Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
  • C09J175/04—Polyurethanes
• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
  • A61L15/00—Chemical aspects of, or use of materials for, bandages, dressings or absorbent pads
  • A61L15/16—Bandages, dressings or absorbent pads for physiological fluids such as urine or blood, e.g. sanitary towels, tampons
  • A61L15/42—Use of materials characterised by their function or physical properties
  • A61L15/58—Adhesives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G18/00—Polymeric products of isocyanates or isothiocyanates
  • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
  • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
  • C08G18/30—Low-molecular-weight compounds
  • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
  • C08G18/3225—Polyamines
  • C08G18/3237—Polyamines aromatic
  • C08G18/324—Polyamines aromatic containing only one aromatic ring
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G18/00—Polymeric products of isocyanates or isothiocyanates
  • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
  • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
  • C08G18/40—High-molecular-weight compounds
  • C08G18/61—Polysiloxanes
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
  • C09J183/10—Block or graft copolymers containing polysiloxane sequences
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G2170/00—Compositions for adhesives
  • C08G2170/40—Compositions for pressure-sensitive adhesives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/02—Polysilicates
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
  • Y10T428/2852—Adhesive compositions
  • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31652—Of asbestos
  • Y10T428/31663—As siloxane, silicone or silane

Definitions

• Pressure sensitive adhesive compositions comprising an unreactive mixture of polydiorganosiloxane polyurea copolymer, diluent, and silicate tackifying resin.
• the compositions are useful for articles such as medical devices.
• U.S. Patent No. 5,580,915 describes silicone adhesive compositions having excellent quick stick, peel and tack adhesion properties.
• the adhesive composition is the reaction mixture of a silanol-containing siloxane resin, a silicone polymer gum, and a silicone fluid containing functionality capable of reacting with silanol and silanol-like groups; optionally, a solvent and a cure catalyst are added.
• EP 0 667 382 A 1 describes a silicone pressure sensitive adhesive containing thermoplastic multi-segmented copolymer.
• WO 97/40103 describes a composition that includes a silicone fluid, a silicone- urea segmented copolymers, and no more than about 30% by weight of a silicate tackifying resin.
• WO 03/052019 describes pressure sensitive adhesives and methods, wherein the adhesives include a silicone tackifying resin and a polydiorganosiloxane polyurea copolymer. The tack of these adhesives is improved by the use of a processing as, such as a plasticizer.
• the invention discloses an article, such as a medical device, comprising a substrate and a pressure sensitive adhesive composition disposed on the substrate.
• the adhesive composition comprises an unreactive mixture of polydiorganosiloxane polyurea copolymer, greater than 10 wt-% of a diluent, and greater than 30 wt-% silicate tackifying resin.
• the invention discloses an article comprising a substrate, a tie layer composition disposed on the substrate and a pressure sensitive adhesive composition disposed on the tie layer.
• the tie layer composition and the adhesive composition comprise a common base polymer and a common tackifying resin.
• the tie layer composition further comprises a reinforcement material.
• the tie layer comprises polydiorganosiloxane polyurea copolymer, a silicate tackifying resin, and polymeric fibers.
• the diluent and resin of the adhesive are preferably free of functional groups that react with the components of the adhesive.
• the polydiorganosiloxane polyurea copolymer is also substantially free of reactive end groups.
• the diluent is preferably a silicone fluid.
• the diluent is typically present in amount ranging from about 20 wt-% to about 50 wt-%.
• the diluent preferably has a weight average molecular weight of less than 50,000 g/mole.
• the amount of silicate tackifying resin is typically less than about 60 wt-%.
• the adhesive preferably has a storage modulus of no greater than about 1 X 10 5 Pa at about 25°C. Further, the initial peel force of the adhesive from polypropylene ranges from about 3 g/linear inch (2.54 cm) to 200 g/linear inch (2.54 cm).
• the present invention relates to an adhesive composition and articles, such as a medical device, comprising a substrate and the pressure sensitive adhesive disposed on the substrate.
• the adhesive composition comprises an unreactive mixture of at least one polydiorganosiloxane polyurea copolymer, greater than 10 wt-% of at least one diluent, and greater than 30 wt-% of at least one silicate tackifying resin.
