WO2005081023A1 - 光導波路及びその製造方法 - Google Patents
光導波路及びその製造方法 Download PDFInfo
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- WO2005081023A1 WO2005081023A1 PCT/JP2005/002997 JP2005002997W WO2005081023A1 WO 2005081023 A1 WO2005081023 A1 WO 2005081023A1 JP 2005002997 W JP2005002997 W JP 2005002997W WO 2005081023 A1 WO2005081023 A1 WO 2005081023A1
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- Prior art keywords
- cladding layer
- dry film
- core
- optical waveguide
- iii
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
Definitions
- the present invention relates to an optical waveguide and a method for manufacturing the same.
- optical waveguides have been attracting attention as optical transmission media that can meet the demands for high-capacity and high-speed information processing in optical communication systems and computers.
- Quartz-based waveguides are typical of such optical waveguides, but there have been problems such as the necessity of a special manufacturing apparatus and a long manufacturing time.
- a core film is formed by laminating a dry film containing a radiation-polymerizable component on a substrate, irradiating the film with light, curing a predetermined portion with light, and developing an unexposed portion as necessary.
- a method for manufacturing an optical waveguide having excellent transmission characteristics is known.
- Japanese Patent Application Laid-Open No. 2003-195081 discloses an optical waveguide having a lower cladding layer, a core portion, and an upper cladding layer, wherein at least one of the lower cladding layer and the core portion is formed using a dry film.
- the upper cladding layer is formed by applying and curing a coating liquid containing a radiation-curable resin or a thermosetting resin and an organic solvent.
- the method of forming the upper cladding layer using an organic solvent-containing coating solution has a problem of environmental pollution due to the organic solvent, and also involves disposal, recovery, and safety measures of the organic solvent. Equipment is large and not economical.
- the upper clad layer is formed of a dry film
- the dry film for forming the upper clad layer is adhered to the surfaces of the core and the lower clad layer, the convex portion as the core and the upper portion are formed.
- An object of the present invention is to provide an upper cladding layer that does not degrade the transmission characteristics and the like of an optical waveguide.
- the present inventors have conducted intensive studies to achieve the above object. As a result, by setting the soft film temperature of the dry film forming the upper clad layer lower than the soft film temperature of the core portion, the dry film forming the upper clad layer on the core portion and the lower clad layer is reduced. It has been found that since no gap is formed between the convex portion, which is the core portion, and the upper cladding layer when attaching the optical waveguide, the transmission characteristics of the optical waveguide do not deteriorate. The present invention has been completed based on powerful new findings.
- the present invention provides the following optical waveguide and a method for manufacturing the same.
- An optical waveguide composed of a lower cladding layer (I), a core part (II) and an upper cladding layer (III), wherein the upper cladding layer (III) is lower than the softening temperature of the core part.
- the relative refractive index difference between the higher refractive index layer of the lower cladding layer (I) and the upper cladding layer (III) and the core part (II) is 0.1% or more according to item 1 above.
- the core ( ⁇ ) is formed by coating the surface of the lower cladding layer (I) with the negative active energy ray-sensitive resin composition, or by heating a dry film comprising the composition, Pressure 7.
- the core (II) is formed by coating the surface of the lower cladding layer (I) with a positive active energy ray-sensitive resin composition, or by heating a dry film comprising the composition and applying Z or Z 7.
- the optical waveguide of the present invention is an optical waveguide composed of a lower cladding layer (1), a core part (II) and an upper cladding layer (III). It is formed using a dry film having a lower softening temperature than the softening temperature.
- the optical waveguide of the present invention is usually formed by forming a lower cladding layer (I), a core portion (II) and an upper cladding layer (III) in this order on a substrate for an optical waveguide. can get.
- Examples of the base material include a silicon substrate, a quartz substrate, a polyimide substrate, a PET substrate, a liquid polymer substrate, a copper foil, a copper-clad laminate, and a circuit-formed substrate.
