WO2005087396A1 - Circulation type gas-dissolved water supply device and method of operating such device - Google Patents
Circulation type gas-dissolved water supply device and method of operating such device Download PDFInfo
- Publication number
- WO2005087396A1 WO2005087396A1 PCT/JP2005/004900 JP2005004900W WO2005087396A1 WO 2005087396 A1 WO2005087396 A1 WO 2005087396A1 JP 2005004900 W JP2005004900 W JP 2005004900W WO 2005087396 A1 WO2005087396 A1 WO 2005087396A1
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- WIPO (PCT)
- Prior art keywords
- gas
- water
- water tank
- dissolved
- tank
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F21/00—Dissolving
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/68—Treatment of water, waste water, or sewage by addition of specified substances, e.g. trace elements, for ameliorating potable water
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Definitions
- the present invention relates to evacuating a circulating / dissolving water feeding apparatus. More specifically, the present invention relates to a method for dissolving and dissolving a specific gas used in a wet process such as an electronic material by using a gas dissolving water having an enhanced effect. Return the dissolved gas water that did not exist to the water tank, and set the concentration of the specific gas in the gas dissolved water above a certain level. This is related to the removal of the circulating gas, water, and water supply equipment that can keep the concentration low. Background scythe
- the present inventors have found that the use of electronic materials such as silicon for body ⁇ ⁇ ⁇ , glass for liquid crystal and the like contaminated by fine particles can be efficiently performed with a small amount of wisteria IJ.
- the inclusion concentration is less than ⁇ 0.7 mg / L, and the PH is between 6 and 12
- An electronic material i »7_R made of a thread feK was provided (Patent Document 1).
- the amount of water in the shelf fluctuates without creeping due to the formation of U: ⁇
- the stable and hydrogen gas concentration of water is more than ⁇ , it is provided to youth points
- the dewatering unit that removes the 3 ⁇ 4fek ⁇ gas, the dissolving unit that dissolves the hydrogen gas in the super-degasified state, and the jj water tank that is not used in youth points It has a sealed water tank that can supply mixed water of super 2 fek and replenished water, and hydrogen gas can be applied to the eyes of the closed water tank according to the fluctuation of water level.
- gas-dissolved water which is used for cutting electronic materials, is supplied to the point of use.
- the gas-dissolved water that has not been used in youth points is returned to the shell tank, and the gas-dissolved water can be circulated and used without any fluctuation in the gas concentration of the gas-dissolved water.
- a dispenser for dissolving water has been proposed (Patent Document 3). 0 This device is useful, but requires special attachment, and thus has been difficult in practical use.
- Patent Document 2 Japanese Patent Application Laid-Open No. 117-177021 (page 2, FIG. 3)
- Patent Document 3 Japanese Patent Laid-Open Publication No. 2000-2771549 (Page 2, FIG. 1, FIG. 2)
- the present invention relates to a gas-dissolved water supply device in which a specific gas used in an etching process such as an electronic material is dissolved to enhance the result, and the gas-dissolved water that has not been used in a large amount is supplied to a water tank. Circulating gas-dissolved water that can maintain the concentration of specific gas in the gas-dissolved water above a certain value and maintain the concentration of the specific gas in the upper space of the water tank in which the power and gas-dissolved water are formed.
- Supply equipment The purpose of this equipment is to make clear the details of the equipment. Disclosure of the invention
- the present inventors have conducted intensive studies to solve the above, and as a result, gas dissolved water not used at the point of use and gas dissolved water supplied to
- gas dissolved water not used at the point of use and gas dissolved water supplied to By providing a tank for the mixed water of the above, and maintaining the position of the tank ⁇ at a constant level, replenishing the required amount of gas and the amount of dissolved gas and increasing the amount of dissolved gas ,?
- the concentration of the specific gas to be entrained can be maintained at a certain level or more.
- the gas such as nitrogen gas and rare gas is not affected.
- ventilating the active gas over a certain flow rate It has been found that the specific gas inside can be suppressed to a certain value or less, and based on this finding, the present invention has been accomplished.
