WO2005070614A1 - 超微細結晶層生成方法、その超微細結晶層生成方法により生成された超微細結晶層を備えた機械部品、及び、その機械部品を製造する機械部品製造方法、並びに、ナノ結晶層生成方法、そのナノ結晶層生成方法により生成されたナノ結晶層を備えた機械部品、及び、その機械部品を製造する機械部品製造方法 - Google Patents
超微細結晶層生成方法、その超微細結晶層生成方法により生成された超微細結晶層を備えた機械部品、及び、その機械部品を製造する機械部品製造方法、並びに、ナノ結晶層生成方法、そのナノ結晶層生成方法により生成されたナノ結晶層を備えた機械部品、及び、その機械部品を製造する機械部品製造方法 Download PDFInfo
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- WO2005070614A1 WO2005070614A1 PCT/JP2004/018650 JP2004018650W WO2005070614A1 WO 2005070614 A1 WO2005070614 A1 WO 2005070614A1 JP 2004018650 W JP2004018650 W JP 2004018650W WO 2005070614 A1 WO2005070614 A1 WO 2005070614A1
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D7/00—Modifying the physical properties of iron or steel by deformation
- C21D7/02—Modifying the physical properties of iron or steel by deformation by cold working
- C21D7/04—Modifying the physical properties of iron or steel by deformation by cold working of the surface
- C21D7/08—Modifying the physical properties of iron or steel by deformation by cold working of the surface by burnishing or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B1/00—Methods for turning or working essentially requiring the use of turning-machines; Use of auxiliary equipment in connection with such methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P9/00—Treating or finishing surfaces mechanically, with or without calibrating, primarily to resist wear or impact, e.g. smoothing or roughening turbine blades or bearings; Features of such surfaces not otherwise provided for, their treatment being unspecified
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/06—Surface hardening
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2228/00—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
- B23B2228/44—Materials having grain size less than 1 micrometre, e.g. nanocrystalline
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D2201/00—Treatment for obtaining particular effects
- C21D2201/03—Amorphous or microcrystalline structure
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D2261/00—Machining or cutting being involved
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/0068—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for particular articles not mentioned below
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/08—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for tubular bodies or pipes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49982—Coating
- Y10T29/49986—Subsequent to metal working
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
Definitions
- An ultrafine crystal layer generation method a mechanical component having an ultrafine crystal layer generated by the ultrafine crystal layer generation method, a mechanical component manufacturing method for manufacturing the mechanical component, and a nanocrystal layer generation method.
- Ultrafine crystal layer generation method machine component provided with ultrafine crystal layer generated by the ultrafine crystal layer generation method, machine component manufacturing method for manufacturing the mechanical component, and nanocrystal
- the present invention relates to a layer forming method, a mechanical component including a nanocrystalline layer generated by the nanocrystalline layer generating method, and a mechanical component manufacturing method for manufacturing the mechanical component.
- An ultrafine crystal layer is one having a crystal grain size of lOOnm: m
- a nanocrystal layer is one having a crystal grain size of lOOnm or less.
- the ultrafine crystal layer has excellent properties suitable for machine parts, such as high hardness compared to the hardness of the base material and high compressive residual stress.
- the nanocrystalline layer has extremely high hardness compared to the hardness of the base material, makes it difficult to grow grains even at high temperatures, and has excellent properties suitable for machine parts, such as high compressive residual stress. Te, ru.
- FIG. 16 is a schematic diagram showing the shotpy jung. As shown in FIG. 16, this shot peung uses a compressed pressure of compressed air injected from an injection device 100 to apply hard particles G, such as steel or ceramic, to a processing surface 101a of a metal material 101 at a high speed. The collision causes plastic deformation on the surface of the processing surface 101a, thereby generating a nanocrystal layer or the like.
- hard particles G such as steel or ceramic
- Patent Document 1 JP-A-2003-39398 (paragraph [0010], FIG. 2, etc.)
- the above-described conventional technology requires special equipment such as a metal weight collision device and a hard particle G injection device 100, which increases the cost of the device.
- a metal weight collision device and a hard particle G injection device 100
- the processing cost increases.
- the processing cost (the generation cost of the nanocrystal layer or the like) increases accordingly.
- the above-described conventional technique involves colliding projections or hard particles G on the surface of a product and plastically deforming the colliding surface, thereby generating a nanocrystal layer or the like.
- a problem that not only cannot a smooth finished surface be obtained, but also a uniform nanocrystal layer cannot be obtained, because the formed surface of the layer becomes rough.
- the thickness and characteristics of the nanocrystal layer formed on the collision surface of the product are reduced. It becomes uneven in the radial direction.
- the hard particles G cannot uniformly collide with the inner peripheral surface of the hole or the like, and the nanocrystal layer is closer to the mouth than near the bottom of the hole. It is generated intensively.
- the present invention has been made to solve the above-described problems, and a method for generating an ultrafine crystal layer capable of stably generating a nanocrystal layer on a surface of a metal product at low cost.
- a mechanical component having an ultrafine crystal layer generated by the ultrafine crystal layer generation method, a mechanical component manufacturing method for manufacturing the mechanical component, a nanocrystal layer generation method, and a nanocrystal layer generation method It is an object of the present invention to provide a mechanical component having a nanocrystal layer generated by the method, and a method of manufacturing a mechanical component for manufacturing the mechanical component.
- a method for producing an ultrafine crystal layer according to claim 1 performs machining using a machining tool on a workpiece composed of a metal material, and locally applies a machining to the machined surface. By applying a partial large strain, an ultra-fine crystal layer is generated on the surface portion of the processing surface.Machining using the processing tool requires less processing on the processing surface of the workpiece. Both have a plastic strain with a true strain of 1 or more.
- the method for generating an ultrafine crystal layer according to claim 2 is the method for generating an ultrafine crystal layer according to claim 1, wherein the machining using the processing tool is performed on a processing surface of the workpiece. This is performed while maintaining the material temperature below a predetermined upper limit temperature, and the predetermined upper limit temperature is determined by the Acl transformation of the steel material when the material to be processed is made of a steel material. In the case where the workpiece is made of a metal material other than a steel material, the temperature is approximately one-half of the melting point of the metal material in terms of absolute temperature.
- the method for producing an ultrafine crystal layer according to claim 1 is characterized in that the machining using the processing tool is performed on a processing surface of the workpiece.
- the temperature of the material is maintained within a predetermined temperature range, and the predetermined temperature range is equal to or higher than the Acl transformation point of the steel material when the material to be processed is composed of a steel material.
- the temperature range is less than the melting point, and when the workpiece is made of a metal material other than a steel material, the temperature is at least about 1/2 of the melting point converted to the absolute temperature of the metal material and The temperature range is below the melting point.
- the method for generating an ultrafine crystal layer according to claim 3 uses the processing tool when the workpiece is made of a steel material. After performing the machining described above, the machined surface is cooled at a speed higher than a cooling speed required for quenching the object to be quenched.
- the method for generating an ultrafine crystal layer according to claim 5 is the method for generating an ultrafine crystal layer according to any one of claims 2 to 4, wherein the machining using the processing tool is performed on the workpiece.
- a non-ultra-fine crystal layer in which a material temperature on a processing surface is maintained below the predetermined upper limit temperature or in the predetermined temperature range, and a lower layer portion of the processing surface of the workpiece or a surface layer portion in the vicinity of the processing surface.
- the time during which the material temperature at 500 ° C becomes approximately 500 ° C or more is set within approximately 1 second, and a hardness of approximately 80% of the hardness of the base material is secured.
- the mechanical component according to claim 6 is made of a metal material, and has at least a part of a surface layer thereof formed by the ultrafine crystal layer generation method according to any one of claims 1 to 5. It has a crystal layer.
- the method for manufacturing a mechanical part according to claim 7 is made of a metal material and has a small surface layer portion. It is for producing a mechanical part in which an ultrafine crystal layer is generated at least in part, and an ultrafine crystal layer is formed on the mechanical component by the ultrafine crystal layer generation method according to any one of claims 1 to 5. At least a step of generating an ultrafine crystal layer is provided.
- the nanocrystal layer generating method according to claim 8 is characterized in that a workpiece formed of a metal material is machined by using a processing tool, and a local large strain is applied to the processed surface. A nanocrystal layer is formed on a surface portion of the processing surface, and the machining using the processing tool gives a plastic surface having a true strain of at least 7 to the processing surface of the workpiece.
- the temperature of the material to be processed on the processing surface of the object to be processed is maintained within a predetermined temperature range. In this case, the temperature range is between the Acl transformation point and the melting point of the steel material and below the melting point. If the workpiece is made of another metal material excluding the steel material, the absolute temperature of the metal material The temperature range is at least about half the melting point and less than the melting point.
- the nanocrystal layer generation method according to claim 9 is the nanocrystal layer generation method according to claim 8, wherein the machining using the processing tool is performed by using a material on a processing surface of the object to be processed.