• Pressure-sensitive adhesive (PSA) compositions are well known to those of ordinary skill in the art to possess properties including the following: (1) aggressive and permanent tack, (2) adherence with no more than finger pressure, (3) sufficient ability to hold onto an adherend, and (4) sufficient cohesive strength to be cleanly removable from the adherend.
• medical device refers to an article comprises at least one substrate and an adhesive composition.
• the adhesive composition is temporality bonded to (e.g. human) skin.
• the pressure-sensitive adhesive of the present invention are useful in many medical applications such as tapes, bandages, dressings, drapes, athletic tapes, tapes and tabs used in adhering a medical device such as a sensor, electrode, and an ostomy appliance, as well as transdermal drug delivery devices.
• the adhesive may be employed on protective and decorative face masks.
• the adhesive characteristicly feels "soft" to the touch and has a gel-like consistency.
• the softness of the adhesive can be characterized to at least some extent with certain tests. For example the softness can be characterized by Dynamic Mechanical Analysis.
• Exemplary adhesive compositions of the invention exhibit a storage modulus (G') of no more than about 1 X 10 5 Pa at 25°C. Preferably, the storage modulus (G') is about 1 X 10 4 Pa at 25°C or less.
• the adhesive may have a storage modulus (G') of any integer between 1 X 10 5 Pa and 1 X 10 4 Pa.
• G' storage modulus
• An advantage of the adhesive compositions of the present invention is that the storage modulus exhibits a plateau region from about 25°C to temperatures of 50°C and even 100°C.
• the adhesive also exhibits adequate adhesion to (e.g. human) skin.
• Polypropylene test panels are often employed to simulate adhesion to skin.
• the adhesive composition preferably exhibits an 180° peel adhesion to polypropylene according to the test method described in the forthcoming examples of at least 3 g/linear inch (2.54 cm).
• the 180° peel adhesion to polypropylene is at least 5 to 10 g/linear inch (2.54 cm).
• the adhesive of the invention is less aggressive. Accordingly, the 180° peel adhesion to polypropylene is less than 1000 g/linear inch (2.54 inch), preferably less than 500 g/linear inch (2.54 inch), and more preferably less than 200 g/linear inch (2.54 cm) (e.g. less than 100 g/linear inch (2.54 cm)).
• the adhesive can be reapplied to skin after being removed. Further, the adhesive can be cleanly removed without removing hair because of its softness.
• the adhesive can be coated onto any backing suitable for medical uses including porous and nonporous backings.
• the substrates i.e., backings
• the substrates are preferably flexible yet resistant to tearing.
• the thickness of the substrate is typically at least 0.0125 mm. In general, the thickness of the substrate is no greater than 3 mm.
• the substrate may have a basis weight of at least 5 grams/meter 2 . Further, the substrate typically has a basis weight of no greater than 200 grams/meter 2 .
• Suitable substrates include fabric, non- woven or woven polymeric webs, polymer films, hydrocolloids, foam, metallic foils, paper, and/or combinations thereof.
• an open apertured substrate e.g., a scrim.
• the apertures (i.e., openings) in the porous substrates are of sufficient size and sufficient number to facilitate mechanical bonding of the adhesive and the backing. As an additional benefit such construction is typically highly breathable.
• a scrim typically comprises a plurality of warp elements and a plurality of weft elements that are woven or knitted together to form the scrim.
• the warp elements extend longitudinally along the backing layer and are uniformly transversely spaced from one another.
• the weft elements extend transversely along the backing layer typically at right angles to the warp elements.
• Other open structures that are either woven or nonwoven (e.g. meltblow) may also be employed.
• meltblow e.g. meltblow
• Materials of the backing or support substrate include a wide variety of materials including paper, natural or synthetic fibers, threads and yarns made from materials such as cotton, rayon, wool, hemp, jute, nylon, polyesters, polyacetates, polyacrylics, alginates, ethylene-propylene-diene rubbers, natural rubber, polyesters, polyisobutylenes, polyolefins (e.g., polypropylene polyethylene, ethylene propylene copolymers, and ethylene butylene copolymers), polyurethanes (including polyurethane foams), vinyls including polyvinylchloride and ethylene-vinyl acetate, polyamides, polystyrenes, fiberglass, ceramic fibers, and/or combinations thereof.
• materials of the backing or support substrate include a wide variety of materials including paper, natural or synthetic fibers, threads and yarns made from materials such as cotton, rayon, wool, hemp, jute, nylon, polyesters, polyacetates, polyacrylics, alginates,
• the backing can also be provided with stretch-release properties.
• Stretch-release refers to the property of an adhesive article characterized in that, when the article is pulled from a surface, the article detaches from the surface without leaving significant visible residue.
• a film backing can be formed from a highly extensible and highly elastic composition that includes elastomeric and thermoplastic A-B-A block copolymers, having a low rubber modulus, a lengthwise elongation to break of at least 200%, and a 50% rubber modulus of not above 2,000 pounds/square inch (13.8 megapascals (MPa)).
