WO2005057484A1

WO2005057484A1 - Ic card and method for manufacturing ic card

Info

Publication number: WO2005057484A1
Application number: PCT/JP2004/018335
Authority: WO
Inventors: Mineko Ito
Original assignee: Konica Minolta Photo Imaging, Inc.
Priority date: 2003-12-15
Filing date: 2004-12-02
Publication date: 2005-06-23
Also published as: JP2005174220A

Abstract

Disclosed is an IC card (1) wherein an IC module (9), which has an antenna (7) and an IC chip (6) and is supported by a module supporting body (8), is interposed between opposing first sheet material (2) and second sheet material (3) and integrated together using adhesives (4, 5). The IC card (1) is characterized by having an antistatic layer (11) on at least one side of the module supporting body (8). With such a constitution, damages to electronic components caused by electrostatic charges as well as mixing of foreign particles into the IC card can be prevented during production. Consequently, there can be obtained an IC card having good surface roughness.

Description

P T / JP2004 / 018335

Specification

IC card and method of manufacturing IC card

The present invention relates to an IC card having a built-in IC module and a method of manufacturing an IC card. Background art

Conventionally, magnetic cards that record data using the magnetic recording method have been widely used for identification cards (ID cards) and credit cards. However, magnetic cards allow data to be rewritten relatively easily, preventing data falsification from being sufficiently protected, being magnetically vulnerable to external influences, and ensuring that data is not sufficiently protected. There were problems such as a small capacity. Therefore, in recent years, IC cards with a built-in IC chip have begun to spread.

The IC card reads and writes data from and to external devices via electrical contacts provided on the surface and loop antennas inside the card. The Ic card has a large storage capacity and greatly improved security compared to a magnetic card. In particular, non-contact type IC cards that have an internal antenna for exchanging information between the IC chip and the outside inside the card and do not have electrical contacts outside the card are compared with contact type IC cards that have electrical contacts on the card surface. It is being used for applications requiring high data confidentiality and anti-counterfeiting like ID cards.

As such an IC card, for example, a first sheet material and a second sheet material are bonded with an adhesive. And an IC module having an IC chip and an antenna in the adhesive layer (see, for example, Japanese Patent Application Laid-Open No. 2002-72498). It is preferable to use a low-temperature adhesive from the viewpoint of the transportability of the first sheet material and the second sheet material, the transportability of the IC card due to heat shrinkage, warpage, and the like. IC chip breakage has become a major issue due to the electrification that occurs in the IC. In addition, when dust adheres to the IC module due to electrification and the adhesive is applied as it is, the dust causes uneven application, and the unevenness of the card surface deteriorates, which is a problem. On the other hand, a technology has been disclosed in which a surfactant is interposed on a contact surface between a plastic sheet and a pressing member in order to alleviate electrification due to friction between a conveying member and an IC card (for example, see Japanese Unexamined Patent Application Publication No. No. 63-3030205).

However, although the antistatic effect is improved because of being interposed on the surface of the IC card, the printing is deteriorated when information such as an image is recorded on the finished IC card, which is a problem. Disclosure of the invention

The present invention can prevent an electronic component from being damaged by electrification at the time of manufacturing, which is a conventional problem, and can prevent dust from being mixed at the time of manufacturing, and can obtain an IC card having good surface unevenness. It aims to provide IC cards and IC card manufacturing methods.

(1) In order to achieve the above object, one embodiment of the present invention provides an IC module having an antenna and an IC chip supported by a module support, and two first sheet members opposing the IC module. An IC card integrated with an adhesive sandwiched between a sheet material and a second sheet material, wherein the IC card has an antistatic layer on at least one surface of the module support. PT / JP2004 / 018335

Three

(2) In the present invention, the antistatic layer is characterized by comprising at least one of an ionic conductive polymer, a colloidal metal oxide sol, a crystalline metal oxide particle, and a conjugated conductive polymer. The Ic card according to the above (1).

(3) In the present invention, the IC card according to (1) or (2), wherein the antistatic layer is applied simultaneously with the step of forming the module support. -

(4) In the present invention, the surface specific resistance of at least one surface of the module support is not more than 1 E + 11 ΩΖ at 23 ° C. and 20% RH.

An IC card according to any of (3).

(5) In the present invention, the viscosity of the adhesive is 120. The IC card according to any one of the above (1) to (4), wherein C is 3000 to 20000 mPas.

(6) In the present invention, the IC card according to any one of the above (1) to (4), wherein the adhesive is a reactive hot melt adhesive.

(7) Further, one embodiment of the present invention is a sheet-like shape in which an IC module having an antenna and an IC chip is supported by a module support, and the IC module is provided with two first sheet members facing each other. A method for manufacturing an IC card, wherein the IC card is sandwiched between second sheet materials and integrated with an adhesive, comprising an antistatic layer on at least one surface of the module support.

(8) In the present invention, the antistatic layer comprises at least one of an ion conductive polymer, a colloidal metal oxide sol, a crystalline metal oxide particle, and a conjugated conductive polymer. (7) The method for manufacturing an IC card according to the above (7).

(9) In the present invention, the antistatic layer comprises a step of forming a film of the module support. The method for producing an IC card according to the above (7) or (8), wherein the method is applied simultaneously.

(10) In the present invention, the surface specific resistance of at least one side of the module support is 1 E + 11 ΩΖ or less at 23 ° C. and 20% RH, and A method for manufacturing the IC card according to any one of the above.

