WO2005090909A1 - 膜厚測定装置および膜厚測定方法 - Google Patents
膜厚測定装置および膜厚測定方法 Download PDFInfo
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- WO2005090909A1 WO2005090909A1 PCT/JP2004/003787 JP2004003787W WO2005090909A1 WO 2005090909 A1 WO2005090909 A1 WO 2005090909A1 JP 2004003787 W JP2004003787 W JP 2004003787W WO 2005090909 A1 WO2005090909 A1 WO 2005090909A1
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- film thickness
- probe
- axis
- displacement mechanism
- liquid film
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
- G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
- G01B5/066—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness of coating
Definitions
- the present invention relates to a technique for measuring a film thickness of a liquid thin film on a solid object, and more particularly, to a film thickness measuring apparatus and a film thickness measuring method that do not require physical property values of the thin film.
- liquid thin films such as photoresists in semiconductor manufacturing and lubricating oils in friction lubrication have been widely used in various industrial fields as well as solid thin films.
- a light wave interference method can be used to measure the film thickness from interference fringes obtained by reflected light from the front and back surfaces of the thin film.
- the film thickness obtained by the light wave interferometry is an optical length
- the refractive index of a medium through which light propagates needs to be known in advance. For this reason, accurate film thickness measurement cannot be performed unless the refractive index for the wavelength of the light source used is known.
- ellipsometry has been developed as a method that can simultaneously measure the refractive index as well as the film thickness.
- this method not only the film thickness but also the refractive index can be measured with relatively high accuracy by irradiating light having a known polarization state onto a measurement sample and analyzing the change in the polarization state.
- this method is effective for films with a thickness smaller than the wavelength of the light source, such as oxide films and vapor deposition films on semiconductor surfaces, and is applicable to films with a thickness of several hundred nm or more. There is a constraint that it is difficult.
- the present invention has been made in view of the above points, does not use an optical method, does not use ultrasonic waves or capacitance, and therefore does not need to know the physical properties of a thin film such as a refractive index in advance. It is an object of the present invention to provide a film thickness measuring device and a film thickness measuring method capable of accurately measuring a thickness. Disclosure of the invention
- a film thickness measuring apparatus includes: a mounting table for mounting a sample to be measured having a liquid film formed on a substrate surface; and a direction perpendicular to an upper surface of the mounting table.
- a needle probe fixed to the Z-axis displacement mechanism having an axis perpendicular to the upper surface of the mounting table, and having a sharpened end near the mounting table; fixed to the Z-axis displacement mechanism;
- a crystal oscillator having an electrode disposed between the sample to be measured and the Z-axis displacement mechanism in contact with the probe; a signal generator for supplying an AC signal to the electrode of the crystal oscillator; and an electrode of the crystal oscillator.
- Current detector that detects the current generated from the sensor, and Z-axis displacement value and current detection by the Z-axis displacement mechanism And the film thickness analyzer and a current value of the pressurizing et resulting crystal oscillator analyzing the thickness of the liquid film, is characterized in that example Bei a.
- the tip portion of the probe is caused to approach the liquid film while being vibrated, and is brought into contact with the liquid film, and further is brought into contact with the substrate surface.
- the vibration amplitude is greatly attenuated.
- the vibration amplitude is greatly attenuated at the position where the probe tip penetrates the liquid film and contacts the substrate surface. Measure the thickness of the liquid film from two positions where the vibration amplitude is greatly attenuated.
- a film thickness measuring apparatus capable of directly measuring the film thickness of a liquid film without knowing physical properties such as the refractive index of the liquid film is provided. Can be provided.
- the probe to be penetrated into the liquid film is an extremely sharp probe having a tip of 100 nm or less, the diameter of the through-hole of the liquid film can be reduced. Is about 100 nm, and it is possible to provide a film thickness measuring device that is so small that the effect of the through hole can be ignored.