- the temperature is maintained in the predetermined temperature range, and the time during which the material temperature in the lower layer portion of the processing surface of the workpiece or the non-nanocrystalline layer in the surface layer portion near the processing surface becomes approximately 500 ° C. or more is set.
- the hardness should be within about 1 second, and the hardness of the base material should be at least about 80%.
- a nanocrystal layer generation method is for generating a nanocrystal layer as a fine crystal grain layer on a processing surface of a workpiece made of a metal material, and adding the nanocrystal layer to the workpiece.
- the nanocrystal layer is generated on the surface layer of the machining surface by performing machining using a tool and applying a large local strain to the machining surface.
- the method for generating a nanocrystal layer according to claim 11 is the method for generating a nanocrystal layer according to claim 12, wherein the machining using the processing tool includes at least a true strain on a processing surface of the workpiece.
- the method is performed by giving a plastic kamune of 7 or more and maintaining the material temperature on the processing surface of the object to be machined at or below a predetermined upper limit temperature.
- the nanocrystal layer generation method wherein the material temperature on the processing surface of the object to be processed is a time during which the mechanical processing is performed.
- the average average material temperature and the average material temperature of the heat distribution over the entire processing surface are maintained so as to be equal to or lower than the predetermined upper limit temperature.
- the nanocrystal layer generation method according to claim 13 is the nanocrystal layer generation method according to any one of claims 8 to 12, wherein the machining using the processing tool includes a surface layer portion of the processing surface. Is performed so as to give a strain gradient of 1 ⁇ m or more.
- a method of manufacturing a mechanical part according to claim 15 is for manufacturing a mechanical part made of a metal material and having a nanocrystal layer formed in at least a part of a surface portion thereof. 14.
- the ultrafine crystal layer generation method of claim 1 since the workpiece is machined using a processing tool, an ultrafine crystal layer is generated on the surface layer of the processed surface.
- the conventional technology it is possible to suppress the generation of the ultrafine crystal layer from being limited by the shape of the object to be processed, and to suppress the thickness and characteristics of the ultrafine crystal layer from becoming nonuniform. As a result, there is an effect that an ultrafine crystal layer can be stably formed on a mechanical part or the like.
- the ultrafine crystal layer generation method according to claim 1 generates the ultrafine crystal layer by mechanical working using a processing tool, so that the ultrafine crystal layer can be efficiently generated. Therefore, there is an effect that the generation cost of the ultrafine crystal layer can be suppressed.
- machining using a machining tool gives plastic working with a true strain of 1 or more to the machined surface of the workpiece, so that the burden on the tool and the machining machine can be reduced. There is. As a result, even when machining a workpiece made of a high-hardness material, it is possible to suppress tool breakage, etc., and to stably generate an ultrafine crystal layer on the surface layer of the machined surface of the workpiece. There is an effect that can be.
- machining using a machining tool is performed for the object to be machined. This is performed while maintaining the material temperature on the work surface below the specified upper limit temperature, and the specified upper limit temperature is the Ac 1 transformation point of the steel material when the work piece is composed of the steel material.
- the temperature is approximately half the melting point of the metal material converted to the absolute temperature.
- machining using a machining tool can reduce the This is performed while maintaining the material temperature on the working surface within a predetermined temperature range, and the predetermined temperature range is determined by the Acl transformation point of the steel material when the material to be processed is composed of steel material. If the temperature range is above and below the melting point, and the object to be cooked is made up of other metal materials excluding steel materials, the melting point is approximately 1Z2 or more, which is the absolute melting point of the metal material. The temperature range is below the melting point.
- the processing surface of the object to be processed can be softened. This has an effect that a strain of 1 or more true strain can be reliably applied to the processed surface of the object to be cut while suppressing the load. As a result, even when a hardened material made of a material having relatively high hardness is used, it is possible to suppress tool breakage and the like, and the ultrafine crystals are formed on the surface layer of the work surface of the work. There is an effect that a layer can be stably formed.
- the hardness of the ultrafine crystal layer can be kept high by cooling the cutting surface at a speed higher than the cooling speed required for quenching the material to be quenched. There is an effect.
- machining using a machining tool is also possible.
- the material temperature on the processing surface of the material to be processed is kept below the above-mentioned predetermined upper limit temperature or in a predetermined temperature range, and the lower layer portion of the processing surface of the material to be processed or the surface portion near the processing surface.
- the time during which the material temperature of the non-ultra-fine crystal layer in the non-ultra-fine crystal layer becomes approximately 500 ° C. or more is set within approximately 1 second, and approximately 80% of the hardness of the base material is secured.
- the non-ultra-fine crystal layer at the lower part of the processing surface of the workpiece or at the surface part near the processing surface is prevented from being affected by heat such as tempering or annealing, and the lower layer of the processing surface is suppressed.
- the hardness of the non-ultra-fine crystal layer in the surface portion near the portion or the processed surface can be prevented from lowering. That is, it is possible to secure the hardness and strength of the non-ultra-fine crystal layer in the lower layer portion of the processing surface and the surface layer portion near the processing surface while generating the ultra-fine crystal layer on the processing surface.
- the ultrafine crystal layer generated by the ultrafine crystal layer generation method according to any one of claims 1 to 5 is provided on at least a part of a surface layer portion thereof. I have. Therefore, it is possible to improve the surface hardness of the mechanical parts, to improve the fatigue strength by adding a compressive residual stress, and to improve the wear resistance because it is difficult to recrystallize even at a high temperature. As a result, there is an effect that the characteristics of such mechanical parts can be improved.
- an ultrafine crystal for generating an ultrafine crystal layer on a mechanical part by the method for generating an ultrafine crystal layer according to any one of claims 1 to 5 Since at least the layer forming step is provided, there is an effect that the ultrafine crystal layer can be stably formed, the production cost can be suppressed, and mechanical parts can be manufactured.
- the nanocrystal layer is generated on the surface portion of the processed surface by performing mechanical processing on the object to be processed using a processing tool.
- a processing tool unlike the conventional technology, it is possible to suppress the generation of the nanocrystal layer depending on the shape of the object to be formed, and to suppress the nonuniformity of the thickness and characteristics of the nanocrystal layer.
- a nanocrystal layer can be stably formed on a mechanical part or the like.
- the nanocrystal layer is generated in a wide range, it is necessary to repeat the collision of projections and hard particles a plurality of times.
- the nanocrystal layer is generated by machining using a processing tool, so that the nanocrystal layer can be efficiently generated. There is an effect that the generation cost of can be suppressed.
- the machining using a machining tool gives plastic working with a true strain of 7 or more to the machined surface of the workpiece, and maintains the material temperature of the machined surface of the workpiece within a predetermined temperature range.
- the predetermined temperature range is the temperature range above the Acl transformation point and lower than the melting point of the steel material when the material to be processed is composed of steel material.
- the temperature range is not less than about half the melting point and less than the melting point converted into the absolute temperature of the metal material.
- the processing surface of the object to be processed can be softened. It has the effect of being able to reliably apply a large strain of 7 or more to the machined surface of the object to be machined while suppressing the burden. As a result, even when processing a hardened material made of a material having relatively high hardness, it is possible to suppress tool breakage, etc., and to apply nanocrystals to the surface layer of the processed surface of the hardened material. There is an effect that a layer can be stably formed.
- machining using a processing tool is performed on the processing surface of the workpiece. Maintain the material temperature in the specified temperature range and set the time for the material temperature of the non-nanocrystalline layer in the lower part of the processing surface of the workpiece or in the surface layer near the processing surface to be approximately 500 ° C or more.
- the hardness should be within about 1 second, and the hardness of the base material should be about 80% or more.
- the non-nanocrystalline layer in the lower part of the processing surface of the object to be processed or the surface part near the processing surface is prevented from being affected by heat such as tempering or annealing, and the lower layer of the processing surface is suppressed.
- the effect is that the hardness of the non-nanocrystalline layer at the surface portion or near the processed surface can be prevented from lowering. That is, it is possible to secure the hardness and strength of the non-nanocrystal layer in the lower layer portion of the processing surface and the surface layer portion near the processing surface while generating the nanocrystal layer on the processing surface.
- the nanocrystal layer generation method by performing machining using a processing tool on the workpiece, a nanocrystal layer is generated on the surface layer portion of the processing surface.
- a nanocrystal layer is generated on the surface layer portion of the processing surface.
- the process change for generating the nanocrystal layer can be minimized, which reduces the production cost of the nanocrystal layer and accordingly reduces the product cost of the product There is an effect that can be.
- the nanocrystal layer generation method when a nanocrystal layer is generated in a wide range, it is necessary to repeatedly perform collision of projections and hard particles.
- the nanocrystal layer generation method according to claim 1 generates the nanocrystal layer by mechanical machining using a processing tool, so that the nanocrystal layer can be efficiently generated. There is an effect that the generation cost of the crystal layer can be suppressed.