- the lower cladding layer (I) is a layer formed of a known composition containing a resin such as a thermoplastic resin or a curable resin.
- thermoplastic resin examples include acrylic resin, epoxy resin, silicone resin, polycarbonate resin, siloxane resin, polyimide resin, polyurethane resin, and oxetane resin.
- Fat polyethersulfone resin, polyphenol sulfide resin, polyetherimide resin, polysulfone resin, polyetherketone resin, polyamide amide S, polyethylene amide S, polypropylene System S, polyethylene terephthalate resin, phenol novolak resin, ethylene vinyl alcohol copolymer, ethylene butyl acetate copolymer, polystyrene resin, fluorine resin, polybutylene terephthalate Resin, polyacetal resin, polyether nitrile resin, polyamide resin, polyamide 11, polyolefin'maleimide copolymer, aramide resin, liquid crystal polymer, polyetherketone resin, cyana resin G-based resin.
- a polyacetal copolymer can be used as the liquid crystal polymer.
- Examples of the curable resin include a thermosetting resin, a room temperature-curable resin, and an active energy ray-curable resin.
- thermosetting resin for example, a base resin having a thermoreactive functional group and a curing agent having a functional group that reacts with the functional group can be used in combination. Further, a self-crosslinking resin having an N-methylol group, an N-alkoxymethylol group, or the like can be used.
- Examples of the combination of the heat-reactive functional group and the functional group that reacts with the functional group include, for example, a carboxyl group and an epoxy group (an oxysilane group), a carboxylic anhydride and an epoxy group (an oxysilane group), and an amino group and an epoxy group. (Oxysilane group), carboxyl group and hydroxyl group, carboxylic anhydride and hydroxyl group, blocked isocyanate group and hydroxyl group, isocyanate group and amino group, and the like.
- room temperature curable resin examples include an oxidatively curable unsaturated resin and an isocyanate curable resin.
- an active energy ray-curable resin an active energy ray-curable resin containing two or more ring-opening-polymerizable functional group-containing compounds as an essential component, and optionally using an active energy ray polymerization initiator together; It is preferable to use, for example, a compound which uses an active energy ray polymerization initiator in combination with the unsaturated unsaturated compound, the unsaturated resin or the like, if necessary. Further, as the active energy ray-curable resin, the same ones as used in a negative active energy ray-curable resin composition described later can be used. When the active energy ray-curable resin composition is cured, the entire surface of the film is irradiated.
- thermoplastic resin or the curable resin is dissolved or dispersed in a solvent such as an organic solvent or water, if necessary, together with a curing agent and the like, to form a thermoplastic resin composition or a thermosetting resin.
- a solvent such as an organic solvent or water, if necessary, together with a curing agent and the like, to form a thermoplastic resin composition or a thermosetting resin.
- a sex resin composition is prepared. Further, a liquid polymerizable monomer or the like can be used as the solvent.
- a roller, a roll coater, and a spin coater are used to coat the resin composition on an optical waveguide substrate.
- the lower clad layer (I) can be formed by applying the coating by means of a coater, a knife edge coater, a curtain roll coater, spraying, electrostatic coating, dip coating, silk printing, and drying. Further, if necessary, the coating film can be cured or dried by irradiation with active energy rays, heating, or the like.
- the above resin composition is applied on a base film by means such as a roller, a roll coater, a spin coater, a knife edge coater, a curtain roll coater, a spray, an electrostatic coating, an immersion coating, and a silk printing. Then, by drying, a dry film layer can be formed on the surface of the base film. Next, the base film is peeled off, and a dry film is attached to the substrate by heating and Z or pressure bonding to form the lower clad layer (I). Also, a laminated film having a dry film layer formed on the surface of the base film is adhered to the substrate by heating and Z or pressure bonding, and then the base film is peeled off.
- a lower cladding layer (I) may be formed on the substrate surface.