(11) In the present invention, the IC according to any of (7) to (10), wherein the viscosity of the adhesive is 3000 to 2000 OmPas at 120 ° C. This is a method for manufacturing a card.

(12) In the present invention, the method for producing an IC card according to any one of the above (7) to (11), wherein the adhesive is a reactive hot melt adhesive. Brief Description of Drawings

FIG. 1 is an exploded perspective view of an IC card according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the IC card according to the embodiment of the present invention.

FIG. 3 is a plan view of the IC card according to the embodiment of the present invention.

FIG. 4 is an enlarged view of a manufacturing apparatus for performing the method for manufacturing an IC card according to the embodiment of the present invention.

FIG. 5 is a diagram showing an IC module in an IC card according to the embodiment of the present invention. FIG. 6 shows the results of the evaluation. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of an IC card and a method of manufacturing an IC card according to the present invention will be described. As will be described, the present invention is not limited to this embodiment. The embodiments of the present invention show the most preferable embodiments of the present invention, and the terms of the present invention are not limited to these.

FIG. 1 is an exploded perspective view of the IC card, FIG. 2 is a sectional view of the IC card, and FIG. 3 is a plan view of the IC card.

The thickness of the IC card 1 of this embodiment is specified to be 0.76 mm according to the ISO standard. The IC card 1 includes first and second sheet materials 2 and 3 which are two sheet materials, and adhesives 4 and 5 interposed between the first and second sheet materials 2 and 3. . An image receiving layer 60 is provided on the surface of the first sheet material 2 on which the adhesive 4 is not interposed, and a writing layer is provided on the surface of the second sheet material 3 on which the adhesive 5 is not interposed. 6 1 is formed.

An example of the image receiving layer 60 is a layer formed of a material that traps and fixes the dye when the sublimation dye ink is heated by TPH (thermal head) and thermally diffuses. 60 is provided with personal identification information 62. For example, in the case of an employee certification card, the character "name", the character "issue date", and the image of "face photo" are provided. Information. This image receiving layer 60 is protected by the transparent protective layer 63. The writing layer 61 ′ can be formed, for example, by coating a polyester resin or the like with a white pigment such as silica dispersed therein.

An IC module 9 is enclosed in the adhesives 4 and 5, and the IC module 9 includes an antenna 7 and an IC chip 6. The IC module 9 has a single-wafer shape supported by a module support 8. The module support 8 has an antistatic layer 11 on at least one surface. The module support 8 having the antistatic layer 11 has a surface resistivity of at least one side of not more than 1 E + 11 Ω / port at 23 ° C and 20% RH. Is preferred.

Hereinafter, the present invention will be described in detail.

[IC module]

The IC module according to the present invention includes an IC chip for electrically storing information of a user of the IC card, and a coil-shaped antenna connected to the IC chip. The IC chip is a memory only or a microcomputer in addition to the memory, and may include a capacitor in some cases. The IC module has an antenna coil. When the IC module has an antenna pattern, any method such as conductive paste printing, copper foil etching, or wire welding may be used. The bonding between the IC chip and the antenna pattern is made of conductive adhesives such as silver paste, copper paste, carbon paste, etc. (EN-400 series of Hitachi Chemical Co., Ltd., XAP series of Toshiba Chemical, etc.) or anisotropic conductive A method using a film (e.g., asolum manufactured by Hitachi Chemical Co., Ltd.), or a method of performing solder bonding or ACF bonding is known, but any method may be used. It is also preferable to have a reinforcing plate near the IC chip in order to improve the point pressure strength of the IC chip.

The IC module has a single-wafer shape supported by a module support, and the module support is not particularly limited. However, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), PET-G (at least ethylene Modified polyester resin obtained by polymerizing three components of glycol, terephthalic acid and 1,4-six-hexane dimethanol), polybutylene terephthalate (PBT), polycarbonate (PC), polyimide (P 1), atarilonitrile-butadiene Use styrene (ABS) polyvinyl chloride (PVC) or the like. When the IC module is finally sandwiched between two opposing sheet materials, it may have a single-wafer shape. It may be used in the form of a leaf (referred to as an individual piece) or cut from a roll form into a single-sheet form.

Conventionally, in the case of individual IC modules, there has been a problem in that when one of the IC modules is peeled off from the overlapping state, peeling electrification occurs and the IC chip is damaged. Also, in the case where the roll is changed from the wool shape to the single-wafer shape, there is a problem that peeling charging occurs when the roll is unwound. According to the present invention, the IC chip can be kept in a good state by suppressing the charging and regenerating.

The thickness of the module support is preferably from 10 to 100 μm, and more preferably from 20 to 60. Further, the total thickness of the IC module is preferably from 100 to 500 / m, more preferably from 150 to 450 zm.

[Antistatic layer and its coating method]

The module support of the IC module has an antistatic layer on at least one side, and the antistatic layer contains a conductive material called an antistatic agent or a conductive material (hereinafter referred to as an antistatic agent). . The antistatic agent is not particularly limited, but preferably contains at least one of an ionic conductive polymer, a colloidal metal oxide sol, a crystalline metal oxide particle, and a conjugated conductive polymer.

