WO2005104026A1

WO2005104026A1 - Ic card and method of producing the same

Info

Publication number: WO2005104026A1
Application number: PCT/JP2005/007294
Authority: WO
Inventors: Ryoji Hattori
Original assignee: Konica Minolta Photo Imaging, Inc.
Priority date: 2004-04-23
Filing date: 2005-04-15
Publication date: 2005-11-03

Abstract

An IC card where an electronic component in which an IC chip and an antenna are integrated is provided, with an adhesive agent in between, between a first sheet member and a second sheet member. The IC card has at least two regions where interlayer separation force between the first sheet member and/or the second sheet member and the adhesive agent layer is strong and weak, respectively.

Description

Specification

IC card and its manufacturing method

Technical field

The present invention relates to an IC card suitable for being applied to a non-contact electronic card that stores personal information or the like that requires security (security) such as forgery and falsification prevention, and a manufacturing method thereof.

Patent Document 1: JP 2003-108958 A

Background art

[0002] Conventionally, magnetic cards that record data by a magnetic recording method have been widely used as identification cards (ID cards) and credit cards. However, magnetic cards allow data to be rewritten relatively easily, preventing data from being tampered with, and being magnetically affected by external influences and improper protection of data. There were problems such as a small capacity for recording. In recent years, IC cards with built-in IC chips have begun to spread.

[0003] An IC card reads and writes data from and to an external device via an electrical contact provided on a surface or a loop antenna inside the card. IC cards have a larger storage capacity than magnetic cards, and security is greatly improved. In particular, non-contact IC cards that have built-in antennas for exchanging information between the IC chip and the outside inside the card and do not have electrical contacts outside the card are more suitable for contact IC cards that have electrical contacts on the card surface. It is superior in security, and is being used for applications that require high data confidentiality and anti-counterfeiting like ID cards.

[0004] As such an IC card, for example, there is a card in which a first sheet member and a second sheet member are bonded via an adhesive, and an IC module having an IC chip and an antenna is sealed in the adhesive layer. . In this case, it has been proposed to provide an IC chip concealing layer between the support and the adhesive as described in Patent Document 1 to prevent forgery and alteration.

[0005] However, as a counterfeiting method, specifically, the IC chip inside the card is falsified, or a cut is made in a cross section of the IC chip with a cutter or the like, and the upper and lower sheets are peeled off to remove the IC chip from the card. The above-mentioned technology has led to a solution for preventing forgery and falsification. As described above, since the IC card is required to have high security, durability has become important from the viewpoint of forgery and falsification.

Disclosure of the invention

[0006] The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide an IC card which can prevent chip removal due to card destruction, thereby preventing alteration, and a method of manufacturing the same. .

[0007] In order to solve the above problems, the IC card of the present invention uses an electronic component in which an IC chip and an antenna are integrated between a first sheet member and a second sheet member via an adhesive. And at least two regions having a strong and a weak region for delamination between the first sheet member and the Z or second sheet member and the adhesive layer.

In order to adjust the delamination force, at least one of the first sheet member and the second sheet member has a delamination adjusting layer.

[0009] Thus, areas having different peel strengths at the time of peeling are provided, making it difficult for the first sheet member and the second sheet member to be peeled off from the card. Parts are damaged and hard to be forged.

[0010] Furthermore, the region having a strong delamination force overlaps at least a part of the region where the IC chip and the antenna are located.

[0011] As a result, if it is forcibly peeled off, a sudden force is transmitted to the IC chip, the antenna, and the connection portion of these electronic components, and the IC chip is damaged and the antenna and the joint are disconnected, so that the card can be used as a card. It disappears and prevents forgery.

[0012] Further, the peel strength in a region where the delamination force is strong is 1700 gZ25 mm or more, and the peel strength in a region where the peel force is weak V ヽ is 1000 gZ25 mm to 1500 gZ25 mm.

[0013] In an area where the peel strength is 1700gZ25mm or more, a more abrupt load is generated when the peeling is performed, and the IC chip is damaged, the antenna or the joint is disconnected, and the sheet member is damaged. In addition, the peel strength is 1500gZ25mn! Due to the presence of an area of ~ 1000gZ25mm, a load is generated at the time of peeling.

Further, the delamination adjusting layer is formed by a printing method. [0014] Thus, at least one of a region having a strong delamination force and a region having a weak delamination force can be formed with high dimensional accuracy on at least a part of a region having an IC chip and an antenna by a printing method.

[0015] Further, the invention of the method for manufacturing an IC card includes an image receiving layer forming step of forming an image receiving layer on one surface of the first sheet member, and a writing layer of forming a writing layer on one surface of the second sheet member. In the forming step, the delamination force of the sheet member is adjusted on the surface of the first sheet member opposite to the side having the image receiving layer and on the surface of the Z or second sheet member opposite to the side having the writing layer. A delamination adjusting layer forming step of forming the delamination adjusting layer by a printing method, and a side opposite to the side of the first sheet member having the image receiving layer and the opposite side of the second sheet member having the writing layer. And an integrated part that sandwiches the electronic component in which the IC chip and the antenna are integrated with each other with an adhesive.

[0016] Further, in the integrating step, an area where the first sheet member and the Z or second sheet member have a strong delamination force is overlapped with at least a part of an area where the IC chip and the antenna are.

Brief Description of Drawings

FIG. 1 is a diagram showing an example of a front surface, a front surface appearance, and a rear surface appearance of an IC card.

FIG. 2 is a diagram showing an example of an IC module using a printed board, and using a nonwoven fabric as the board.