- the coating film is cured or dried by irradiation with active energy rays, heating, or the like, as necessary, to form a lower cladding layer (I). Can be formed.
- the lower cladding layer (I) As a method for forming the lower cladding layer (I), it is particularly preferable to form the lower cladding layer (I) using a dry film from the viewpoint of environmental protection, safety, workability, and the like.
- the resin constituting the lower cladding layer (I) is obtained by curing the resin by irradiation with active energy rays, heating, etc., in terms of durability, heat resistance, workability, and optical transmission characteristics. It is preferred.
- the core (II) is formed on a part of the surface of the lower cladding layer (I).
- a known resin composition can be used for forming the core portion ( ⁇ ).
- the resin composition include a thermoplastic resin composition; a thermosetting resin composition, a negative active energy ray-sensitive resin composition, and a positive active energy ray-sensitive resin composition. Among them, it is preferable to use a negative active energy ray-sensitive resin composition and a positive active energy ray-sensitive resin composition.
- the thermoplastic resin composition include those similar to those used for forming the clad layer. [0039] Of these, it is preferable to use the negative active energy-sensitive linear resin composition or the positive active energy-sensitive linear resin composition as it is or as a dry film.
- the negative active energy ray-sensitive resin composition becomes insoluble in a developing solution when a film formed from the composition is cured by irradiation with energy rays such as ultraviolet rays, visible rays, and heat rays.
- energy rays such as ultraviolet rays, visible rays, and heat rays.
- a core portion can be formed, and a known material can be used without any particular limitation.
- an aqueous or organic solvent-type composition comprising, as an essential component, a compound containing two or more functional groups capable of ring-opening polymerization in a molecule, and optionally containing an active energy ray polymerization initiator; It is particularly preferable to use an aqueous or organic solvent type composition containing a polymerizable unsaturated compound, an unsaturated resin or the like and, if necessary, an active energy ray polymerization initiator.
- the positive active energy ray-sensitive resin composition a film formed by the composition is exposed to energy rays such as ultraviolet rays, visible rays, and heat rays, and is decomposed to dissolve in a developing solution.
- energy rays such as ultraviolet rays, visible rays, and heat rays
- Any known aqueous or organic solvent-type composition capable of forming a core by changing its properties can be used without particular limitation.
- the positive-type energy-sensitive resin composition for example, a resin obtained by bonding quinonediazidesulfonic acids to a base resin such as an atalyl resin having an ion-forming group via a sulfonic acid ester bond is used as a main component.
- a resin obtained by bonding quinonediazidesulfonic acids to a base resin such as an atalyl resin having an ion-forming group via a sulfonic acid ester bond
- the composition which is mentioned. is disclosed in
- This composition is a naphthoquinonediazide photosensitive composition utilizing a reaction in which a quinonediazide group is photolyzed by irradiation light to form indenecarboxylic acid via ketene.
- a positive-type energy-sensitive resin composition for example, a photo-acid generator that forms an insoluble cross-linked film in an alkaline developer and an acidic developer by heating, and then generates an acid group by light irradiation.
- Positive photosensitive compositions utilizing a mechanism in which a crosslinked structure is cut by an agent so that an irradiated portion becomes soluble in an alkaline developer or an acidic developer.
- the photoacid generator is a compound that generates an acid upon exposure to light, and the generated acid is used as a catalyst. Thus, known substances can be used.
- the positive heat-sensitive resin composition known ones, for example, a composition containing a heat-sensitive resin, an olefinic unsaturated compound containing an ether bond, and a thermal acid generator can be used.
- Examples of powerful compositions include those described in JP-A No. 12-187326.
- the composition is applied to the surface of the lower cladding layer (I) by using a roller, a Rhono coater, a spin coater, a knife edge coater, A composition film is formed by applying by means of a ten-roll coater, spraying, electrostatic coating, dip coating, silk printing, and drying.