- machining using a processing tool is performed on the processing surface of the workpiece. Since the plastic deformation is performed with a true strain of 7 or more and the material temperature of the processed surface is maintained at or below a predetermined upper limit temperature, a nanocrystalline layer is formed on the surface layer of the processed surface of the workpiece. If it can actually be generated, there is an effect.
- the material temperature on the processing surface of the workpiece is maintained during the mechanical processing. Is maintained so that the average material temperature over time and the average material temperature of the heat distribution over the entire processed surface are equal to or lower than a predetermined upper limit temperature. That is, even when the above-mentioned material temperature is instantaneously or locally raised from a predetermined upper limit temperature, it is sufficient that the average material temperature is kept below the predetermined upper limit temperature. The cost can be reduced, and the cost of forming the nanocrystal layer can be reduced accordingly.
- machining using a processing tool is performed by machining. Since it is performed so as to give a strain gradient of l / zim or more to the surface layer portion of the surface, there is an effect that a nanocrystal layer can be surely generated in the surface layer portion of the processed surface of the caroeye.
- the nanocrystal layer generated by the nanocrystal layer generation method according to any one of claims 8 to 13 is provided on at least a part of a surface layer portion thereof. Therefore, it is possible to improve the surface hardness of the mechanical parts, to improve the fatigue strength by applying a compressive residual stress, and to improve the abrasion resistance because it is difficult to grow grains even at a high temperature. As a result, there is an effect that the characteristics of a powerful mechanical component can be improved.
- At least a nanocrystal layer generating step of generating a nanocrystal layer on a mechanical component by the nanocrystal layer generating method according to any one of claims 8 to 13 is provided. Therefore, there is an effect that the nanocrystal layer can be stably generated, and the cost of the generation can be suppressed, and a mechanical component can be manufactured.
- FIG. 1 is a view for explaining a method of forming an ultrafine crystal layer according to a first embodiment of the present invention, wherein (a) is a cross-sectional view of a substrate to be drilled during drilling by Dorinore, and (b) () Is a cross-sectional view of the workpiece after drilling.
- FIG. 2 is a diagram showing cutting conditions as first processing conditions.
- FIG. 3 is a view showing a sectional structure of a hole.
- FIG. 4 is a view for explaining a method for generating an ultrafine crystal layer according to the second embodiment, and is a perspective view of an object to be cut during cutting by an end mill.
- FIG. 5 is a view for explaining a method of forming an ultrafine crystal layer according to the third embodiment.
- FIG. 5 (a) is a perspective view of a workpiece in a sliding tool using a pressing tool
- FIG. (A) is a cross-sectional view of the object to be cut along the line Vb-Vb.
- FIG. 6 is a diagram illustrating a nanocrystal layer generation method according to a fourth embodiment, where (a) is a cross-sectional view of an object to be cut during drilling with a drill, and (b) is a cross-sectional view. It is sectional drawing of the to-be-processed object after drilling by a drill.
- FIG. 7 is a diagram showing cutting conditions as fourth processing conditions.
- FIG. 8 is a view showing a sectional structure of a hole.
- FIG. 9 is a photograph showing a cross-sectional structure of a hole.
- FIG. 10 is a schematic diagram schematically showing the cross-sectional structure of FIG. 9.
- FIG. 11 (a) is a diagram showing the relationship between the depth of the hole from the surface and the displacement of the crystal, (b) is a diagram showing the relationship between the depth and the shear strain, and (c) Is a diagram showing the relationship between depth and strain gradient.
- FIG. 12 is a diagram illustrating a nanocrystal layer generation method according to a fifth embodiment, and is a perspective view of an object to be cut during cutting by an end mill.
- FIG. 13 is a diagram illustrating a nanocrystal layer generation method according to a sixth embodiment, where (a) is a cross-sectional view of an object to be cut during drilling with a drill, and (b) is a cross-sectional view. It is sectional drawing of the to-be-processed object after drilling by a drill.
- FIG. 14 is a diagram showing a comparison between conventional cutting conditions and cutting conditions as a sixth processing condition.
- FIG. 15 is a diagram illustrating a nanocrystal layer generation method according to a seventh embodiment, where (a) is a perspective view of a workpiece in a sliding cover by a pressing tool, and (b) Is the XI of ( a )
- FIG. 3 is a cross-sectional view of the object to be cut along the line Vb—XlVb.
- FIG. 16 is a schematic view showing a conventional method for producing a nanocrystal layer or the like (shot peening). Explanation of symbols
- an ultrafine crystal layer is formed on a surface portion of a processing surface of a workpiece by drilling (machining) using a drill D (machining tool).
- machining drilling
- drill D machining tool
- the ultrafine crystal refers to a crystal whose crystal grain size (length) is lOOnm-1 ⁇ m, and the ultrafine crystal layer is at least 50% of its crystal structure. This refers to a structure containing the ultrafine crystals.
- the “ultra-fine crystal layer” according to any one of claims 1 to 7.
- an ultrafine crystal has a size (length) of 100 ⁇ m ⁇ ⁇ ⁇ ⁇ ⁇ in any direction and does not have to have a size (length) of lOOnm ⁇ 1 / im in at least one direction.
- the ultrafine crystal need not necessarily be a crystal having a circular cross section, but may be a crystal having a flat cross section.
- the ultrafine crystal layer contains at least 50% or more of the above ultrafine crystals. If so, it is of course possible to have a mixed grain structure, and the remainder of the ultrafine crystals may have any form of crystallinity.
- FIG. 1 is a diagram for explaining a method for forming an ultrafine crystal layer according to the first embodiment of the present invention.
- FIG. FIG. 1B is a cross-sectional view of the material W after drilling with a drill D.
- FIG. 1 a part of the drill D and a part of the material W are omitted.
- the hole W formed by the drill D is applied to the workpiece W while satisfying the first and second processing conditions shown below.
- an ultrafine crystal layer C1 can be generated on the inner peripheral surface (surface layer of the processed surface) of the hole 1 (Fig. 1 (b)). )reference).
- the first processing condition is that plastic working with a true strain of 1 or more is applied to the inner peripheral surface of the hole 1 and this is achieved by following the cutting conditions shown in FIG. Is performed.
- the cutting conditions will be described with reference to FIG.
- FIG. 2 is a diagram showing cutting conditions (ultra-fine crystal layer forming cutting conditions) as the first processing conditions of the present invention.
- the horizontal axis represents the hardness (Hv) of the workpiece W, and the vertical axis represents the hardness. Indicates the peripheral speed (m / min) of the drill D, respectively.
- the first processing condition is to define the peripheral speed V [m / min] of the drill D in association with the hardness H [Hv] of the workpiece W.
- the peripheral speed V of the drill D is set as V ⁇ 175_HZ4 [mZmin].
- the peripheral speed V of the drill D is defined as V ⁇ 50 [mZmin].
- the feed speed of the drill D is preferably set to 0.3 mm or less per rotation.
- the purpose is to surely give a plastic layer with a true strain of 1 or more to the inner peripheral surface of the hole 1 while suppressing the load of the drill D.
- the cutting condition as the first processing condition is that the hardness H of the workpiece W is not more than 500 [Hv].
- the peripheral speed V of the drill D is set to V ⁇ 175-H / 4 [m / min], and the feed speed of the drill D is set to 0.05 mm or less per rotation.
- the hardness H is 500 [Hv] or more
- the peripheral speed V of drill D should be 75 [m / min] or more
- the feed speed of drill D should be 0.05 mm or less per rotation. More preferred ,. This is because it is possible to more reliably apply a plastic kneaded material having a true strain of 1 or more to the inner peripheral surface of the hole 1 while suppressing the load of the drill D.
- a pilot hole 2 (indicated by a dashed line in FIG. 1 (a)) is drilled in advance with a drill having a smaller diameter than specified, and then The hole 1 may be finished to a specified diameter by the above-mentioned drill D or reamer having a specified outer diameter.
- the drilling of the pilot hole 2 is performed under normal cutting conditions (for example, a peripheral speed of 20 m or less per minute), while the finishing of the hole 1 by the drill D or the reamer is performed as shown in FIG. According to the processing conditions (ultrafine crystal layer generation cutting conditions).
- the material temperature of the processing surface of the hole 1 is maintained in a predetermined temperature range (hereinafter, referred to as a "temperature range") during drilling by the drill D.
- a temperature range a predetermined temperature range
- the material temperature of the machining surface of the hole 1 is maintained within the temperature range by adjusting the supply amount of cutting oil and the like to the machining part and the cutting conditions (peripheral speed V or feed speed) using the drill D. It is.
- the temperature range is set to be equal to or higher than the Acl transformation point and lower than the melting point of the steel material, and the work W is excluding the steel material.
- the temperature is set to a temperature that is approximately equal to or more than half of the melting point of the metal material and less than the melting point.
- “maintaining in the temperature range” in the second processing condition means that the time average material temperature after the drilling of the hole 1 is started by the drill D and the processing of the hole 1 Across the surface It is only necessary that the average material temperature of the heat distribution in each temperature be maintained within the respective temperature ranges.