• the adhesive composition preferably comprises an unreactive mixture of at least one polydiorganosiloxane polyurea copolymer, at least one unreactive diluent, and at least one silicate tackifying resin.
• the polydiorganosiloxane polyurea copolymer preferably comprises unreactive end groups. An unreactive mixture is preferred due to exhibiting stable adhesive properties even after aging.
• Stable adhesive properties refers to cleanly removing from (e.g. human) skin and/or a polypropylene substrate as subsequently described without leaving a sticky residue.
• the polydiorganosiloxane polyurea copolymer may optionally comprise end groups having ethylenic unsaturation.
• copolymer refers to polymers containing two or more different monomers, including terpolymers, tetrapolymers, etc.
• Preferred polydiorganosiloxane polyurea copolymers suitable for use in the preparation of adhesives according to the present invention are the reaction products of at least one polyamine, wherein the polyamine includes at least one polydiorganosiloxane polyamine (preferably, diamine) with at least one polyisocyanate, and an optional polyfunctional chain extender such as an organic amine and/or alcohol.
• the mole ratio of isocyanate to amine is preferably in a range of about 0.9:1 to about 1.1:1, more preferably about 0.95:1 to about 1.05:1, and most preferably about 0.97:1 to about 1.03:1.
• preferred polydiorganosiloxane polyurea copolymers suitable for use in the preparation of pressure sensitive adhesives according to the present invention have polydiorganosiloxane units, polyisocyanate residue units, and optionally, organic polyamine and/or polyol residue units.
• the polyisocyanate residue units and the polyamine residue units preferably form less than 15% by weight, and more preferably, less than 5% by weight, of the of the polydiorganosiloxane polyurea copolymer.
• the polyisocyanate residue is the polyisocyanate minus the -NCO groups and the polyamine residue is the polyamine minus the -NH 2 groups.
• the polyisocyanate residue is connected to the polyamine residue by urea linkages.
• polystyrene resin is connected to the polyol residue by urethane linkages.
• segmented copolymers are disclosed in U.S. Pat. No. 5,461,134 (Leir et al.) and International Publication Nos. WO 96/34029, WO 96/35458, and WO 98/17726.
• Preferred polydiorganosiloxane polyurea copolymers, used in preparing the adhesive of the present invention can be represented by the repeating unit (Formula I):
• R moieties are methyl moieties with the balance being monovalent alkyl or substituted alkyl moieties having 1 to 12 carbon atoms, alkenylene moieties, phenyl moieties, or substituted phenyl moieties; each Z is independently a polyvalent moiety that is an arylene moiety, an aralkylene moiety, an alkylene moiety, or a cycloalkylene moiety (each of which preferably has 6 to 20 carbon atoms); preferably Z is 2,6-tolylene, 4,4'- methylenediphenylene, 3,3'-dimethoxy-4,4'-biphenylene, tetramethyl- -xylylene, 4,4'- methylenedicyclohexylene, 3,5,5-trimethyl-3-methylenecyclohexylene, 1
• Diisocyanates useful in the process of the present invention can be represented by the following (Formula II): OCN— Z— NCO Any dusocyanate that can react with a polyamine, and in particular with polydiorganosiloxane diamine of Formula III, below, can be used in the present invention.
• diisocyanates include, but are not limited to, aromatic diisocyanates, such as 2,6-toluene dusocyanate, 2,5-toluene dusocyanate, 2,4-toluene dusocyanate, m-phenylene dusocyanate, jr phenylene dusocyanate, methylene bis(o-chlorophenyl dusocyanate), methylenediphenylene-4,4'-diisocyanate, polycarbodiimide-modified methylenediphenylene dusocyanate, (4,4'-diisocyanato-3,3',5,5'-tetraethyl) diphenylmethane, 4,4'-diisocyanato-3,3'-dimethoxybiphenyl (o-dianisidine dusocyanate), 5-chloro-2,4-toluene dusocyanate, l-chloromethyl-2,4
• Preferred diisocyanates include 2,6-toluene dusocyanate, methylenediphenylene- 4,4'-diisocyanate, polycarbodiimide-modified methylenediphenyl dusocyanate, 4,4'- diisocyanato-3,3'-dimethoxybiphenyl(o-dianisidine dusocyanate), tetramethyl-m-xylylene dusocyanate, methylenedicyclohexylene-4,4'-diisocyanate, 3-isocyanatomethyl-3,5,5- trimethylcyclohexyl isocyanate (isophorone dusocyanate), 1,6-diisocyanatohexane, 2,2,4- trimethylhexyl dusocyanate, and cyclohexylene-l,4-diisocyanate.
• Polydiorganosiloxane polyamines useful in the process of the present invention are preferably diamines
• the number average molecular weight of the polydiorganosiloxane polyamines useful in the present invention is greater than about 700.
• Preferred polydiorganosiloxane diamines (also referred to as silicone diamines) useful in the present invention are any which fall within Formula III above and including those having number average molecular weights in the range of about 5000 to about 150,000.
• Polydiorganosiloxane diamines are disclosed, for example, in U.S. Pat. Nos.