FIG. 3 is a diagram showing the positional relationship between the arrangement of the delamination adjusting layer and the arrangement of the IC modules on the inner surface of the IC card, and a diagram showing the inner surface of the IC card having no delamination adjusting layer.

FIG. 4 is a cross-sectional view of an IC card using the IC module shown in FIGS. 2 (a) and 2 (b).

FIG. 5 is a view showing an IC card base material manufacturing apparatus.

FIG. 6 is a diagram showing an example of an IC card creation device.

FIG. 7 is a diagram showing another example of an IC card creation device.

BEST MODE FOR CARRYING OUT THE INVENTION

[0018] The IC card of the present invention includes an electronic component in which an IC chip and an antenna are integrated between a first sheet member and a second sheet member with an adhesive therebetween. The delamination force of the Z or second sheet member is at least strong and weak in the long side direction of the card. Also has two regions.

[0019] In the present invention, the delamination force is obtained by cutting a sheet member integrally formed into a 25 mm width, with the cut-side surface facing downward, using FUDO RHEO METER NRM-2002J manufactured by Fudo Kogyo Co., Ltd. By using the unbonded portion of the edge of the sheet member, the upper portion is fixed and the lower portion is pulled to obtain the maximum strength required for peeling. If it is out of the measurement range, reduce the width of the sheet to be cut and measure it.

In adjusting the delamination force, a delamination adjustment layer is formed on at least one selected from a first sheet member and a second sheet member on a substrate provided with an electronic component in which an IC chip and an antenna are integrated. Being preferred to be. Particularly, in order that the delamination force is strong and the area overlaps with at least a part of the area where the IC chip and the antenna are provided, it may be formed on at least one of the first sheet member and the second sheet member. Like,. The delamination adjusting layer is not particularly limited as long as it is located in one of the areas where the IC chip and the antenna are present, but at least overlaps with an area of 5% or more with respect to the area of the IC chip part and has a strong delamination force. It is preferred to have a region and a weak region, preferably in a ratio of 95: 5 to 5:95.

[0021] The delamination force is strong !, the area is weak, and the difference in peel strength between the areas is large! The more preferable strength, the more preferable the peel strength of the area is 1700gZ25mm or more. Prefer to destroy the material. Weak, peel strength of the area is 1000gZ25mn! ~ / 500gZ preferably in the range of 25mm! / ,.

[0022] In the present invention, since it is difficult to measure if there is a distribution of a region where the delamination force is strong and a distribution of the region where the delamination force is weak, the delamination test was performed by forming the delamination adjustment layer alone and measuring the delamination force.

Hereinafter, embodiments of the present invention will be described, but the present invention is not limited thereto. Further, the embodiments of the present invention show the most preferable embodiments of the invention, and the terms used herein do not limit the invention. In the following description, for convenience, an IC card processed into a use form is referred to as an IC card, and a raw card before processing or a card having a constituent layer for kamitsu is referred to as an IC card substrate. The card encompasses all of these.

First, FIG. 1 shows an example of an embodiment of an IC card. 1 (a) is a front view of the IC card base material, FIG. 1 (b) is a front view of the IC card, and FIG. 1 (c) is a back view of the IC card. Fig. 1 (a) On the surface of the IC card substrate shown, a format 100 such as employee ID and name characters is recorded by printing. The face image, name, ID number 101, etc. are recorded on the front side of this IC card base as shown in Fig. 1 (b), and on the back side, a blue line and an emergency call are displayed as shown in Fig. 1 (c). Record the bibliographic information 102, etc., and create an IC card.

[0025] By describing personal information such as a face image, address, name, and date of birth on the IC card base material, an identification card, passport, alien registration card, library use card, cash card, tail card can be used. It can be used for licenses such as automobile licenses, employee IDs, employee IDs, membership IDs, medical cards and student IDs.

Next, FIG. 2 shows an example of an embodiment of an IC module provided in an IC card. FIG. 2A is a schematic diagram showing an embodiment using a printed circuit board, and FIG. 2B is a schematic diagram showing an embodiment using a nonwoven fabric as a substrate of an IC module.

In the embodiment shown in FIG. 2A, an electronic component in which a printed pattern of an antenna 3c is formed on a printed circuit board 2a, and an IC chip 3a is bonded to the antenna 3c by bonding or the like and integrally formed. are doing. 3b is a reinforcing plate that covers at least one side of the IC chip 3a by 50% or more (see Fig. 4). In the embodiment of FIG. 2 (b), an antenna 3c is formed on a nonwoven fabric sheet 2b, and an electronic component in which an IC chip 3a is bonded to the antenna 3c by bonding or the like is integrally formed. For example, a commercially available IC card sheet “FT series” manufactured by Hitachi Maxell, Ltd. can be used. By using a porous resin sheet such as the nonwoven fabric sheet 2b, the adhesiveness between the members becomes superior because the impregnating property of the adhesive during the heat bonding is improved. These IC modules can be larger or smaller than the IC card size.

FIGS. 3 (a) to 3 (g) show the inner surface of the IC card and show the positional relationship between the delamination adjusting layer and the IC module.

