WO2005057484A1 - Carte a circuit integre et procede de fabrication d'une carte a circuit integre - Google Patents

Carte a circuit integre et procede de fabrication d'une carte a circuit integre Download PDF

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Publication number
WO2005057484A1
WO2005057484A1 PCT/JP2004/018335 JP2004018335W WO2005057484A1 WO 2005057484 A1 WO2005057484 A1 WO 2005057484A1 JP 2004018335 W JP2004018335 W JP 2004018335W WO 2005057484 A1 WO2005057484 A1 WO 2005057484A1
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WO
WIPO (PCT)
Prior art keywords
card
adhesive
module
module support
antistatic layer
Prior art date
Application number
PCT/JP2004/018335
Other languages
English (en)
Japanese (ja)
Inventor
Mineko Ito
Original Assignee
Konica Minolta Photo Imaging, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Photo Imaging, Inc. filed Critical Konica Minolta Photo Imaging, Inc.
Publication of WO2005057484A1 publication Critical patent/WO2005057484A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07735—Physical layout of the record carrier the record carrier comprising means for protecting against electrostatic discharge
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Definitions

  • the present invention relates to an IC card having a built-in IC module and a method of manufacturing an IC card.
  • the IC card reads and writes data from and to external devices via electrical contacts provided on the surface and loop antennas inside the card.
  • the Ic card has a large storage capacity and greatly improved security compared to a magnetic card.
  • non-contact type IC cards that have an internal antenna for exchanging information between the IC chip and the outside inside the card and do not have electrical contacts outside the card are compared with contact type IC cards that have electrical contacts on the card surface. It is being used for applications requiring high data confidentiality and anti-counterfeiting like ID cards.
  • an IC card for example, a first sheet material and a second sheet material are bonded with an adhesive. And an IC module having an IC chip and an antenna in the adhesive layer (see, for example, Japanese Patent Application Laid-Open No. 2002-72498). It is preferable to use a low-temperature adhesive from the viewpoint of the transportability of the first sheet material and the second sheet material, the transportability of the IC card due to heat shrinkage, warpage, and the like. IC chip breakage has become a major issue due to the electrification that occurs in the IC.
  • the present invention can prevent an electronic component from being damaged by electrification at the time of manufacturing, which is a conventional problem, and can prevent dust from being mixed at the time of manufacturing, and can obtain an IC card having good surface unevenness. It aims to provide IC cards and IC card manufacturing methods.
  • one embodiment of the present invention provides an IC module having an antenna and an IC chip supported by a module support, and two first sheet members opposing the IC module.
  • An IC card integrated with an adhesive sandwiched between a sheet material and a second sheet material, wherein the IC card has an antistatic layer on at least one surface of the module support.
  • the antistatic layer is characterized by comprising at least one of an ionic conductive polymer, a colloidal metal oxide sol, a crystalline metal oxide particle, and a conjugated conductive polymer.
  • the surface specific resistance of at least one surface of the module support is not more than 1 E + 11 ⁇ at 23 ° C. and 20% RH.
  • the viscosity of the adhesive is 120.
  • the IC card according to any one of the above (1) to (4), wherein the adhesive is a reactive hot melt adhesive.
  • one embodiment of the present invention is a sheet-like shape in which an IC module having an antenna and an IC chip is supported by a module support, and the IC module is provided with two first sheet members facing each other.
  • a method for manufacturing an IC card wherein the IC card is sandwiched between second sheet materials and integrated with an adhesive, comprising an antistatic layer on at least one surface of the module support.
  • the antistatic layer comprises at least one of an ion conductive polymer, a colloidal metal oxide sol, a crystalline metal oxide particle, and a conjugated conductive polymer.
  • the antistatic layer comprises a step of forming a film of the module support.
  • the surface specific resistance of at least one side of the module support is 1 E + 11 ⁇ or less at 23 ° C. and 20% RH, and A method for manufacturing the IC card according to any one of the above.
  • the IC according to any of (7) to (10), wherein the viscosity of the adhesive is 3000 to 2000 OmPas at 120 ° C. This is a method for manufacturing a card.
  • FIG. 1 is an exploded perspective view of an IC card according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the IC card according to the embodiment of the present invention.
  • FIG. 3 is a plan view of the IC card according to the embodiment of the present invention.