- the coating is irradiated with an active energy ray so as to form a core pattern, and then, when a negative active energy-sensitive linear resin composition is used, the non-irradiated portion,
- the core part ( ⁇ ) can be formed by removing the irradiated part by development.
- the above resin composition is used as a dry film from the viewpoints of environmental conservation, safety, workability, and the like.
- the composition is applied on a base film by means such as a roller, a Rhono recorder, a spin coater, a knife edge coater, a curtain Rhono recorder, spraying, electrostatic coating, dip coating, silk printing, or the like.
- a dry film layer is formed on the base film surface.
- the base film is peeled off, and the dry film is attached on the lower clad layer (I) by heating and Z or pressure bonding to form a composition film.
- a laminated film having a dry film layer formed on the base film surface is adhered onto the lower clad layer (I) by heating and Z or pressure bonding, and then the base film is peeled off, and the base film is peeled off.
- a composition film can be formed.
- the active energy ray irradiation is performed so that the surface force of the composition film and the core pattern are formed, and when the negative active energy ray resin composition is used, the non-irradiated portion is On the other hand, when a positive active energy ray resin composition is used, the core portion (II) can be formed by removing the irradiated portion by development.
- thermosetting resin composition When a thermosetting resin composition is used for forming the core ( ⁇ ), the composition is placed in the lower part. The composition is applied to the surface of the cladding layer (I) by means of a roller, rhono recorder, spin coater, knife edge coater, curtain roll coater, spray, electrostatic coating, dip coating, silk printing, etc., and then dried. An object film is formed. At this time, for example, after applying the thermosetting resin composition, the core portion ( ⁇ ) in which the core portion pattern is formed can be formed by molding using a mold.
- the upper cladding layer (III) is formed on the surfaces of the lower cladding layer (I) and the core part (II) using a dry film.
- the upper cladding layer (III) can be formed of a known composition containing a resin such as a thermoplastic resin or a curable resin.
- a resin such as a thermoplastic resin or a curable resin.
- the resin composition for forming the upper clad layer include the same ones as those described for the lower clad layer (I).
- the formation of the upper cladding layer (III) is performed as follows. That is, the above resin composition is applied onto a base finolem by means such as a roller, a rhono recorder, a spin coater, a knife edge coater, a curtain roll coater, a spray, an electrostatic coating, a dip coating, and a silk printing. By drying, a dry film layer is formed on the surface of the base film. Next, the base film is peeled off, and the dry film is adhered to the surfaces of the lower clad layer (I) and the core portion (II) by heating and pressing or pressing to form an upper clad layer (in).
- a laminated film with a dry film layer formed on the base film surface is adhered to the surface of the lower clad layer (I) and the core part ( ⁇ ) by heating and ⁇ or pressure bonding, and then the base film is peeled off.
- a cladding layer (III) can also be formed.
- the formed upper cladding layer (III) may be further subjected to curing or drying of the coating film, if necessary, by irradiation with active energy rays, heating or the like.
- the upper cladding layer (III) is formed using a dry film, environmental conservation, safety, workability, and the like are improved.
- the upper cladding layer (III) has a softening temperature in the case of using a thermosetting resin composition as a dry film before being attached to the surfaces of the lower cladding layer (I) and the core part (II).
- o ° c is preferably about 300 ° C, more preferably about 10 ° C to about 250 ° C.
- the softening temperature is about 0 ° C-300 ° C. More preferably, it is about 10 ° C. to about 250 ° C.
- the soft film temperature of the dry film is lower than the above-mentioned range, the dry film becomes soft and sticky due to the heating at the time of sticking the dry film to the substrate, so that the sticking operation is extremely difficult. Or foam after application. On the other hand, if it exceeds the above range, it becomes difficult to attach the dry film itself.
- the soft film temperature of the dry film forming the upper cladding layer (III) is preferably lower than the soft film temperature of the core portion (II), preferably 10 ° C. or more.