- the tuning-fork type quartz resonator is widely used as, for example, a quartz resonator for a wristwatch, and can be obtained simply and easily.
- a measuring device can be provided.
- the frequency of the signal supplied to the crystal unit is changed within a predetermined range near the nominal resonance frequency, thereby setting the resonance frequency specific to the crystal unit. Therefore, the vibration amplitude of the probe can be detected with high sensitivity, and as a result, a highly accurate film thickness measuring device can be provided.
- the SN ratio of the current of the crystal resonator is (Signal-to-noise power ratio) can be improved. Therefore, a weak current of the quartz oscillator can be detected at a high SN ratio, and as a result, a highly accurate film thickness measuring apparatus can be provided.
- digital data analysis can be performed by an AZD converter, a DZA converter, and a personal computer, and a simple and low-cost film thickness measuring device can be provided.
- the position where the vibration amplitude is greatly attenuated can be converted into a peak point by the differential processing. It is possible to provide an easily and highly efficient film thickness measuring device.
- a film thickness measuring method for mounting a sample to be measured having a liquid film formed on a substrate surface, A horizontal holding unit that holds the installation table, a Z-axis displacement mechanism that displaces the installation table in a direction perpendicular to the top surface of the installation table, and a fixed connection mechanism that connects the horizontal holding unit and the vertical holding unit in a fixed manner
- a needle-shaped probe fixed to the vertical holder, having an axis perpendicular to the upper surface of the mounting table, and having a sharpened end near the mounting table; fixed to the vertical holder,
- a quartz oscillator having electrodes, disposed between the measurement sample and the vertical holder in contact with the probe, a signal generator for supplying an AC signal to the electrodes of the quartz oscillator, and an electrode of the quartz oscillator Current detector that detects the generated current and Z-axis displacement value by Z-axis displacement mechanism It is characterized in that and a film thickness analyze
- a sample to be measured having a liquid film formed on a substrate surface Is mounted on a mounting table, and a probe having an axis in a direction perpendicular to the surface of the liquid film and having a sharpened end near the liquid film, and a quartz oscillator in contact with the probe are Arranged at a predetermined distance from the surface of the film, an AC signal is supplied from the signal generator to the crystal oscillator electrode to vibrate the crystal oscillator, and the current flowing through the crystal oscillator electrode is detected by the current detector
- the probe vibrating upon contact with the quartz oscillator is moved together with the quartz oscillator in a direction perpendicular to the surface of the liquid film, and the Z-axis displacement mechanism is moved.
- the first position where the vibration amplitude is reduced due to the tip of the probe coming into contact with the surface of the liquid film is measured using the probe, and the probe is further penetrated through the liquid film. Move the probe close to the base
- a second position at which the vibration amplitude decreases due to contact with the surface of the base material is measured, and a difference between the first position and the second position is determined as a liquid film thickness. is there.
- the amount of displacement in the vertical direction by the Z-axis displacement mechanism can be set with high accuracy by means of the piezoelectric actuator.
- a method for measuring thickness can be provided.
- the probe for penetrating the liquid film is a probe whose tip is extremely sharp at 100 nm or less, the through hole of the liquid film is formed. Has a diameter of about 100 nm, which can provide a method for measuring the thickness of a film that is so small that the effect of the through hole can be ignored.
- the tuning-fork type crystal unit is widely used as, for example, a crystal unit for a wristwatch, and can be obtained simply and easily.
- a measuring method can be provided.
- the frequency of the signal supplied to the crystal unit can be set to the resonance frequency, the vibration amplitude of the probe can be detected with high sensitivity, and as a result, high precision Can be provided.
- the current of the crystal resonator is The S / N ratio (signal to noise power ratio) can be improved. As a result, a weak current of the crystal oscillator can be detected at a high SN ratio, and as a result, a highly accurate method for measuring the film thickness can be provided.
- digital data analysis can be performed by an AZD converter, a DZA converter, and a personal computer, so that a simple and low-cost film thickness measurement can be provided.