  • FIG. 4 is an enlarged view of a manufacturing apparatus for performing the method for manufacturing an IC card according to the embodiment of the present invention.
  • FIG. 5 is a diagram showing an IC module in an IC card according to the embodiment of the present invention.
  • FIG. 6 shows the results of the evaluation. BEST MODE FOR CARRYING OUT THE INVENTION
  • an embodiment of an IC card and a method of manufacturing an IC card according to the present invention will be described.
  • the present invention is not limited to this embodiment.
  • the embodiments of the present invention show the most preferable embodiments of the present invention, and the terms of the present invention are not limited to these.
  • FIG. 1 is an exploded perspective view of the IC card
  • FIG. 2 is a sectional view of the IC card
  • FIG. 3 is a plan view of the IC card.
  • the thickness of the IC card 1 of this embodiment is specified to be 0.76 mm according to the ISO standard.
  • the IC card 1 includes first and second sheet materials 2 and 3 which are two sheet materials, and adhesives 4 and 5 interposed between the first and second sheet materials 2 and 3. .
  • An image receiving layer 60 is provided on the surface of the first sheet material 2 on which the adhesive 4 is not interposed, and a writing layer is provided on the surface of the second sheet material 3 on which the adhesive 5 is not interposed. 6 1 is formed.
  • An example of the image receiving layer 60 is a layer formed of a material that traps and fixes the dye when the sublimation dye ink is heated by TPH (thermal head) and thermally diffuses.
  • 60 is provided with personal identification information 62.
  • personal identification information 62 For example, in the case of an employee certification card, the character "name”, the character "issue date”, and the image of "face photo” are provided. Information.
  • This image receiving layer 60 is protected by the transparent protective layer 63.
  • the writing layer 61 ′ can be formed, for example, by coating a polyester resin or the like with a white pigment such as silica dispersed therein.
  • An IC module 9 is enclosed in the adhesives 4 and 5, and the IC module 9 includes an antenna 7 and an IC chip 6.
  • the IC module 9 has a single-wafer shape supported by a module support 8.
  • the module support 8 has an antistatic layer 11 on at least one surface.
  • the module support 8 having the antistatic layer 11 has a surface resistivity of at least one side of not more than 1 E + 11 ⁇ / port at 23 ° C and 20% RH. Is preferred.
  • the IC module includes an IC chip for electrically storing information of a user of the IC card, and a coil-shaped antenna connected to the IC chip.
  • the IC chip is a memory only or a microcomputer in addition to the memory, and may include a capacitor in some cases.
  • the IC module has an antenna coil.
  • any method such as conductive paste printing, copper foil etching, or wire welding may be used.
  • the bonding between the IC chip and the antenna pattern is made of conductive adhesives such as silver paste, copper paste, carbon paste, etc.
  • a method using a film e.g., asolum manufactured by Hitachi Chemical Co., Ltd.
  • a method of performing solder bonding or ACF bonding is known, but any method may be used. It is also preferable to have a reinforcing plate near the IC chip in order to improve the point pressure strength of the IC chip.
  • the IC module has a single-wafer shape supported by a module support, and the module support is not particularly limited.
  • the module support is not particularly limited.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PET-G at least ethylene Modified polyester resin obtained by polymerizing three components of glycol, terephthalic acid and 1,4-six-hexane dimethanol
  • PBT polybutylene terephthalate
  • PC polycarbonate
  • P 1 poly
  • the IC chip can be kept in a good state by suppressing the charging and regenerating.
  • the thickness of the module support is preferably from 10 to 100 ⁇ m, and more preferably from 20 to 60. Further, the total thickness of the IC module is preferably from 100 to 500 / m, more preferably from 150 to 450 zm.
  • the module support of the IC module has an antistatic layer on at least one side, and the antistatic layer contains a conductive material called an antistatic agent or a conductive material (hereinafter referred to as an antistatic agent).
  • the antistatic agent is not particularly limited, but preferably contains at least one of an ionic conductive polymer, a colloidal metal oxide sol, a crystalline metal oxide particle, and a conjugated conductive polymer.