- the softening temperature of the core (II) is determined by the resin composition forming the core.
- the upper clad layer (III) may be formed by curing the resin composition constituting the layer by irradiation with active energy rays, heating, or the like, to improve durability, heat resistance, workability, and light transmission characteristics. Preferred from the point.
- a base film for preparing a dry film for example, a film such as polyethylene terephthalate, aramide, kapton, polymethylpentene, polyethylene, or polypropylene can be used.
- a polyethylene terephthalate film is optimal in terms of cost and good properties as a dry film.
- the thickness of the base film is preferably about 1 ⁇ m to 10 mm, more preferably about 10 ⁇ m to 1 mm.
- the softening temperature is a value measured by a thermal deformation behavior of a resin sheet having a thickness of lmm using a thermomechanical analyzer. That is, a quartz needle was placed on the sheet, a load of 49 g was applied, and the temperature was raised at 5 ° C./min. The temperature at which the needle penetrated 0.635 mm was defined as the softening temperature.
- a thermomechanical analyzer for example, a device commercially available from DuPont can be used.
- the relative refractive index difference between the lower cladding layer (I) and the upper cladding layer (III) having a higher refractive index and the core part (II) is 0.1% or more. It is preferable that
- the relative refractive index difference is defined by the following equation (1).
- Relative index difference (%) [(n-n) / n] X 100 (1)
- n is the refractive index of the core part (II), and n is the lower cladding layer (I) and the upper cladding layer (III
- the refractive index of the core part (II) needs to be larger than the refractive index of the lower clad layer and the upper clad layer.
- the refractive index of the core portion (II) is usually set to a value within the range of 1.420-1.650 for light having a wavelength of 400-1700 nm, It is preferable that the refractive index of the lower cladding layer (I) and that of the upper cladding layer (III) are each in the range of 1.400-1.648.
- the refractive index can be adjusted by appropriately selecting the type of the resin used, the additives, and the amounts of these additives.
- the thicknesses of the lower cladding layer (I), the upper cladding layer (III), and the core portion ( ⁇ ) are not particularly limited. Normally, the thickness of the lower cladding layer (I) is about 1 to 200 ⁇ m, the thickness of the core (II) is about 1 to 200 ⁇ m, and the thickness of the upper cladding layer (III) is about 1 to 200 m. Is preferably within the range. Further, the core portion (II) generally has a rectangular cross-sectional shape, and its width is not particularly limited. Usually, it is preferable that the width of the core part (II) is in the range of about 11 to 200 m.
- a lower clad layer (I) is formed on a base material, and a core portion (II) is formed on the surface of the lower clad layer (I).
- a dry film is applied on the surface of the clad layer (I) and the core part (II) by heating and Z or pressure bonding to form an upper clad layer ( ⁇ ).
- the surfaces of the core portion (II) and the lower clad layer (I) are overlapped with the dry film on the base film so as to be in contact with each other.
- a pressing method such as a normal pressure hot roll pressing method, a vacuum hot roll pressing method, and a vacuum hot pressing method.
- the base film is peeled off with a dry film, and the dry film is transferred onto the core part (II) and the lower clad layer (I), whereby the core part (II) and the lower clad layer (I) are transferred.
- a curable resin composition is used, the formed upper cladding layer (III) is preferably cured by heating or irradiation with active energy rays.
- visible light, ultraviolet light, infrared light, X-ray, ⁇ -ray, j8-ray, ⁇ -ray and the like can be used as the active energy ray.
- the irradiation device for example, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal nitride lamp, an excimer lamp, or the like is preferably used.
- the irradiation dose is not particularly limited. In general, it is preferable to irradiate with radiation having a wavelength of 200 to 440 nm and an illuminance of 11 to 5 OOmWZcm 2 so that the irradiation amount becomes 10 to 5 and OOOmjZcm 2 , thereby performing exposure.