- a heating means for example, a gas furnace or an electric furnace
- the generation of the ultrafine crystal layer C1 can be promoted, and the workpiece W can be softened. And the ability to control its breakage.
- the material W to be used for this drilling is made of carbon steel (JIS-S55C), and its hardness is set to about 7.8 GPa (800 Hv) by quenching.
- FIG. 3 is a view showing a sectional structure of the hole 1. As shown in FIG. 3, a surface layer 11 and a second layer 12 were observed on the inner peripheral surface of the hole 1 in order from the front side (the upper side in FIG. 3).
- the lower layer side (the lower side in FIG. 3) of the second layer 12 is a non-machining region (a region not affected by the machining by the drill D) 13.
- an ultrafine crystal layer C1 having a particle size of approximately 600 nm was observed in the surface layer 11 of the hole 1.
- the surface layer 11 was recrystallized in the spike region by heating at the time of processing by the drill D, and then was further heated to the (h + ⁇ ) two-phase region, where the remaining strata became island-like, and dissolved carbon. It is considered that ⁇ was transformed to (a + martensite) during cooling.
- the surface layer 11 is given a plastic deformation of true strain 1 or more.
- the thickness of surface layer 11 (the depth from the surface to the lower surface of surface layer 11) in the first embodiment was approximately 10 ⁇ 10 ⁇ .
- the thickness (depth) of the force layer increases as the peripheral speed V of the drill D increases. It has also been observed that the thickness (depth) of such a layer increases as the diameter of the drill D increases, provided that the peripheral speed V of the drill D is constant.
- the second layer 12 is considered to be a region that has been heated to approximately 700 ° C by drilling of the drill D and generated by static recrystallization (ie, a region that has been tempered by the heat effect during drilling). available. It should be noted that the second layer 12 corresponds to the “non-ultra-fine crystal layer at the lower part of the processed surface of the object to be processed”.
- the drilling (mechanical processing) using the drill D is performed based on the supply amount of the cutting oil or the like and the cutting conditions.
- the material temperature on the processing surface is controlled to satisfy the above-mentioned second processing condition while the material temperature in the second layer 12 is approximately 500 ° C. or more. It is preferable to control so that the time to be set can be made within about 1 second. Thereby, the tempering of the second layer 12 can be suppressed, and its hardness and strength can be ensured.
- the structure can be refined by utilizing the plastic deformation by the drill D and the heat treatment transformation, so that the hardness of the ultrafine crystal layer C1 can be further ensured.
- the annealing treatment was performed by maintaining the material W to be heated at an atmosphere temperature of 600 ° C for 1 hour.
- the particle size of the ultrafine crystal layer C1 in the surface layer 11 was maintained at approximately 600 ⁇ m.
- the ultrafine crystal layer C1 was excellent in temperature insensitivity, in which the crystal grains were less likely to be recrystallized even by the annealing treatment.
- the input shaft is made of the same material as the workpiece W described above. It is formed as a long perforated shaft having therein a horizontal hole for oil introduction extending in the axial direction.
- the torsional fatigue strength of the input shaft in the branch hole forming section was 378653 times on average with an additional torque of 392Nm, and 95727 times on average with 451Nm of attached tongue.
- the ultrafine crystal layer C1 was found on the inner peripheral surface of the branch hole. It was confirmed that the strength (torque ratio corresponding to 90,000 times) was improved by about 20% compared to the conventional product that did not have the same.
- the ultrafine crystal layer C1 is generated by drilling using a drill D, but the method for generating an ultrafine crystal layer according to the second embodiment uses an end mill E.
- the ultra-fine crystal layer C1 is generated by the cutting.
- the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.
- FIG. 4 is a diagram for explaining a method for generating an ultrafine crystal layer according to the second embodiment, and is a perspective view of a material W to be processed during cutting by an end mill E.
- FIG. 4 does not show a holder for transmitting the rotational force from the processing machine while holding the end mill E.
- the workpiece W can be processed while satisfying the first and second processing conditions described above.
- cutting machining
- E machining tool
- an ultrafine crystal layer C1 can be generated on the surface layer of the machined surface.
- Workpiece W is material: carbon steel C [IS_SUJ2), heat treatment: quenching, hardness: 790 [Hv], end mill ⁇ is material: cemented carbide, coating: TiAIN coating, tool diameter: ⁇ 10mm .
- the cutting conditions were as follows: peripheral speed: 150 mZmin, feed speed: 0.18 mm / rev, axial depth of cut: 2 mm, radial depth of cut: 0.1 mm, and cutting oil: unused.
- a plastic surface having a true strain of 1 or more is imparted to the machined surface of the workpiece W (see the first example described above). Processing conditions), the material temperature of the processed surface was raised above the Acl transformation point (second processing condition described above), and an ultrafine crystal layer C1 was formed on the processed surface.
- the ultrafine crystal layer C1 is generated by drilling using a drill D, but the method for generating an ultrafine crystal layer according to the third embodiment uses a pressing tool P.
- An ultra-fine crystal layer C1 is generated by the sliding card used.
- FIG. 5 is a diagram for explaining a method for forming an ultrafine crystal layer according to the third embodiment.
- FIG. 5 (a) is a perspective view of the workpiece W in the sliding basket by the pressing tool P
- FIG. 5 (b) is a view of the workpiece W in the Vb-Vb line of FIG. 5 (a).
- FIG. 5 (a) the illustration of the holder 1 for transmitting the rotational force from the lathe while holding the workpiece W is omitted.
- FIG. 5 (b) shows a cross-sectional view of the workpiece W after sliding by the pressing tool P.
- the ultra-fine crystal layer generation method is intended to stably generate the ultra-fine crystal layer C1 on the surface layer of the processed surface of the material to be processed W made of a material having relatively low hardness. It is a method. Specifically, the workpiece W is slid (machined) on the outer peripheral surface 21 by the pressing tool P (machining tool) while satisfying the first machining condition described above (see FIG. 5). (a)), and an ultrafine crystal layer C1 is generated on the surface layer (surface layer of the processing surface) of the outer peripheral processing surface 21 (see FIG. 5 (b)).
- third processing conditions conditions different from the above-described second processing conditions (hereinafter, referred to as “third processing conditions”) are applied.
- the third processing condition is that the material temperature of the outer peripheral processing surface 21 is maintained lower than a predetermined temperature (hereinafter, referred to as “upper limit temperature”) during the drilling operation by the drill D.
- a predetermined temperature hereinafter, referred to as “upper limit temperature”
- the upper limit temperature is the A cl transformation point of the steel material when the material W is composed of a steel material, and the workpiece W is made of another metal material except the steel material (eg, , Aluminum alloys, titanium alloys, etc.), the temperature is about half the melting point of the metal material. Note that the melting point is calculated based on the absolute temperature as in the case described above.
- maintaining a temperature lower than the upper limit temperature means that an average material temperature over time during which the sliding force of the outer peripheral processing surface 21 is performed by the pressing tool P is performed. It is sufficient that the average material temperature of the heat distribution on the entire outer peripheral processing surface 21 is maintained at a temperature lower than the upper limit temperature. Therefore, even if the material temperature of the processing surface instantaneously or locally becomes higher than the upper limit temperature, if the above average temperature is maintained lower than the upper limit temperature, the third processing The conditions are met.
- Sliding means that the workpiece W is rotated (in the direction of the arrow R in FIG. 5A) and, at the same time, the tool P is pressed against the outer peripheral processing surface 21 of the workpiece W at a predetermined pressure. This is a process in which the outer peripheral processing surface 21 of the workpiece W is subjected to plastic working by sliding.
- Workpiece W is material: carbon steel IIS-S10C), hardness: 3.9 GPa (400 Hv), outer diameter of machined outer peripheral surface 21 is ⁇ 10 mm
- pressing tool P is material: tool steel JIS- SKD61), hardness: 8 3GPa (850 Hv), tool width (width in the horizontal direction in Fig. 5 (a)): 5mm.
- the above-described first processing condition condition under which plastic working with a true strain of 1 or more
- the third processing condition temperature condition
- Adjust the pressing surface pressure (for example, 100MPa) of the bevel pressing tool P for example, 100MPa
- the sliding time for example, 3 minutes
- the rotation speed of the workpiece W and the supply amount of the coolant.
- the hardened material W after the annealing treatment has an internal hardness in which the ultrafine crystal layer C1 is not generated.
- the hardness in the ultrafine crystal layer C1 was 1.5 GPa (150 Hv), the hardness in the ultrafine crystal layer C1 was more than twice as high, and high hardness was maintained.
- the method of generating the ultrafine crystal layer in the third embodiment is, for example, the rotation axis.
- the present invention has been described based on the first to third embodiments.
- the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the present invention. It can be easily inferred that the improved deformation of is possible.
- the mechanical processing for generating the ultrafine crystal layer C1 drilling using a drill D, cutting using an end mill E, or Has been described as an example of sliding machining using the pressing tool P, but it is not necessarily limited to such machining, but a machine that satisfies both the first and second (or third) machining conditions described above As far as machining is concerned, other types of machining can naturally be applied to the present invention.