In FIG. 3A, a region 4al having a strong delamination force and a region 4a2 having a weak delamination force are provided in the form of a thin line in the short side direction of the card as the delamination adjusting layer 4a. In FIG. 3B, as the delamination adjusting layer 4a, a region 4al having a strong delamination force and a region 4a2 having a low delamination force are provided in a cut shape. In FIG. 3 (c), as the delamination adjusting layer 4a, the delamination force is strong! The thick and spline-shaped delamination force and the region 4al are provided at the position of the IC chip 3a. In FIG. 3 (d), as the delamination adjusting layer 4a, a region 4al having a strong delamination force and a region 4a2 having a weak delamination force are provided in a plurality of elliptical rings. In FIG. 3 (e), as the delamination adjusting layer 4a, a region 4al having a strong delamination force and a weak delamination force !, and a region 4a2 are provided in the short side direction of the card in a narrow, spline-like and thick, spline-like manner. Further, a region 4al having a strong delamination force is provided on the outer periphery. In FIG. 3 (f), as the delamination adjusting layer 4a, a region 4al having a strong delamination force and a region 4a2 having a weak delamination force are provided at the center so that both-side forces are gradually reduced. In FIG. 3 (g), as the delamination adjusting layer 4a, a region 4al having a strong delamination force and a region 4a2 having a weak delamination force are provided in the short side direction of the card in the form of a thin V, a spline shape, a thick shape, and a spline shape. A thick and spline-shaped region 4a1 having a strong delamination force is provided at the position of the IC chip 3a, and a region 4a3 having a strong delamination force as a different delamination adjusting layer is provided in a thick spline shape. FIG. 3 (h) shows a comparative example in which no delamination adjusting layer was provided.

[0030] Materials for the delamination adjusting layer include "lithographic printing technology", "new printing technology overview", "offset printing technology", and "engraving and printing encyclopedia" published by Japan Printing Technology Association. It can be formed using the general inks described, and examples thereof include photocurable inks, oil-soluble inks, and solvent-based inks.

[0031] The delamination force adjusting layer is a force IC chip that can be provided by a method such as gravure coating, dipping, screen printing, resin letterpress printing, offset printing, silk printing, flexographic printing, screen gravure printing, or the like. In addition, in order to position the antenna in the area where the antenna is located, it is preferable to use a printing method such as oil relief printing, offset printing, silk printing, flexo printing, or screen gravure printing.

Next, FIG. 4 shows a cross-sectional view of the IC card of this embodiment. The embodiment of FIG. 4A uses the IC module of FIG. 2A, and the embodiment of FIG. 4B uses the IC module of FIG. 2B. .

In the embodiment shown in FIG. 4A, the IC chip 3a and the antenna 3c are connected between the first sheet member 5a and the second sheet member 5b via the adhesives 6a and 6b. This is an IC card with electronic components. A bump 3a1 is provided on the non-circuit side of the IC chip 3a, and the bump 3a1 is It is connected to the antenna 3c of the printed circuit board 2a by the conductive adhesive 3a2. A reinforcing plate 3b is provided on the circuit surface side of the IC chip 3a, and an adhesive 3a3 is provided between the reinforcing plate 3b and the printed board 2a so as to surround the IC chip 3a.

[0034] The first sheet member 5a has an image receiving layer 5al that receives a sublimation or heat diffusible dye image and a heat fusible ink image by a thermal transfer recording method. Various information is described on the image receiving layer 5al. Protected by layer 5a2. The second sheet member 5b has a writing layer 5bl.

In the embodiment shown in FIG. 4 (b), a reinforcing plate 3b is provided on the side other than the circuit surface of the IC chip 3a, and the reinforcing plate 3b is provided on the nonwoven fabric 2b. A bump 3al is provided on the circuit surface side of the IC chip 3a, and the bump 3al is connected to the antenna 3c.

[0036] The power to explain the technology used in the IC card of the present invention is not limited to these.

As the first sheet member or the second sheet member, for example, polyester resin such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate Z isophthalate copolymer, polyolefin resin such as polyethylene, polypropylene, and polymethylpentene; Polyfluorinated resins such as vinyl chloride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene tetrafluoroethylene copolymer, polyamides such as nylon 6, nylon 6.6, polychlorinated vinyl, and salt Z Vinyl acetate copolymer, ethylene Z-vinyl acetate copolymer, ethylene Z-butyl alcohol copolymer, polyvinyl alcohol, vinyl polymer such as vinyl, biodegradable aliphatic polyester, biodegradable polycarbonate, Degradable polylactic acid, biodegradable polyvinyl Biodegradable resins such as rucol, biodegradable cellulose acetate, and biodegradable polyproprolataton, cellulose resins such as cellulose triacetate and cellophane, polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate , Polybutyl acrylate, etc., acrylic resin, polystyrene, polycarbonate, polyarylate, polyimide, etc., synthetic resin sheet, or high quality paper, thin paper, dalasin paper, parchment paper, etc., single layer of metal foil etc. Or a laminate of two or more of these. The thickness of the sheet material is about 30 to 300 μm, preferably about 50 to 200 μm.

[0037] The first sheet member and the second sheet member may be the same or different. [0038] These sheet members can be easily formed by forming a layer of a coupling agent, a latex, a hydrophilic resin or the like, which can be subjected to an easy contacting treatment, or a corona treatment or a plasma treatment. Fold. Further, an annealing treatment or the like may be performed to reduce heat shrinkage.

As the adhesive, a hot-melt adhesive, a reactive hot-melt adhesive such as a light-curable adhesive, a moisture-curable adhesive, or an elastic epoxy adhesive can be used.

Examples of the hot melt adhesive include an ethylene-vinyl acetate copolymer (EVA) -based, polyester-based, polyamide-based, thermoplastic elastomer-based, and polyolefin-based adhesive, and a thermoplastic elastomer-based hot-melt adhesive is preferred.まし. Macromelt series manufactured by Henkel, Kariflex TR and Clayton series manufactured by Shell Chemical, Tufprene manufactured by Asahi Kasei, Tuffden manufactured by Firestone Synthetic Rubber and Latex, Solprene 400 series manufactured by Phillips Petroleum as hot melt adhesives Sumitomo Chemical's Sumic, Chisso Petrochemical's Vistack, Mitsubishi Yuka Yucatak, Henkel's Macromelt Series, Mitsui Petrochemical's Tuffmer, Ube Rexen's APAO, Eastman Chemical's East Bond, Hercules A-FAX or the like can be used.