• Polydiorganosiloxane polyamines are commercially available from, for example, Shin-Etsu Silicones of America, Inc., Akron, OH, and H ⁇ ls America, Inc., Pitscataway, NJ. Preferred are substantially pure polydiorganosiloxane diamines prepared as disclosed in U.S. Pat. No.
• the polydiorganosiloxane diamines having such high purity are prepared from the reaction of cyclic organosilanes and bis(aminoalkyl)disiloxanes utilizing an anhydrous amino alkyl functional silanolate catalyst such as tetramethylammomum-3-aminopropyldimethyl silanolate, preferably in an amount less than 0.15 weight percent based on the weight of the total amount of cyclic organosiloxane with the reaction run in two stages.
• Particularly preferred polydiorganosiloxane diamines are prepared using cesium and rubidium catalysts and are disclosed in U.S. Pat. No.
• polydiorganosiloxane polyamines useful in the present invention include, but are not limited to, polydimethylsiloxane diamine, polydiphenylsiloxane diamine, polytrifluoropropylmethylsiloxane diamine, polyphenylmethylsiloxane diamine, polydiethylsiloxane diamine, polydivinylsiloxane diamine, polyvinylmethylsiloxane diamine, poly(5-hexenyl)methylsiloxane diamine, and copolymers and mixtures thereof.
• the polydiorganosiloxane polyamine component employed to prepare polydiorganosiloxane polyurea segmented copolymers of this invention provides a means of adjusting the modulus of elasticity of the resultant copolymer.
• high molecular weight polydiorganosiloxane polyamines provide copolymers of lower modulus
• low molecular weight polydiorganosiloxane polyamines provide polydiorganosiloxane polyurea segmented copolymers of higher modulus.
• polydiorganosiloxane polyurea segmented copolymer compositions contain an optional organic polyamine
• this optional component provides yet another means of modifying the modulus of elasticity of copolymers of this invention.
• concentration of organic polyamine as well as the type and molecular weight of the organic polyamine determine how it influences the modulus of polydiorganosiloxane polyurea segmented copolymers containing this component.
• organic polyamines useful in the present invention include but are not limited to polyoxyalkylene diamine, such as D-230, D-400, D-2000, D-4000, DU-700, ED-2001 and EDR-148, all available from Huntsman Chemical Corp., Salt Lake City, UT, polyoxyalkylene triamine, such as T-3000 and T-5000 available from Huntsman, polyalkylene diamines such as DYTEK A and DYTEK EP, available from DuPont, Wilmington, DE, l,4-bis(3-aminopropyl)piperazine, (3,3'-diamino-N-methyl- dipropylamine) both available from Aldrich Chemical Co., Milwaukee, WI, and mixtures thereof.
• polyoxyalkylene diamine such as D-230, D-400, D-2000, D-4000, DU-700, ED-2001 and EDR-148, all available from Huntsman Chemical Corp., Salt Lake City, UT
• polyoxyalkylene triamine
• isocyanate residue in the polydiorganosiloxane polyurea copolymer influences stiffness and flow properties, and also affects the properties of the mixtures.
• Isocyanate residues resulting from diisocyanates that form crystallizable ureas such as tetramethyl-m-xylylene dusocyanate, 1,12-dodecane dusocyanate, and dianisidine dusocyanate, provide mixtures that can be stiffer, if sufficient polydiorganosiloxane polyurea copolymer is used, than those prepared from methylenedicyclohexylene-4,4'- diisocyanate, 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate, and w-xylylene dusocyanate.
• Crosslinking agents if desired may be used, for example Si-H-containing agents may be used to crosslink curable polydiorganosiloxane polyurea copolymers or photoinitiators can be used for free-radically curable polydiorganosiloxane urea copolymers. Additional curatives may also be present such as hydrosilation curatives, peroxide curatives, and photocuratives, such as triazines. When used, the amounts of such components are those that are suitable for the purpose intended and are typically used at a concentration of from about 0.1 % to about 5% by weight of the total weight of the polymerizable composition. Crosslinking can also be carried out using electron beam radiation if desired.
• the polydiorganosiloxane polyurea copolymer may comprise reactive end groups.
• the polydiorganosiloxane polyurea copolymer may have the same general formula as Formula III as previously described with the exception that the hydrogen end groups are replaced with a ultraviolet (UN) curable end group represented by the following (Formula IV): -C-(Qr)-X II o
• X is a group having ethylenic unsaturations
• Q is a divalent linking group
• r is an integer of 0 to 1.
• the polydiorganosiloxane polyurea copolymer is generally prepared such that the molar ratio of diamine to dusocyanate is maintained in the range of about 1.0 :0.95 to 1.0 :1.05.
• the resulting polydiorganosiloxane polyurea copolymer has a high molecular weight.
• the adhesive of the invention may comprise a mixture of more than one of the polydiorganosiloxane polyurea copolymers just described.
• the adhesive may comprises a blend of two polydiorganosiloxane polyurea copolymers, each having unreactive end groups, wherein the first copolymer has a higher molecular weight than the second copolymer.