  • the ionic conductive polymer is not particularly limited, and may be any of anionic, cationic, amphoteric and nonionic. Among them, anionic and cationic are preferred. More preferred are sulfonic acid-based and carboxylic acid-based polymers or latex-based quaternary ammonium-based polymers or latexes for anionic properties. These ionic conductive monopolymers are described, for example, in the anionic polymer or latex described in JP-B-52-25251, JP-A-51-29923 and JP-B-60-48024. No. 7- 1 8 1 76, No. 5 7- 5 6 05 9, No. 58- 568 Five
  • Colloidal metal oxide sols include, for example, an amorphous stannic acid sol as disclosed in JP-B-35-6616, and an amorphous vanadium pentoxide described in JP-A-55-5982. And alumina sol having an electrolyte as disclosed in JP-B-57-12979.
  • a substance containing a small amount of a hetero atom forming a donor with respect to a metal oxide generally has high conductivity and is preferred.
  • the addition of such I n, 1 ⁇ 0 for a 2 ⁇ 1), the addition of such T a, for the S N_ ⁇ 2 Addition of Sb, Nb, halogen element, etc. is effective.
  • the addition amount of these hetero atoms is preferably in the range of 0.01 mol% to 30 mol%, more preferably 0.1 mol% to 1 mol%.
  • a method of coating the surface of the inorganic or organic filler with these crystalline oxides can also be preferably used.
  • a conjugated conductive polymer is a conjugated polymer with a molecular skeleton consisting of a conjugated system in which a double bond or triple bond that connects a carbon atom to a carbon atom or a heteroatom is alternately long with a single bond.
  • conjugated polymers include: 1) aliphatic conjugated polymers: polymers in which carbon-carbon conjugated systems such as polyacetylene are continuously extended; 2) aromatic co-polymers: aromatic carbonized materials such as poly (paraphenylene). 3) Heterocyclic conjugated polymer: polypyrrole, polythiophene, polyisothia 4018335
  • 1) aliphatic conjugated systems, 3) heterocyclic conjugated systems, and 4) heteroatom-containing conjugated systems can be particularly preferably used. Specific examples thereof include polyacetylene and derivatives thereof, polypyrrole and derivatives thereof.
  • Polythiophene and its derivatives, polyisothianaphthene and its derivatives, polyaniline and its derivatives can be mentioned, but the present invention is not limited to these.
  • a conjugated conductive polymer expresses excellent conductivity by doping with a dopant.
  • the dopant used in the present invention is not particularly limited, and examples thereof include the following.
  • Halogen molecule e.g., C l 2, B r 2 , I 2, IC 1 2, IC 13, IB r, IF , etc.
  • Lewis acids e.g., PF 5, As F 5, S b F 5, BF 3, BC 1 3, BB, etc.
  • the method of doping the dopant is not particularly limited, but a method of polymerizing a conjugated conductive polymer in the presence of the dopant is generally used.
  • the antistatic layer is applied simultaneously with the step of forming a module support of the IC module.
  • “coating at the same time as the film forming step of the module support” means that the antistatic layer is coated before winding once in the film forming step of the module support.
  • a coating liquid for forming an antistatic layer is applied to the polyester film before the completion of the oriented crystallization, and then stretched and heat-treated in at least one direction. Coating the antistatic layer at the same time as the film forming process of the module support of the IC module not only increases the production efficiency but also strengthens the adhesion of the antistatic layer to the module support.
  • the module support having an antistatic layer preferably has a surface specific resistance of at least one side of not more than 1E + 11 ⁇ at 23 ° C20% RH, more preferably 1E at 23 ° C20% RH. + 10 ⁇ or less.
  • the antistatic layer may contain a binder.
  • the binder is not particularly limited, and can be selected according to the adhesiveness to the module support, the physical properties of the antistatic layer, and the like.
  • an aqueous polymer is preferred.
  • a curing agent may be used together with these binders.
  • the thickness of the antistatic layer is preferably not less than 0.0001 ⁇ and not more than 3 am, more preferably not less than 0.001 ⁇ m and not more than 2.5 / im.
  • the adhesive is not particularly limited, but the adhesive of the present invention is preferably a reactive hot melt adhesive.
  • the reactive hot menoleto adhesive has a solid property at room temperature, is melted by heating, is bonded, and then cures itself.
  • the bonding is performed at 80 ° C. or lower, more preferably 10 to 80 ° C., and further preferably 20 to 80 ° C.
  • the reactive hot melt adhesive is excellent in such low-temperature bonding.
  • a reactive hot melt adhesive a moisture-curable material is disclosed in JP-A-2000-036026, JP-A-2000-219855, JP-A-2000- 211278, and Japanese Patent Application No. 2000-369855.