- Dissolver A for producing specific gas-dissolved water A water tank B for dissolving specific gas-dissolved water, water pipe B for connecting dissolver A to water tank B Pump D that sends water to the machine, pump D from tank B and circulation pipe E that returns to water tank B via the branch point to the machine, and three pipes F that feed gas to the upper space of 7_MfB Gas-to-container ⁇ a water-supplying device, in which the lower end of the weaving pipe C and the lower end of the circulating pipe E are submerged under the water surface in the water tank B. Separation of dissolved water,
- a circulating gas-dissolving water dispenser according to (4) which has an oxygen gas detector or a gas concentration meter that looks at the space above zfB.
- Dissolving device A for producing specific gas-dissolved water
- water tank B for dissolving specific gas-dissolved water
- fiber tube C for connecting dissolving device A and water tank B
- water tank B for dissolving specific gas-dissolved water
- Water tank B for dissolving specific gas-dissolved water
- fiber tube C for connecting dissolving device A and water tank B
- water tank B for dissolving specific gas-dissolved water
- Water tank B for dissolving specific gas-dissolved water
- fiber tube C for connecting dissolving device A and water tank B
- water tank B ⁇ Pump D to send water to the machine
- Pump D from water tank B and circulation pipe E to return to water tank B via a branch point to the 3 ⁇ 4if machine, and gas supply to the upper space of water tank B
- Gas pipe F for T At the branch point, the water is supplied to a specific gas-dissolving hydraulic power plant, and the specific gas-dissolving hydraulic power of S is circulated and returned to water tank B, and the lower end of connection pipe C and the lower end of circulation
- the specific gas is hydrogen gas
- Fig. 1 is a diagram of the device of the present invention!
- Fig. 2 is an explanatory diagram of the device used in the embodiment,
- Fig. 3 is a diagram of the hydrogen gas-dissolved water 7]
- Elemental gas concentration 4A and 4B are graphs showing the temporal change of the hydrogen gas concentration in the upper space of FIG. 4 __Mf.
- ⁇ ⁇ ⁇ is a melting device
- ⁇ is a tank
- C is a connecting rooster S pipe
- D is a pump
- ⁇ is a circulating rooster S pipe
- F is a gas pipe
- a is a dissolving device
- b is a KzK tank
- c is a connection.
- the lower end of the connection pipe, 16 represents the lower end of the circulation pipe.
- the circulation type gas-dissolved water dispenser of the present invention includes a dissolution apparatus A for producing a specific gas-dissolved water, a water tank B for shelling a specific gas-dissolved water, a connection pipe C for connecting the dissolution apparatus A and the water tank B, Shell D in tank B Pump D that sends water to the fresh machine, Pump D from tank B and a circulation pipe that returns to tank B via the branch point to the machine E, and gas piping that supplies gas to the upper space of zMfB
- the specific gas to which the device of the present invention or the present invention can be applied includes, for example, hydrogen gas, ozone gas, oxygen gas, anoregon gas, carbon dioxide gas, nitrogen gas and the like.
- the present invention can be particularly suitably applied to 7_K element gas dissolved water.
- FIG. 1 is an unpleasant view of the apparatus of the present invention.
- the device of this fiber is a melting device A for producing a specific gas-dissolved water, a water tank B for supplying the specific gas-dissolved water, a connecting pipe C connecting the dissolution device A and the water tank B, and a cleaning of the ff water in the water tank B. It has a pump D that sends out to the machine, a pump D from the ⁇ tank B, a circulation pipe E that returns to the water tank B via a branch point to the »machine, and a gas pipe F that supplies gas to the upper space of the water tank B ⁇ super ifck It is sent to melting device A via force valve 1 and melts a specific gas. It becomes gas dissolved water.
- Tank B is provided with a total of two forces S, and the opening force S of Norbu 3 is controlled by a signal sent from the ⁇ meter, so that the water level in tank ⁇ is kept constant.
- the gas-dissolved water shelled in the water tank ⁇ is pumped out by the pump D, cooled by the heat pump 4 so as to keep the water constant, and the fine particles 5 are installed on the secondary side of the pump by fine particles 5.
- the gas concentration meter 6 measures the specific gas concentration of the gas-dissolved water.
