WO2005103793A1 - Miroir bidimensionnel a systeme micro-electromecanique a structures de suspension articulees pour reseaux a taux de remplissage eleve - Google Patents

Miroir bidimensionnel a systeme micro-electromecanique a structures de suspension articulees pour reseaux a taux de remplissage eleve Download PDF

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Publication number
WO2005103793A1
WO2005103793A1 PCT/CA2004/001995 CA2004001995W WO2005103793A1 WO 2005103793 A1 WO2005103793 A1 WO 2005103793A1 CA 2004001995 W CA2004001995 W CA 2004001995W WO 2005103793 A1 WO2005103793 A1 WO 2005103793A1
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WO
WIPO (PCT)
Prior art keywords
mirror
cantilever
rotation
axis
articulated hinge
Prior art date
Application number
PCT/CA2004/001995
Other languages
English (en)
Inventor
Mohiuddin Mala
Thomas Ducellier
Alan Hnatiw
David Peale
Original Assignee
Metconnex Canada Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metconnex Canada Inc. filed Critical Metconnex Canada Inc.
Priority to EP04821902A priority Critical patent/EP1738214A1/fr
Priority to JP2007508682A priority patent/JP2007534017A/ja
Priority to CA002526231A priority patent/CA2526231A1/fr
Publication of WO2005103793A1 publication Critical patent/WO2005103793A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0062—Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3584—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/058—Rotation out of a plane parallel to the substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
    • G02B6/3518—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/354—Switching arrangements, i.e. number of input/output ports and interconnection types
    • G02B6/3544—2D constellations, i.e. with switching elements and switched beams located in a plane
    • G02B6/3546—NxM switch, i.e. a regular array of switches elements of matrix type constellation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/354—Switching arrangements, i.e. number of input/output ports and interconnection types
    • G02B6/3544—2D constellations, i.e. with switching elements and switched beams located in a plane
    • G02B6/3548—1xN switch, i.e. one input and a selectable single output of N possible outputs

Definitions

  • the invention relates to a MEMS (micro-electro- mechanical-system) two dimensional mirror with articulated suspension structures for high fill factor arrays .
  • MEMS micro-electro- mechanical-system
  • a MEMS (Micro-Electro-Mechanical-System) device is a micro-sized mechanical structure having electrical circuitry fabricated together with the device by various microfabrication processes mostly derived from integrated circuit fabrication methods .
  • MEMS microelectromechanical systems
  • the developments in the field of microelectromechanical systems (MEMS) allow for the bulk production of microelectromechanical mirrors and mirror arrays that can be used in all-optical cross connect switches, IxN, NxN optical switches, attenuators etc.
  • a number of microelectromechanical mirror arrays have already been built using MEMS production processes and techniques. These arrays have designs that fall into approximately three design categories.
  • a first category consists of conventional 2D gimbal mirrors with each mirror surrounded by a frame .
  • the conventional 2D gimbal mirror is one of the most common types of MEMS 2D micromirrors .
  • An example is shown in Figure 6. It consists of a central mirror 10 that is connected to an outer frame 12 with torsional hinges 14. The outer frame 12 is in turn connected to the support structure 16 with another set of torsional hinges 18.
  • There are four electrodes under the central mirror 10 that can be actuated resulting in a 2D tilt of the mirror-frame assembly.
  • US Patent Application Publication No: US2002/0071169 Al publication date June 13, 2002.
  • One of the shortcomings of this design is the inability to achieve high fill factors (that is the spacing between two consecutive mirrors or the ratio of the active area to the total area in an array) in a mirror array.
  • high fill factor that is the spacing between two consecutive mirrors or the ratio of the active area to the total area in an array
  • An example of a high fill factor would be >90% active mirror portion along one dimension.
  • a second category consists of 2D/3D mirrors with hidden hinge structures.
  • 2D micromirror devices With significant advances made in Spatial Light Modulators, a number of 2D micromirror devices have been designed with various types of hidden hinge structure. Examples of these are disclosed in US Patent Number 5,535,047, US Patent Number 5,661,591, US Patent Number: US 6,480,320 B2.
  • FIG. 7 A schematic of an example of such a device is shown in Figure 7. Although this device structure can yield high fill factor arrays, the fabrication processes are very complex.
  • references are made to US Patent No 5,061,049, US Patent No 5,079,545, US Patent No 5,105,369, US Patent No 5,278,652, US Patent No 4,662,746, US Patent No 4,710,732, US Patent No 4,956,619, US Patent No 5,172,262, and US Patent No 5,083,857.
  • a third category consists of 2D mirrors each mounted ' on a single moving flexible post.