- an active energy ray-curable and thermosetting composition can also be used as the curable resin composition or its dry film.
- a composition can be obtained, for example, by mixing an active energy ray-curable resin composition and a thermosetting resin composition.
- an active energy ray-curable and thermosetting resin composition is used, for example, after the lower clad layer (I) is light-cured, the lower clad layer (I) is further hardened by heating to form a stronger lower clad layer. Can be formed. Further, in the same manner, the hardened core portion and the upper clad layer can be formed in the core portion (II) and the upper clad layer (III).
- heat curing may be performed for each formation, and the lower cladding layer ( Heat curing may be performed after the formation of I) and the core portion (II) and after the formation of the upper cladding layer (III). After the formation of the lower cladding layer (I), the core portion (II) and the upper cladding layer (III), heat curing may be performed simultaneously.
- the optical waveguide of the present invention is a core portion because the soft film temperature of the dry film forming the upper clad layer (III) is lower than the soft temperature of the core portion (II). Since a gap is hardly generated between the projection and the upper cladding layer, the transmission characteristics are excellent. Also, since the upper cladding layer ( ⁇ ) is formed using dry film, there is no risk of polluting the environment as compared with the case where an organic solvent-based composition is used. There is no danger of.
- the upper clad layer (III) is formed using a dry film having a thermoplastic resin composition strength. In this case, the attachment of the film is simple and easy.
- the softening temperature of the dry film forming the upper clad layer (III) is lower than the softening temperature of the core (II), Since a gap is hardly generated between the convex portion and the upper cladding layer, an optical waveguide having excellent transmission characteristics can be manufactured. Also, since the upper cladding layer (III) is formed using a dry film, there is no danger of polluting the environment.
- the non-irradiated portion is developed and removed to easily form the core portion pattern in a short time. it can.
- the core portion ( ⁇ ) is formed of a positive active energy ray-curable resin composition
- the core portion pattern can be easily formed in a short time by developing and removing the irradiated portion. You.
- the optical waveguide of the present invention is used as an optical waveguide used for an optical integrated circuit, an optical modulator, an optical switch, an optical connector, an optical branching coupling, a coupling between an optical device such as a thin film device and an optical fiber, and the like. It can be used preferably.
- each resin composition is coated on a polyethylene terephthalate film (25 m in thickness) with a knife edge coater, dried at 80 ° C for 30 minutes, and dried for the lower clad layer, core film, or A dry film for the upper cladding layer was prepared.
- the dry film for the lower cladding layer shown in Table 1 was transferred onto the surface of the silicon substrate by a normal pressure hot-hole compression bonding method, and dried or cured under the conditions shown in Table 1 to obtain a thickness of 40/100.
- the lower cladding layer of zm was obtained.
- the core dry film shown in Table 1 was transferred onto the lower clad layer by a normal pressure hot roll compression method, and passed through a photomask having a line pattern with a width of 30 ⁇ m, with a wavelength of 365 ⁇ m and illuminance.
- Ultraviolet rays of 10 mWZcm 2 were irradiated for 100 seconds and developed with a developing solution (1.8% by weight aqueous solution of tetramethylammonium hydroxide) to form a core portion having a 30 m wide linear pattern.
- the upper clad layer dry film described in Table 1 was transferred to the upper surface of the lower clad layer having a core portion by a normal pressure hot roll pressing method, and dried or cured under the conditions described in Table 1, An upper cladding layer having a thickness of 40 m was obtained.
- Table 1 below shows resin components constituting each dry film and conditions for forming the same in Examples 17 to 17.
- Thermoplastic resin (0: liquid crystal polymer (polyacetal copolymer, manufactured by Asahi Kasei Kogyo Co., Ltd., trade name “TENAC”, softening temperature 190 ° C).
- Room temperature curable resin i: isocyanate-curable hydroxyl-containing silicone resin (softening temperature 50 ° C
- Active energy ray-curable resin (i): Negative active energy ray-curable resin (mixture of unsaturated group-containing acrylic resin and photopolymerization initiator, softening temperature 40 ° C).