- the gas-dissolved water is diverted at branch points 7 and 8 of the circulation pipe ⁇ , sent to Nadaki via valves 9 and 10, and stored at the return of electronic materials.
- the gas-dissolved water from the block! 1 that has not been used for cleaning is returned to the water tank ⁇ via the circulation pipe ⁇ .
- the circulating rooster ⁇ has a knob 11 to keep the water pressure at the point of use constant.
- the tank 8 is provided with a gas pipe F for supplying gas to the upper space of the water tank ⁇ , and a gas supplied from the gas pipe F is used to measure a specific gas in the upper space of the water tank ⁇ . Keep the specific gas concentration in the headspace below a certain value.
- a specific gas monitor 12 In the upper space of 7 ⁇ tank ⁇ , there is a specific gas monitor 12 to monitor the specific gas concentration in the upper space, and to enjoy the oxygen gas concentration in the upper space ⁇ * Gas monitor 13 A pressure estimator 14 is provided for
- the lower end 15 of the connecting pipe C and the lower end 16 of the circulating pipe ⁇ are submerged under the water surface in the S water tank ⁇ .
- the lower end 15 of the connecting fiber tube C and the lower end 16 of the circulation pipe ⁇ S The specific gas volume that is connected to the water tank ⁇ ⁇ from the connecting pipe C by submerging under the water surface in the water tank ⁇
- the specific gas dissolved water returned from the circulation pipe ⁇ to the water tank ⁇ from the circulation pipe ⁇ does not disintegrate with the eyes of the upper space, and the specific gas power is volatilized from the gas dissolved water to produce a specific gas. It is possible to prevent the concentration from decreasing and to prevent the specific gas concentration power S in the upper space from increasing.
- an inert gas is supplied to the apparatus of the present invention through the gas pipe F.
- the specific gas dissolved in water is a dangerous gas such as hydrogen gas or ozone gas.
- a dangerous gas such as hydrogen gas or ozone gas.
- the apparatus of the present invention can be suitably used as a circulating nitrogen gas dissolved water supply apparatus which is a hydrogen gas having a specific gas power. Hydrogen gas-dissolved water has an excellent effect in removing adhered fine particles, particularly for electronic materials.
- the upper space of B is in a state of high hydrogen gas concentration.
- the lower limit of the mixture gas of hydrogen gas and air at normal temperature and normal pressure is 4.1 m% of hydrogen gas. Therefore, it is extremely dangerous if the upper space force of water tank B S hydrogen gas concentration is high.
- the apparatus of the present invention can maintain the hydrogen gas concentration in the upper space of 7W1B low even if it is used as a circulating hydrogen gas dissolved water supply apparatus. be able to.
- the specific gas is hydrogen gas
- the inside of zfB is always maintained at a positive pressure by the pressure regulator 14, there is no gas from the outside air to the water tank B, and the gas in the upper space of the water tank B is normally used. * Gas concentration is 0 # 3 ⁇ 4%.
- Circulating the gas dissolved water supply device of the present invention can and different! ⁇ And child and ⁇ shown in F i g. 1.
- the gas concentration meter 6 is used to measure the gas concentration of the dissolved gas in the circulation pipe E and the water tank B.
- the gas concentration meter 6 may be located anywhere in the circulation pipe ⁇ , and may be located in the tank ⁇ .
- Gas? The dissolved gas concentration of the volume water can also be measured directly with a gas concentration meter.
- the exhaust gas from the specific gas monitor 12 that changes the specific gas concentration in the upper space and the oxygen gas monitor 13 that monitors the oxygen gas concentration in the upper space can be discharged outside the system.
- the circulation gas dissolving water supply device includes a dissolving device for dissolving specific gas dissolving water, a water tank for dissolving specific gas dissolving water, and a dissolving device.
- the amount of gas dissolution zk supplied from the dissolving device A to the water tank is circulated. 5 ⁇ 2) ⁇ 3 ⁇ 43 ⁇ 4 or more with respect to 0 0.
- the gas dissolved hydraulic power circulating in the circulation pipe is divided at the s branch point, and when the water is dissipated in the »machine, the amount of the gas dissolved water returning to the water tank B decreases, and zMf B The amount of gas-dissolved water starts to decrease.