  • the post 30 extends within a moat 32 or trench formed in the substrate or supporting material 34.
  • the post 30 can be made sufficiently long and flexible to act as an omnidirectional hinge, bending to allow the mirror 36 to be positioned with two degrees of freedom.
  • Some of the advantages realized in some but not necessarily all embodiments include: high fill factor linear arrays. Fill factors as high as 99% may be achieved in some embodiments along one dimension; almost negligible coupling between two tilt axes; inexpensive and simple control. Even an open loop/look up table control is a possibility; simple fabrication process can be used to fabricate the device; and the cantilever part of the device can also be used for capacitive, magnetic or optical sensing of mirror position.
  • the invention provides a micro-electro-mechanical-system (MEMS) mirror device, comprising: a mirror having a 2-dimensional rotational articulated hinge at a first end, and having a 1-dimensional rotational articulated hinge at a second end opposite the first end; a movable cantilever connected to the mirror through the 1-dimensional rotational articulated hinge; a support structure connected to the mirror through the 2-dimensional rotational articulated hinge and connected to the movable cantilever; a rigid extension of the movable cantilever extending beyond where the support structure is connected to the movable cantilever in a direction opposite to the mirror; whereby movement of said movable cantilever causes rotation of the mirror in a first axis of rotation, and the mirror is also rotatable about a second torsional axis of rotation perpendicular to said first axis of rotation; and whereby movement of the extension of the movable cantilever causes a corresponding opposite movement of the movable cantilever.
  • MEMS micro-electro
  • the 2-dimensional rotational articulated hinge comprises: a first 1-dimensional rotational articulated hinge having a first mounting point at a first end and having a second end; a second 1-dimensional rotational articulated hinge having a second mounting point at a first end and having a second end, the second end of the first 1- dimensional rotational articulated hinge being connected to the second end of the second 1-dimensional rotational articulated hinge; a third 1-dimensional rotational articulated hinge connected to the second ends of the first and second articulated 1-dimensional rotational hinges; whereby the first 1-dimensional rotational articulated hinge and the second 1- dimensional rotational articulated hinge define the first axis of rotation between the first and second mounting points, and the third 1-dimensional rotational articulated hinge and the 1- dimensional rotational articulated hinge at the second end of the mirror define the second torsional axis of rotation perpendicular to the first axis of rotation.
  • each 1-dimensional rotational articulated hinge comprises a respective articulated beam having a large thickness to width aspect ratio.
  • each 1-dimensional rotational articulated hinge comprises a respective articulated beam having a large thickness to width aspect ratio, the beam being formed of a material or materials selected from a group consisting of silicon, polysilicon, Silicon Nitride, Silicon dioxide, and metallic depositable materials.
  • the beams are formed of a unitary construction. In some embodiments, the beams the mirror, and the movable cantilever are formed of a unitary construction.
  • a device in which the mirror has an angular range of motion at least 0.3 degrees in each axes In some embodiments, a device in which the mirror has an angular range of motion at least 0.3 degrees in each axes.
  • a device further comprises electrodes for applying electrostatic force to the mirror so as to move the mirror in the first and second axes of rotation.
  • the electrodes comprise two electrodes each for applying a respective electrostatic force to the mirror so as to move the mirror in a respective direction in the second axis of rotation, and at least one electrode for applying electrostatic force to the movable cantilever so as to move the mirror in the first rotational axis.
  • said at least one electrode comprises two electrodes mounted on the support structure each for applying a respective electrostatic force to the moving cantilever so as to move the mirror in a respective direction in the first rotational axis.
  • said support structure comprises a first region on a first side of the movable cantilever to which is mounted a first of said two electrodes for applying electrostatic force to the movable cantilever, and a second region opposite the moving cantilever to the first region to which is mounted a second of said two electrodes for applying electrostatic force to the movable cantilever.
  • a device comprises a first electrode for applying electrostatic force to the mirror so as to move the mirror in a first direction in the first axis of rotation, and a second electrode for applying electrostatic force to the mirror so as to move the mirror in a second direction in the first axis of rotation.
  • the first electrode for applying electrostatic force to the mirror so as to move the mirror in a first direction in the first axis of rotation is on the support structure proximal the moving cantilever
  • the second electrode for applying electrostatic force to the mirror so as to move the mirror in a second direction in the first axis of rotation is on the support structure proximal the extension of the moving cantilever.
  • the moving cantilever and the rigid extension of the moving cantilever are together pivotably mounted to the support structure .
  • the moving cantilever and the rigid extension of the moving cantilever are together rigidly mounted to a portion of the support structure which is sufficiently flexible to allow the moving cantilever and the rigid extension of the moving cantilever to rotate in the first axis of rotation.