  • JP-A-10-316959, JP-A-11-5964 and the like are disclosed as photocurable adhesives.
  • a reactive moisture-curing adhesive there is an adhesive whose main component is a urethane polymer containing an isocyanate group at a molecular end, and the isocyanate group reacts with moisture to form a crosslinked structure.
  • Examples of reactive adhesives that can be used in the present invention include TE03 ⁇ manufactured by Sumitomo 3LEM. PT / JP2004 / 018335
  • the viscosity of the adhesive of the present invention is preferably from 3000 to 20000 mPa ⁇ s at 120 ° C.
  • the intensity can be measured by a usual method. When measuring with a BM type viscometer, the above range is obtained under the conditions of rotor No. 4 and rotation speed of 12 rpm.
  • the thickness of the adhesive is preferably from 10 to 500 ⁇ , more preferably from 10 to 450 ⁇ m, in terms of the total thickness of the adhesive in the IC card.
  • an adhesive is first applied to the front and back sheets with an applicator to a predetermined thickness.
  • a coating method a usual method such as a roller method, a T-die method, and a dice method is used.
  • a method of intermittently providing an opening in the T-die slit but the method is not limited to this.
  • a method of making the surface of the adhesive of the present invention uneven there is a method in which the surface of the adhesive applied by the above method is subjected to pressure treatment with an embossinda roll.
  • the applied adhesive Before mounting, the applied adhesive may be heated in advance by a heater or the like. Then, press the IC module mounted between the upper and lower sheets with a press heated to the bonding temperature of the adhesive for a predetermined time, or Alternatively, instead of rolling with a press, the sheet may be rolled while being conveyed in a constant temperature layer at a predetermined temperature. Also, vacuum pressing may be performed to prevent air bubbles from entering during bonding. After laminating with a press or the like, it is punched into a predetermined shape and cut into cards to make cards. When a reactive adhesive is used as the adhesive, it is cured for a predetermined time and then cut into cards.
  • polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate Z-isophthalate copolymer, and polyolefin resins such as polyethylene, polypropylene, and polymethylpentene.
  • the thickness of the support of the present invention is 30 to 300 ⁇ , preferably 50 to 200 m.
  • the bonding process is reduced in view of shrinkage and warpage of the support due to heat.
  • the heat shrinkage of the sheet member at 150 ° C for 30 minutes is preferably 1.2% or less in the longitudinal (MD) and 0.5% or less in the transverse (TD).
  • a heat bonding method, an adhesive bonding method, and an injection molding method are known, but they may be bonded by any method.
  • the two opposing first and second sheet materials may be subjected to format printing or information recording before or after laminating, and offset printing, gravure printing, silk printing, screen printing, intaglio printing It can be formed by any method such as letterpress printing, ink jet method, sublimation transfer method, Kameshi photographic method, and heat melting method.
  • the method of manufacturing an IC card according to the present invention includes a bonding and coating method as disclosed in JP-A-2000-036026, JP-A-2000-2198.55, JP-A-2000- 211278, JP-A-10-316959, and JP-A-11-15964. Is disclosed. Any laminating system, coating system, or the like can be used, and the present invention is not particularly limited. In the method of manufacturing an IC card according to the present invention, it is preferable to process at a low temperature.
  • the temperature at which a predetermined IC module is bonded between two opposing first and second sheet materials is preferably 80 ° C or less, more preferably 0 to 80 ° C, and still more preferably 20 ° C or more.
  • the cooling temperature is 70 ° C.
  • the temperature is preferably 10 to 70 ° C., and more preferably 10 to 60 ° C.
  • the surface smoothness of the base material of the first and second sheet materials, Heating and pressurizing are preferably performed to increase the adhesion between the two sheet materials and the IC module, and it is preferable to manufacture the upper and lower presses, a laminating method, a kyatumble method, and the like.
  • Heating is preferably 10 to 120 ° C, more preferably 30 to 100 ° C.
  • the pressure is preferably 0.1 to 300 kgf Zcm 2 , and more preferably 0:! To 100 kgf / cm 2. If the pressure is higher than this, the IC chip may be damaged.
  • the pressurization time is preferably 0.1 to 180 sec, more preferably 0.1 to 120 sec.If longer, the production efficiency is reduced.