- the height of the inverted water tank B is preferably 60% or less of the standard water level, more preferably 40% or less, and 2% or less. More preferably, it is 0% or less 7] Fluctuation force of the liquid level in the tank When the water level exceeds 60% of the standard water level, the lower end of the connection pipe C and the lower end of the circulation pipe E are below the water level.
- the upper fck position and lower position are set by the liquid level gauge 2, and the amount of water from the connection pipe c is controlled so that the liquid level is within this range.
- the free gas concentration of the gas-dissolved water can be maintained at a predetermined value. If the amount of gas-dissolved water used is less than 5 parts per 100 parts of gas-dissolved water sent out by the pump D, the amount of gas-dissolved water from the dissolution device A to the water tank , 5 ⁇ 3 ⁇ 43 ⁇ 4 or more with respect to the gas dissolved water 100 ## sent out by the pump D.
- the hydrogen gas concentration of the hydrogen gas-dissolved water supplied from the dissolving device to the water tank is set to 0.6 mg / L or more. More preferably, it is O mg gL or more.
- the concentration of t 7j elemental gas is 0.6 mg gZL or more! The fruit develops.
- the hydrogen gas used in the washing machine is sent out from the water tank B to the circulation pipe E by the pump D. Dissolved water easily increases hydrogen gas concentration 0.6 It can be kept above magZL.
- the flow rate of the gas supplied through the gas pipe F is 0.15 to 50 with respect to the gas-liquid contact of the water tank B.
- L (standard state) Zm i ⁇ ⁇ m 2
- the flow rate of the test ⁇ Ru gas through the gas pipe F is at 0. 1 5 L (standard state) Zm in. M less than 2 with respect to gas-liquid transliteration insect ®3 ⁇ 4 aquarium beta
- hydrogen in the upper space of the tank B Gas concentration may exceed 4.0 # 3 ⁇ 4%.
- the lower limit of the mixture of hydrogen gas and air at normal temperature and normal pressure is 7_ ⁇ gas 4.1 ⁇ * 3 ⁇ 4%, so by setting the hydrogen gas concentration in the upper space of water tank ⁇ to 4.0% or less, Inside the zMfB; not only can prevent accidents, but also eliminate the possibility of a crane accident, even if the gas in the upper space of tank B leaks into the atmosphere. 5 0 L (exceeding normal state JZm in.
- Hydrogen gas concentration meter 6 Professional water discharge norb 9, Circulation piping e Pulp to keep the pressure in e 0.2MPa 1 1, 7
- Gas piping f to supply nitrogen gas to the upper space of tank b, supply gas
- a pressure regulator 14 for maintaining the upper space of the water tank b at a positive pressure at the outlet side of the tank b, and a sensor 12 for measuring the hydrogen gas concentration in the upper space of the water tank b are provided.
- the lower end 15 of the exchange pipe c and the lower end 16 of the circulating rooster S pipe e are located 10 cm ⁇ ⁇ from the bottom of the tank.
- Example 1 Dissolved hydrogen gas concentration was prepared by dissolving device a. 1. Hydrogen gas dissolved water of Omg / L was prepared, and 160 L of hydrogen gas water was filled in water tank b with AU circulation pipe e filled with hydrogen gas dissolved water.
- Water tank b Hydrogen gas concentration from dissolution device a 1. Hydrogen gas dissolved water at Omg / L 1.0 L / min is supplied, and hydrogen gas dissolved water 20 L / min is sent out to fb power and circulation pipe e by pump d. Blow water discharge valve The blow water was discharged at 1.0 L / min from 9 power and circulated through the 7 k ⁇ gas melt angle. In addition, gas piping (nitrogen gas, 0.5 U, standard condition) was supplied to the upper space of the water tank b.
- the hydrogen gas-dissolved water measured by the hydrogen gas key meter 6 was 1.Omg / L at the beginning of the cloud, 0.88mg after 13 temples, 2 hours after 0.75mg / hour, and 3 hours after 0.68mg / hour. L, 0.66 mgZ after 4 hours, 0.65 mgZ after 5 hours, 0.65 mgZ after 6 hours.