  • moments of inertia of the rigid extension of the moving cantilever substantially balance moments of inertia of the moving cantilever and mirror.
  • a device in which the mirror is made of silicon plated with a metal.
  • the metal comprises Au, Al or Cu layers.
  • a plurality N of devices arranged side by side to form a IxN MEMs array, where N>2.
  • a plurality NxM of devices arranged in N rows of M devices thereby forming an NxM MEMs array, where N>2 and M>2.
  • the mirror is used for optical switching.
  • the movable cantilever is used for capacitive, magnetic or optical sensing of mirror position.
  • Figure 1A and Figure IB provide two views of a conventional 1 dimensional MEMS mirror with an articulated suspension structure
  • Figure 2 shows the device of Figure 1 in two rotational states
  • Figure 3A is a plan view of a two dimensional articulated rotational hinge provided by an embodiment of the invention.
  • Figure 3B illustrates a MEMS mirror featuring the two dimensional rotational articulated hinge of Figure 3A;
  • Figure 4A is a view of a mirror with a two dimensional rotational articulated hinge and moving cantilever mounting system provided by an embodiment of the invention
  • Figures 4B and 4C provide a cutaway and side sectional view of a mirror with a two dimensional rotational articulated hinge and moving cantilever mounting system provided by another embodiment of the invention
  • Figure 4D is a view of a mirror with a two dimensional rotational articulated hinge and moving cantilever mounting system provided by another embodiment of the invention.
  • Figure 5 is a one dimensional MEMS array of devices like the device of Figure 4A;
  • Figure 6 is a view of a conventional two dimensional gimbal mirror with a supporting frame
  • Figure 7 is a representative sketch of a MEMS mirror with a hidden hinge structure
  • Figure 8 is a representative sketch of a 2D mirror mounted on a single moving flexible post .
  • FIG. 1A and IB A known ID MEMS torsional mirror supported by articulated suspension springs/hinges is shown in Figures 1A and IB.
  • This arrangement consists of a support structure 30 within which is mounted a mirror 34 connected to the support structure 30 through two articulated hinges 36.
  • the articulated hinges 36 consist of a silicon beam with a high aspect ratio of length to width thereby allowing torsional rotation. Using articulation allows a long silicon beam to be provided in a very small space.
  • a pair of address electrodes 38 and 40 are also shown. These would be connected to control systems capable of applying voltages to the electrode. Typically the mirror arrangement would be attached to ground.
  • the mirror 34 can be rotated around its rotational axis ( ⁇ x) 32 by applying electrostatic force on either side of the mirror using the electrodes 38,40. This is shown in Figure 2.
  • Generally indicated at 50 is the mirror in a first configuration where the mirror has been rotated counter clockwise about the rotational axis 32 and generally indicated at 52 shows the same arrangement in which the mirror has t been rotated clockwise about the rotational axis 32.
  • an embodiment of the invention provides a 2D rotatable articulated hinge.
  • a top view of a new articulated hinge is shown in Figure 3A.
  • the 2D rotatable articulated hinge includes a first articulated hinge portion 60 and a pair of second articulated hinges 62,63.
  • Each of the second articulated hinges 62,63 is connectable to a support structure indicated generally at 64 and is also connected to the first articulated hinge 60.
  • Each of the three articulated hinges 60,62,63 is similar to the conventional articulated hinge 36 of Figure 1A.
  • each articulated hinge consists of a silicon beam with high aspect ratio thickness to width.
  • the entire arrangement consisting of the three articulated hinges 60,62,63 is preferably made from a single unitary piece of silicon.
  • the arrangement is made of a deposited material such as polysilicon, Silicon Nitride, Silicon dioxide, and Metallic depositable materials. Other materials may be employed.
  • the construction is unitary in the sense that no assembly is required.
  • the beams may be made of multiple materials, for example in a layered structure.
  • the first articulated hinge 60 allows rotation along a first torsional axis ( ⁇ x) while each of the second articulated hinges 62 and 63 allow rotation about a second axis ( ⁇ z) .
  • FIG. 3B shown is a first example use of the articulated hinge of Figure 3A.
  • the articulated hinge is generally indicated by 70 and is connected to a mirror 72 at the opposite end of which there is another ID articulated hinge 74.
  • the entire arrangement of Figure 3B is made from a single piece of silicon.
  • the arrangement as shown in Figure 3B allows the mirror 72 to rotate about the main rotational axis ( ⁇ x) and the additional rotational axis ( ⁇ z) which is orthogonal to the main rotational axis.
  • Figure 3B the arrangement of Figure 3B is employed in an apparatus illustrated by way of example in Figure 4A.