• the adhesive may comprises a blend of two polydiorganosiloxane polyurea copolymers, wherein the first copolymer comprises end group(s) having ethylenic unsaturation and the second copolymer comprise unreactive end groups.
• the polydiorganosiloxane polyurea copolymers can be made by any of a variety of known methods, including solvent-based and solvent-free methods.
• solvent-based processes include Tyagi et al., "Segmented Organosiloxane Copolymers: 2. Thermal and Mechanical Properties of Siloxane urea Copolymers," Polymer, Vol. 25, December, 1984 and U.S. Pat. No. 5,214,119 (Leir et al.).
• Suitable solvents are organic solvents that are unreactive with the polyisocyanates and that maintain the reactants and products completely in solution throughout the polymerization reaction.
• Typical organic solvents include those that have a combination of polar and nonpolar character, or mixtures of polar solvents with nonpolar solvents can be used.
• Preferred organic solvents include polar aprotic solvents, chlorinated solvents, ethers, aromatic hydrocarbons, aliphatic hydrocarbons, and alcohols. Examples include heptane, toluene, xylene, methyl ethyl ketone, 2-propanol, tert-butanol, tetrahydrofuran, isoamyl alcohol, chloroform, dichloromethane, dimethyl formamide, and the like, and combinations thereof. Examples of solvent- free processes are described in International Publication Nos.
• the adhesive composition of the invention comprises greater than 30 wt-% of at least one silicate tackifying resin in order to provide the proper level of adhesion to skin.
• the amount of silicate tackifying resin is no greater than about 60 wt-%.
• the amount of silicate tackifying resin is at least 40 wt-%.
• Silicate tackifying resin amounts of any integer between the minimums and maximums can usefully employed.
• the silicate tackifying resins useful in the present invention include those resins composed of the following structural units M (R' SiO ⁇ /2 units), D (R' 2 SiO 2 / 2 units), T (R'SiO 3 / 2 units), and Q (SiO 4/2 units), and combinations thereof.
• Typical examples include MQ silicone tackifying resins, MQD silicone tackifying resins, and MQT silicone tackifying resins. These preferably have a number average molecular weight of about 100 to about 50,000, more preferably about 500 to about 15,000 and generally have methyl substituents.
• MQ silicone tackifying resins are copolymeric silicone resins having R' SiO ⁇ /2 units ("M" units) and SiO 4/2 units ("Q”units). Such resins are described in, for example, Encyclopedia of Polymer Science and Engineering, vol. 15, John Wiley & Sons, New
• Certain MQ silicone tackifying resins can be prepared by the silica hydrosol capping process described in U.S. Pat. No. 2,676,182 (Daudt et al.) as modified according to U.S. Pat. No. 3,627,851 (Brady), and U.S. Pat. No. 3,772,247 (Flannigan). The modified process of Daudt et al.
• the neutralized silica hydrosol is preferably stabilized with an alcohol, such as 2-propanol, and capped with R 3 SiO ⁇ / 2 siloxane units as soon as possible after being neutralized.
• the level of silicon bonded hydroxyl groups on the MQ resin may be reduced, preferably to less than about 1.5% by weight, more preferably to no greater than about 1.2 wt-%, even more preferably to no greater than about 1.0 wt-%, and most preferably to no greater than 0.8 wt-%.
• This may be accomplished, for example, by reacting hexamethyldisilazane with the silicone tackifying resin. Such a reaction may be catalyzed, for example, with trifluoroacetic acid. Alternatively, trimethylchlorosilane or trimethylsilylacetamide may be reacted with the silicone tackifying resin, a catalyst not being necessary in this case.
• Suitable silicate tackifying resins are commercially available from sources such as Dow Corning, Midland, MI, General Electric Silicones Waterford, NY and Rhodia Silicones, Rock Hill, SC.
• MQ silicone tackifying resins include those available under the trade designations SR-545 and SR-1000, both of which are commercially available from GE Silicones, Waterford, NY.
• Such resins are generally supplied in organic solvent and may be employed in the adhesives of the present invention as received.
• the adhesive composition comprises greater than 10 wt-% of at least one unreactive diluent.
• unreactive it is meant that the diluent does not react with the silicate tackifying resin or the polydiorganosiloxane polyurea copolymer(s) of the adhesive composition.
• the diluent does not react with such component during manufacture of the adhesive, during application of the adhesive to a substrate, or upon aging.
• the diluent is substantially free of reactive groups.
• the amount of diluent is no greater than 50 wt-%.
• the amount of silicate tackifying resin is at least 20 wt-% and more preferably at least 30 wt-%. Diluent amounts of any integer between the minimums and maximums can be employed.
• Useful unreactive diluents are compatible with the polydiorganosiloxane polyurea copolymers, such that the diluent does not phase separate.
• a means of detecting phase separation is by the presence of a sticky residue left on the skin after removal of the medical device from skin or the presence of a sticky residue upon removal of adhesive coated substrate from polypropylene test substrate (i.e. as further described in the forthcoming examples.)