The ionic conductive polymer is not particularly limited, and may be any of anionic, cationic, amphoteric and nonionic. Among them, anionic and cationic are preferred. More preferred are sulfonic acid-based and carboxylic acid-based polymers or latex-based quaternary ammonium-based polymers or latexes for anionic properties. These ionic conductive monopolymers are described, for example, in the anionic polymer or latex described in JP-B-52-25251, JP-A-51-29923 and JP-B-60-48024. No. 7- 1 8 1 76, No. 5 7- 5 6 05 9, No. 58- 568 Five

8

No. 56, U.S. Pat. No. 4,118,231 and the like.

Colloidal metal oxide sols include, for example, an amorphous stannic acid sol as disclosed in JP-B-35-6616, and an amorphous vanadium pentoxide described in JP-A-55-5982. And alumina sol having an electrolyte as disclosed in JP-B-57-12979.

The crystalline metal oxide particles, Z n 0 as disclosed in _{JP-A-56- 143431, T i 0 2,} S n0 2, A 1 2 0 3, I n 2 〇 _3, S i _{0 2, M g 0, B} a 0, Mo0 3 etc., or good composite oxides thereof, in particular _{ZnO, T i 0 2, S} ηθ 2 is preferred. In addition, a substance containing a small amount of a hetero atom forming a donor with respect to a metal oxide generally has high conductivity and is preferred. As an example of containing a heteroatom, ZnO pair and is Al, the addition of such I n, 1 ^ 0 for a ₂ ^^ _1), the addition of such T a, for the S N_〇 ₂ Addition of Sb, Nb, halogen element, etc. is effective. The addition amount of these hetero atoms is preferably in the range of 0.01 mol% to 30 mol%, more preferably 0.1 mol% to 1 mol%.

Further, a method of coating the surface of the inorganic or organic filler with these crystalline oxides can also be preferably used.

A conjugated conductive polymer is a conjugated polymer with a molecular skeleton consisting of a conjugated system in which a double bond or triple bond that connects a carbon atom to a carbon atom or a heteroatom is alternately long with a single bond. is there. These conjugated polymers include: 1) aliphatic conjugated polymers: polymers in which carbon-carbon conjugated systems such as polyacetylene are continuously extended; 2) aromatic co-polymers: aromatic carbonized materials such as poly (paraphenylene). 3) Heterocyclic conjugated polymer: polypyrrole, polythiophene, polyisothia 4018335

9 A polymer in which a heterocyclic compound such as naphthene is bonded to form a conjugated system, and 4) a heteroatom conjugated system: an aliphatic or aromatic conjugated system such as polyaline is heteroatom-containing. 5) Mixed-type conjugated polymers: conjugated polymers having a structure in which the constituent fu positions of the above-mentioned conjugated systems are alternately bonded, such as poly (phenylenevinylene). Of these, 1) aliphatic conjugated systems, 3) heterocyclic conjugated systems, and 4) heteroatom-containing conjugated systems can be particularly preferably used. Specific examples thereof include polyacetylene and derivatives thereof, polypyrrole and derivatives thereof. Polythiophene and its derivatives, polyisothianaphthene and its derivatives, polyaniline and its derivatives can be mentioned, but the present invention is not limited to these.

In general, a conjugated conductive polymer expresses excellent conductivity by doping with a dopant.

The dopant used in the present invention is not particularly limited, and examples thereof include the following. Halogen molecule _{_{(e.g., C l 2, B r 2}} , I 2, IC 1 2, IC 13, IB r, IF , etc.), Lewis acids _{_{(e.g., PF 5, As F 5,}} S b F 5, BF 3, BC 1 _3, BB, etc. r _{_3,} S0 _3), protonic acid _{(e.g., HF, HC 1, HN0 3} , H 2 S0 4, HC 10 4, FS_〇 _{_{3 H, C 1 S 0 3}} H, CF 3 S 〇 ₃ H, various organic acids, such as amino acids), transition metal compounds _{(e.g., F e C l 3, F} eOC and _{T i C l 4, Z r} C 1 4, H f C 1 4, Nb F 5 _{, Nb C 1 5, T a} C 1 5, Mo F 5, Mo C 1 5, WF S, WC 1 6, Ln C 13 (Ln = L a, C e, P r, Nd, Rantanoido of Sm, etc.) Do etc.), electrolyte Anion (e.g. CI-, B r -, I-, C 1_Rei _{_{4 -, PF S -, As}} F s _{one, S b F 6 -, BF} 4 -, CF 3 S0 3 -, CF _{_{_{3 C0 2 -, CH 3 S0}}} 3 one, such as CH ₃ C ₆ H ₅ S_〇_R), polymer electrolytes Anion (e.g. Poribieru sulfate, polystyrene scan Honoré acid, poly (p- vinyl Benzyl sulfonic acid), polyacrylic acid, polyethylene sulf O ₂ , XeOF ₄ , (N0 ²⁺ ) (S b F ₆ ), (N0 ²⁺ ) (S b C l ₆ ), etc., such as sulfonic acid, polyvinyl sulfonic acid, polyphosphoric acid, polyaspartic acid, etc. _{^{), (N0 2 +) (}} BF 4 -), F S0 2 00 S0 2 F, Ag C 10 4, H 2 I r C 1 6, La ( N_〇 _{₃₎ 3} · 6H ₂ 〇 and the like it can. ''

The method of doping the dopant is not particularly limited, but a method of polymerizing a conjugated conductive polymer in the presence of the dopant is generally used.