- a simple and low-cost film thickness measurement can be provided.
- the position where the vibration amplitude is greatly attenuated can be converted into the peak point by the differential processing, the determination of the liquid film surface position and the base material surface position can be easily performed in a data analysis.
- the film thickness can be measured two-dimensionally at an arbitrary point on the liquid film by moving the installation table in a plane perpendicular to the probe.
- a method for measuring thickness can be provided.
- FIG. 1 is a diagram showing a configuration of an embodiment of a film thickness measuring device according to the present invention.
- FIG. 2 is a view for explaining a positional relationship between a quartz oscillator and a probe of the film thickness measuring apparatus according to the present invention.
- FIG. 3 is a diagram for explaining the measurement principle of the film thickness measuring device and the film thickness measuring method according to the present invention.
- FIG. 4 is a view for explaining a method of detecting the vibration amplitude of the crystal resonator of the film thickness measuring device according to the present invention.
- FIG. 5 is a view for explaining a mechanism for attenuating a current flowing through a quartz oscillator of the film thickness measuring apparatus according to the present invention.
- FIG. 6 is a diagram illustrating an embodiment of a current detector of the film thickness measuring apparatus according to the present invention.
- FIG. 7 is a diagram for explaining a connection relationship between a crystal oscillator and a signal generator when the current detector of the film thickness measuring apparatus according to the present invention is a lock-in amplifier.
- FIG. 8 is a view for explaining a schematic process when a probe of the film thickness measuring apparatus according to the present invention is manufactured by processing it from an optical fiber.
- FIG. 9 is a diagram showing a connection system of the film thickness measuring device at the time of film thickness measurement shown in the embodiment of the present invention.
- FIG. 10 shows the results of the film thickness measurement shown in the examples of the present invention.
- FIG. 1 is a diagram showing an outline of a first embodiment of a film thickness measuring apparatus according to the present invention.
- the film thickness measuring device 1 includes a mounting table 5 for mounting a sample 4 having a liquid film 3 formed on the surface of a base material 2 and a Z that can be displaced in a direction perpendicular to the surface of the liquid film 3. And a shaft displacement mechanism 6.
- the mounting table 5 is held by a horizontal holding unit 7.
- the Z-axis displacement mechanism 6 is held by a vertical holding unit 8.
- the horizontal holding unit 7 and the vertical holding unit 8 are connected by a fixed connecting mechanism 9, and the relative positional relationship between them is fixed.
- the probe 10 is fixed to the Z-axis displacement mechanism 6 by a probe fixture 10a.
- the axis of the probe 10 is fixed to be perpendicular to the liquid film 3.
- a crystal oscillator 11 is provided between the probe 10 and the sample 4 to be measured.
- the crystal unit 11 is fixed to the Z-axis displacement mechanism 6 by a crystal unit fixture 1 1a.
- the crystal unit 11 includes two electrodes, an electrode 11 b and an electrode 11 c.
- One electrode for example, electrode 1 lb
- the other electrode eg, electrode 11 c
- the current detector 13 is connected to a reference signal 13 a obtained by branching a part of the output signal of the signal generator 14.
- the current detector 13 is connected to the AZD converter 15 to convert the detected current value into digital data.
- the output of the AZD converter 15 is connected to a film thickness analyzer 16.
- the film thickness analyzer 16 is connected to a DZA converter (Z) 17 for converting the Z-axis displacement amount into an analog amount (for example, a voltage value). Further, the output of the DZA converter (Z) 17 is connected to a Z-axis driver 18 for driving the Z-axis displacement mechanism 6.
- the mounting table 5 may be configured to be movable in a plane perpendicular to the Z-axis by at least one of the X-axis displacement mechanism 20 and the Y-axis displacement mechanism 21.