  • the card After leaving the laminated sheet or continuous coated eramy roll formed as a continuous sheet by the adhesive laminating method or the resin injection method for a predetermined time corresponding to the predetermined curing time of the adhesive, the authentication identification image and the bibliographic information are recorded. After that, the card may be formed into a predetermined card size. As a method of forming into a predetermined card size, a punching method, a cutting method, and the like are mainly selected, and an IC card base material can be prepared.
  • the surface resistivity ( ⁇ / port) at 23 ° C and 20% RH was measured at an applied voltage of 100 V with a super insulation resistance meter MODEL-VE-40 (manufactured by Kawaguchi Electric Industry Co., Ltd.). Damage to electronic components due to charging during manufacturing>
  • Adhesion of dust due to electrification at the time of production was judged by evaluating the printability on the IC card.
  • Heat treatment was performed at 210 ° C. to obtain a 38 / m-thick double-sided biaxially stretched polyester film. One side is the A side and the other side is the B side.
  • a mixture of sodium dodecyl diphenyl ether disulfonate and acryl-modified copolymerized polyester resin (Takamatsu Oil & Fats Co., Ltd. SH-416) was used to obtain a total solids content of 4 wt%, and sodium dodecyl diphenyl ether disulfonate Z-acrylic modified copolymer.
  • An aqueous dispersion having a polymer polyester resin ratio of 10Z90 was prepared and applied at 2 g / m 2 (wet).
  • Silver-doped colloidal vanadium pentoxide (US Pat. No. 5,679,505) was dispersed in water together with an aqueous polyurethane dispersion (Daiichi Kogyo Seiyaku Co., Ltd., Superflex 300), and the total solid content was A 10 wt%, silver-doped colloidal pentaoxide / polyurethane / polyurethane aqueous dispersion was prepared at a weight ratio of 10/90, and 2 g / m 2 (wet). Applied. ⁇
  • An aqueous dispersion of antimony-doped tin oxide was mixed with an aqueous polyurethane dispersion (Daiichi Kogyo Seiyaku Co., Ltd., Superflex 300) to give a total solid content of 10 wt%, and an aqueous dispersion of antimony-doped tin oxide / polyurethane at a weight ratio of 65/35.
  • aqueous dispersion of antimony-doped tin oxide / polyurethane was prepared and applied at 2 g / m 2 (wet).
  • Baytronp registered trademark
  • Bayer which is a poly (3,4-ethylenedioxythiophene / polystyrene-snorrephonate)
  • aqueous polyurethane dispersion (Daiichi Kogyo Seiyaku Co., Ltd., Superflexs 300).
  • the mixture was mixed to prepare an aqueous dispersion having a total solid content of 2 wt% and a weight ratio of BaytronP (registered trademark) / polyurethane of 20/80.
  • aqueous dispersion of a polyurethane aqueous dispersion having a solid content of 1% by weight was applied at 2 g / m 2 (wet).
  • An antenna pattern is formed by etching on the B surface of the module support prepared as described above, and an IC chip with a thickness of 70 ⁇ m and 4 x 4 mm square is joined, consisting of 3113304 with a thickness of 100 ⁇ , ⁇ ⁇ 6111111 square.
  • the reinforcing plate was bonded to obtain an IC module.
  • Lumirror E 210 88 ⁇ m manufactured by Toray Industries, Inc. was used as the front and back support of the IC card.
  • a coating liquid for forming the first image-receiving layer, a coating liquid for forming the second image-receiving layer, and a coating liquid for forming the third image-receiving layer, having the following compositions, were applied in this order to the surface of the support 1888 ⁇ m that had been subjected to corona discharge treatment. After drying, the image receiving layer was formed by laminating each layer to have a thickness of 0.2 ⁇ um, 2.5 ⁇ , and 0.5 ⁇ . ⁇ Coating liquid for forming first image receiving layer>
  • the coating liquid for forming the first writing layer, the coating liquid for forming the second writing layer, and the coating liquid for forming the third writing layer having the following composition were applied to the surface of the support backing sheet 188 / zm subjected to the corona discharge treatment.