It is preferable that the antistatic layer is applied simultaneously with the step of forming a module support of the IC module. Here, “coating at the same time as the film forming step of the module support” means that the antistatic layer is coated before winding once in the film forming step of the module support. For example, when the module support is a biaxially oriented polyester film, a coating liquid for forming an antistatic layer is applied to the polyester film before the completion of the oriented crystallization, and then stretched and heat-treated in at least one direction. Coating the antistatic layer at the same time as the film forming process of the module support of the IC module not only increases the production efficiency but also strengthens the adhesion of the antistatic layer to the module support.

Further, the module support having an antistatic layer preferably has a surface specific resistance of at least one side of not more than 1E + 11Ω at 23 ° C20% RH, more preferably 1E at 23 ° C20% RH. + 10 Ω or less. By having these values, the effect of the present invention can be exerted in a low humidity kagyu case where static electricity itself or dust adhesion due to electrification is a problem.

The antistatic layer may contain a binder. The binder is not particularly limited, and can be selected according to the adhesiveness to the module support, the physical properties of the antistatic layer, and the like. In particular, when the antistatic layer is applied simultaneously with the step of forming the module support of the IC module, an aqueous polymer is preferred. Acrylic resin, styrene type as the aqueous polymer Resin, polyester resin, polyurethane resin, polyvinyl resin, polyvinylidene chloride, polyvinyl alcohol, polyamide resin, etc., or their modified resins, etc. Any aqueous polymer can be used. A curing agent may be used together with these binders. The thickness of the antistatic layer is preferably not less than 0.0001 μπι and not more than 3 am, more preferably not less than 0.001 μm and not more than 2.5 / im.

[adhesive]

The adhesive is not particularly limited, but the adhesive of the present invention is preferably a reactive hot melt adhesive. The reactive hot menoleto adhesive has a solid property at room temperature, is melted by heating, is bonded, and then cures itself.

In the present invention, if the IC card base is easily warped, the base material is subjected to heat shrinkage or the like due to force and high temperature bonding, and the dimensions and positional accuracy at the time of bonding are deteriorated. When bonding together, it is preferable that the bonding is performed at 80 ° C. or lower, more preferably 10 to 80 ° C., and further preferably 20 to 80 ° C. The reactive hot melt adhesive is excellent in such low-temperature bonding. As a reactive hot melt adhesive, a moisture-curable material is disclosed in JP-A-2000-036026, JP-A-2000-219855, JP-A-2000- 211278, and Japanese Patent Application No. 2000-369855. JP-A-10-316959, JP-A-11-5964 and the like are disclosed as photocurable adhesives. As an example of a reactive moisture-curing adhesive, there is an adhesive whose main component is a urethane polymer containing an isocyanate group at a molecular end, and the isocyanate group reacts with moisture to form a crosslinked structure.

Examples of reactive adhesives that can be used in the present invention include TE03◦ manufactured by Sumitomo 3LEM. PT / JP2004 / 018335

12

TE100, Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Pondmaster 170 Series manufactured by Kanebo Wenuss C, Macroplast QR 3460 manufactured by Henke 1, and ESDUINE 9631 manufactured by Sekisui Chemical Co., Ltd. It is preferable to use a moisture-curable adhesive having a free MDI content of 1.0% or less from the viewpoint of material safety. The viscosity of the adhesive of the present invention is preferably from 3000 to 20000 mPa · s at 120 ° C. If it is more than 20000 mPa * s, it is difficult to obtain smoothness during coating or pressing, and if it is less than 300 OmPas, the adhesive will protrude from the coating sheet during coating or pressing, When an IC module is placed, there are problems such as the IC module moving without being fixed.

The intensity can be measured by a usual method. When measuring with a BM type viscometer, the above range is obtained under the conditions of rotor No. 4 and rotation speed of 12 rpm. The thickness of the adhesive is preferably from 10 to 500 μπι, more preferably from 10 to 450 μm, in terms of the total thickness of the adhesive in the IC card.

Here is an example of a method for manufacturing an IC card using an adhesive. When manufacturing an IC card, an adhesive is first applied to the front and back sheets with an applicator to a predetermined thickness. As a coating method, a usual method such as a roller method, a T-die method, and a dice method is used. In the case of coating in the form of stripes according to the present invention, there is a method of intermittently providing an opening in the T-die slit, but the method is not limited to this. Further, as a method of making the surface of the adhesive of the present invention uneven, there is a method in which the surface of the adhesive applied by the above method is subjected to pressure treatment with an embossinda roll. Install the IC module between the upper and lower sheets coated with adhesive. Before mounting, the applied adhesive may be heated in advance by a heater or the like. Then, press the IC module mounted between the upper and lower sheets with a press heated to the bonding temperature of the adhesive for a predetermined time, or Alternatively, instead of rolling with a press, the sheet may be rolled while being conveyed in a constant temperature layer at a predetermined temperature. Also, vacuum pressing may be performed to prevent air bubbles from entering during bonding. After laminating with a press or the like, it is punched into a predetermined shape and cut into cards to make cards. When a reactive adhesive is used as the adhesive, it is cured for a predetermined time and then cut into cards.

