JP2007128268A - Information recording medium, and ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an information recording medium and an IC card, having excellent durability such as the bending resistance, twist resistance, etc. <P>SOLUTION: In the information recording medium disposed with an IC module 2 including an IC chip 2a and an antenna 2b connected to the IC chip 2a, the antenna 2b is coated with a separation layer 40. The periphery of the antenna 2b is covered with a composition 41 having a dilatancy characteristic, and the composition 41 having the dilatancy characteristic is covered with a separation layer 42. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an information recording medium such as a non-contact type electronic card and an IC card for storing personal information and the like that require safety (security) such as forgery and alteration prevention.

  In recent years, an IC module having an IC chip and an antenna coil has been arranged to receive power from a reader / writer and exchange information with the reader / writer using electromagnetic coupling between antennas. Various media have been proposed. For example, passports, health insurance cards, Basic Resident Registers, driver's license information, identification information, etc. are beginning to spread.

  For example, an IC card reads / writes data with an external device via an electrical contact provided on the surface or a loop antenna inside the card. The IC card has a larger storage capacity than the magnetic card and greatly improves security. In particular, a non-contact IC card that has an antenna for exchanging information between the IC chip and the outside inside the card and has no electrical contact outside the card is a contact IC card that has an electrical contact on the card surface. Compared with an ID card, it is being used for applications that require high confidentiality of data and prevention of forgery and alteration.

Such an information recording medium is required to have high durability while being used and spread in various applications. In particular, failure due to antenna deformation or disconnection due to external pressure, bending, or the like is fatal because it loses its function as a recording medium because it cannot exchange information. Accordingly, an antenna having higher durability is desired, and such durability is disclosed in JP-A-6-199083 and JP-A-8-324166.
JP-A-6-199083 JP-A-8-324166

  However, although a certain improvement in durability can be seen, sufficient durability has not been obtained for various situations. For example, durability against shocks that are subjected to sudden stress, repeated bending durability that is repeatedly stressed However, the current situation is that the problems such as disconnection of the antennas, short-circuiting of the antennas due to repeated local loads, and disconnection from the joint surface of the IC chip are not sufficient.

  The present invention has been made in view of this point, and an object thereof is to provide an information recording medium and an IC card which are excellent in durability such as bending resistance and twist resistance.

  In order to solve the above problems and achieve the object, the present invention is configured as follows.

  The invention according to claim 1 is an information recording medium in which an IC module having an IC chip and an antenna connected to the IC chip is disposed, wherein the antenna is covered with a release layer, and the information recording medium It is.

  The invention according to claim 2 is the information recording medium according to claim 1, wherein the periphery of the antenna is covered with a composition having dilatancy characteristics.

  The invention according to claim 3 is the information recording medium according to claim 2, wherein the composition having the dilatancy characteristic is covered with a release layer.

  The invention described in claim 4 is an IC card in which an IC module and an adhesive are interposed between two sheet materials, and at least the IC module is defined in any one of claims 1 to 3. An IC card, which is the IC module described.

  The invention according to claim 5 is the IC card according to claim 4, wherein the adhesive is a reactive hot melt adhesive.

  The invention according to claim 6 is characterized in that an image receiving layer for recording personal identification information including name and face image is provided on at least one of the sheet materials. It is.

  The invention described in claim 7 is characterized in that one sheet material is provided with personal identification information including at least a name and a face image, and the other sheet material has a writable writing layer. Item 7. The IC card according to any one of items 6 above.

  With the above configuration, the present invention has the following effects.

  In the first aspect of the present invention, the antenna is covered with the release layer and has strength against external stress, so that it has excellent durability such as bending resistance and twist resistance.

  In the invention according to claim 2, the periphery of the antenna is covered with a composition having dilatancy characteristics, and in the case of a sudden impact, the IC chip is protected as a hard protective layer, while the stress is slowly applied from the outside. In some cases, the flexible protective layer also has a followability to deformation.

  In the invention according to claim 3, the composition having a dilatancy characteristic is covered with a release layer, and the release layer portion acts as a buffer layer against internal deformation caused by a sudden impact or a slowly applied stress. .