  • the writing layer was formed by sequentially applying and drying the layers and laminating them so that the respective thicknesses became 5 / ⁇ 1-1-1, 15 im, 0.2 / m. ⁇ Coating liquid for forming first writing layer>
  • Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
  • Carbon black Trace amount of titanium dioxide particles [CR80, manufactured by Ishihara Sangyo Co., Ltd.] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts ⁇ Coating liquid for forming the second writing layer>
  • polyester resin [Toyobo Co., Ltd .: Vironal MD 1200]
  • FIG. 4 is an enlarged view of an IC card manufacturing apparatus. Subsequently, an IC card manufacturing apparatus as an embodiment will be described.
  • a first sheet material (table sheet) having a long sheet shape and a thickness of 188 / z rn is arranged in a first sheet member supply section ⁇ , and a single sheet material is provided.
  • a second sheet material (back sheet) 3 having a thickness of 188 m is provided in the second sheet member supply section B.
  • the second sheet member supply unit B conveys the second sheet material 3 by sand grip conveyance, and conveys it to the second sheet conveyance member C.
  • the second sheet conveying member C sends the second sheet material 3 to the pressure heating unit D.
  • the adhesive is supplied from the adhesive supplying section E to the second sheet material 3, and the IC module 9 shown in FIG. Place it on sheet material 3.
  • the first sheet material 2 is supplied with an adhesive from an adhesive supply section G, and the first sheet material 2 is sent to a pressure heating section D.
  • the IC card material is sandwiched between the first sheet material 2 and the second sheet material 3 by a heating or pressure roll (pressure 3 kg / cm 2 ), An IC card base material is created.
  • the IC card base material is controlled to a predetermined film thickness by the film thickness control section H, and the adhesive is cooled by the IC card base material cooling member I to be cured and sufficiently adhered to the support. From It is preferable to trim the makeup. With the prepared IC card base material, a 55 mm X 85 mm size IC card base material could be obtained with a rotary cutter.
  • Each of the first sheet member 2 and the second sheet material 3 is coated with a reactive hot-melt adhesive layer IJS 1 to S3 as shown below to a thickness of 16 2 m ', respectively.
  • the IC module was inserted between the front and back supports with the agent, and laminated at 65 ° C for 1 minute.
  • the thickness of the IC card base material thus produced was 760 ⁇ . After the preparation, it was stored for 10 days in an environment of 25 ° C. and 55% RH, and punched by a 55 mm ⁇ 85 mm size card-shaped punching die apparatus.
  • Adhesive S1 Sekisui Chemical Co., Ltd.
  • a personal identification card was prepared by providing a face image, attribute information, and format printing on the IC card that had been subjected to the punching process as described below.
  • the following coating liquid for forming a yellow ink layer, coating liquid for forming a magenta ink layer, and coating liquid for forming a cyan ink layer are formed on a polyethylene terephthalate sheet having a thickness of 6 w'm which has been subjected to a fusion preventing process on the back surface. Were provided so that the thickness of each was 1 ⁇ , and ink sheets of three colors, yellow, magenta, and cyan were obtained.
  • Cyan dye (Compound C-1) 1. Cyan dye (Compound C-1) 1. Polyvinyl acetal 5. [Electrical Chemical Industry Co., Ltd .: Denka Butyral KY
  • Methynorethenoketone 70 parts Toluene 20 parts
  • An ink sheet was obtained by applying a coating liquid for forming an ink layer having the following composition to a 6 / m-thick polyethylene terephthalate sheet that had been subjected to a fusion preventing treatment on the back surface so as to have a thickness of 2 / xm and dried.
  • the ink receiving layer and the ink side of the sublimation type thermal transfer recording ink sheet are overlapped, and the output from the ink sheet side is 0.23 W / dot, pulse width 0.3 to 4.5 msec, dot
  • the output from the ink sheet side is 0.23 W / dot, pulse width 0.3 to 4.5 msec, dot
  • the OP varnish part and the ink 'side of the ink sheet for melt-type thermal transfer recording are overlapped, and the output from the ink sheet side using a thermal head is 0.5 WZ dot, pulse width 1.0 msec, dot density 16 dots / mm
  • the character information was formed on the ⁇ P gas by heating with.
  • An actinic ray-curable transfer foil 1 was prepared by laminating the following composition on a 25 im-thick polyethylene terephthalate film release layer provided with a 0.1 im fluororesin release layer.
  • Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 ⁇ 90 parts of methinoreeth / leketone After application, the curing agent was cured at 50 ° C for 24 hours.