- Active energy-sensitive resin (ii): Positive active energy-sensitive resin (olefinic polyurethane-based unsaturated compound containing an ether bond, resin containing a carboxyl group and a hydroxyphenyl group, and a photoacid generator) Formulation, softening temperature 45 ° C).
- Positive active energy-sensitive resin olefinic polyurethane-based unsaturated compound containing an ether bond, resin containing a carboxyl group and a hydroxyphenyl group, and a photoacid generator
- Active energy-sensitive resin (iii): Negative active energy-sensitive resin (a mixture of heat-sensitive, oxetane-conjugated product and photoacid generator, softening temperature: 80 ° C).
- fc-2 A dry film described in Table 1 was pressed onto the surface of a silicon substrate by a normal pressure hot roll pressing method ( The transferred image was transferred at a temperature of 100 ° C., and cured by irradiating ultraviolet rays having a wavelength of 365 nm and an illuminance of 200 mWZcm 2 for 5 seconds to obtain a lower cladding layer.
- [0100] fc-3 The dry film described in Table 1 was transferred onto the lower clad layer by a normal pressure hot roll bonding method (temperature: 100 ° C), and had a line pattern with a width of 30 ⁇ m.
- Ultraviolet rays having a wavelength of 365 nm and an illuminance of lOmWZcm 2 were irradiated for 100 seconds through a photomask to partially cure the dry film.
- the film was irradiated with ultraviolet light and immersed in a developing solution consisting of 1.8% by weight aqueous solution of tetramethylammonium hydroxide (TMAH) to dissolve the unexposed portion of the film. In this way, a core part having a linear pattern with a width of 30 m was formed.
- TMAH tetramethylammonium hydroxide
- fc-4 The dry film described in Table 1 was transferred onto the lower clad layer by a normal pressure hot roll bonding method (temperature: 100 ° C), and had a line pattern with a width of 30 ⁇ m. through a photomask, wavelength 365 nm, it is irradiated with ultraviolet illuminance lOmWZcm 2 100 seconds and then ultraviolet irradiation was 1.8 wt 0/0 tetramethylammonium - is immersed in a developing solution consisting Umuhidorokishido solution (TMAH) The exposed portion of the film was dissolved. In this way, a core part having a linear pattern with a width of 30 m was formed.
- TMAH Umuhidorokishido solution
- fc-6 The dry film shown in Table 1 was transferred onto the upper surface of the lower cladding layer having the core by normal pressure hot roll pressing (temperature: 100 ° C), and was transferred at a temperature of 200 ° C. After curing, an upper clad layer was obtained.
- Fc-7 The dry film described in Table 1 was transferred to the upper surface of the lower cladding layer having the core by normal pressure hot roll pressing (temperature: 40 ° C.), and was transferred at a temperature of 40 ° C. After curing, an upper clad layer was obtained.
- Fc-8 The dry film described in Table 1 was transferred onto the upper surface of the lower cladding layer having the core by normal pressure hot roll compression bonding (temperature: 100 ° C.), and the wavelength was 365 nm and the illuminance was 200 mWZcm 2. The entire surface was irradiated with ultraviolet rays for 5 seconds to cure, thereby obtaining an upper clad layer.
- Example 3 the upper clad layer was replaced with a dry film, and instead of a dry film, a copolymer of a monomer mixture consisting of 5% by weight of ⁇ -methacryloxyl-opened tritrimethoxysilane and 95% by weight of methyl methacrylate, and paratoluene sulfone as an acid catalyst were used.
- An organic solvent-type thermosetting composition obtained by dissolving an acid in acetone is spray-coated on the surface of a lower clad layer having a core portion, and is heat-cured at 50 ° C for 30 minutes to have a thickness of 40 m. Was formed.