- an X-axis driver 20a is connected to the X-axis displacement mechanism 20, and the X-axis driver 20a is connected to a film thickness analyzer 16 via a DZA converter (X) 20b. Connected to.
- a Y-axis driver 21 a is connected to the Y-axis displacement mechanism 21, and a Y-axis driver 2 la is connected to the film thickness analyzer 16 via a DZA converter (Y) 21 b. Is done.
- the measurement principle of the film thickness measuring apparatus and the film thickness measuring method according to the present invention will be described with reference to FIGS.
- the sample 4 to be measured is set on the setting table 5 shown in FIG.
- the sample 4 to be measured has the liquid film 3 formed on the surface of the substrate 2.
- the thickness of the liquid film 3 is an object to be measured in the present invention.
- the material of the liquid that forms the liquid film there are no particular restrictions on the material of the liquid that forms the liquid film. Also, the physical property value of the material, e.g., For example, the refractive index and the dielectric constant may be unknown. Further, there is no particular limitation on the thickness of the liquid film. This point is completely different from the conventional film thickness measurement method using an optical method.
- a probe 10 having an axis perpendicular to the surface of the liquid film 3 is provided.
- the tip of the probe 10 on the liquid film 3 side is sharpened.
- the probe 10 is fixed to the Z-axis displacement mechanism 6 by the probe fixture 10a as shown in FIG.
- the sharpened tip of the probe 10 approaches the liquid film 3 of the sample 4 to be measured by the Z-axis displacement mechanism 6, and further penetrates through the liquid film 3 until it comes into contact with the surface of the substrate 2. It can move in the direction, that is, the direction perpendicular to the liquid film 3.
- the quartz oscillator 11 is also fixed to the Z-axis displacement mechanism 6 by the quartz oscillator fixture 11a. For this reason, the crystal unit 11 is moved in the Z-axis direction by the Z-axis displacement mechanism 6 while maintaining the relative positional relationship with the probe 3.
- the shape of the crystal unit 11 is not limited, for example, a tuning fork type crystal unit having two symmetrical projections, such as a tuning fork, is widely distributed as a reference oscillator for watches and the like. It is preferable in terms of cost and cost.
- the probe 10 When the crystal unit 11 is a tuning-fork type crystal unit, the probe 10 is positioned such that one point on the axis contacts the central concave portion of the crystal unit 11 from the inside as shown in FIG. At this time, it is important that the probe 10 "contacts" the projection of the tuning fork shape, and the contact position is not limited to FIG.
- the positional relationship between the crystal unit 11 and the probe 10 is shown in Fig. 2A (corresponding to the positional relationship in Fig. 1), as well as in Fig. 2B or Fig. 2C.
- the positional relationship may be as follows. In short, it only has to make “contact with the protrusion”.
- the spacing between the two protrusions of the tuning fork crystal unit is typically about 0.2 mm (200 m), and the diameter of the probe 10 at the part that contacts the crystal unit is Typically about 125 im.
- the outer shape of the tuning-fork type quartz resonator is about 4 mm on the long side and about 3.5 mm on the short side.
- the crystal unit 11 has two electrodes including an electrode 11 b and an electrode 11 c.
- an AC signal for example, a sine wave signal is applied between the electrodes 11b and 11c, the crystal vibrates due to the piezoelectric effect of the crystal unit.
- a signal having a frequency near the resonance frequency of the crystal resonator 11 is applied, the vibration amplitude increases.
- the vibration direction of the main vibration component vibrates in the direction in which the two projections open and close, similarly to the so-called tuning fork.
- the probe 10 that is in contact with it can also be vibrated.
- FIG. 3 is a diagram showing a positional relationship (approach distance) between the tip of the probe 10 and the sample 4 to be measured to explain the principle of the film thickness measuring method of the present invention, and the positional relationship (approach distance). This is also shown together with a schematic graph showing the vibration amplitude of the probe 10 corresponding to (separation).