Examples of the photocurable adhesive include those described in JP-A-10-316959, JP-A-11-5964, JP-A-11-161762, and the like. It can be used after being cured with a light source such as a mercury lamp, UV lamp, or xenon at an exposure of 100 to 500 mj.

Examples of the moisture-curable adhesive include those described in JP-A-2000-036026, JP-A-2000-219855, and JP-A-2000- 211278. For example, TE030 and TE100 manufactured by Sumitomo 3LEM, Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Bondmaster 170 Series manufactured by Kanebo Wen Sushi and Macroplast QR 460 manufactured by Henkel.

Examples of the elastic epoxy adhesive include those described in JP-A-63-63716, JP-A-10-120764, JP-A-2000-229927, JP-A-6-87190, JP-A-5-295272, etc. Is received. For example, Cemedine Co., Ltd., Cemedine EP-001, Three Bond Co., Ltd., 3950 Series, 3950, 3951, 3952, Koshi Co., Ltd. Bond MOS Series, MOS07, MOS10, Toho-Daisei Industrial Co., Ltd. It is preferable to use the 1500 series, Ulti-T 15 40, and the like. [0041] The thickness of the adhesive layer including the electronic component is preferably 100 to 600 µm, more preferably 200 to 600 µm, and still more preferably 250 to 600 µm.

When an IC module has an antenna pattern, a coil made of copper winding, a coil printed with a conductive paste such as silver paste on an insulating substrate in a spiral shape, or a coil etched with a metal foil such as a copper foil is used. Used. From the viewpoint of communication, it is preferable to use a coil formed by copper winding, and the coil may be covered with a resin, an insulating layer, or the like.

As the printed circuit board, a thermoplastic film such as polyester is used, and when heat resistance is required, polyimide is advantageous. The bonding between the IC chip and the antenna pattern can be performed using a conductive adhesive such as silver paste, copper paste, or carbon paste, a method using an anisotropic conductive film, or a method using solder bonding or ACF bonding. Good.

In order to place the IC module at a predetermined position, an adhesive layer is formed on a sheet member in advance, and the module is placed and sealed. In doing so, it is preferable to form the electronic component on a substrate made of a porous resin film, a porous foamed resin film, a flexible resin sheet, a porous resin sheet, or a nonwoven sheet.

[0043] Further, since the IC chip has a low point pressure strength, it is preferable to provide a reinforcing plate near the IC chip via an adhesive in terms of durability. The total thickness of the electronic component is preferably from 10 to 500 m, more preferably from 10 to 450 111, and even more preferably from 10 to 350 m! / ヽ.

Although a conventionally known adhesive bonding method can be arbitrarily adopted, an example of a method of manufacturing an IC card using a hot melt adhesive will be described here.

When manufacturing an IC card, first, a hot melt adhesive is applied to the front and back sheets with an applicator to a predetermined thickness. As a coating method, a usual method such as a roller method, a T-die method, and a die method is used. The applied adhesive may be preheated by a heater or the like before mounting the IC module. After that, the sheet with the IC module mounted between the upper and lower sheets is pressed by a press heated to the bonding temperature of the adhesive for a predetermined time, or the sheet is transported in a constant temperature layer at a predetermined temperature instead of rolling by the press. While rolling with pressure May be extended. Further, vacuum pressing may be performed to prevent air bubbles from entering during bonding.

[0044] A vertical press method, in which it is preferable to perform heating and pressurization in order to improve the surface smoothness of the IC card and improve the adhesion between the first sheet member and the second sheet member by incorporating electronic components, and a laminate. It is preferable to manufacture by a method, a kyatabila method or the like.

[0045] The heating temperature is preferably from 10 to 120 ° C, more preferably from 30 to: LOO. Pressure, from the point of view to avoid the damage of the IC chip, more preferably preferred tool is 0. 05~300kgfZcm ² 0.

05～: a LOOkgfZcm ^2. The heating and pressurizing time is preferably from 0.1 to 180 sec, more preferably from 0.1 to 120 sec.

The laminated sheet or roll is allowed to stand for a time corresponding to a predetermined curing time of the adhesive, or after a curing reaction for a predetermined time when a reactive adhesive is used as the adhesive, is subjected to authentication identification. Images and bibliographic items may be recorded, and then molded into a predetermined card size.

[0047] As a method of forming a predetermined card size, a punching method, a cutting method, and the like can be selected. The thickness of the card produced is between 300 and 1000 / ζπι, preferably between 300 and 900 μm.

The first sheet member is preferably provided with an image receiving layer. When an image containing gradation information is formed on the image receiving layer by a sublimation type thermal transfer method and a character information containing image is formed by a sublimation type heat transfer method or a fusion type heat transfer method, the dyeing property of a sublimable dye or The adhesiveness of the hot-melt ink must be good as well as the dyeability of the flower pigment. In order to impart a powerful property to the image receiving layer, the types of the binder and various additives and the amounts thereof are appropriately adjusted.

As the binder for the image receiving layer, a commonly known binder for the sublimation type thermal transfer recording image receiving layer can be appropriately used.