[Sheet material for IC card substrate]

Examples of the sheet member used for the first and second sheet materials include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate Z-isophthalate copolymer, and polyolefin resins such as polyethylene, polypropylene, and polymethylpentene. , Polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylenetetrafluoroethylene, copolymers, etc.Polyfluoroethylene resins, polyamides such as nylon 6, nylon 66, polyvinyl chloride, Vinyl polymers such as vinyl chloride / vinyl acetate copolymer, ethylene / vinyl acetate copolymer, ethylene Z vinyl alcohol copolymer, polyvinyl alcohol, vinylon, etc., biodegradable aliphatic polyester, biodegradable polycarbonate, Biodegradable poly milk Biodegradable resins such as acid, biodegradable polyvinyl alcohol, biodegradable cellulose acetate, and biodegradable polycaprolactone; cellulosic resins such as cellulose triacetate and cellophane; polymethyl methacrylate, polyethyl methacrylate, polyataryl Acrylic resins such as ethyl, polybutyl acrylate, etc., synthetic resin sheets such as polystyrene, polycarbonate, polyarylate, polyimide, etc., or single-layer paper such as high-quality paper, thin paper, dalacin paper, parchment paper, etc. Or a laminate of two or more of these. The thickness of the support of the present invention is 30 to 300 μπι, preferably 50 to 200 m. In the present invention, the bonding process is reduced in view of shrinkage and warpage of the support due to heat. In addition to the heat treatment, the heat shrinkage of the sheet member at 150 ° C for 30 minutes is preferably 1.2% or less in the longitudinal (MD) and 0.5% or less in the transverse (TD).

[Method of manufacturing IC card]

As the IC card manufacturing method of the present invention, a heat bonding method, an adhesive bonding method, and an injection molding method are known, but they may be bonded by any method. Also, the two opposing first and second sheet materials may be subjected to format printing or information recording before or after laminating, and offset printing, gravure printing, silk printing, screen printing, intaglio printing It can be formed by any method such as letterpress printing, ink jet method, sublimation transfer method, Kameshi photographic method, and heat melting method.

The method of manufacturing an IC card according to the present invention includes a bonding and coating method as disclosed in JP-A-2000-036026, JP-A-2000-2198.55, JP-A-2000- 211278, JP-A-10-316959, and JP-A-11-15964. Is disclosed. Any laminating system, coating system, or the like can be used, and the present invention is not particularly limited. In the method of manufacturing an IC card according to the present invention, it is preferable to process at a low temperature. The temperature at which a predetermined IC module is bonded between two opposing first and second sheet materials is preferably 80 ° C or less, more preferably 0 to 80 ° C, and still more preferably 20 ° C or more. ° (: up to 80 ° C. In the production of the present invention, it is preferable to provide a cooling step after bonding to reduce the warpage of the first and second sheet materials. The cooling temperature is 70 ° C. The temperature is preferably 10 to 70 ° C., and more preferably 10 to 60 ° C. At the time of laminating, the surface smoothness of the base material of the first and second sheet materials, Heating and pressurizing are preferably performed to increase the adhesion between the two sheet materials and the IC module, and it is preferable to manufacture the upper and lower presses, a laminating method, a kyatabila method, and the like. Considering the crack of It is preferable to use a flat press type so as to avoid an opening which causes excessive bending force even with slight displacement close to line contact. Heating is preferably 10 to 120 ° C, more preferably 30 to 100 ° C. The pressure is preferably 0.1 to 300 kgf Zcm ² , and more preferably 0:! To 100 kgf / cm ^2. If the pressure is higher than this, the IC chip may be damaged. And the pressurization time is preferably 0.1 to 180 sec, more preferably 0.1 to 120 sec.If longer, the production efficiency is reduced.

After leaving the laminated sheet or continuous coated eramy roll formed as a continuous sheet by the adhesive laminating method or the resin injection method for a predetermined time corresponding to the predetermined curing time of the adhesive, the authentication identification image and the bibliographic information are recorded. After that, the card may be formed into a predetermined card size. As a method of forming into a predetermined card size, a punching method, a cutting method, and the like are mainly selected, and an IC card base material can be prepared.

[Example]

Hereinafter, the present invention will be described in detail with reference to examples, but embodiments of the present invention are not limited thereto. The evaluation in the examples was measured by the following method. Figure 6 shows the results of the evaluation.

The surface resistivity (Ω / port) at 23 ° C and 20% RH was measured at an applied voltage of 100 V with a super insulation resistance meter MODEL-VE-40 (manufactured by Kawaguchi Electric Industry Co., Ltd.). Damage to electronic components due to charging during manufacturing>

Electronic components were evaluated for damage before and after manufacturing by using R / M to evaluate communication.

A: Can communicate

B: Communication possible but unstable C: Communication not possible

Dust adhesion due to static electricity during manufacturing>

Adhesion of dust due to electrification at the time of production was judged by evaluating the printability on the IC card.

A: Good printing

B: The print part was slightly faint

C: The printed part was clearly faded

After drying polyethylene terephthalate with an intrinsic viscosity of 0.65 at 170 for 3 hours 2

It is melt extruded onto a rotating cooling drum maintained at 0 ° C to form an unstretched film.Then, the unstretched film is stretched 3.6 times in the machine axis direction. And applied. Continue stretching 3.9 times in the transverse direction at 105 ° C, then

Heat treatment was performed at 210 ° C. to obtain a 38 / m-thick double-sided biaxially stretched polyester film. One side is the A side and the other side is the B side.

• Coating liquid L (ion conductive polymer)

A mixture of sodium dodecyl diphenyl ether disulfonate and acryl-modified copolymerized polyester resin (Takamatsu Oil & Fats Co., Ltd. SH-416) was used to obtain a total solids content of 4 wt%, and sodium dodecyl diphenyl ether disulfonate Z-acrylic modified copolymer. An aqueous dispersion having a polymer polyester resin ratio of 10Z90 was prepared and applied at 2 g / m ² (wet).