- the hydrogen gas concentration in the upper space of tank 7_k was consistently 0.0% by volume from the beginning of the constitution to 18 hours later.
- Omg, L hydrogen gas dissolved water. .5 L / min was supplied and blow gas was discharged from water tank b to circulation pipe e by pump d in the same manner as mmn l, except that blow water 0.5 L / min was discharged from blow ⁇ discharge nozzle 9. ⁇ Kangaku drought 2 OL / min was sent out, and zK raw gas ⁇ Kangaku ZK was circulated.
- the concentration of hydrogen gas dissolved in hydrogen gas dissolved water measured with a hydrogen gas concentration meter 6 is 1. Omg / L 1 hour later 0.8 Smg / L 2 hours later 0.73mgZ 3 hours later 0.65 mg / L, 4 hours later 0.57 mgZ, 5 hours later 0.53 mgZZ, 6 hours later 0.49 mg / L
- Difficult case 2 Dissolver a power k tank b 7k in the same manner as in Example 1 except that the amount of nitrogen gas supplied to the upper space of water tank b was set to 0.0375 L (standard state) Zmin.
- Power Pro Water 1.0 LZm i ⁇ was discharged and hydrogen gas-dissolved water was circulated.
- the dissolved hydrogen gas concentration measured by the gas concentration meter 6 was 1.0 mg at the start of the treatment, 0.88 mgZ after 1 hour, 2 hours after 0.75 mgZ: L, 3 hours after 0.68 mgZ: L, 4 hours after 0.66 mgZ The dose was 0.65 mg / L after 5 hours and 0.65 mgZL after 6 hours. 7
- the hydrogen gas concentration in the upper space of water tank b measured by the elementary gas concentration sensor 12 was at the beginning of the wisteria.
- the hydrogen gas concentration in the upper space of the water tank b measured by the specific gas monitor 12 was 0.53 # 3 ⁇ 4% at the start of the application, 1.77f «% after 2 hours, 2.79 # 3 ⁇ 4% after 4 hours, 3.49 # after 6 hours 3 ⁇ 4%, 8 hours after 3.73 marrow 0 I 10 h after 3.88 marrow%, 12 hours after 3.98 bran 0 I 14 h after 4.02IPH3 ⁇ 4%, after 16 hours 4.07Im%, was 4. 10 # 3 ⁇ 4% after 18 hours .
- Table 1 shows the conditions of Examples 1 and 2 and Comparative Examples 1 to 3
- Fig. 3 shows the change over time of the hydrogen gas concentration of the dissolved hydrogen gas dissolved water
- Fig. 3 shows the hydrogen gas concentration in the upper space of zMfb. The change over time is shown in FIG. Table 1
- Example 1 the concentration of dissolved hydrogen gas in the hydrogen gas-dissolved water sent out from the seven-vessel ID force is maintained at 0.6 mg / L or more, which is necessary as washing water for removing fine particles.
- the hydrogen gas concentration of the hydrogen gas-dissolved water supplied from the hydrogen gas dissolving device a to the water tank b was set to 1. Omg / L, and the replenishment amount of the hydrogen gas-dissolved water was pumped from the water tank b.
- the concentration of hydrogen gas dissolved hydrogen gas sent to the circulation pipe e can be reduced to » It can be seen that it can be maintained at 0.6 mg / L or more.
- a gas-melting water in which a specific gas used in a jetting process such as an electronic material is dissolved is used. Return the water to the water tank, which is not used in the process, and return the water to the water tank.
- the concentration of certain gases in the upper space of the aquarium can be kept low.
- the present application is applied to 7k hydrogen gas dissolved water to increase the concentration of dissolved hydrogen gas to achieve sufficient results, and the upper space of the water tank where the hydrogen gas dissolved water is shelled.