- the cause is believed to be that the tip of the probe 10 receives a shear force (Shear force) from the surface of the liquid film 3 (for example, see Non-Patent Document 1).
- Region 12c is the region where the tip of probe 10 moves in liquid film 3. . In this region 12c, the vibration amplitude of the probe 10 is maintained at a substantially constant vibration amplitude.
- the probe 10 When the probe 10 is brought closer to the base material and the tip of the probe 10 comes into contact with the surface of the base material 2, the probe 10 receives a shear force from the surface of the base material 2 in the same manner as in the region 12b. The vibration amplitude attenuates further. This is the area indicated as area 12d.
- the vibration amplitude of the probe 10 shows large attenuation in the region 12b and the region 12d.
- the region 12 b is a region where the tip of the probe 10 contacts the surface of the liquid film 3
- the region 12 d is a region where the tip of the probe 10 contacts the surface of the substrate 2.
- the difference in the approach distance D d corresponding to the median value of the approach distance D b and the region 1 2 d corresponding to the center value of the region 1 2 b will indicate the thickness of the liquid film 3.
- the damping characteristic of the vibration amplitude in the region 1 2 b and the region 1 2 d is very steep, the approach distance D b, D d is can easily be determined.
- the vibration amplitude of the probe 10 must be detected. Means are indispensable.
- FIG. 1 The mechanism for detecting the vibration amplitude of the probe 10 will be described with reference to FIGS. 4 to 7.
- FIG. 4A shows a state where only the probe 10 is brought into contact with the crystal unit 11.
- a sine wave signal was applied from the signal generator 14 to the electrode 11b and electrode 11c of the crystal unit 11
- the crystal unit 11 contacted the crystal unit 11 due to the piezoelectric effect of the crystal unit 11.
- Both probes 10 start oscillating (Fig. 4B).
- a sinusoidal current flows through the electrode 1 lb and the electrode 11 c of the crystal unit 11. Since the crystal oscillator 11 can be considered to form a resonance circuit equivalently, the sinusoidal current of the crystal oscillator has a local maximum near the resonance frequency.
- the vibration amplitude of the crystal unit 11 also reaches a maximum near the resonance frequency, and there is a one-to-one correspondence between the magnitude of the sine wave current flowing through the crystal unit 11 and the size of the vibration amplitude. I do.
- the magnitude of the sinusoidal current flowing through the electrode 1 lb and the electrode 11 c of the crystal unit 11 is detected by the current detector 13 shown in FIG. It is possible to detect the vibration amplitude, and thus the vibration amplitude of the probe 10.
- the vibration amplitude of the probe 10 is attenuated due to a shear force from the surface.
- the vibration amplitude of the crystal unit 11 in contact with the probe 10 is also attenuated, and the magnitude of the sine wave current flowing through the crystal unit 11 is also attenuated.
- the current detector 13 can also detect the attenuation state of the vibration amplitude of the probe 10.
- the attenuation of the sinusoidal current flowing through the crystal unit 11 can also be explained from the change in the resonance characteristics schematically shown in FIG.
- the graph in Fig. 5 shows the resonance characteristics of the crystal unit 11; the horizontal axis shows the frequency near the resonance frequency, and the vertical axis shows the magnitude of the sinusoidal current flowing through the crystal unit 11. It is.
- the graph shown by the solid line in FIG. 5 shows the resonance characteristics when the probe 10 is separated from the surface of the liquid film 3.
- the frequency applied to the crystal unit 11 is, for example, the resonance frequency f of the resonance characteristics shown by the solid line. Is set to the neighborhood f c of.
- the magnitude of the current flowing through the electrode of the crystal unit 11 is very small, for example, 150 nA or less as shown in FIG.
- the current detector is not particularly limited as long as it has a current detection method capable of improving the signal-to-noise power ratio.For example, a part of a signal applied to the crystal unit 11
- the method for improving the signal-to-noise power ratio by synchronizing detection of the input signal 13b of the current detector 13 and the reference signal by branching the signal from the signal generator 14 and using this as the reference signal 13a It is one form of a current detector preferred for the invention.