- Examples of such machining include lathing using a bite tool, milling using a milling tool, planing using a bite tool, and gear cutting using a hob tool.
- Examples include machining and grinding, such as finishing using a grindstone tool, and Panitsu Shindaka using a punching tool.
- the force described using the input shaft for an automatic transmission as an example is not necessarily limited to this. It is not necessary to use metal materials that can be used. Any mechanical component may be used, and it does not need to be a structural component for automobiles. Examples of other mechanical components include, for example, structural components for construction.
- the object W is composed of a steel material.
- the present invention is not limited to this. It is, of course, possible to compose other metal materials except steel materials.
- other metal materials other than steel materials include metal materials such as aluminum, magnesium, titanium, and copper and alloys thereof. That is, the metal material described in any one of claims 1 to 7 is intended to include various metal materials other than steel materials and the metal materials exemplified here.
- a fourth embodiment will be described with reference to Figs.
- a method of generating a nanocrystal layer a method of generating a nanocrystal layer on a surface portion of a processed surface of a workpiece by drilling (machining) using a drill D (machining tool) is described. explain.
- nanocrystal refers to a crystal in which the size (length) of the crystal grain is 100 nm or less
- the nanocrystal layer refers to a nanocrystal layer having at least 50% or more of its crystal structure. A structure that contains crystals.
- the wording “nanocrystalline layer” according to any one of claims 8 to 15 has the same meaning.
- the size (length) of a crystal grain of a nanocrystal does not need to be lOOnm or less in any direction, and it is sufficient if the size is at most lOOnm in at least one direction. That is, the nanocrystal does not necessarily have to be a crystal having a circular cross section, but may be a crystal having a flat cross section.
- the nanocrystal layer can of course have a mixed grain structure as long as it contains at least 50% or more of the above-mentioned nanocrystals. It may be.
- FIG. 6 is a diagram for explaining a nanocrystal layer generation method according to a fourth embodiment of the present invention.
- FIG. 6A is a cross-sectional view of a workpiece W during drilling with a drill D.
- FIG. 6B is a cross-sectional view of the workpiece W after drilling by the drill D.
- drill D A part of the workpiece w is omitted from the drawing.
- the hole W formed by the drill D is applied to the workpiece W while satisfying the following fourth and fifth processing conditions, respectively.
- a nanocrystalline layer C2 can be generated on the inner peripheral surface of the hole 1 (the surface layer of the processed surface) (see Fig. 6 (b)). ).
- the fourth processing condition is that plastic working with a true strain of at least 7 is applied to the inner peripheral surface of the hole 1, which is achieved by following the cutting conditions shown in FIG. Is performed.
- the cutting conditions will be described with reference to FIG.
- FIG. 7 is a view showing cutting conditions (cutting conditions for forming a nanocrystal layer) as the fourth processing condition of the present invention.
- the horizontal axis represents the hardness (Hv) of the material W to be worked.
- the vertical axis indicates the peripheral speed (m min) of the drill D.
- the fourth machining condition is to define the peripheral speed V [mZmin] of the drill D in association with the hardness H [Hv] of the workpiece W.
- the peripheral speed V of the drill D is V ⁇ 175-H / 4.
- the peripheral speed V of the drill D is specified as V ⁇ 50 [m / min].
- the feed rate of the drill D is preferably 0.2 mm or less per rotation. This is because plastic working with a true strain of 7 or more is reliably applied to the inner peripheral surface of the hole 1 while suppressing the load of the drill D.
- the hardness H of the workpiece W is 500 [Hv] or more.
- the peripheral speed V of drill D is specified as 50 [mZmin] or more, and the feed speed of drill D is specified as 0.2 mm or less per rotation.
- the hardness H of the workpiece W is 500 [Hv] or more
- the peripheral speed V of the drill D is 75 [m / min] or more
- the drill D Feed rate of 0 per rotation Defined as 05mm or less. This is because a plastic layer having a true strain of 7 or more can be more reliably applied to the inner peripheral surface of the hole 1 while suppressing the load of the drill D.
- pilot hole 2 (indicated by a dashed line in Fig. 6 (a)) is drilled in advance with a drill having a smaller diameter than the specified one, and then The hole 1 may be finished to a specified diameter by the above-mentioned drill D or reamer having a specified outer diameter.
- the drilling of pilot hole 2 is performed under normal cutting conditions (for example, a peripheral speed of 20 m / min or less), while the finish of hole 1 with drill D or reamer is as shown in Fig. 7.
- processing conditions of 4 Nanocrystal layer generation cutting conditions).
- the material temperature of the processing surface of the hole 1 is maintained in a predetermined temperature range (hereinafter, referred to as "temperature range") during drilling with the drill D.
- temperature range a predetermined temperature range
- the material temperature of the machining surface of the hole 1 is maintained within the temperature range by adjusting the supply amount of cutting oil and the like to the machining part and the cutting conditions (peripheral speed V or feed speed) using the drill D. It is.
- the temperature range is set to be equal to or higher than the Acl transformation point and lower than the melting point of the steel material.
- the temperature is set to a temperature that is approximately equal to or more than half of the melting point of the metal material and less than the melting point.
- maintaining in the temperature range in the fifth processing condition refers to the time average material temperature after drilling of the hole 1 is started by the drill D and the processing of the hole 1 It is sufficient that the average material temperature of the heat distribution over the entire surface is maintained within the respective temperature ranges.
- a heating means for example, a gas furnace or an electric furnace
- the formation of the nanocrystalline layer C2 can be promoted, and the material W to be worked can be softened. S can be suppressed.
- the material W to be used for this drilling is made of carbon steel (JIS-S55C), and its hardness is set to about 7.8 GPa (800 Hv) by quenching.
- FIG. 8 is a view showing a cross-sectional structure of the hole 1.
- a surface layer 31, a second layer 32, and a third layer 33 were observed on the inner peripheral surface of the hole 1 in order from the front side (the upper side in FIG. 8).
- the lower layer side (the lower side in FIG. 8) of the third layer 33 is a non-machining region (a region which is not affected by the drill D).
- a nanocrystalline layer C2 having a particle size of approximately 20 nm was observed in the surface layer 31 of the hole 1, a nanocrystalline layer C2 having a particle size of approximately 20 nm was observed. In this nanocrystal layer C2, it was confirmed that the hardness was improved to 1150 Hv. Surface 31 becomes a fine ⁇ grains undergo large deformation (over true strain 7) while being heated to ⁇ zone by the drilling by the drill D, the nanocrystal layer C2 has been produced by the spread transformation during the subsequent cooling Conceivable.
- the second layer 32 an ultrafine crystal layer having a particle size of about 100 nm was observed. In this fine crystal layer, it was confirmed that the hardness was improved to ⁇ .
- the second layer 13 is recrystallized in the spike region by heating after processing, and is further heated in the (h + ⁇ ) two-phase region. It is probable that it transformed to (hi + martensite) during cooling.
- the second layer 32 has a plastic strain of 1 or more true strain (and less than 7 true strain). Is given.
- the total thickness of the surface layer 31 and the second layer 32 (the depth from the surface to the lower surface of the second layer 32) in the fourth embodiment was approximately 10 / im.
- the thickness (depth) of such a layer increases as the peripheral speed V of the drill D increases.
- the thickness (depth) of such a layer increases as the diameter of the drill D increases, provided that the peripheral speed V of the drill D is constant.
- the third layer 33 is considered to be a region heated to approximately 700 ° C by drilling of the drill D and generated by static recrystallization (that is, a region tempered by the heat effect during drilling). available.
- the third layer 33 corresponds to the “non-nanocrystalline layer at the lower part of the processed surface of the object to be processed”.
- drilling (mechanical processing) using a drill D is based on the supply amount of cutting oil and the like and cutting conditions.
- the material temperature on the processing surface is controlled to satisfy the fifth processing condition described above, and the material temperature in the third layer 33 is approximately 500 ° C. or more. It is preferable to control so that the time to be set can be made within about 1 second. Thereby, the third layer 33 can be prevented from being tempered, and its hardness and strength can be ensured.
- Drilling (mechanical processing) by drill D is preferably performed so as to give a strain gradient of 1 / ⁇ or more to the surface layer of the processed surface. Thereby, the nanocrystalline layer C2 can be more reliably generated.
- each processing condition for example, cooling method, processing speed, etc.
- the value of the strain gradient can be used as a guide, so that each processing condition can be set easily and efficiently, and as a result, the work efficiency is improved. be able to.
- the strain having the above-described strain gradient means a shear strain.
- the strain gradient according to the thirteenth aspect is not necessarily limited to the shear strain, and further includes a compressive strain and a tensile strain in addition to the shear strain. That is, in a processing method other than the drilling method using the drill D, the distortion (deformation) of the surface layer of the processed surface is different, and the compressive strain or the tensile strain may be dominant in some cases. Therefore, in this case, the expression “strain gradient is equal to or greater than 1 / ⁇ ” in claim 13 means that the strain gradient of compressive strain or tensile strain is equal to or greater than 1 // im.