  • an actinic ray-curable transfer foil 1 having the above-mentioned configuration is formed on the image receiving body on which images and characters are recorded Using a heat roller heated to a surface temperature of 200 ° C. and having a rubber hardness of 85 with a diameter of 5 cm, heat was applied at a pressure of 150 kg / cm 2 for 1.2 seconds to perform transfer.
  • An IC module having an antenna and an IC chip is supported by a module support.
  • An IC module is sandwiched between two opposing first and second sheet materials and integrated with an adhesive to form an integrated circuit.
  • the present invention can be applied to an IC card and an IC card manufacturing method capable of preventing damage to electronic components due to electrification, preventing dust from being mixed during manufacturing, and obtaining an IC card having good surface irregularities.
  • the antistatic layer is applied simultaneously with the step of forming the module support, Not only does production efficiency increase, but also the adhesion of the antistatic layer to the module support becomes stronger. ,
  • the surface resistivity of at least one side of the module support is 1 E + 11 ⁇ / port or less at 23 ° C and 20% RH, it can be used in low humidity conditions where static electricity and dust adhesion due to electrification are a problem.
  • the effects of the present invention can be further exerted, and electronic components can be prevented from being damaged due to electrification at the time of manufacturing, dust can be prevented from being mixed at the time of manufacturing, and an IC card having good surface unevenness can be obtained. .
  • the viscosity of the adhesive is 3000 to 20000 mPa's at 120 ° C, and if it is larger than 20000 mPa.s, it is difficult to obtain smoothness at the time of coating or pressing, and the viscosity is higher than 300 OmPa ⁇ s. If it is too small, it will prevent problems such as the adhesive sticking out of the coated sheet during coating and pressing, and the IC module moving without being fixed when the IC module is placed on the adhesive. Can be.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Cette invention concerne une carte à circuit intégré (1) dans laquelle un module à circuit intégré (9), qui comporte une antenne (7) et une puce à circuit intégré (6) et qui repose sur un corps support de module (8), est intercalé entre un premier matériau en feuille (2) et un second matériau en feuille (3) opposés et intégré à ceux-ci à l'aide d'adhésifs (4, 5). La carte à circuit intégré (1) se caractérise en ce qu'elle comporte une couche antistatique (11) disposée sur au moins une face du corps support de module (8). La constitution de cette carte à circuit intégré permet de prévenir les dommages causés aux composants électroniques par des charges électrostatiques et d'empêcher que des particules étrangères ne se mélangent dans la carte à circuit intégré pendant la production. Cette invention permet ainsi d'obtenir une carte à circuit intégré présentant une bonne rugosité de surface.
PCT/JP2004/018335 2003-12-15 2004-12-02 Carte a circuit integre et procede de fabrication d'une carte a circuit integre WO2005057484A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003416689A JP2005174220A (ja) 2003-12-15 2003-12-15 Ｉｃカード及びｉｃカードの製造方法
JP2003-416689 2003-12-15

Publications (1)

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WO2005057484A1 true WO2005057484A1 (fr) 2005-06-23

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PCT/JP2004/018335 WO2005057484A1 (fr) 2003-12-15 2004-12-02 Carte a circuit integre et procede de fabrication d'une carte a circuit integre

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WO (1) WO2005057484A1 (fr)

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JP2007241999A (ja) * 2006-02-08 2007-09-20 Semiconductor Energy Lab Co Ltd 半導体装置
EP1818860B1 (fr) * 2006-02-08 2011-03-30 Semiconductor Energy Laboratory Co., Ltd. Dispositif d'identification à radio fréquence
KR100875952B1 (ko) * 2006-09-22 2008-12-26 소프트픽셀(주) 전자카드 및 그 제조방법
KR100856627B1 (ko) * 2007-01-16 2008-09-03 도레이새한 주식회사 대전방지성을 가진 투명한 생분해성 시트

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000298717A (ja) * 1999-04-13 2000-10-24 Oji Paper Co Ltd Ｉｃカード

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3608012B2 (ja) * 1995-09-12 2005-01-05 昭和電工株式会社 帯電防止膜形成用組成物及び帯電防止膜の製造法
JP3933778B2 (ja) * 1997-12-22 2007-06-20 三菱レイヨン株式会社 導電性被覆用水性樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000298717A (ja) * 1999-04-13 2000-10-24 Oji Paper Co Ltd Ｉｃカード

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