681674A (en) * | 1979-12-06 | 1981-07-03 | Mitsubishi Heavy Ind Ltd | Charging apparatus of molten metal for plating by vacuum vapor coating |
| JPS6233762A (en) * | 1985-08-06 | 1987-02-13 | Hitachi Ltd | Vacuum deposition device |
| JPH0647724B2 (en) * | 1986-05-16 | 1994-06-22 | 三菱重工業株式会社 | Molten metal level detection control method in continuous vacuum deposition chamber |
| JPS63199868A (en) * | 1987-02-13 | 1988-08-18 | Mitsubishi Heavy Ind Ltd | Device for controlling molten metal level in vacuum evaporator |
| JPS63312968A (en) * | 1987-06-15 | 1988-12-21 | Hitachi Ltd | Melting and evaporating device |
| SU1698939A1 (en) * | 1987-12-17 | 1991-12-15 | Всесоюзный научно-исследовательский, проектно-конструкторский и технологический институт электросварочного оборудования | Device for metered alloy feed |
| JPH01234560A (en) * | 1988-03-11 | 1989-09-19 | Ulvac Corp | Method and device for supplying low-melting-point material to be vaporized in vapor deposition apparatus |
| JPH02118064A (en) * | 1988-10-27 | 1990-05-02 | Mitsubishi Heavy Ind Ltd | Vacuum deposition device |
| RU1639383C (en) * | 1989-07-04 | 1994-03-15 | Kirillov I R | Linear induction pump |
| JPH0372037A (en) * | 1989-08-14 | 1991-03-27 | Toshiba Corp | Metal vapor generator |
| US5923104A (en) * | 1994-05-05 | 1999-07-13 | Lockheed Martin Energy Research Corporation | Single channel double-duct liquid metal electrical generator using a magnetohydrodynamic device |
| JPH0953173A (en) * | 1995-08-18 | 1997-02-25 | Nisshin Steel Co Ltd | Method for stably feeding evaporating material |
-
2004
- 2004-05-27 LV LV040063A patent/LV13383B/en unknown
-
2005
- 2005-05-26 WO PCT/LV2005/000005 patent/WO2005116290A1/en active Application Filing
- 2005-05-26 DE DE112005001190.9T patent/DE112005001190B4/en not_active Expired - Fee Related
- 2005-05-26 JP JP2007514934A patent/JP2008500454A/en active Pending
- 2005-05-26 CN CNA2005800146727A patent/CN1950541A/en active Pending
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| TWI839614B (en) * | 2020-06-04 | 2024-04-21 | 美商應用材料股份有限公司 | Crucible for flash evaporation of a liquid material, vapor deposition apparatus and method for coating a substrate in a vacuum chamber |
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Also Published As
| Publication number | Publication date |
|---|---|
| DE112005001190T5 (en) | 2007-04-19 |
| DE112005001190B4 (en) | 2014-02-13 |
| JP2008500454A (en) | 2008-01-10 |
| WO2005116290A1 (en) | 2005-12-08 |
| LV13383B (en) | 2006-02-20 |
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