- the material temperature of the processed surface is not particularly limited as long as a strain gradient of 1 / ⁇ m or more is applied to the surface layer of the processed surface. Les ,. That is, even if the above-described fifth processing condition (maintaining the material temperature of the processed surface within a predetermined temperature range) is not satisfied, a strain gradient of l / zm or more is applied to the surface layer portion of the processed surface. This is because if possible, the nanocrystalline layer C2 can be generated.
- the method of generating a nanocrystal layer in this case is described as follows. "Machining is performed using a processing tool on a workpiece made of a metal material, and local large strain is imparted to the processed surface.
- a nanocrystal layer generating method for generating a nanocrystal layer on a surface portion of the processing surface, wherein the machining using the processing tool is performed on the processing surface of the workpiece by at least a true strain of 7 or more. And a strain gradient of lZ xm or more on the surface layer of the machined surface The method for producing a nanocrystalline layer is characterized in that the method is performed to give
- FIG. 9 is a photograph showing a cross-sectional structure of the hole 1
- FIG. 10 is a schematic diagram schematically showing the cross-sectional structure of FIG. 9 in order to simplify the drawing and facilitate understanding.
- Fig. 11 (a) shows the relationship between the depth z from the surface of the hole 1 and the displacement X of the crystal
- Fig. 11 (b) shows the relationship between the depth z and the shear strain ⁇
- (C) is a diagram showing the relationship between the depth ⁇ and the strain gradient g.
- 9 and 10 are cross sections perpendicular to the feed direction of the drill D, and the imaginary line Lz is an imaginary line perpendicular to the cutting direction.
- the depth z is measured along a virtual line Lz with the surface of the hole 1 as the origin, and the displacement X is measured along a direction perpendicular to the virtual line Lz.
- the layered crystals are arranged along the imaginary line Lz on the workpiece W (not shown). Is greatly bent in the sliding direction as shown in Figs.
- the curve (displacement X) of the layered crystal can be almost expressed as an exponential function x (z) of the depth z.
- the particle size of the nanocrystalline layer C2 in the surface layer 31 was kept at approximately 200 nm.
- the nanocrystal layer C2 was excellent in temperature insensitivity, since the crystal grains did not easily grow even by the annealing treatment.
- the input shaft is made of the same material as the above-mentioned workpiece W, and is formed as a long shaft with a hole having an oil-introducing lateral hole extending in the axial direction.
- a plurality of branch holes for oil supply communicating with the above-described lateral holes are formed.
- the above-described method of forming a nanocrystal layer is applied. Have been. Therefore, a nanocrystalline layer C2 is formed on the inner peripheral surface of each branch hole, and its hardness is improved.
- the torsional fatigue strength of the input shaft in the branch hole forming section was 378653 times on average with an additional torque of 392Nm, and 95727 times on average with an added torque of 451Nm, and there was no nanocrystalline layer C2 on the inner peripheral surface of the branch hole It was confirmed that the strength (torque ratio for 90,000 operations) was improved by about 20% compared to the conventional product.
- the nanocrystal layer C2 was generated by drilling using a drill D.
- the nanocrystal layer generation method according to the fifth embodiment uses a cutting method using an end mill E.
- a nanocrystal layer C2 is generated. Note that the same parts as those in the above-described fourth embodiment are used. Are denoted by the same reference numerals, and description thereof is omitted.
- FIG. 12 is a diagram for explaining a nanocrystal layer generation method according to the fifth embodiment, and is a perspective view of a workpiece W during cutting by an end mill E.
- the illustration of the holder for transmitting the rotational force from the processing machine while holding the end minole E is omitted.
- the object to be carohydrate W is satisfied while satisfying the above-described fourth and fifth processing conditions.
- a nanocrystalline layer C2 can be generated on the surface layer of the processed surface.
- Material W Material: Carbon steel C [IS_SUJ2), Heat treatment: Hardening, Hardness: 790 [Hv], End mill ⁇ Material: Carbide, Coating: TiAIN coating, Tool diameter: ⁇ 10mm It is.
- the cutting conditions were as follows: peripheral speed: 150 m / min, feed speed: 0.18 mm / rev, axial depth of cut: 2 mm, radial depth of cut: 0.1 mm, and cutting oil: unused.
- the present invention has been described based on the fourth and fifth embodiments.
- the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the present invention. It can be easily inferred that the improved deformation of is possible.
- a temperature gradient is applied to the surface layer portion of the processing surface, that is, the workpiece W is liquefied at an extremely low temperature.
- a processing surface is irradiated with a laser beam so that only the surface is exposed.
- Means for performing processing (machining) after preheating is exemplified.
- a larger temperature gradient can be applied to the surface layer of the processed surface, so that the distortion gradient can be easily provided and the generation of the nanocrystalline layer C2 can be ensured. .
- examples of drilling using a drill D and cutting using an end mill E are described as examples of mechanical processing for generating the nanocrystal layer C2.
- the present invention is not necessarily limited to these types of machining.As long as the machining satisfies both the fourth and fifth machining conditions described above, other types of machining can naturally be applied to the present invention. It is.
- Examples of such machining include lathing using a bite tool, milling using a milling tool, flat cutting using a bite tool, and gear cutting using a hob tool.
- Cutting work grinding work typified by a finishing tool using a grindstone tool, and panitizing work using a panitizing tool.
- the force described in the example of the input shaft for the automatic transmission is not necessarily limited to the metal material force. Any mechanical parts can be used, and they need not be structural parts for automobiles. Examples of other mechanical parts include, for example, structural parts for construction.
- the work W is made of a steel material.
- the work W is not necessarily limited to the steel material.
- Other metal materials are of course possible to construct. Examples of other metal materials other than steel materials include metal materials such as aluminum, magnesium, titanium, and copper, and alloys thereof. That is, the metal material described in any one of claims 1 to 4 is intended to include various metal materials other than iron and steel materials and the metal materials exemplified here.
- a sixth embodiment will be described with reference to the accompanying drawings.
- a method of generating a nanocrystal layer a method of generating a nanocrystal layer on a surface layer of a processed surface of a workpiece by drilling (mechanical processing) using a drill D (machining tool) will be described. You.
- FIG. 13 is a diagram for explaining a nanocrystal layer generation method according to the sixth embodiment of the present invention.
- FIG. 13 (a) is a cross-sectional view of a workpiece W during drilling with a drill D.
- FIG. 13B is a cross-sectional view of the material W after drilling with the drill D. Note that, in FIG. 13, the drill D and a part of the material W are omitted.
- a drill D is applied to the workpiece W while satisfying the following sixth and seventh processing conditions, respectively.
- a nanocrystalline layer C3 can be generated on the inner peripheral surface of the hole 1 (the surface layer of the processed surface) (Fig. 13 (a)).
- the sixth processing condition it is a condition that plastic working with a true strain of 7 or more is applied to the inner peripheral surface of the hole 1 and this is achieved by following the cutting conditions shown in FIG. Is performed.
- FIG. 14 is a diagram showing a comparison between the conventional cutting conditions and the cutting conditions (cutting conditions for forming a nanocrystal layer) as the sixth processing condition of the present invention.
- the speed (mm / rev) and the vertical axis indicate the peripheral speed (m / min) of the drill D, respectively.
- the sixth processing condition specifies that the peripheral speed of the drill D is 50m or more per minute and the feed speed of the drill D is 0.2mm or less per rotation.
- the inner peripheral surface of the hole 1 can be subjected to plastic working with a true strain of at least 7 or more.
- the peripheral speed of the drill D be 75 m or more per minute and the feed speed of the drill D be 0.05 mm or less per rotation. This is because a plastic layer having a true strain of 7 or more can be more reliably applied to the inner peripheral surface of the hole 1.
- a pilot hole 2 (indicated by a dashed line in Fig. 13) is drilled in advance with a drill having a smaller diameter than the specified diameter, and then the specified outer diameter
- the hole 1 may be finished to a specified diameter by the above-described drill D or reamer having a hole.
- the drilling of pilot hole 2 follows the conventional cutting conditions shown in Fig. 14, while drill D or reaming
- the material temperature of the processing surface of the hole 1 was maintained at a lower temperature than a predetermined temperature (hereinafter, referred to as an "upper limit temperature") during drilling by the drill D. Is required. In other words, cutting oil or the like is supplied to the processing portion to suppress an increase in the material temperature of the processing surface.
- a predetermined temperature hereinafter, referred to as an "upper limit temperature”
- maintaining a temperature lower than the upper limit temperature refers to a time average material temperature during drilling of the hole portion 1 by the drill D, and the average temperature of the hole. It is sufficient if the average material temperature of the heat distribution over the entire processing surface of the part 1 is maintained lower than the upper limit temperature. Therefore, even if the material temperature of the processed surface instantaneously or locally becomes higher than the upper limit temperature, if the above average temperature is maintained lower than the upper limit temperature, the seventh Processing conditions are met.