[0049] In forming the image receiving layer, it is preferable to include a metal ion-containing compound that reacts with the sublimated dye compound to form a chelate. For ^{^{example, Ni 2 +, Cu 2+,}} Co 2+, complex represented by the following general formula containing Cr ²⁺及beauty Zn ²⁺ is preferably used. [0050] [M (Ql) k (Q2) m (Q3) n] p ⁺ p (L ")

Here, M represents a metal ion, Ql, Q2, and Q3 each represent a coordination compound capable of coordinating with the metal ion represented by M, and L represents a counter ion capable of forming a complex. And k represents an integer of 1, 2, or 3, m represents 1, 2, or 0, n represents 1 or 0, and p represents 1, 2, or 3.

[0051] It is preferable to add a release agent to the image receiving layer. The release agent is preferably one that is compatible with the binder, prevents fusion with the ink sheet, and does not hinder the secondary workability of the image receiving layer. The secondary processability of the image receiving layer refers to writability with magic ink, laminating properties that are a problem when protecting the formed image, and the like.

The thickness of the image receiving layer is generally 1 to 50 m, preferably 2 to about LO / z m. Between the sheet member and the image receiving layer, a cushion layer or a Norr layer may be provided. By providing the cushion layer, it is possible to transfer and record an image corresponding to image information with high reproducibility with little noise.

The second sheet member may be provided with a writing layer so that writing can be performed on the back surface of the IC card as needed. The writing layer can be formed with a binder and various additives. The thickness of the writing layer is preferably 1 to 50 μm, more preferably 1 to 40 μm. When the writing layer is formed, an adhesive layer may be provided for improving the adhesion to the sheet member, or a cushion layer may be provided for improving the writing property, and there is no particular limitation. The writing layer preferably has a fine surface and an uneven surface on the surface in order to improve writability.

An information carrier layer formed by format printing can be provided on the image receiving layer or the writing layer. To be more specific, it shows the blue line, company name, card name, notes, issuer phone number, etc.

[0052] Format printing may employ permeability printing, holograms, fine prints, etc. to prevent forgery by visual inspection. Further, printed materials, holograms, bar codes, mat patterns may be used as a forgery / alteration prevention layer. , Fine pattern, ground pattern, uneven pattern, etc., visible light absorbing color material, ultraviolet light absorbing material, infrared light absorbing material, fluorescent brightening material, glass vapor deposition layer, bead layer, optical change element layer, pearl ink layer, flake It is also possible to provide a pigment layer, IC hiding layer, permeability printing layer, etc. by printing or the like. The

[0053] The formation of the information carrier consisting of the format printing is performed by "lithographic printing technology", "new printing technology introduction", "offset printing technology", and "plate making" printing published by the Japan Printing Technology Association. It is formed of a general photocurable ink, oil-soluble ink, solvent-based ink, etc. described in "Kankan".

In addition to format printing, authentication identification images such as face images and attribute information images such as bibliographic items are generally formed.

The face image is usually a full-color image having gradation (gradation information-containing image), and is created by, for example, a sublimation thermal transfer recording method or an ink jet method. The character information-containing image is a binary image, and is created by, for example, a fusion type thermal transfer recording method, a sublimation type thermal transfer recording method, an ink jet method, or the like. In the present invention, it is preferable that an authentication identification image such as a face image is formed by a sublimation type thermal transfer recording method, and an attribute information image is recorded by a fusion type thermal transfer recording method.

To form an image containing gradation information by the sublimation type thermal transfer recording method, the ink layer side of the sublimation type thermal transfer recording ink sheet and the image receiving layer side of the IC card base material are overlapped, and the image is formed from the ink sheet side. The thermal energy is applied wisely to transfer the thermal diffusible dye in the ink layer to the image receiving layer side. As a heat source for applying thermal energy, a thermal head is generally used, and in addition, a known one such as a laser beam, an infrared flash, and a hot pen can be used.

[0055] When using a thermal ^{head, 0. 3kgZcm 2 ~0. 01kg /} cm 2, preferably ^{0. 25kg Zcm 2 ~0. Olkg /} cm 2, more preferably in the range of from 0. 25kgZcm ^² ~0. 02kgZcm ² in pressure Caro, head, temperature 50 to 500 ^o C, preferably 100 to 500 ^o C, more preferably it is preferred to form a gradation information containing image 100 to 4 00 ° C.

After the image is formed, a heat treatment may be performed using a thermal head, a heat roller, an infrared flash lamp, or the like for the purpose of improving image storability.

<Formation of image containing text information> When a thermal head is used in the fusion thermal transfer method, the heat-meltable ink layer side of the ink sheet for fusion-type thermal transfer recording and the image receiving layer side of the IC card substrate are brought into close contact, and a thermal pulse is applied from the ink sheet side by the thermal head. Then, the heat-meltable ink layer corresponding to the desired transfer pattern is heated and transferred to the image receiving layer surface. The formation of the character information-containing image may be performed prior to the formation of the gradation information-containing image, or may be performed after the formation of the gradation information-containing image. The character information-containing image can also be formed using the sublimation type thermal transfer recording ink sheet.

When using a thermal ^{head, 0. 3kgZcm 2 ~0. 01kg /} cm 2, preferably ^{0. 25kg / cm 2 ~0. 01kg} / cm 2, more preferably 0. 25kgZcm ² ~0. Range of 02kg / cm ² in Caro pressed, the head, the temperature 50 to 500 ^o C, preferably 100 to 500 ^o C, more preferably Uヽpreferred to form character information containing image 100 to 4 00 ° C.