- FIG. 6 is an example showing the operating principle of a current detector using the synchronous detection method. The principle of operation in FIG. 6 is well known and will not be described.
- FIG. 7 shows an embodiment of the current detector 13 according to the present invention, which is configured using a lock-in amplifier 13, and includes a signal generator 14 and electrodes 11 b, 11 c of a crystal unit 11. It also shows the connection relationship with.
- the current of the signal generator 14 is input to the crystal unit 11 from the electrode 11 c and input to the lock-in amplifier 13 from the electrode 11 b. Further, the signal returns to the signal generator 14 via the ground line 11h.
- the lock-in amplifier 13 also adopts the synchronous detection method shown in Fig. 6 in its operation principle.
- FIG. 8 shows an example of a method of manufacturing an optical fiber probe 10 using an optical fiber as a preferred embodiment of the probe 10 according to the present invention.
- FIG. 8 conceptually shows a process of sharpening an optical fiber by a melt drawing method.
- FIG. 8A shows the structure of the optical fiber before being melted.
- the optical fiber has a core 23 a having a diameter of about 10 m and a clad 23 b having a diameter of about 125 m.
- This optical fiber is melted and stretched while applying heat using, for example, a carbon dioxide laser. ( Figure 8B). As a result, the optical fiber is split as shown in Fig. 8C, and the split point becomes extremely sharp. -The sharpened portion is used as the tip of the probe 10.
- the optical fiber probe 10 according to the present invention may be formed by any method as long as its tip can be tapered to a tip diameter of, for example, 100 nm or less.
- a commercially-available processing device called a pipette blur using a carbon dioxide gas laser manufactured by Satyu Corporation of the United States may be used.
- the vibration amplitude (vertical axis) of the probe 10 is simultaneously measured with the probe 1. It is necessary to measure the relative displacement on the Z-axis of the zero point, that is, the approach distance (horizontal axis) of the sample 4 to the surface of the liquid film 3 or the surface of the substrate 2.
- a Z-axis displacement mechanism 6 is used to bring the tip of the probe 10 closer to the sample 4 to be measured.
- a preferred embodiment of the Z-axis displacement mechanism 6 is a combination of a coarse adjustment mechanism 6a for roughly positioning in the Z direction and a piezoelectric actuator 6b for highly accurately setting the position in the Z-axis direction.
- the Z-axis moving table 6c is fixed to the piezoelectric actuator 6b, and the probe 10 and the crystal unit 11 are fixed to the Z-axis moving table 6c and move in the Z-axis direction.
- the piezoelectric actuator 6b is preferably a piezoelectric actuator using PZT-based piezoelectric ceramics.
- the piezoelectric actuator 6b is driven by a Z-axis driver 18 constituted by, for example, a high-voltage amplifier.
- the piezoelectric actuator 6b can be driven to move the probe 10 in the Z-axis direction.
- the voltage applied to the Z-axis driver 18 is obtained by converting the Z-axis displacement data indicated by the film thickness analyzer 16 into an analog voltage by the DZA converter (Z) 17.
- the film thickness analyzer 16 can be regarded as the actual Z-axis displacement.
- the Z-axis displacement data indicated by the film thickness analyzer 16 Corresponds to short distance (horizontal axis).
- the displacement of the probe 10 or the Z-axis displacement mechanism 6 is measured by a position sensor, for example, independently of the Z-axis displacement data indicated by the film thickness analyzer 16, and the measured data is used for film thickness analysis. It is also possible to adopt a method in which the data is taken into the device 16 and this is used as the approach distance.
- the film thickness analyzer 16 can be configured using, for example, a general-purpose personal computer 16, but is not limited thereto.
- a dedicated film thickness analyzer 16 may be constructed.