  • the 2D rotation articulated hinge 70 is shown connected to the mirror 72 and ID rotational articulated hinge 74.
  • a support structure is generally indicated by 76.
  • the 2D rotational articulated hinge 70 is connected in two places 78,79 to the support structure.
  • the ID rotational articulated hinge 74 is connected to the support structure 76 through a cantilever 80.
  • the cantilever is preferably simply another piece of silicon which is connected to the support structure 76 at 82 in a manner which allows substantially no rotation of this cantilever about the main rotational axis ( ⁇ x) .
  • the cantilever 80 does have some flexibility, and in particular, the end 87 of the cantilever 80 most remote from the connection 82 to the support structure is capable of some up and down motion. To allow additional flexibility of the cantilever 80, parts may be removed. In the illustrated example, the cantilever 80 includes a gap 89 near the mounting point 82 to support structure 76. This reduces the amount of force necessary to cause the up and down motion of point 87. To control rotation in the torsional axis ( ⁇ x) ,electrodes are provided 84,85 which operate similar to the electrodes through 38,40 of Figure 1A. This allows the control of the rotation of the mirror 72 about the main torsional axis.
  • an electrode 86 beneath the cantilever structure 80 which controls the up and down motion of the end 87 of the cantilever 80 most remote from the connection 82 to the support structure 76.
  • the up and down motion of this point 87 causes rotation of the mirror 72 about the additional rotational axis ( ⁇ z) , thus making the mirror tilt in both axes either simultaneously or independently.
  • any suitable dimensions for the articulated hinges may be employed. Different numbers of articulations can be employed. The more articulations included in a given articulated hinge, the less will be the required force to cause rotation about the respective axis . In an example implementation, the dimensions of the various hinges are as follows :
  • Hinge 62 and 63 ⁇ 75 urn (L), 1.5 urn (W) , 15 um (T) , 5 um (Gap) and 3 (articulations) ⁇ ;
  • Hinge 60 and 74 ⁇ 75 um (L) , 1.5 um (W) , 15 um (T) , 5 um (Gap) and 11 (articulations) ⁇
  • some or all of the entire structure used to make the mirror, cantilevers and articulated hinges is connected to ground, and behaves like an electrode. For example if these components are made of doped silicon they become conductive. In this way, by applying a voltage to an electrode (for example electrode 84 of Figure 4A) the mirror behaves as the second electrode without the need to deposit a second designated electrode.
  • an additional support structure is provided on top of the cantilever 80 with an additional electrode so that a force could be applied to cause the end of 87 of the cantilever 80 to move upwards.
  • Figure 4B (and the side view in figure 4C) which is very similar to Figure 4A, with the exception of the additional support structure 91 and additional electrode 93 which allow an electrostatic force to be applied to the cantilever structure to move it both up and down.
  • the embodiment of Figure 4A has employed the use of electrodes through which electrostatic forces can be applied to control rotation in the two rotational axes. More generally, any other type of force could also be employed in either or both of these rotational axes. For example thermal, magnetic, thermal bimorph or piezo-electric forces can be employed to achieve the required rotation and control .
  • the cantilever can be deflected in either up or down directions depending on the arrangement of electrodes or force application, thus making the torsional mirror rotate about the second axis ⁇ z in either direction.
  • the cantilever can be deflected downwards only to reduce the number of i/O's and control complexity.
  • a number of mirrors can be placed side by side to make a linear mirror array with minimal spacing between two mirrors .
  • An example of this is shown in Figure 5 where a linear array of four 2D torsional mirrors 90,92,94,96 with 2D rotational articulated hinges and cantilevers is shown. An arbitrary number could be included in such an array.
  • Another embodiment provides a two dimensional array of NxM such mirror devices.
  • One of the main advantages of the structure of Figure 4A is the minimal coupling between the two tilt axes.
  • This device structure can be used in any number of applications. It can be used as a single mirror for any appropriate application of a single or multi-array configuration.
  • the arrangement achieves a high fill factor for mirror arrays (that is the spacing between two consecutive mirrors in an array is minimized) and is very simple to fabricate.
  • the spacing between two mirrors can be as low as few microns or as limited by microfabrication processes.
  • FIG. 4D This embodiment is very similar to that of Figure 4A.
  • This embodiment includes an additional cantilever 97 mounted over further support structure
  • Cantilever structures 80 and 97 together pivot about mounting points to the support structure 76.
  • an electrostatic force can be applied between the electrode 87 and cantilever 80 to move point 87 in a downward direction.
  • an electrostatic force can be applied between electrode 99 and the underside of cantilever 97 to cause the end 87 of cantilever 80 to move upwards.