Image formation by inkjet method>

When the ink jet method is adopted, for example, a printer having a resolution of about 400 dpi by a bubble jet (registered trademark) method is used. The face image can be multi-graded by a printer using a shear mode head. JP-A 9-71743, an ink in which a fatty acid ester of an alkyl group having 18 to 36 carbon atoms is used in combination with a dimer acid-based polyamide, and a binder in a photocurable composition described in JP-A-2000-44857. Or inks described in JP-A-9-71743, JP-A-2000-297237, JP-A-2000-85236, JP-A-5-1254 and the like can be used. In addition, the post-heating, post-exposure, etc. may be performed after writing the character information, face image, etc. by the ink jet as post-processing, and there is no particular restriction on the type of ink and the image forming method.

The IC card of the present invention may be provided with a surface protective layer, and is preferably made of a photocurable resin. The surface protective layer may be provided by applying a resin solution or using a transfer foil. An optical change element such as a hologram may be provided on the transfer foil for the purpose of preventing forgery and falsification.

[Example]

Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited thereto. << Preparation of the first sheet member 1 >>

(Image receiving layer formation)

Using 188 m thick white U2L98W manufactured by Teijin Dupont Film Co., Ltd. as a support, a coating solution for forming the first image receiving layer and a coating solution for forming the second image receiving layer having the following compositions are respectively provided in this order. Was applied and dried so as to have a thickness of 2.5 m and 0.5 m to form an image receiving layer. <Coating liquid for forming first image receiving layer>

Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-LEC BX-1]

6 copies

Metal ion-containing compound (Compound MS) 4 parts

Methyl ethyl ketone 80 parts

Butyl acetate 10 parts

Polyethylene wax [Toho Chemical Industry Co., Ltd .: Hitec E1000]

2 copies

8 parts of urethane-modified ethylene acrylic acid copolymer [Toho Chemical Industry Co., Ltd .: Hitec S6254]

Methylcellulose (Shin-Etsu-Dagaku Kogyo Co., Ltd .: SM15) 0.1 part

90 parts of water

Compound MS

(Formation of delamination adjusting layer)

A delamination adjusting layer shown in FIG. 3 was provided on the back side of the image receiving layer on the support by an offset printing method using a UV printing ink described as a preparation example in the table below. UV illumination during printing The irradiation conditions were equivalent to 200 mj with a high-pressure mercury lamp.

The ink of Formulation Example 4 also serves as the printing ink.

Format printing (employee identification, name) was performed on the image receiving layer using UV black ink by offset printing. Further, a transparent UV-curable OP varnish (FD-O dry coat varnish, manufactured by Naruto Ink Co., Ltd.) was provided by offset printing except for the sublimation thermal transfer image recording area. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

<< Preparation of the first sheet member 2 >>

A first sheet member 2 was produced in the same manner as the first sheet member 1 except that a white, 188 m-thick U2L98W non-adhesive layer treated product of Teijin DuPont Films Co., Ltd. was used.

《Creating the second sheet member 1》

(Formation of writing layer)

Using U2L98W manufactured by White Teijin Dupont Film Co., Ltd. as a support having a thickness of 188 μm, a coating solution for forming a writing layer having the following composition was sequentially coated and dried, and each had a thickness of 5 / ζπι, 15 ^ πι, 0.2 μm writing layer was formed.

Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts

Isocyanate (Nippon Polyurethane Industry Co., Ltd .: Coronate HX) 1 copy

Carbon black trace

1 part of titanium dioxide particles (manufactured by Ishihara Sangyo Co., Ltd .: CR80)

Methyl ethyl ketone 80 parts

Butyl acetate 10 parts

Polyester resin (Toyobo Co., Ltd .: Vironal MD 1200) 4 parts

Silica 5 parts

90 parts of water

Polyamide resin [Sanmide 55, manufactured by Sanwa Chemical Industry Co., Ltd.] 5 parts

Methanore 95¾ (Formation of delamination adjusting layer)

On the back side of the writing layer on the support, an interlayer release adjusting layer shown in FIG. 3 was provided by an offset printing method using the UV printing ink described in Table 1 above. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Formation of Information Carrier Layer on Writing Layer)

Format printing (line, issuer name, issuer telephone number) was performed on the writing layer surface by offset printing. The printing ink used was UV black ink, and the UV irradiation conditions during printing were equivalent to 200 mj using a high-pressure mercury lamp.

<< Preparation of the second sheet member 2 >>

A second sheet member 2 was produced in the same manner as the second sheet member 1 except that a white, 188 μm-thick U2L98W product without an easy-adhesion layer treatment manufactured by Teijin Dupont Films Co., Ltd. was used.

<< IC card base material production >>

Using the first sheet member and the second sheet member produced above, an IC card base material was produced using the apparatus shown in FIG.

FIG. 5 is a schematic configuration diagram showing an IC card base material manufacturing apparatus 80. A second sheet member 5b (back sheet, not shown) cut into a sheet on which a plurality of cards are arranged is provided on the right hand side of the apparatus, and a long sheet-like first sheet member is provided downstream. Sheet member 5a (top sheet) is provided in a roll shape. The melted adhesive is supplied from the adhesive dissolution supply section 81 to the sheet bonding adhesive supply section 82b, and is applied to the second sheet member 5b supplied by the second sheet member supply section 83 by a T-die coating method. You. Next, the IC module having the electronic components shown in FIG. 2 on the formed adhesive layer 6b of the second sheet member 5b conveyed by the sheet conveying member 85 corresponds to the card arrangement from the ICZ fixing member supply unit 84. And placed.

On the other hand, the first sheet member 5a is also supplied with the melted adhesive from the sheet bonding adhesive supply section 82a by a T-die coating method.