• Preferred diluents typically have a number average molecular weight of at least about 150 g/mole and more preferably at least about 500 g/mole.
• the molecular weight of the diluent is preferably less than 100,000 g/mole, more preferably less than about 50,000 g/mole, and in some embodiment preferably less than about 30,000 g/mole. For amounts of diluent of about 40 wt-% or greater the molecular weight is preferably less than about 20,000 g/mole.
• the molecular weight of the diluent may be measured or reported by the supplier (e.g. GE Silicones, Waterford, NY). In some embodiments the molecular weight of the unreactive diluent is less than the molecular weight of the diamine employed to make the polydiorganosiloxane polyurea copolymer.
• a preferred unreactive diluent is a silicone oil.
• Representative silicone oils include but are not limited to trialkylsiloxy terminated polydimethylsiloxane, polyphenylmethylsoloxane, polydialkylsiloxane, as well as copolymers of such with trialkylsiloxy terminated species.
• Other suitable diluents include for example hydrocarbon fluids, low molecular weight oligomers and oils. Selection of such other suitable diluents shall be based on compatibility. Further, for medical devices, care will also be taken to selected diluents that are not known to be skin irritants such as mineral oil for example. Various combinations of diluents can be used if desired.
• the pressure sensitive adhesives of the present invention can include one or more additives.
• dyes or pigments may be added as colorant; electrically and/or thermally conductive compounds may be added to make an adhesive electrically and/or thermally conductive or antistatic; antioxidants and bacteriostatic agents may be added; and UV light stabilizers and absorbers, such as hindered amine light stabilizers (HALS), may be added to stabilize the PSA against UV degradation and to block certain UV wavelengths from passing through the article.
• HALS hindered amine light stabilizers
• Other additives include adhesion promoters, fillers, tack enhancers, glass or ceramic microbubbles, expanded and unexpanded polymeric microspheres, blowing agents, polymers, and other property modifiers, such as clays, flame retardants, and compatibilizers.
• the adhesive composition can be applied to appropriate release liners or directly to a substrate (e.g. tape backings) by a wide range of processes, including, solution coating, solution spraying, hot melt coating, extrusion, coextrusion, lamination, pattern coating, etc., to make adhesive laminates.
• liners include liners having a fluorosilicone release coating such as commercially available from Dow Corning Corp., Midland, MI under the trade designation “Dow Corning SYL-OFF Q2-7785”; commercially available from Shin-Etsu Silicones of America, Inc., Torrance, CA under the trade designation “X-70-029NS”; and commercially available from Release International, Bedford Park, IL under the trade designation "S TAKE-OFF 2402", and the like.
• the articles of the invention may contain additional layers such as primers, barrier coatings, tie layers, and combinations thereof. Priming of the layer(s) may include a priming step such as chemical or mechanical priming.
• a tie layer between the pressure sensitive adhesive composition in the backing.
• the tie layer preferably comprises the same base polymer and resin (i.e. common) as the adhesive composition and further comprises a reinforcement material.
• a preferred reinforcement material is polymeric fiber. Suitable polymeric fibers include polyolefin (e.g. polyethylene copolymers, terpolymers, and tetrapolymers; polypropylene copolymers), polyamide, polyester, copolyesters, and the like.
• the reinforcement material is not appreciably affected by the adhesive composition.
• the reinforcement material is not plasticized by the diluent of the adhesive composition and accordingly do not exhibit a substantial decrease in mechanical properties.
• the tie layer composition is typically substantially free of diluent.
• the tie layer may comprise a diluent, yet at a concentration significantly less than that of the adhesive.
• tie layers comprised of polydiorganosiloxane polyurea copolymer(s), silicate tackifying resins(s), and polyolefin fibers, are presently disclosed in combination with adhesive compositions comprising the same polymer and resin, it is surmised that the use of tie layers comprising a common base polymer and resin in combination with at least one reinforcement material may be employed with other types of pressure sensitive adhesive compositions (e.g.
• thermoplastic block copolymer based as well.
• Objects and advantages of this invention are further illustrated by the following examples, but the particular materials and amounts thereof recited in these examples, as well as other conditions and details, should not be construed to unduly limit this invention. All amounts listed in the tape preparations and examples are by weight unless otherwise specified.
• the ingredients employed in the Examples are set forth in Table I as follows: Table I