  • the arrangement of Figure 4D provides the same flexibility as the arrangement of Figure 4B provided earlier in that both upwards and downwards mobility in the second axis of rotation ( ⁇ z) is possible.
  • the attachment of the cantilever structure composed of combined elements 80 and 97 to the support structure can either be pivotable, or rigid.
  • the support structure 76 would need to have some flexibility to allow the upwards and downwards motion of the two cantilever portions on either side of support structure 76.
  • the arrangement of Figure 4D is implemented with a balanced cantilever structure. With this embodiment, the moments of inertia on either side of the support structure 76 are substantially equalized. In one embodiment, this is achieved by making the second cantilever portion 97 substantially longer than the cantilever portion 80 such that the moments of inertia of the second cantilever portion 97 about the support structure 76 offsets the moment of inertia of the components on the other side of the support structure .
  • the device can be fabricated with existing MEMS fabrication processes.
  • the mirrors in the above employed embodiments need to have a reflective coating, for example of Au, Al, or Cu in one of more layers .
  • the mirrors are used to perform the main switching of beams of light.
  • the cantilever portion could also have a reflective coating.
  • the cantilever and/or mirror components could be used for capacitive or optical sensing.
  • the mirror components might be used for switching, while the cantilever components are used to perform sensing with signals generated to perform feedback control over the orientation of the mirrors in the additional rotational axis ( ⁇ z) .

Abstract

L'invention concerne un dispositif à miroir à système micro-électromécanique (MEMS), caractérisé en ce qu'il comprend un miroir présentant, à une première extrémité, une charnière articulée en rotation bidimensionnelle et, à une seconde extrémité opposée à la première, une charnière articulée en rotation unidimensionnelle ; un élément en porte-à-faux relié au miroir par ladite charnière articulée en rotation unidimensionnelle ; une structure support reliée au miroir par ladite charnière articulée en rotation bidimensionnelle et reliée à l'élément en porte-à-faux ; en ce que le mouvement dudit élément en porte-à-faux provoque la rotation du miroir dans un premier axe de rotation, et en ce que le miroir est également entraîné en rotation autour d'un second axe de torsion en rotation, perpendiculaire audit premier axe de rotation.
PCT/CA2004/001995 2004-04-20 2004-11-19 Miroir bidimensionnel a systeme micro-electromecanique a structures de suspension articulees pour reseaux a taux de remplissage eleve WO2005103793A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP04821902A EP1738214A1 (fr) 2004-04-20 2004-11-19 Miroir bidimensionnel a systeme micro-electromecanique a structures de suspension articulees pour reseaux a taux de remplissage eleve
JP2007508682A JP2007534017A (ja) 2004-04-20 2004-11-19 高フィルファクターアレイのための、連接式サスペンション構造を有する微小電子機械システム２次元ミラー
CA002526231A CA2526231A1 (fr) 2004-04-20 2004-11-19 Miroir bidimensionnel a systeme micro-electromecanique a structures de suspension articulees pour reseaux a taux de remplissage eleve

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/827,252 2004-04-20
US10/827,252 US7095546B2 (en) 2003-04-24 2004-04-20 Micro-electro-mechanical-system two dimensional mirror with articulated suspension structures for high fill factor arrays

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WO2005103793A1 true WO2005103793A1 (fr) 2005-11-03

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US (1) US7095546B2 (fr)
EP (1) EP1738214A1 (fr)
JP (1) JP2007534017A (fr)
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WO (1) WO2005103793A1 (fr)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7372616B2 (en) * 2001-12-06 2008-05-13 Microfabrica, Inc. Complex microdevices and apparatus and methods for fabricating such devices