[0062] The second sheet member 5b on which the adhesive is applied and on which the IC module is arranged is conveyed by the sheet conveying member 85, and is bonded to the first sheet member 5b by the heating Z pressure roll 86 to form a film. An IC card base material having a thickness adjusted by the thickness control roll 87 is created, and is conveyed to the next cutting step (not shown) by the card base conveyance member 87.

[0063] Specifically, a Henkel company melted at 130 ° C was placed on the support side of the first sheet member.

Macroplast QR3460 manufactured by Hitachi Chemical Co., Ltd. The IC card sheet “FT series” manufactured by Hitachi Maxell, Ltd. is laminated on the support, and the second sheet member is melted at 130 ° C on the support side of Sekisui Chemical Co., Ltd. Esdyne 2013MK was applied and bonded at 60 ° C while applying a pressure of 0.2 kg / cm ² . After that, the IC card base material with the first sheet member cut in accordance with the second sheet member is further stored at 23 ° C. 55% for 10 days, and then cut with a roll cutter to make a 55 mm X 85 mm size IC card. A substrate was obtained.

<< Formation of authentication identification image and attribute information image >>

ID information was recorded on the image receiving layer side of the IC card substrate using an apparatus schematically shown in FIG. 6 or FIG.

In the apparatus shown in FIG. 6, the card base material supply unit 10 and the information recording unit 20 are arranged at an upper position, and the resin application unit 60 is arranged at a lower position.

[0065] In the card base material supply unit 10, a plurality of card base materials 50 that have been cut in a sheet shape in advance for writing personal information of the card user are used to receive a face photograph (authentication identification image). Stocked with the layer side up. The card base material 50 is automatically supplied one by one at a predetermined timing.

In the information recording section 20, a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 for sublimation-type thermal transfer recording are arranged. An image area having a gradation such as a face photograph of a card user is recorded in a predetermined area of the image receiving layer by thermal recording synchronized with the transport of the card base material 50. Next, a fusion type thermal transfer recording character ribbon cassette 31 and a thermal head 32 are arranged, and attribute information such as a name and a date of card issuance is recorded by thermal transfer to form an image recording layer.

A transfer foil cassette 61 is arranged in the resin application section 60, and a heat roller 62 is arranged corresponding to the transfer foil cassette 61. A cured resin transfer foil 66 for forming a surface protective layer is set in the transfer foil cassette 61, and the transfer foil 66 is transferred to the transfer layer containing the cured protective layer. Is provided.

In the apparatus shown in FIG. 7, the card base material supply unit 10 and the information recording unit 20 have the same configuration, but the surface protective layer and the Z or optical change element transfer layer providing unit Z or the resin layer providing unit After that, the transparent protective layer and the Z or optical change element transfer layer providing section Z or the resin layer providing section 70 are further disposed.

In the surface protective layer and the Z or optically variable element transfer layer providing section Z or the resin layer providing section 70, a transfer foil cassette 71 is provided, and a heat roller 72 is provided corresponding to the transfer foil cassette 71. I have. The optical change element transfer foils 43 and Z or the surface protection transfer foil 64 and the cured resin type transfer foil 66 are transferred to provide an optical change element transfer layer, a Z transparent protection transfer layer, and a transfer layer containing a cured type protection layer.

(Preparation of sublimation type thermal transfer recording ink ribbon)

A 6 μm-thick polyethylene terephthalate sheet, which has been processed to prevent fusing on the back surface, is coated with a coating liquid for forming a yellow ink layer, a coating liquid for forming a magenta ink layer, and a coating liquid for forming a cyan ink layer as follows. : L m, and yellow, magenta and cyan ink ribbons were obtained.

Yellow dye [Mitsui Toatsu Dye Co., Ltd. MS Yellow] 3 parts

Polybutylacetal [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.]

5.5 copies

1 part of polymethylmetaarylate-modified polystyrene [Toda Gosei Chemical Industry Co., Ltd .: Rededa GP 200]

Urethane-modified silicone oil [Dainichisei Chemical Co., Ltd .: DIALOMAR SP-2105]

0.5 咅

Methyl ethyl ketone 70 parts

Tonolen 20 parts

Magenta dye [MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.] 2 parts

Polybutylacetal [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.] 5.5 copies

Polymethylmetaarylate-modified polystyrene [Toa Gosei Chemical Industry Co., Ltd .: Rededa GP-200] 2

0.5 咅

Methyl ethyl ketone 70 parts

Tonolen 20 parts

Cyan dye [Casset Blue 136 manufactured by Nippon Kayaku Co., Ltd.] 3 parts

5. 6 咅

0.5 咅

Methyl ethyl ketone 70 parts

Tonolen 20 parts

(Production of Ink Ribbon for Fused Thermal Transfer Recording)

A 6 μm-thick polyethylene terephthalate sheet, which has been processed to prevent fusing on the back surface, is coated with a coating liquid for forming an ink layer of the following composition to a thickness of 2 μm, dried and slit to obtain an ink ribbon. Was.

1 copy of carnauba wax

Ethylene vinyl acetate copolymer [Mitsui DuPont Chemical: EV40Y] 1 part Carbon black 3 parts

5 parts of phenolic resin [Ara J11 Chemical Industry Co., Ltd .: Tamanol 521]

Methyl ethyl ketone 90 parts

(Formation of face image to authentication identification image) The ink side of the sublimation type thermal transfer recording ink ribbon is superimposed on the image receiving layer surface, and output from the ink ribbon side using a thermal head 0.23 WZ dot, pulse width 0.3 to 4.5 ms, dot density 16 dot Zmm By heating under the conditions described above, a human image having gradation in the image was formed on the image receiving layer.