- the workpiece W used for this drilling is composed of alloy steel JIS-SCM420H), and has been subjected to a hardening treatment of the surface by heat treatment such as carburizing and quenching. It should be noted that the hardness of the material W to be coated is such that the surface hardness is about 6.8 GPa (700 Hv) and the internal hardness S is about 3.4 GPa (350 Hv).
- the inner peripheral surface of the hole 1 has As shown in FIG. 13 (b), a nanocrystalline layer C3 was generated. As a result of detailed observation of the generated nanocrystalline layer C3, the nanocrystalline layer C3 has a particle size of approximately 100 nm (0.1 ⁇ m) and a hardness improved to 9.8 GPa (980 Hv). It was confirmed that. The surface roughness of the nanocrystal layer C3 was RaO.7.
- the input shaft is made of the same material as the above-mentioned workpiece W, and is formed as a long holed shaft having a horizontal hole for oil introduction extending in the axial direction therein.
- a plurality of oil supply branch holes communicating with the above-mentioned lateral holes are formed.
- the above-described nanocrystal layer generation method is applied. Have been. Therefore, a nanocrystal layer is formed on the inner peripheral surface of each branch hole, and its hardness is improved.
- the torsional fatigue strength of the input shaft in the branch hole forming section was 378653 times on average with an additional torque of 392Nm, and 95727 times on average with a 451Nm of attached tongue. Its strength (torque ratio equivalent to 90,000 operations) is approximately 20 compared to the product. It has been confirmed that / o has been improved.
- a seventh embodiment will be described with reference to FIG.
- a nanocrystal layer was generated by drilling using a drill D.
- the nanocrystal layer generation method of the seventh embodiment is a method of forming a nanocrystal layer using a pressing tool P.
- a nanocrystal layer is generated by the shaping process.
- the same parts as those in the sixth embodiment are denoted by the same reference numerals, and description thereof will be omitted.
- FIG. 15 is a diagram for explaining a nanocrystal layer generation method according to the seventh embodiment.
- Fig. 15 (a) is a perspective view of a workpiece W in a sliding package by a pressing tool P.
- FIG. 15 (b) is a cross-sectional view of the subject material W taken along the line XlVb-XlVb in FIG. 15 (a).
- FIG. 15A a holder for transmitting the rotational force from the lathe while holding the workpiece W is not shown.
- FIG. 15 (b) is a cross-sectional view of the workpiece W after sliding by the pressing tool P.
- the pressing tool P (processing tool) is applied to the workpiece W while satisfying the above-described sixth and seventh processing conditions.
- the nanocrystalline layer C3 is formed on the surface layer of the outer peripheral processed surface 41 (the surface layer of the processed surface). It can be generated (see Fig. 15 (b)).
- the sliding process means that the workpiece W is rotated (in the direction of the arrow R in Fig. 15 (a)), and at the same time, the tool P is pressed against the outer peripheral processing surface 41 of the workpiece W at a predetermined pressure. This is a process in which the outer peripheral processed surface 41 of the workpiece W is given a plastic kneading by pressing and sliding.
- the workpiece W is made of material: carbon steel (JIS-S10C), the outer diameter of the outer peripheral surface 41 is ⁇ 10 mm, and the pressing tool P is made of material: tool steel (JIS_SKD61), hardness: 8.3GPa (850Hv) , Tool width (width in the horizontal direction in Fig. 15 (a)): 5 mm.
- the pressing surface pressure of the goug pressing tool P that satisfies the above-described sixth processing condition is not more than lOOMPa.
- the rotation speed of the object to be caroeuted W is good, even if it is out of rotation.
- the rotation speed of the workpiece W is 25 rotations or more per minute
- the pressing surface pressure of the pressing tool P is 400 MPa or more
- the sliding processing time is 5 minutes or more.
- the supply amount of the cooling liquid for example, methanol
- the cooling liquid is about 50 ml per minute. This is because plastic working with a true strain of 7 or more can be more reliably applied to the processing outer peripheral surface 41.
- a result of performing an annealing process on the material W in which the nanocrystal layer C3 is generated will be described. Note that the annealing treatment was performed by holding the material W for 1 hour in an atmosphere temperature of 600 ° C. [0208] The workpiece W after the annealing treatment has an internal hardness of 1. in which the nanocrystalline layer C3 is not generated.
- the hardness in the nanocrystalline layer C3 was 3.9 GPa (400 HV), whereas the hardness was 5 GPa (155 Hv), and high hardness was maintained.
- the nanocrystal layer generation method according to the seventh embodiment is described, for example, by using the rotation axis. By applying to the sliding surface, the wear resistance of the sliding surface can be improved, and the life of the rotating shaft can be improved.
- the nanocrystal layer generation method of the present invention performs machining (drilling, sliding force pulling) on the workpiece W using the drill D or the pressing tool P. Therefore, the nanocrystal layer C3 is generated on the surface layer of the processing surface (the inner peripheral surface of the hole 1 and the outer peripheral surface 41). The nanocrystal layer C3 can be formed even in a region where the layer C3 cannot be formed, and the uniform nanocrystal layer C3 can be stably formed.
- the nanocrystal layer generation method of the present invention it is necessary to separately provide a special device such as a shot peening injection device 100 (see Fig. 4) as in the conventional nanocrystal layer generation method. Since there is no apparatus, the cost of the apparatus can be reduced. In the manufacturing process of the product, it is possible to reduce the production cost of the nanocrystal layer by minimizing the process change that occurs to produce the nanocrystal layer C3, and to reduce the product cost of the product accordingly. Can be.
- the nanocrystal layer C3 can be generated simultaneously with the drilling of the hole 1 by the drill D, an additional process for generating the nanocrystal layer C3 is unnecessary. It can be. Further, in the example of the seventh embodiment, after the outer peripheral surface 41 is externally cut by a cutting tool, the cutting tool is simply changed to the pressing tool P, that is, while the workpiece W is held in the holder. As a result, the nanocrystalline layer C3 can be generated, so that a process change can be minimized.
- the nanocrystal layer C3 when the nanocrystal layer C3 is generated in a wide area, it is necessary to repeat the collision of protrusions and hard particles G (see Fig. 4) many times.
- the method for forming a nanocrystal layer of the present invention while the time is bulky and inefficient, machining (drilling, sliding) using a drill D or a pressing tool P is performed. Since the nanocrystalline layer C3 is generated, the nanocrystalline layer C3 can be efficiently generated. Therefore, the production cost of the nanocrystalline layer C3 can be suppressed.
- the present invention has been described based on the sixth and seventh embodiments.
- the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the gist of the present invention. It can be easily inferred that the improved deformation of is possible.
- examples of drilling using a drill D and sliding force using a pressing tool P are described as examples of machining for generating a nanocrystal layer.
- the present invention is not necessarily limited to these types of machining, but any other type of machining can be applied to the present invention as long as it satisfies both the sixth and seventh machining conditions described above. is there.
- Examples of such machining include lathing using a bite tool, milling using a milling tool, planing using a bite tool, and gear cutting using a hob tool. Examples thereof include machining, grinding such as finishing using a grindstone tool, and polishing such as panitizing using a punishing tool.
- the force described in the example of the input shaft for the automatic transmission is not necessarily limited to the metal material force. Any mechanical parts can be used, and they need not be structural parts for automobiles. Examples of other mechanical parts include, for example, structural parts for construction.
- the work W is made of a steel material.
- the work W is not necessarily limited to the steel material.
- Other metal materials are of course possible to construct. Examples of other metal materials other than steel materials include metal materials such as aluminum, magnesium, titanium, and copper and alloys thereof. That is, the metal material described in any one of claims 1 to 5 is intended to include various metal materials other than the steel material and the metal materials exemplified here.