- the main function of the film thickness analyzer 16 is to acquire the approach distance (Z-axis displacement data) of the probe 10 to the sample 4 to be measured and the corresponding vibration amplitude data of the probe 10 and record the data. It is.
- the recorded data can be output to the display device as a graph, for example, as shown in FIG.
- the center value of each of the two regions where the vibration amplitude of the probe 10 is greatly attenuated (corresponding to the regions 12b and 12d in the graph of Fig. 3) is determined, and the difference is measured.
- the liquid film 4 may be recorded, displayed or printed out as the film thickness of the liquid film 3.
- the area 12b and the area 12d are obtained.
- the thickness of the liquid film 3 may be determined based on a difference between two approaching distances at each peak appearing in d.
- a mounting table 5 on which a sample 4 to be measured is mounted is fixed, and a probe 10 and a quartz oscillator 11 are displaced by a Z-axis displacement mechanism 6.
- the probe 10 and the crystal unit 11 are fixed, and the mounting table on which the sample 4 to be measured is mounted is displaced by the Z-axis displacement mechanism 6.
- the second embodiment and the first embodiment are different from each other only in that the sample 4 to be measured and the probe 10 or the quartz oscillator 11 are fixed and which one is displaced. The principle of measurement is no different.
- the method of vibrating the probe 10 the method of detecting the vibration amplitude, the method of bringing the probe 10 and the sample 4 to approach by the Z-axis displacement mechanism 6, and the like are all the same as those in the first embodiment. Therefore, these descriptions are omitted.
- the mounting table 5 is moved in a plane perpendicular to the Z axis, and
- the film thickness measuring device 1 is configured so that the film thickness of the liquid film 3 can be measured not only at one point but also at a plurality of points.
- the present invention also provides a film thickness measuring method using the film thickness measuring device 1.
- an X-axis displacement mechanism 20 that can be displaced on an axis (X-axis) that is perpendicular to the Z-axis is provided. Is to be displaced.
- the installation table 5 may be moved in both the X axis and the Y axis, that is, two-dimensionally.
- the third embodiment may be a combination of any one of the first embodiment and the second embodiment.
- FIGS. 9 and 10 show the results of actually measuring the film thickness of the liquid film using the film thickness measuring apparatus and the film thickness measuring method according to the present invention.
- FIG. 9 shows a system of the film thickness measuring apparatus 1 used for the measurement.
- the probe 10 and the crystal unit 11 were fixed, and the installation table 5 on which the sample 4 to be measured was installed was displaced in the Z-axis direction (vertical direction).
- a high-precision motor drive type driving mechanism was used as the coarse adjustment mechanism, and a PZT piezoelectric actuator was used as the fine adjustment mechanism.
- a high-voltage generator was used for the PZT piezoelectric actuator driver (Z-axis driver 18).
- the signal generator 14 a commercially available function generator was used.
- the current detector 13 also uses a commercially available lock-in amplifier, and branches the output of the function generator into a reference signal (reference signal).
- the probe 10 used was one obtained by sharpening the tip of an optical fiber by a melt drawing method.
- the crystal resonator 11 used was a tuning fork type crystal resonator for a wrist watch having a nominal resonance frequency of 32.768 kHz.
- a general-purpose personal computer having an AZD converter 15 and a D / A converter 17 was used as the film thickness analyzer 16.
- a glass substrate was used as the substrate 2, and a cutting oil was used as the liquid film 3.
- Fig. 10 shows the measurement results of the film thickness by this measurement.
- the horizontal axis represents the approach distance (Ap p ro a c h d i s p l a c e me n t), and the vertical axis represents the normalized vibration amplitude (Amp r i t u d e r a t i o) of the probe 10.
- the normalized vibration amplitude is obtained by normalizing the vibration amplitude with the vibration amplitude when the probe 10 is sufficiently away from the liquid film.