Shin coating liquid M (colloidal metal oxide sol)

Silver-doped colloidal vanadium pentoxide (US Pat. No. 5,679,505) was dispersed in water together with an aqueous polyurethane dispersion (Daiichi Kogyo Seiyaku Co., Ltd., Superflex 300), and the total solid content was A 10 wt%, silver-doped colloidal pentaoxide / polyurethane / polyurethane aqueous dispersion was prepared at a weight ratio of 10/90, and 2 g / m ² (wet). Applied. ·

Coating liquid N (crystalline metal oxide)

An aqueous dispersion of antimony-doped tin oxide was mixed with an aqueous polyurethane dispersion (Daiichi Kogyo Seiyaku Co., Ltd., Superflex 300) to give a total solid content of 10 wt%, and an aqueous dispersion of antimony-doped tin oxide / polyurethane at a weight ratio of 65/35. Was prepared and applied at 2 g / m ² (wet).

• Paint O (conjugated conductive polymer)

'' Baytronp (registered trademark) (Bayer), which is a poly (3,4-ethylenedioxythiophene / polystyrene-snorrephonate), is added to an aqueous polyurethane dispersion (Daiichi Kogyo Seiyaku Co., Ltd., Superflexs 300). The mixture was mixed to prepare an aqueous dispersion having a total solid content of 2 wt% and a weight ratio of BaytronP (registered trademark) / polyurethane of 20/80.

² (wet) was applied.

Hata Paint P (Comparison: without antistatic agent)

An aqueous dispersion of a polyurethane aqueous dispersion having a solid content of 1% by weight (Daiichi Kogyo Seiyaku Co., Ltd., Superfretas 300) was applied at 2 g / m ² (wet).

An antenna pattern is formed by etching on the B surface of the module support prepared as described above, and an IC chip with a thickness of 70 ^ m and 4 x 4 mm square is joined, consisting of 3113304 with a thickness of 100 μχη, δ Χ 6111111 square. The reinforcing plate was bonded to obtain an IC module.

As is evident from the results shown in the table of FIG. 6, when the module support satisfies the surface resistivity of the present invention, no breakage of electronic components or blurring of printing occurs. On the other hand, if the surface resistivity exceeds the range of the present invention, the printed parts will be blurred due to the damage or unevenness of the electronic components. Creating an IC card>

Lumirror E 210 88 μm manufactured by Toray Industries, Inc. was used as the front and back support of the IC card.

(Creation of surface support),

A coating liquid for forming the first image-receiving layer, a coating liquid for forming the second image-receiving layer, and a coating liquid for forming the third image-receiving layer, having the following compositions, were applied in this order to the surface of the support 1888 μm that had been subjected to corona discharge treatment. After drying, the image receiving layer was formed by laminating each layer to have a thickness of 0.2 μum, 2.5 μπι, and 0.5 μπι. <Coating liquid for forming first image receiving layer>

Polybier Petilal resin

[Sekisui Chemical Co., Ltd .: Eslec BL-1] 9 parts Isocyanate [Nippon Polyurethane Industry Co., Ltd .: Coronate ΗΧ] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <For forming the second image receiving layer Coating liquid>

Polyvinyl butyral resin

[Sekisui Chemical Co., Ltd .: Esrec II-1] '6 parts Metal ion-containing compound (Compound MS) 4 parts Methylethynoleketone 80 parts Butyl acetate 10 parts

2 parts of polyethylene wax

[Toho Chemical Industry Co., Ltd .: Hitec E100]

8 parts of urethane-modified ethylenic allylic acid copolymer [Toho Chemical Industry Co., Ltd .: Hitec S 6254]

Methylcellulose [Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 parts Water 90 parts

(Format printing)

'Logo and OP varnish were sequentially printed by resin letterpress printing.

(Create backside support) (Create writing layer)

The coating liquid for forming the first writing layer, the coating liquid for forming the second writing layer, and the coating liquid for forming the third writing layer having the following composition were applied to the surface of the support backing sheet 188 / zm subjected to the corona discharge treatment. The writing layer was formed by sequentially applying and drying the layers and laminating them so that the respective thicknesses became 5 / ^ 1-1-1, 15 im, 0.2 / m. <Coating liquid for forming first writing layer>

Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]

Carbon black Trace amount of titanium dioxide particles [CR80, manufactured by Ishihara Sangyo Co., Ltd.] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming the second writing layer>

4 parts of polyester resin [Toyobo Co., Ltd .: Vironal MD 1200]

Silica 5 parts Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Coating liquid for forming the third writing layer>

Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sunmide 55] 5 parts Methanol 95 5 parts Preparation of base material for IC card>

The IC card manufacturing apparatus shown in FIG. 4 was used, and a back support and a front support were used as the first sheet material and the second sheet material. FIG. 4 is an enlarged view of an IC card manufacturing apparatus. Subsequently, an IC card manufacturing apparatus as an embodiment will be described.

In this IC card manufacturing apparatus, a first sheet material (table sheet) having a long sheet shape and a thickness of 188 / z rn is arranged in a first sheet member supply section 、, and a single sheet material is provided. A second sheet material (back sheet) 3 having a thickness of 188 m is provided in the second sheet member supply section B. The second sheet member supply unit B conveys the second sheet material 3 by sand grip conveyance, and conveys it to the second sheet conveyance member C. The second sheet conveying member C sends the second sheet material 3 to the pressure heating unit D.

