WO2005110921A1 - Hydroxyde d'aluminium et son utilisation - Google Patents

Hydroxyde d'aluminium et son utilisation Download PDF

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Publication number
WO2005110921A1
WO2005110921A1 PCT/JP2005/009117 JP2005009117W WO2005110921A1 WO 2005110921 A1 WO2005110921 A1 WO 2005110921A1 JP 2005009117 W JP2005009117 W JP 2005009117W WO 2005110921 A1 WO2005110921 A1 WO 2005110921A1
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WO
WIPO (PCT)
Prior art keywords
aluminum hydroxide
particle diameter
mass
average particle
logd
Prior art date
Application number
PCT/JP2005/009117
Other languages
English (en)
Inventor
Sirou Tomitsuka
Akira Onishi
Seisuke Takahashi
Original Assignee
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Publication of WO2005110921A1 publication Critical patent/WO2005110921A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C01F7/021—After-treatment of oxides or hydroxides
    • C01F7/023—Grinding, deagglomeration or disintegration
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/40—Compounds of aluminium
    • C09C1/407—Aluminium oxides or hydroxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/29—Protection against damage caused by extremes of temperature or by flame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/88—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by thermal analysis data, e.g. TGA, DTA, DSC
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/90—Other properties not specified above
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)

Abstract

Considérant que D est le diamètre moyen des particules (νm), l'invention se rapporte à (1) un hydroxyde d'aluminium, dans lequel le taux moyen de décroissance de la masse WLR250 ( % en masse/minute) que l'hydroxyde d'aluminium présente lorsqu'il est maintenu à 250 °C pendant 15 minutes est spécifié par la relation: WLR250 <-0,62 x logD + 2,2, (2) un hydroxyde d'aluminium dans lequel le taux moyen de décroissance de la masse WLR250 WLR 200 ( % de masse/minute) que l'hydroxyde d'aluminium présente lorsqu'il est maintenu à 200 °C pendant 100 minutes est spécifié par la relation WLR200 <-0,056 x logD + 0,12, (3) un hydroxyde d'aluminium, dans lequel le taux moyen de décroissance de la masse WL 250 (%) que l'hydroxyde d'aluminium présente lorsqu'il est chauffé à 250 °C à une cadence de 5 °C/minute est spécifié par la relation: WL250 <-3,0 x logD + 10, (4) une composition contenant des hydroxydes d'aluminium qui contient ces hydroxydes d'aluminium en tant que matière de remplissage, et (5) un fil électrique et une carte imprimée comportant cette composition contenant des hydroxydes d'aluminium. Lorsque l'hydroxyde d'aluminium de la présente invention, qui s'avère posséder une résistance élevée à la température, est ajouté à une résine, ladite résine s'avère être moins visqueuse et plus apte à durcir facilement.
PCT/JP2005/009117 2004-05-13 2005-05-12 Hydroxyde d'aluminium et son utilisation WO2005110921A1 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2004143303 2004-05-13
JP2004-143303 2004-05-13
US57223704P 2004-05-19 2004-05-19
US60/572,237 2004-05-19
JP2004374251 2004-12-24
JP2004-374251 2004-12-24
US64297005P 2005-01-12 2005-01-12
US60/642,970 2005-01-12

Publications (1)

Publication Number Publication Date
WO2005110921A1 true WO2005110921A1 (fr) 2005-11-24

Family

ID=34968134

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/009117 WO2005110921A1 (fr) 2004-05-13 2005-05-12 Hydroxyde d'aluminium et son utilisation

Country Status (1)

Country Link
WO (1) WO2005110921A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007047528A2 (fr) * 2005-10-18 2007-04-26 Albemarle Corporation Particules d'hydroxyde d'aluminium thermiquement stables et leur utilisation en tant que matiere de charge dans des stratifies de resine epoxyde
WO2008056966A1 (fr) * 2006-11-10 2008-05-15 Servicios Industriales Peñoles, S.A. De C.V. Procédé de préparation d'additif ignifugeant destiné à des revêtements et produits ainsi obtenus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0960855A1 (fr) * 1998-05-29 1999-12-01 Martinswerk GmbH für chemische und metallurgische Produktion Hydroxyde d'aluminium non hygroscopique et thermiquement stable
US20030049198A1 (en) * 2000-01-10 2003-03-13 Neil Brown Process for the production of aluminum hydroxide of improved thermal stability
US20040013604A1 (en) * 2001-06-21 2004-01-22 Akira Onishi Aluminum hydroxide and production process thereof
EP1411079A2 (fr) * 2002-10-16 2004-04-21 Nabaltec GmbH Composition polymérique ignifuge, son utilisation et préparation de l'agent ignifugeant
WO2004050556A1 (fr) * 2002-12-05 2004-06-17 Showa Denko K.K. Hydroxyde d'aluminium et procede de production de cet hydroxyde d'aluminium

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0960855A1 (fr) * 1998-05-29 1999-12-01 Martinswerk GmbH für chemische und metallurgische Produktion Hydroxyde d'aluminium non hygroscopique et thermiquement stable
US20030049198A1 (en) * 2000-01-10 2003-03-13 Neil Brown Process for the production of aluminum hydroxide of improved thermal stability
US20040013604A1 (en) * 2001-06-21 2004-01-22 Akira Onishi Aluminum hydroxide and production process thereof
EP1411079A2 (fr) * 2002-10-16 2004-04-21 Nabaltec GmbH Composition polymérique ignifuge, son utilisation et préparation de l'agent ignifugeant
WO2004050556A1 (fr) * 2002-12-05 2004-06-17 Showa Denko K.K. Hydroxyde d'aluminium et procede de production de cet hydroxyde d'aluminium

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007047528A2 (fr) * 2005-10-18 2007-04-26 Albemarle Corporation Particules d'hydroxyde d'aluminium thermiquement stables et leur utilisation en tant que matiere de charge dans des stratifies de resine epoxyde
WO2007047528A3 (fr) * 2005-10-18 2007-05-24 Albemarle Corp Particules d'hydroxyde d'aluminium thermiquement stables et leur utilisation en tant que matiere de charge dans des stratifies de resine epoxyde
WO2008056966A1 (fr) * 2006-11-10 2008-05-15 Servicios Industriales Peñoles, S.A. De C.V. Procédé de préparation d'additif ignifugeant destiné à des revêtements et produits ainsi obtenus

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