KR101484435B1 (ko) 2003-04-09 2015-01-19 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
US7245415B2 (en) * 2003-10-23 2007-07-17 Spatial Photonics, Inc. High contrast spatial light modulator
US7307777B2 (en) * 2003-10-23 2007-12-11 Spatial Photonics, Inc. High-resolution spatial light modulation
TWI609409B (zh) 2003-10-28 2017-12-21 尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造方法
TWI385414B (zh) 2003-11-20 2013-02-11 尼康股份有限公司 光學照明裝置、照明方法、曝光裝置、曝光方法以及元件製造方法
TWI395068B (zh) 2004-01-27 2013-05-01 尼康股份有限公司 光學系統、曝光裝置以及曝光方法
TWI505329B (zh) 2004-02-06 2015-10-21 尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法以及元件製造方法
US7356880B2 (en) * 2004-07-26 2008-04-15 Pentax Corporation Hinge structure of micromirror device
US9082353B2 (en) 2010-01-05 2015-07-14 Pixtronix, Inc. Circuits for controlling display apparatus
US7999994B2 (en) 2005-02-23 2011-08-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US9229222B2 (en) 2005-02-23 2016-01-05 Pixtronix, Inc. Alignment methods in fluid-filled MEMS displays
US8519945B2 (en) 2006-01-06 2013-08-27 Pixtronix, Inc. Circuits for controlling display apparatus
US9158106B2 (en) 2005-02-23 2015-10-13 Pixtronix, Inc. Display methods and apparatus
US8310442B2 (en) 2005-02-23 2012-11-13 Pixtronix, Inc. Circuits for controlling display apparatus
US20070205969A1 (en) 2005-02-23 2007-09-06 Pixtronix, Incorporated Direct-view MEMS display devices and methods for generating images thereon
US9261694B2 (en) 2005-02-23 2016-02-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
KR100682958B1 (ko) 2006-01-10 2007-02-15 삼성전자주식회사 2축 마이크로 스캐너
US8526096B2 (en) 2006-02-23 2013-09-03 Pixtronix, Inc. Mechanical light modulators with stressed beams
JP4495095B2 (ja) * 2006-03-07 2010-06-30 日本電信電話株式会社 マイクロミラー装置およびミラーアレイ
CA2612206A1 (fr) * 2006-11-30 2008-05-30 Jds Uniphase Corporation Matrice a micromiroirs avec actionneur hybride
US7911672B2 (en) * 2006-12-26 2011-03-22 Zhou Tiansheng Micro-electro-mechanical-system micromirrors for high fill factor arrays and method therefore
US9176318B2 (en) 2007-05-18 2015-11-03 Pixtronix, Inc. Methods for manufacturing fluid-filled MEMS displays
US7817331B2 (en) 2007-06-21 2010-10-19 Jds Uniphase Corporation MEMS device with an angular vertical comb actuator
US8451427B2 (en) * 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US20090091730A1 (en) * 2007-10-03 2009-04-09 Nikon Corporation Spatial light modulation unit, illumination apparatus, exposure apparatus, and device manufacturing method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
EP2179330A1 (fr) * 2007-10-16 2010-04-28 Nikon Corporation Système optique d'éclairage, appareil d'exposition et procédé de fabrication de dispositif
KR101546987B1 (ko) * 2007-10-16 2015-08-24 가부시키가이샤 니콘 조명 광학 시스템, 노광 장치 및 디바이스 제조 방법
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
JP2010004008A (ja) * 2007-10-31 2010-01-07 Nikon Corp 光学ユニット、照明光学装置、露光装置、露光方法、およびデバイス製造方法
KR20160092053A (ko) * 2007-11-06 2016-08-03 가부시키가이샤 니콘 조명 광학계, 노광 장치 및 노광 방법
KR101708943B1 (ko) 2007-11-06 2017-02-21 가부시키가이샤 니콘 제어 장치, 노광 방법 및 노광 장치
JP5326259B2 (ja) 2007-11-08 2013-10-30 株式会社ニコン 照明光学装置、露光装置、およびデバイス製造方法
TW200929333A (en) 2007-12-17 2009-07-01 Nikon Corp Illumination optical system, exposure apparatus, and device manufacturing method
WO2009078223A1 (fr) 2007-12-17 2009-06-25 Nikon Corporation Unité de modulation spatiale de lumière, système d'éclairage optique, dispositif d'alignement et procédé de fabrication de dispositif
WO2009125511A1 (fr) 2008-04-11 2009-10-15 株式会社ニコン Unité de modulation spatiale de la lumière, système optique d'éclairage, aligneur et procédé de fabrication du dispositif
WO2009145048A1 (fr) 2008-05-28 2009-12-03 株式会社ニコン Dispositif et procédé d'inspection pour modulateur spatial de lumière, système optique d'éclairage, procédé de réglage de ce système optique d'éclairage, dispositif d'exposition et procédé de fabrication de dispositif