- FIG. 10B is obtained by numerically differentiating the same normalized vibration amplitude data as in FIG. 10A with the approach distance so that the position where the vibration amplitude attenuates can be more easily identified. As is clear from Fig. 10B, sharp peaks appear at two close distances where the vibration amplitude is greatly attenuated. The difference (1100 nm) between the approach distances of these two peaks is the thickness of the liquid film 3. Industrial applicability
- Liquid films are used in a wide range of industrial fields, such as photoresist in semiconductor manufacturing, lubricating oil for friction lubrication, and coating films before drying in the coating process. Thickness control based on liquid film thickness measurement is extremely important in order to demonstrate the performance of the liquid film.
- the thickness of a liquid film is measured using a probe having a tip sharpened to about 100 nm, and the influence on the liquid film is so small as to be negligible. It is possible to provide a film thickness measuring device and a film thickness measuring method capable of measuring a film thickness even when a physical property value is unknown.
- the measurable film thickness is not limited by the measurement principle, and it can measure even a film thickness exceeding several hundred nm, and can be used in a wide range of industrial fields.
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PCT/JP2004/003787 WO2005090909A1 (ja) | 2004-03-19 | 2004-03-19 | 膜厚測定装置および膜厚測定方法 |
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CN102853797A (zh) * | 2011-06-30 | 2013-01-02 | 安徽华东光电技术研究所 | 一种锥体膜厚测试装置及其制作方法 |
CN105043210A (zh) * | 2015-05-07 | 2015-11-11 | 嘉兴斯达微电子有限公司 | 一种物体表面镀层厚度的检测装置及过程管控方法 |
CN107044820A (zh) * | 2017-04-10 | 2017-08-15 | 天津大学 | 环状流局部动态液膜平均厚度的直接测量系统 |
CN107356178A (zh) * | 2017-06-13 | 2017-11-17 | 中国科学院力学研究所 | 高超声速溢流液膜冷却膜厚测量探头的标定装置 |
CN112985251A (zh) * | 2021-03-24 | 2021-06-18 | 新乡学院 | 一种微观表面形貌测量装置及方法 |
Families Citing this family (1)
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US20170317268A1 (en) * | 2014-11-14 | 2017-11-02 | Mitsui Chemicals, Inc. | Polymeric piezoelectric film |
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- 2004-03-19 JP JP2006511098A patent/JP4427654B2/ja not_active Expired - Fee Related
- 2004-03-19 WO PCT/JP2004/003787 patent/WO2005090909A1/ja active Application Filing
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Cited By (8)
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JP2010107493A (ja) * | 2008-09-30 | 2010-05-13 | Espec Corp | 露形状分布測定装置及び露形状分布測定方法 |
CN102853797A (zh) * | 2011-06-30 | 2013-01-02 | 安徽华东光电技术研究所 | 一种锥体膜厚测试装置及其制作方法 |
CN102853797B (zh) * | 2011-06-30 | 2016-11-23 | 安徽华东光电技术研究所 | 一种锥体膜厚测试装置及其制作方法 |
CN105043210A (zh) * | 2015-05-07 | 2015-11-11 | 嘉兴斯达微电子有限公司 | 一种物体表面镀层厚度的检测装置及过程管控方法 |
CN107044820A (zh) * | 2017-04-10 | 2017-08-15 | 天津大学 | 环状流局部动态液膜平均厚度的直接测量系统 |
CN107356178A (zh) * | 2017-06-13 | 2017-11-17 | 中国科学院力学研究所 | 高超声速溢流液膜冷却膜厚测量探头的标定装置 |
CN107356178B (zh) * | 2017-06-13 | 2019-10-29 | 中国科学院力学研究所 | 高超声速溢流液膜冷却膜厚测量探头的标定装置 |
CN112985251A (zh) * | 2021-03-24 | 2021-06-18 | 新乡学院 | 一种微观表面形貌测量装置及方法 |
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JP4427654B2 (ja) | 2010-03-10 |
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