• the bonded assembly dwelled at room temperature for about one minute and was tested for 180° peel adhesion using an IMASS slip/peel tester (Model 3M90, commercially available from Instrumentors Inc., Strongsville, OH) at a rate of 2.3 meters/minute (90 inches/minute) or 30.5 centimeters/minute (12 inches/minute) over a five second data collection time.
• IMASS slip/peel tester Model 3M90, commercially available from Instrumentors Inc., Strongsville, OH
• Two samples were tested; the reported peel adhesion value is an average of the peel adhesion value from each of the two samples and the failure mode was recorded - adhesive at PP, cohesive or adhesive at PET.
• the storage (G') and loss (G") shear moduli were determined using a Rheometrics ARES rheometer operated in the strain controlled oscillatory mode.
• the ARES rheometer (available from TA Instruments, New Castle, Delaware) was equipped with 8 mm parallel plates surrounded with a forced air convection oven for temperature control.
• Silcone fluids of various molecular weights were used to make adhesive compositions of the examples.
• the molecular weights of these fluids is provided in Table II as follows:
• PSA pressure sensitive adhesive
• This PSA was diluted with 280 parts of toluene/isopropanol mixture (70/30 wt) to prepare a PSA solution (30% solid).
• the PSA solution was then coated on the PET film using a knife coater and the wet gap was controlled to be 8 mil.
• the coated PSA was dried at 70°C for 20 minutes to get PSA dry film of about 2 mil.
• Examples 2-7 were prepared as in Example 1 except that a different molecular weight silicone fluid was used as indicated in following Table II.
• Example 8 80 parts silicone fluid DMS-T11 and 100 parts of SPU elastomer solution (20 parts of solid) were mixed with 166.7 parts of silicone tackifier SR-545 (100 parts of solid) to prepare a pressure sensitive adhesive (PSA). This PSA was diluted and coated as described in Example 1.
• Examples 9-13 were prepared as in Example 8 except that a different molecular weight silicone fluid was used as indicated in following Table II. Table II
• a sample of the solid tie layer intermediate sample (225g) was hot-melt mixed with 25g of POE 10 resin in a single screw extruder equipped with a 250-milliliter bowl mixer (available from C.W. Brabender Instruments, Inc., South Hackensack, NJ) at 150°C for 10 minutes to produce a homogeneous mixture.
• the tie layer composition was hot-melt coated using a 3/4 inch (1.9 cm) single screw extruder available from Haake of Düsseldorf, Germany under the trade designation "Haake Rheocord” onto a fluorinated silicone release liner commercially available from Loparex Inc., Bedford Park, IL under the trade designation "REXAM No. 20987" at a thickness of 3 mils.
• the tie layer composition was transfer coated onto a rayon nonwoven backing, such backing is present on medical tape commercially available from 3M Company under the trade designation "Micropore”.
• Example 14 A PSA film was made as in Example 1 only it was coated on the REXAM No. 20987" rather than PET. The coated PSA was dried at 70°C for 20 minutes to get PSA dry film of about 2 mil. The dried adhesive film was then laminated at room temperature to the tie layer/nonwoven backing construction to produce a medical tape.
• Example 15 was prepared as in Example 14 only the PSA film used was as made in Example 2.
• Example 16 was prepared as in Example 14 only the PSA film used was as made in Example 3.
• Example 17 was prepared as in Example 14 only the PSA film used was as made in Example 4.
• Example 18 was prepared as in Example 14 only the PSA film used was as made in Example 5.
• Example 19 was prepared as in Example 14 only the PSA film used was as made in Example 6.
• Example 20 was prepared as in Example 14 only the PSA film used was as made in Example 7.
• the laminated samples were conditioned at 25°C/50% relative humidity for 24 hours before peel test.
• the peel force was measured and recorded along with the failure mode as reported in following Table IN.
• Example 21 In a reaction vessel was placed 7.50 parts of PDMS diamine 14,000 and 7.50 parts of PDMS diamine 33,000. After mixing, 0.23 parts of IEM was added. To this mixture was added 1.00 part of a photoiniatiator commercially available from Speciality Chemical Corp, Tarrytown, NY under the trade designation "Darocur 1173". This was mixed for 2 hours and next was added 35.0 parts polydimethylsiloxane commercially available from Rodia Inc., Rock Hill, SC under the trade designation "Rhodorsil Fluid 47V-500". After mixing, 50 parts of the DC 2-7066 solution was added. This was mixed for 1 hour and then cast onto PET and dried in an oven at 70°C for 10 minutes to yield a 2 mil thick film when dry. The Rexham release liner was next laminated to the dried PSA and the laminated structure was placed under UV lights for 30 minutes to cure the elastomer mixture. After the cure was complete, the liner was removed and the sample was tested. The test results were as follows:
• the cured adhesive composition was clear having slight finger tack (i.e. 1 on a scale of 1-3 scale.
• the peel from polypropylene was 8 g/linear inch (2.54 cm).