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- Engineering & Computer Science (AREA)
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Drilling And Boring (AREA)
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- Forging (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020067013386A KR100756077B1 (ko) | 2004-01-21 | 2004-12-14 | 초미세결정층 생성방법, 그 초미세결정층 생성방법에 의해생성된 초미세결정층을 구비한 기계부품 및 그 기계부품을제조하는 기계부품 제조방법, 나노결정층 생성방법, 그나노결정층 생성방법에 의해 생성된 나노결정층을 구비한기계부품 및 그 기계부품을 제조하는 기계부품 제조방법 |
EP04807011A EP1707306B1 (en) | 2004-01-21 | 2004-12-14 | Process for forming an ultrafine crystal layer on a metallic surface by drilling |
JP2005517202A JP4713344B2 (ja) | 2004-08-20 | 2004-12-14 | 超微細結晶層生成方法、その超微細結晶層生成方法により生成された超微細結晶層を備えた機械部品、及び、その機械部品を製造する機械部品製造方法、並びに、ナノ結晶層生成方法、そのナノ結晶層生成方法により生成されたナノ結晶層を備えた機械部品、及び、その機械部品を製造する機械部品製造方法 |
CNB2004800404264A CN100463769C (zh) | 2004-01-21 | 2004-12-14 | 晶体层生成方法、具有该晶体层的机械部件及其制造方法 |
US10/585,707 US20080286597A1 (en) | 2004-01-21 | 2004-12-14 | Process of Forming Ultrafine Crystal Layer, Machine Component Having Ultrafine Crystal Layer Formed by the Ultrafine Crystal Layer Forming Process, Process of Producing the Machine Component, Process of Forming Nanocrystal Layer, Machine Component Having Nanocrystal Layer Formed by the Nanocrystal Layer Forming Process, and Process of Producing the Machine Component |
US12/590,576 US8382919B2 (en) | 2004-01-21 | 2009-11-10 | Process of forming nanocrystal layer |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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JP2004-013487 | 2004-01-21 | ||
JP2004013487A JP4711629B2 (ja) | 2004-01-21 | 2004-01-21 | ナノ結晶層生成方法、そのナノ結晶層生成方法により生成されたナノ結晶層を備えた機械部品、及び、その機械部品の製造方法 |
JP2004240615 | 2004-08-20 | ||
JP2004-240615 | 2004-08-20 | ||
JP2004240616 | 2004-08-20 | ||
JP2004-240616 | 2004-08-20 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US10/585,707 A-371-Of-International US20080286597A1 (en) | 2004-01-21 | 2004-12-14 | Process of Forming Ultrafine Crystal Layer, Machine Component Having Ultrafine Crystal Layer Formed by the Ultrafine Crystal Layer Forming Process, Process of Producing the Machine Component, Process of Forming Nanocrystal Layer, Machine Component Having Nanocrystal Layer Formed by the Nanocrystal Layer Forming Process, and Process of Producing the Machine Component |
US12/590,576 Continuation US8382919B2 (en) | 2004-01-21 | 2009-11-10 | Process of forming nanocrystal layer |
Publications (1)
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WO2005070614A1 true WO2005070614A1 (ja) | 2005-08-04 |
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PCT/JP2004/018650 WO2005070614A1 (ja) | 2004-01-21 | 2004-12-14 | 超微細結晶層生成方法、その超微細結晶層生成方法により生成された超微細結晶層を備えた機械部品、及び、その機械部品を製造する機械部品製造方法、並びに、ナノ結晶層生成方法、そのナノ結晶層生成方法により生成されたナノ結晶層を備えた機械部品、及び、その機械部品を製造する機械部品製造方法 |
Country Status (5)
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US (2) | US20080286597A1 (ja) |
EP (1) | EP1707306B1 (ja) |
KR (1) | KR100756077B1 (ja) |
CN (1) | CN100463769C (ja) |
WO (1) | WO2005070614A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009535228A (ja) * | 2006-05-03 | 2009-10-01 | パーデュ リサーチ ファンデーション | ナノ結晶チップの製造方法 |
JP2015048474A (ja) * | 2013-09-04 | 2015-03-16 | 出光興産株式会社 | 潤滑油および潤滑システム |
JP2019089232A (ja) * | 2017-11-14 | 2019-06-13 | エスアイアイ・プリンテック株式会社 | 噴射孔プレート、液体噴射ヘッドおよび液体噴射記録装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008034447B3 (de) * | 2008-07-24 | 2010-02-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Fertigbearbeitung einer Oberfläche eines Werkstückes unter Ausbildung eines Dritten Körpers |
US20130260168A1 (en) * | 2012-03-29 | 2013-10-03 | General Electric Company | Component hole treatment process and aerospace component with treated holes |
CN103540727B (zh) * | 2013-10-31 | 2016-01-20 | 中国科学院金属研究所 | 金属二维纳米层片结构及制备方法 |
CN106068331B (zh) * | 2014-03-11 | 2018-07-24 | 本田技研工业株式会社 | 钢部件及其制造方法 |
JP6307109B2 (ja) * | 2016-05-20 | 2018-04-04 | 株式会社不二製作所 | 金属成品の表面処理方法及び金属成品 |
CN115041996B (zh) * | 2022-07-01 | 2023-09-15 | 广东工业大学 | 一种形成梯度纳米结构平面表层的加工装置及加工方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002066873A (ja) * | 2000-09-01 | 2002-03-05 | Horkos Corp | 工作機械の主軸装置 |
JP2003522030A (ja) * | 1998-11-17 | 2003-07-22 | サーブ アー・ベー | 高速機械加工(hsm)によるメタル・マトリックス複合材(mmc)の加工方法 |
JP2003300354A (ja) | 2002-02-06 | 2003-10-21 | Canon Inc | 印刷制御装置、印刷制御方法、及び印刷制御プログラム |
JP2004013487A (ja) | 2002-06-06 | 2004-01-15 | Secom Co Ltd | 勤務表作成支援システム |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE880446C (de) * | 1941-06-20 | 1953-06-22 | Aeg | Verfahren zum Haerten von Werkstuecken |
US3117042A (en) * | 1957-01-04 | 1964-01-07 | Blechner Heinrich | Heat-treatment of metals |
GB884447A (en) * | 1957-01-04 | 1961-12-13 | Heinrich Blechner | Improvements in or relating to metal working |
GB884446A (en) * | 1957-01-04 | 1961-12-13 | Heinrich Blechner | Improvements in and relating to the heat-treatment of metals |
US5881594A (en) * | 1995-02-17 | 1999-03-16 | Sandia Corporation | Method and apparatus for imparting strength to a material using sliding loads |
DE19848033C1 (de) * | 1998-10-17 | 2000-01-05 | Bosch Gmbh Robert | Vorrichtung zur Randschichthärtung von Werkstücken |
JP2001138113A (ja) | 1999-11-08 | 2001-05-22 | Hitachi Tool Engineering Ltd | 耐熱鋳鋼穴加工方法 |
JP2003039398A (ja) * | 2001-07-30 | 2003-02-13 | Daido Steel Co Ltd | 金属製品表面のナノ結晶化方法 |
CN1377987A (zh) * | 2002-01-24 | 2002-11-06 | 天津大学 | 高速塑性剪切变形使金属表面组织纳米化方法 |
JP4195601B2 (ja) | 2002-11-19 | 2008-12-10 | 新日本製鐵株式会社 | 金属材料の超音波衝撃処理条件の設定方法 |
JP2005069377A (ja) | 2003-08-25 | 2005-03-17 | Fuji Univance Corp | 孔付きシャフト |
JP4711629B2 (ja) | 2004-01-21 | 2011-06-29 | 実 梅本 | ナノ結晶層生成方法、そのナノ結晶層生成方法により生成されたナノ結晶層を備えた機械部品、及び、その機械部品の製造方法 |
-
2004
- 2004-12-14 WO PCT/JP2004/018650 patent/WO2005070614A1/ja active Application Filing
- 2004-12-14 CN CNB2004800404264A patent/CN100463769C/zh not_active Expired - Fee Related
- 2004-12-14 US US10/585,707 patent/US20080286597A1/en not_active Abandoned
- 2004-12-14 KR KR1020067013386A patent/KR100756077B1/ko not_active IP Right Cessation
- 2004-12-14 EP EP04807011A patent/EP1707306B1/en not_active Expired - Fee Related
-
2009
- 2009-11-10 US US12/590,576 patent/US8382919B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003522030A (ja) * | 1998-11-17 | 2003-07-22 | サーブ アー・ベー | 高速機械加工(hsm)によるメタル・マトリックス複合材(mmc)の加工方法 |
JP2002066873A (ja) * | 2000-09-01 | 2002-03-05 | Horkos Corp | 工作機械の主軸装置 |
JP2003300354A (ja) | 2002-02-06 | 2003-10-21 | Canon Inc | 印刷制御装置、印刷制御方法、及び印刷制御プログラム |
JP2004013487A (ja) | 2002-06-06 | 2004-01-15 | Secom Co Ltd | 勤務表作成支援システム |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009535228A (ja) * | 2006-05-03 | 2009-10-01 | パーデュ リサーチ ファンデーション | ナノ結晶チップの製造方法 |
JP2015048474A (ja) * | 2013-09-04 | 2015-03-16 | 出光興産株式会社 | 潤滑油および潤滑システム |
JP2019089232A (ja) * | 2017-11-14 | 2019-06-13 | エスアイアイ・プリンテック株式会社 | 噴射孔プレート、液体噴射ヘッドおよび液体噴射記録装置 |
Also Published As
Publication number | Publication date |
---|---|
KR100756077B1 (ko) | 2007-09-07 |
CN1905986A (zh) | 2007-01-31 |
US20100151270A1 (en) | 2010-06-17 |
EP1707306A1 (en) | 2006-10-04 |
EP1707306B1 (en) | 2012-09-26 |
CN100463769C (zh) | 2009-02-25 |
KR20060115912A (ko) | 2006-11-10 |
US20080286597A1 (en) | 2008-11-20 |
US8382919B2 (en) | 2013-02-26 |
EP1707306A4 (en) | 2006-11-08 |
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