When the second sheet conveying member C is conveyed, the adhesive is supplied from the adhesive supplying section E to the second sheet material 3, and the IC module 9 shown in FIG. Place it on sheet material 3.

The first sheet material 2 is supplied with an adhesive from an adhesive supply section G, and the first sheet material 2 is sent to a pressure heating section D.

In the pressure heating section D, the IC card material is sandwiched between the first sheet material 2 and the second sheet material 3 by a heating or pressure roll (pressure 3 kg / cm ² ), An IC card base material is created.

The IC card base material is controlled to a predetermined film thickness by the film thickness control section H, and the adhesive is cooled by the IC card base material cooling member I to be cured and sufficiently adhered to the support. From It is preferable to trim the makeup. With the prepared IC card base material, a 55 mm X 85 mm size IC card base material could be obtained with a rotary cutter.

Each of the first sheet member 2 and the second sheet material 3 is coated with a reactive hot-melt adhesive layer IJS 1 to S3 as shown below to a thickness of 16 2 m ', respectively. The IC module was inserted between the front and back supports with the agent, and laminated at 65 ° C for 1 minute. The thickness of the IC card base material thus produced was 760 μιη. After the preparation, it was stored for 10 days in an environment of 25 ° C. and 55% RH, and punched by a 55 mm × 85 mm size card-shaped punching die apparatus.

Adhesive S1: Sekisui Chemical Co., Ltd.

Esdine 9 6 3 1 S 1 20 ° C melt viscosity 460 OmPas adhesive S 2: Sekisui Chemical Co., Ltd.

Esdine 96 1 1 1 20 ° C Melt viscosity 1 900 OmPas adhesive S 3: Sekisui Chemical Co., Ltd.

Esdine 96 1 3A 1 20 ° C Melt viscosity 2500 OmP a · s Method for describing personal information on personal authentication card and surface protection method>

A personal identification card was prepared by providing a face image, attribute information, and format printing on the IC card that had been subjected to the punching process as described below.

(Preparation of ink sheet for sublimation type thermal transfer recording)

The following coating liquid for forming a yellow ink layer, coating liquid for forming a magenta ink layer, and coating liquid for forming a cyan ink layer are formed on a polyethylene terephthalate sheet having a thickness of 6 w'm which has been subjected to a fusion preventing process on the back surface. Were provided so that the thickness of each was 1 μιη, and ink sheets of three colors, yellow, magenta, and cyan were obtained.

<Coating liquid for forming yellow ink layer> Yellow dye (compound Y_l)

Polybulacetal 5 [manufactured by Denki Kagaku Kogyo Co., Ltd .: Dencaptiral ΚΥ—24]

Polymethyl methacrylate-modified polystyrene

[Toa Gosei Chemical Industry Co., Ltd .: Rededa G II-200]

Urethane-modified silicon oil 0. [Dainichi Seika Industry Co., Ltd .: DIALOMAR SP-2105]

Methyl ethyl ketone 7 Toluene 2 <Magenta ink layer forming coating liquid>

Magenta dye (Compound II-1)

Polyvinyl / Rare Setanol 5 · [Dencaptiral ΚΥ-24 manufactured by Denki Kagaku Kogyo Co., Ltd.]

Polymethyl methacrylate modified polystyrene

[Toa Gosei Chemical Industry Co., Ltd .: Rededa G II-200]

Urethane-modified silicone oil 0 [Dainichi Seika Kogyo Co., Ltd .: DIALOMAR SP-2105]

Met / Reetizole ketone 7. Tonolen 2 <Cyan ink layer forming coating liquid>

Cyan dye (Compound C-1) 1. Cyan dye (Compound C-1) 1. Polyvinyl acetal 5. [Electrical Chemical Industry Co., Ltd .: Denka Butyral KY

Polymethyl methacrylate modified polystyrene

[Toa Gosei Chemical Industry Co., Ltd .: Rededa GP—200]

0.5 parts of urethane-modified silicon oil

[Dainichi Seika Kogyo Co., Ltd .: DIALOMAR SP—210]

Methynorethenoketone 70 parts Toluene 20 parts

(Preparation of ink sheet for melt-type thermal transfer recording)

An ink sheet was obtained by applying a coating liquid for forming an ink layer having the following composition to a 6 / m-thick polyethylene terephthalate sheet that had been subjected to a fusion preventing treatment on the back surface so as to have a thickness of 2 / xm and dried.

Carnauba wax 1 part Ethylene acetic acid vinyl copolymer 1 part [Mitsui DuPont Chemical: EV 40 Y]

Carbon black 3 parts Fuunol resin [Arakawa Chemical Industry Co., Ltd .: Tamanol 5 2 1] 5 parts Methynorethinole ketone 90 parts

(Formation of face image)

The ink receiving layer and the ink side of the sublimation type thermal transfer recording ink sheet are overlapped, and the output from the ink sheet side is 0.23 W / dot, pulse width 0.3 to 4.5 msec, dot By heating under the condition of a density of 16 dots / mm, a human image with gradation was formed on the image receiving layer. In this image, the dye and the image receiving layer Nickel forms a complex.

(Formation of character information)

The OP varnish part and the ink 'side of the ink sheet for melt-type thermal transfer recording are overlapped, and the output from the ink sheet side using a thermal head is 0.5 WZ dot, pulse width 1.0 msec, dot density 16 dots / mm The character information was formed on the 〇 P gas by heating with.