- the hydrogen gas concentration can be kept low, and electronic materials and the like using hydrogen gas dissolved water can be performed quickly.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004-075624 | 2004-03-17 | ||
JP2004075624A JP2005262031A (en) | 2004-03-17 | 2004-03-17 | Circulation type gas-dissolved water feed device and operation method for the device |
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WO2005087396A1 true WO2005087396A1 (en) | 2005-09-22 |
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PCT/JP2005/004900 WO2005087396A1 (en) | 2004-03-17 | 2005-03-14 | Circulation type gas-dissolved water supply device and method of operating such device |
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JP (1) | JP2005262031A (en) |
CN (1) | CN1929930A (en) |
TW (1) | TW200536624A (en) |
WO (1) | WO2005087396A1 (en) |
Families Citing this family (11)
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JP4470101B2 (en) * | 2004-03-24 | 2010-06-02 | 栗田工業株式会社 | Nitrogen-dissolved ultrapure water production method |
JP4891589B2 (en) * | 2005-10-11 | 2012-03-07 | 東京エレクトロン株式会社 | Liquid processing apparatus, processing liquid supply method, and processing liquid supply program |
JP5072062B2 (en) * | 2006-03-13 | 2012-11-14 | 栗田工業株式会社 | Method, apparatus and apparatus for producing hydrogen gas-dissolved cleaning water |
JP5007999B2 (en) * | 2007-03-29 | 2012-08-22 | 国立大学法人広島大学 | Gas-liquid separator |
JP2009032710A (en) * | 2007-07-24 | 2009-02-12 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
KR101082673B1 (en) * | 2009-09-07 | 2011-11-17 | 한국서부발전 주식회사 | standard solution of dissolved in water hydrogen manufacturing equipment |
CN101850344A (en) * | 2010-05-28 | 2010-10-06 | 上海集成电路研发中心有限公司 | Semiconductor part cleaning device and cleaning method |
JP6348330B2 (en) * | 2014-04-22 | 2018-06-27 | 株式会社テックコーポレーション | Hydrogen discharger, hydrogen gas supply method, and hydrogen release system |
CN104588359A (en) * | 2015-02-04 | 2015-05-06 | 河南省爱可沃德生态科技有限公司 | Workpiece undamaged washing machine and using method thereof |
JP6043001B1 (en) * | 2016-01-19 | 2016-12-14 | S.P.エンジニアリング株式会社 | Hydrogen water generator for biological growth |
JP6024060B1 (en) * | 2016-07-14 | 2016-11-09 | 株式会社昭和冷凍プラント | Nitrogen water production system and production method |
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JP2000296899A (en) * | 1999-04-12 | 2000-10-24 | Japan Organo Co Ltd | Method for storing gas dissolved water and its storing device |
JP2003221690A (en) * | 2002-01-29 | 2003-08-08 | Mitsubishi Corp | Apparatus and process for generating high-pressure hydrogen |
JP2003334433A (en) * | 2002-05-16 | 2003-11-25 | Kurita Water Ind Ltd | Continuous dissolving device, continuous dissolving method and apparatus for supplying gas-dissolved water |
JP2004050119A (en) * | 2002-07-23 | 2004-02-19 | Matsushita Electric Ind Co Ltd | Washing device and washing method |
-
2004
- 2004-03-17 JP JP2004075624A patent/JP2005262031A/en active Pending
-
2005
- 2005-02-25 TW TW094105717A patent/TW200536624A/en unknown
- 2005-03-14 CN CNA2005800080749A patent/CN1929930A/en active Pending
- 2005-03-14 WO PCT/JP2005/004900 patent/WO2005087396A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000296899A (en) * | 1999-04-12 | 2000-10-24 | Japan Organo Co Ltd | Method for storing gas dissolved water and its storing device |
JP2003221690A (en) * | 2002-01-29 | 2003-08-08 | Mitsubishi Corp | Apparatus and process for generating high-pressure hydrogen |
JP2003334433A (en) * | 2002-05-16 | 2003-11-25 | Kurita Water Ind Ltd | Continuous dissolving device, continuous dissolving method and apparatus for supplying gas-dissolved water |
JP2004050119A (en) * | 2002-07-23 | 2004-02-19 | Matsushita Electric Ind Co Ltd | Washing device and washing method |
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Publication number | Publication date |
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CN1929930A (en) | 2007-03-14 |
TW200536624A (en) | 2005-11-16 |
JP2005262031A (en) | 2005-09-29 |
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