(Formation of character information to attribute information)

The ink side of the melt-type thermal transfer recording ink ribbon is superimposed on the image receiving layer surface, and output from the ink ribbon side using a thermal head 0.5 WZ dots, pulse width 1. Om seconds, dot density 16 dots Heat at Zmm Thus, character information was formed on the image receiving layer.

<< Applying a card surface protective layer >>

The following transfer foil was prepared, and transferred by applying heat at a pressure of 150 kgZcm ² for 1.2 seconds using a heat roller having a diameter of 5 cm and a rubber hardness of 85 heated to a surface temperature of 200 ° C.

[Synthesis of resin using actinic radiation curable layer]

Put 73 parts of methacrylmethyl, 15 parts of styrene, 12 parts of methanolinoleic acid and 500 parts of ethanol 咅 ^ aa '—azobisisobutyronitrile 3 parts in a three-neck flask under a nitrogen stream, and place it in a nitrogen stream. The reaction was carried out in an oil bath at ° C for 6 hours. After that, 3 parts of triethylammonium-methylene chloride and 1.0 part of glycidyl methacrylate were added and reacted for 3 hours to obtain a target synthetic binder of an acrylic copolymer.

One side of polyethylene terephthalate (S-25) manufactured by Diafoil Hoechst Co., Ltd. was sequentially coated and dried by wire bar coating with the following formulation to prepare a transfer foil.

(Release layer) Film thickness. . 2 m

Polyvinyl alcohol (GL-05 manufactured by Nippon Synthetic Chemical Co., Ltd.) 10 parts

90 parts of water

The release layer was dried under the conditions of 90 ° _C. and 30 ° _C. after coating.

(Light-cured cured layer) Film thickness 8.0 m

A- 9300Z manufactured by Shin-Nakamura Chemical Co., Ltd. EA-1020 manufactured by Shin-Nakamura-Daigakusha

= 35/11. 75 copies Reaction initiator Nippon Ciba-Geigy Co., Ltd.

48 parts of resin with active light curable layer

Tornolen 500 咅

The actinic ray-curable compound after application is dried at 90 ° C for 30 sec.

(300 mi / cm ² ).

(Intermediate layer) Thickness 0.6 ^ πι

Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: Esrec BX-1] 5 parts

Tuftex M—1913 (Asahi Kasei Corporation) 3 parts

Hardener Polyisocyanate [Coronate HX Nippon Polyurethane] 2 parts

Methyl ethyl ketone 90 parts

After application, the curing agent was cured at 50 ° C. for 24 hours.

(Adhesive layer) Film thickness. . 3 m

Urethane-modified ethylene ethyl acrylate copolymer (Toho Chemical Industry Co., Ltd .: No. IT S6254B) 8 parts

Polyacrylic acid ester copolymer [manufactured by Nippon Junyaku Co., Ltd .: Julimer AT510]

2 copies

45 parts of water

Ethanol 45 parts

After the application, drying was performed at 70 ° _C. and 30 ° _C.

<< Evaluation of anti-falsification >>

The following table shows the results of 10 people other than the card material designer who created the cards with the card's cross-section force and also inserted a cutter!

Industrial use

Through the IC force adhesive of the present invention An electronic component in which an IC chip and an antenna are integrated, and has at least two areas of a strong area and a weak area between the first sheet member and / or the second sheet member and the adhesive layer. Therefore, it is possible to prevent the chip from being taken out due to the destruction of the card, thereby preventing the alteration.

Claims

The scope of the claims

[1] An electronic component in which an IC chip and an antenna are integrated through an adhesive between the first sheet member and the second sheet member, and is bonded to the first sheet member and the Z or second sheet member. An IC card characterized in that it has at least two regions where the delamination force with the agent layer is high and low.

[2] The IC card according to claim 1, wherein at least one of the first sheet member and the second sheet member has a delamination adjusting layer for adjusting a delamination force.

[3] The IC card according to claim 1, wherein a region having a strong delamination force overlaps at least a part of a region where an IC chip and an antenna are present.

[4] The IC card according to claim 2, wherein a region having a strong delamination force overlaps at least a part of a region where the IC chip and the antenna are located.

[5] The peel strength in the area with strong delamination force is 1700gZ25mm or more, and the peel strength in the area with weak peel force is 1000gZ25mn! The IC card according to any one of claims 1 to 4, wherein the IC card has a size of from 1500 gZ to 25 mm.

6. The IC card according to claim 2, wherein the delamination adjusting layer is formed by a printing method.

[7] An image receiving layer forming step of forming an image receiving layer on one surface of the first sheet member, a writing layer forming step of forming a writing layer on one surface of the second sheet member, and an image receiving layer of the first sheet member A delamination adjusting layer for adjusting the delamination force of the sheet member is formed by a printing method on the surface opposite to the side and on the surface opposite to the side having Z or the writing layer of the second sheet member. In the adjustment layer forming step, the surface of the first sheet member opposite to the side having the image receiving layer is opposed to the surface of the second sheet member opposite to the side having the writing layer, and the IC chip and the antenna are A method of manufacturing an IC card, comprising: an integrated step of sandwiching integrated electronic components with an adhesive while sandwiching the integrated electronic components.

[8] The method according to claim 8, wherein, in the integrating step, a region where the first sheet member and the Z or the second sheet member have a strong delamination force is overlapped with at least a part of a region where the IC chip and the antenna are. The method for manufacturing an IC card according to range 7.