WO2010024106A1 (fr) * 2008-08-28 2010-03-04 株式会社ニコン Système optique d’éclairage, organe d’alignement et procédé de fabrication d’un dispositif
US8169679B2 (en) 2008-10-27 2012-05-01 Pixtronix, Inc. MEMS anchors
US8264666B2 (en) * 2009-03-13 2012-09-11 Nikon Corporation Exposure apparatus, exposure method, and method of manufacturing device
US8238018B2 (en) 2009-06-01 2012-08-07 Zhou Tiansheng MEMS micromirror and micromirror array
US8883407B2 (en) * 2009-06-12 2014-11-11 Rohm And Haas Electronic Materials Llc Coating compositions suitable for use with an overcoated photoresist
US20110037962A1 (en) 2009-08-17 2011-02-17 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
JP5598733B2 (ja) 2009-12-23 2014-10-01 株式会社ニコン 空間光変調ユニット、照明光学系、露光装置、およびデバイス製造方法
KR20120139854A (ko) 2010-02-02 2012-12-27 픽스트로닉스 인코포레이티드 디스플레이 장치를 제어하기 위한 회로
KR101774607B1 (ko) 2010-02-03 2017-09-04 가부시키가이샤 니콘 조명 광학 장치, 조명 방법, 및 노광 방법 및 장치
JP5842808B2 (ja) 2010-02-20 2016-01-13 株式会社ニコン 瞳強度分布を調整する方法
US20110205519A1 (en) 2010-02-25 2011-08-25 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
US9389519B2 (en) 2010-02-25 2016-07-12 Nikon Corporation Measuring method and measuring apparatus of pupil transmittance distribution, exposure method and exposure apparatus, and device manufacturing method
JP2012004465A (ja) 2010-06-19 2012-01-05 Nikon Corp 照明光学系、露光装置、およびデバイス製造方法
US10551613B2 (en) 2010-10-20 2020-02-04 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
US9036231B2 (en) 2010-10-20 2015-05-19 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
US20120212722A1 (en) 2011-02-21 2012-08-23 Nikon Corporation Fast Illumination Simulator Based on a Calibrated Flexible Point Spread Function
WO2012169089A1 (fr) 2011-06-07 2012-12-13 株式会社ニコン Système optique d'éclairage, appareil d'exposition, procédé de production d'un dispositif et unité de polarisation lumineuse
TWI652508B (zh) 2011-06-13 2019-03-01 尼康股份有限公司 照明方法
JP5767939B2 (ja) * 2011-10-20 2015-08-26 住友精密工業株式会社 ミラーアレイ
JP6120001B2 (ja) 2011-10-24 2017-04-26 株式会社ニコン 照明光学系、露光装置、およびデバイス製造方法
US9385634B2 (en) 2012-01-26 2016-07-05 Tiansheng ZHOU Rotational type of MEMS electrostatic actuator
KR102170864B1 (ko) 2012-05-02 2020-10-28 가부시키가이샤 니콘 동공 휘도 분포의 평가 방법 및 개선 방법, 조명 광학계 및 그 조정 방법, 노광 장치, 노광 방법, 및 디바이스 제조 방법
KR101701219B1 (ko) * 2013-03-11 2017-02-01 인텔 코포레이션 Ｍｅｍｓ 스캐닝 미러 시야 제공 방법 및 장치
US9134552B2 (en) 2013-03-13 2015-09-15 Pixtronix, Inc. Display apparatus with narrow gap electrostatic actuators
JP6154636B2 (ja) * 2013-03-26 2017-06-28 住友精密工業株式会社 ミラーデバイス
US9664897B1 (en) 2015-10-14 2017-05-30 Intel Corporation Apparatus with a rotatable MEMS device
CN113655612B (zh) * 2021-09-03 2023-07-25 上海科技大学 一种高稳定性二维姿态调整机构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6329220B1 (en) * 1999-11-23 2001-12-11 Micron Technology, Inc. Packages for semiconductor die
US6538799B2 (en) * 1997-08-27 2003-03-25 The Microoptical Corporation Magnetically actuated torsional micro-mechanical mirror system
US6597828B2 (en) * 2001-10-18 2003-07-22 Industrial Technology Research Institute Optical switch
CA2429508A1 (fr) * 2002-05-28 2003-11-28 Jds Uniphase Inc. Miroir microelectromecanique a clavier

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US75554A (en) * 1868-03-17 lemaistre
US71169A (en) * 1867-11-19 hayward
US4317611A (en) * 1980-05-19 1982-03-02 International Business Machines Corporation Optical ray deflection apparatus
US4710732A (en) * 1984-07-31 1987-12-01 Texas Instruments Incorporated Spatial light modulator and method
US4662746A (en) * 1985-10-30 1987-05-05 Texas Instruments Incorporated Spatial light modulator and method
US5061049A (en) * 1984-08-31 1991-10-29 Texas Instruments Incorporated Spatial light modulator and method
US5172262A (en) * 1985-10-30 1992-12-15 Texas Instruments Incorporated Spatial light modulator and method
US4956619A (en) * 1988-02-19 1990-09-11 Texas Instruments Incorporated Spatial light modulator