- the relative refractive index difference, transmission loss, core gap, core shape accuracy, core coverability and workability were determined by the following methods. Based on 7 evaluations.
- Relative refractive index difference The refractive index of the resin composition in which the lower clad layer and the upper clad layer have a higher refractive index and the core portion are formed, or the refractive index of a film sample that also has a dry film force, is manufactured by Atago.
- An interference filter with a wavelength of 850 nm was set in the multi-wavelength Abbe refractometer “DR-M4”, and the measurement was performed at 23 ° C. Using the respective refractive index values, the relative refractive index difference (%) was calculated by the above equation (1).
- Transmission loss A light having a wavelength of 850 nm was incident on the optical waveguide at one end, and the amount of light emitted from the other end was measured. The transmission loss per unit length was determined by the cutback method. A indicates that the loss is less than 0.4 dBZcm and the transmission characteristics are good, and B indicates that the loss is more than 0.4 dBZcm and the transmission characteristics are inferior.
- Crevice of core portion A is a case where there is no gap between the convex portion which is the core portion and the upper clad layer, and B is a case where a gap is generated and an organic solvent type composition is used. This indicates that the heat generated and bubbles were generated.
- Core shape accuracy A indicates that the core is not deformed by the upper cladding layer, and B indicates that the core is deformed by the upper cladding layer.
- Core coverage A is a film in which the upper cladding layer covers the protrusions of the core with a sufficient thickness, and B is a film in which the upper cladding layer covers the protrusions of the core. It shows a thin one.
- A indicates that the formation of the optical waveguide is simple and easy throughout
- B indicates that the formation of the optical waveguide is complicated and easy throughout.
- Table 2 shows the evaluation results.
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JP2004049824A JP2007212483A (ja) | 2004-02-25 | 2004-02-25 | 光導波路、光導波路の製造方法 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01189614A (ja) * | 1988-01-26 | 1989-07-28 | Nippon Telegr & Teleph Corp <Ntt> | 石英系光導波路及びその製造方法 |
JPH0375606A (ja) * | 1989-08-17 | 1991-03-29 | Nippon Telegr & Teleph Corp <Ntt> | 埋込み型石英系光導波路およびその製造方法 |
EP0423702A2 (en) * | 1989-10-16 | 1991-04-24 | E.I. Du Pont De Nemours And Company | Multiplexer-demultiplexer for intergrated optic circuit |
JPH1048441A (ja) * | 1996-08-07 | 1998-02-20 | Nippon Telegr & Teleph Corp <Ntt> | 高分子光導波路および高分子光導波路回路、およびそれらの製造方法 |
JPH1138241A (ja) * | 1997-07-14 | 1999-02-12 | Tomoegawa Paper Co Ltd | フレキシブル光導波路素子及びその製造方法 |
-
2004
- 2004-02-25 JP JP2004049824A patent/JP2007212483A/ja active Pending
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2005
- 2005-02-24 WO PCT/JP2005/002997 patent/WO2005081023A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01189614A (ja) * | 1988-01-26 | 1989-07-28 | Nippon Telegr & Teleph Corp <Ntt> | 石英系光導波路及びその製造方法 |
JPH0375606A (ja) * | 1989-08-17 | 1991-03-29 | Nippon Telegr & Teleph Corp <Ntt> | 埋込み型石英系光導波路およびその製造方法 |
EP0423702A2 (en) * | 1989-10-16 | 1991-04-24 | E.I. Du Pont De Nemours And Company | Multiplexer-demultiplexer for intergrated optic circuit |
JPH1048441A (ja) * | 1996-08-07 | 1998-02-20 | Nippon Telegr & Teleph Corp <Ntt> | 高分子光導波路および高分子光導波路回路、およびそれらの製造方法 |
JPH1138241A (ja) * | 1997-07-14 | 1999-02-12 | Tomoegawa Paper Co Ltd | フレキシブル光導波路素子及びその製造方法 |
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