[Surface protection method]

(Method of forming surface protective layer)

Of actinic ray-curable transfer foil 1>

An actinic ray-curable transfer foil 1 was prepared by laminating the following composition on a 25 im-thick polyethylene terephthalate film release layer provided with a 0.1 im fluororesin release layer.

(Actinic ray curable compound)

A—9300 manufactured by Shin-Nakamura Chemical Co., Ltd./Manufactured by Shin-Nakamura Chemical Co., Ltd.

EA-1020 = 35/1 1.75 parts initiator

Irgacure 184 Japan

Additives Unsaturated group-containing resin 48 parts Other additives

Dainippon Ink Surfactant F-179 0.25 咅 B

<Intermediate layer forming coating liquid> Film thickness 1.0 m

Polyvinyl butyral resin

[Sekisui Chemical Co., Ltd .: Esrec BX-1] 3.5 parts Tuftex M- (Asahi Kasei) 5 parts curing agent

Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 咅 90 parts of methinoreeth / leketone After application, the curing agent was cured at 50 ° C for 24 hours.

<Adhesive layer forming coating liquid> Thickness 0.δ μιη.

Urethane-modified ethylene ethyl acrylate copolymer

[Toho Chemical Industry Co., Ltd .: Hitec S6254-II] 8 parts Polyatarylate copolymer

[Manufactured by Nippon Junyaku Co., Ltd .: Jurimar AT510] 2 parts Water 45 parts Etanol / Le 45 parts Further, an actinic ray-curable transfer foil 1 having the above-mentioned configuration is formed on the image receiving body on which images and characters are recorded Using a heat roller heated to a surface temperature of 200 ° C. and having a rubber hardness of 85 with a diameter of 5 cm, heat was applied at a pressure of 150 kg / cm ² for 1.2 seconds to perform transfer. Industrial applicability

An IC module having an antenna and an IC chip is supported by a module support. An IC module is sandwiched between two opposing first and second sheet materials and integrated with an adhesive to form an integrated circuit. The present invention can be applied to an IC card and an IC card manufacturing method capable of preventing damage to electronic components due to electrification, preventing dust from being mixed during manufacturing, and obtaining an IC card having good surface irregularities.

In addition, since the antistatic layer is applied simultaneously with the step of forming the module support, Not only does production efficiency increase, but also the adhesion of the antistatic layer to the module support becomes stronger. ,

Furthermore, since the surface resistivity of at least one side of the module support is 1 E + 11 Ω / port or less at 23 ° C and 20% RH, it can be used in low humidity conditions where static electricity and dust adhesion due to electrification are a problem. In addition, the effects of the present invention can be further exerted, and electronic components can be prevented from being damaged due to electrification at the time of manufacturing, dust can be prevented from being mixed at the time of manufacturing, and an IC card having good surface unevenness can be obtained. .

Further, the viscosity of the adhesive is 3000 to 20000 mPa's at 120 ° C, and if it is larger than 20000 mPa.s, it is difficult to obtain smoothness at the time of coating or pressing, and the viscosity is higher than 300 OmPa · s. If it is too small, it will prevent problems such as the adhesive sticking out of the coated sheet during coating and pressing, and the IC module moving without being fixed when the IC module is placed on the adhesive. Can be.

Claims

The scope of the claims

1. An IC card in which an IC module having an antenna and an IC chip is supported by a module support, and the IC module is sandwiched between a first sheet material and a second sheet material facing each other and integrated with an adhesive. At

An IC card having an antistatic layer on at least one surface of the module support.

2. The antistatic layer,

The IC according to claim 1, comprising at least one of an ion conductive polymer, a colloidal metal oxide sol, a crystalline metal oxide particle, and a shared conductive polymer. card.

3. The antistatic layer,

2. The IC card according to claim 1, wherein the IC card is applied simultaneously with the step of forming a film of the module support.

4. The IC head according to claim 1, wherein the surface resistivity of at least one side of the module support is 1 E + 11 Ω / port at 23 ° C. and 20% RH. .

5. The viscosity of the adhesive is 120. 2. The IC card according to claim 1, wherein the pressure is 3000 to 20000 mPa · s.

6. The adhesive is

2. The IC card according to claim 1, wherein the IC card is a reactive hot melt adhesive.

7. An IC module having an antenna and an IC chip is a single-wafer shape supported by a module support, and the IC module is sandwiched between a first sheet material and a second sheet material facing each other by an adhesive. A method for manufacturing an IC card, wherein the method for manufacturing a C card comprises an antistatic layer on at least one surface of the module support.

8. The antistatic layer is

The IC card according to claim 7, comprising at least one of an ion conductive polymer, a colloidal metal oxide sol, a crystalline metal oxide particle, and a conjugating conductive polymer. Production method.

9. The antistatic layer is

The method for producing an IC card according to claim 7, wherein the IC card is applied simultaneously with the step of forming a film of the module support.

·

10. The IC card according to claim 7, wherein the surface resistivity of at least one surface of the module support is not more than 1E + 11ΩΩ at 23 ° C. and 20% RH. Manufacturing method.

11. The method for producing an IC card according to claim 7, wherein the viscosity of the adhesive is 3000 to 20000 mPa · s at 120 ° C.

12. The adhesive is

8. The method for producing an IC card according to claim 7, which is a reactive hot melt adhesive.