US5079545A (en) * 1989-01-13 1992-01-07 Sun Microsystems, Inc. Apparatus and method for processing graphical information to minimize page crossings and eliminate processing of information outside a predetermined clip window
US5105369A (en) * 1989-12-21 1992-04-14 Texas Instruments Incorporated Printing system exposure module alignment method and apparatus of manufacture
US5083857A (en) * 1990-06-29 1992-01-28 Texas Instruments Incorporated Multi-level deformable mirror device
CA2063744C (fr) * 1991-04-01 2002-10-08 Paul M. Urbanus Architecture et dispositif de synchronisation de systeme d'affichage a modulation d'impulsions en duree
JP3003429B2 (ja) * 1992-10-08 2000-01-31 富士電機株式会社 ねじり振動子および光偏向子
KR970003007B1 (ko) * 1993-05-21 1997-03-13 대우전자 주식회사 투사형 화상표시장치용 광로조절장치 및 그 구동방법
US5673139A (en) * 1993-07-19 1997-09-30 Medcom, Inc. Microelectromechanical television scanning device and method for making the same
US6044705A (en) * 1993-10-18 2000-04-04 Xros, Inc. Micromachined members coupled for relative rotation by torsion bars
US5629790A (en) * 1993-10-18 1997-05-13 Neukermans; Armand P. Micromachined torsional scanner
JP3219123B2 (ja) * 1993-11-29 2001-10-15 株式会社デンソー ２次元光走査装置及びそれを用いたバーコード読取装置
US5535047A (en) * 1995-04-18 1996-07-09 Texas Instruments Incorporated Active yoke hidden hinge digital micromirror device
US5661591A (en) * 1995-09-29 1997-08-26 Texas Instruments Incorporated Optical switch having an analog beam for steering light
US6075239A (en) 1997-09-10 2000-06-13 Lucent Technologies, Inc. Article comprising a light-actuated micromechanical photonic switch
JP3221401B2 (ja) * 1998-06-15 2001-10-22 日本電気株式会社 光信号監視方法及び装置
US6392220B1 (en) * 1998-09-02 2002-05-21 Xros, Inc. Micromachined members coupled for relative rotation by hinges
JP3552601B2 (ja) * 1998-11-16 2004-08-11 日本ビクター株式会社 光偏向子及びこれを用いた表示装置
JP3065611B1 (ja) * 1999-05-28 2000-07-17 三菱電機株式会社 マイクロミラ―装置およびその製造方法
US6315423B1 (en) * 1999-07-13 2001-11-13 Input/Output, Inc. Micro machined mirror
US20020071169A1 (en) 2000-02-01 2002-06-13 Bowers John Edward Micro-electro-mechanical-system (MEMS) mirror device
US6735008B2 (en) 2000-07-31 2004-05-11 Corning Incorporated MEMS mirror and method of fabrication
US6431714B1 (en) 2000-10-10 2002-08-13 Nippon Telegraph And Telephone Corporation Micro-mirror apparatus and production method therefor
TW472402B (en) * 2001-01-02 2002-01-11 Hung-Yi Lin Micro-mechanical driving device and its manufacturing method
US6480320B2 (en) * 2001-02-07 2002-11-12 Transparent Optical, Inc. Microelectromechanical mirror and mirror array
US6690850B1 (en) * 2001-06-05 2004-02-10 Agere Systems Inc. Article comprising a reflection-type spectral equalizer/optical switch
US6778728B2 (en) * 2001-08-10 2004-08-17 Corning Intellisense Corporation Micro-electro-mechanical mirror devices having a high linear mirror fill factor
US6760144B2 (en) * 2001-12-05 2004-07-06 Jds Uniphase Corporation Articulated MEMS electrostatic rotary actuator
JP4036643B2 (ja) * 2001-12-21 2008-01-23 オリンパス株式会社 光偏向器及び光偏向器アレイ
US6822370B2 (en) * 2002-03-06 2004-11-23 Analog Devices, Inc. Parallel plate electrostatic actuation of MEMS mirrors
US6984917B2 (en) * 2002-06-06 2006-01-10 Lucent Technologies Inc. Optical element having two axes of rotation for use in tightly spaced mirror arrays
US6781744B1 (en) * 2003-06-11 2004-08-24 Lucent Technologies Inc. Amplification of MEMS motion

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6538799B2 (en) * 1997-08-27 2003-03-25 The Microoptical Corporation Magnetically actuated torsional micro-mechanical mirror system
US6329220B1 (en) * 1999-11-23 2001-12-11 Micron Technology, Inc. Packages for semiconductor die
US6597828B2 (en) * 2001-10-18 2003-07-22 Industrial Technology Research Institute Optical switch
CA2429508A1 (fr) * 2002-05-28 2003-11-28 Jds Uniphase Inc. Miroir microelectromecanique a clavier

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EP1738214A1 (fr) 2007-01-03

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