Landscapes

• Chemical & Material Sciences (AREA)
• Health & Medical Sciences (AREA)
• Organic Chemistry (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Polymers & Plastics (AREA)
• Medicinal Chemistry (AREA)
• Materials Engineering (AREA)
• Animal Behavior & Ethology (AREA)
• General Health & Medical Sciences (AREA)
• Public Health (AREA)
• Veterinary Medicine (AREA)
• Life Sciences & Earth Sciences (AREA)
• Epidemiology (AREA)
• Engineering & Computer Science (AREA)
• Hematology (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Materials For Medical Uses (AREA)
• Adhesive Tapes (AREA)
• Medicinal Preparation (AREA)

Priority Applications (7)

Applications Claiming Priority (2)

Publications (2)

Family

ID=34678784

Family Applications (1)

Country Status (12)

Cited By (4)

Families Citing this family (59)

Family Cites Families (36)

• 2003
  • 2003-12-22 US US10/744,212 patent/US7407709B2/en not_active Expired - Fee Related
• 2004
  • 2004-12-03 AU AU2004311940A patent/AU2004311940A1/en not_active Abandoned
  • 2004-12-03 JP JP2006547044A patent/JP4891091B2/ja not_active Expired - Fee Related
  • 2004-12-03 WO PCT/US2004/040653 patent/WO2005065736A2/en not_active Ceased
  • 2004-12-03 DE DE200460025615 patent/DE602004025615D1/de not_active Expired - Lifetime
  • 2004-12-03 CA CA 2550858 patent/CA2550858A1/en not_active Abandoned
  • 2004-12-03 CN CNB2004800384932A patent/CN100423787C/zh not_active Expired - Fee Related
  • 2004-12-03 EP EP20040817956 patent/EP1696973B1/en not_active Expired - Lifetime
  • 2004-12-03 AT AT04817956T patent/ATE457748T1/de not_active IP Right Cessation
  • 2004-12-03 BR BRPI0417984-6A patent/BRPI0417984A/pt not_active IP Right Cessation
  • 2004-12-21 TW TW093139882A patent/TW200602094A/zh unknown
• 2006
  • 2006-07-21 ZA ZA200606069A patent/ZA200606069B/en unknown
• 2008
  • 2008-06-30 US US12/164,230 patent/US7807268B2/en not_active Expired - Fee Related

Also Published As

Similar Documents

Legal Events