  In the invention according to claim 4, at least the IC module is the IC module according to any one of claims 1 to 4, and durability such as bending resistance and twist resistance is improved.

  In the invention according to claim 5, the adhesive is a reactive hot-melt adhesive, and the IC module is well embedded so that the occurrence of poor adhesion can be avoided.

  In the invention of claim 6, an image receiving layer for recording personal identification information including a name and a face image is provided on at least one of the sheet materials, and the personal identification information can be recorded.

  In the invention of claim 7, one sheet material is provided with personal identification information including at least a name and a face image, the other sheet material has a writable writing layer, and is preferably applied to an IC card. it can.

  Hereinafter, embodiments of the information recording medium and the IC card of the present invention will be described. However, the embodiments of the present invention show the most preferable modes of the present invention, and the present invention is not limited thereto.

  As an example of application to the information recording medium of the present invention, specifically, business cards, name plates, passports, examination cards, telephone cards, identification cards, driver's licenses, commuter passes, cash cards, IC cards, etc. Cards to be included, which are generally about the size of a hand and are often carried around. Here, for example, there is an information recording medium to which an IC card is applied. For example, an example of a company employee card will be described, but the application example is not limited to this form.

  An IC card contains an IC module provided on a part of a base material made of a synthetic resin such as vinyl chloride resin. Depending on the electrical contact between the IC chip and an external circuit, the contact type and the non-contact type are used. There is a type. However, if the contact terminal is exposed on the card surface as in the contact type, the contact surface may be deteriorated, the contact may be defective, and power supply to the IC card and data signal input / output may not be performed. . In view of this, an IC card having a configuration in which an electromagnetic wave is generated and / or received by an antenna coil for exchanging electrical signals in a non-contact manner has appeared.

  FIG. 1 is a plan view showing an example of such a contactless IC card having no metal terminal on the surface. In the figure, an IC card 1 is provided with an IC module 2 in which an antenna 2b is mounted on a substrate 2c as an IC chip 2a and a signal transmission / reception unit for R / W (read / write). Since the IC chip 2a has a weak point pressure strength, it has a reinforcing plate 2d in the vicinity of the IC chip. The key information portion 3 of the IC card 1 is attribute identification information for identifying the IC card 1 and other cards, and is, for example, a code number given to the surface of the IC card 1. The character information section 4 of the IC card 1 is a name, a workplace, an issue date, and the like attached to the surface of the IC card 1, and the image information section 5 is image information such as a face.

  FIG. 2 is a cross-sectional view schematically showing the layer configuration of the IC card. This is a configuration of the IC card 1 in which the IC module 2 is enclosed in the adhesive layers 6 and 7 interposed between the first sheet material 10 and the second sheet material 20. An image receiving layer 11 is provided on the first sheet material 10, and personal identification information including a name and a face image shown in FIG. 1 is recorded on the image receiving layer 11. Further, the second sheet material 20 has a writing layer 21 on which writing is possible.

  As the sheet material of the IC card 1 composed of the first sheet material 10 and the second sheet material 20, a sheet material such as resin or paper can be used.

  Next, an embodiment of the IC module will be described with reference to FIGS. 3 is a side view of the IC module, FIG. 4 is a plan view of the IC module, and FIG. 5 is an enlarged view of a portion where the antenna is arranged. The IC module 2 of this embodiment is composed of a nonwoven fabric sheet as at least an IC chip 2a, an antenna 2b and a reinforcing plate 2d connected thereto, and a base material 2c of the IC module 2.

  For the antenna 2b, a method of attaching a wire wound in advance, a conductive paste printing process, a copper foil etching process, or the like is preferably used.

  The antenna 2b of the present invention is preferably covered with the release layer 40 from the viewpoint of strength against external stress. More preferably, the periphery of the antenna 2b is covered with a composition 41 having dilatancy characteristics. The dilatancy characteristic indicates a generally known “characteristic in which the viscosity increases when a stress such as flow or stirring is applied and returns to the original viscosity when the stress is removed”.

  As the composition 41 having the dilatancy characteristic of the present invention, a mixture of a resin material and particles is preferable. As the resin material, a known resin material can be used without limitation. Specifically, epoxy resins, urethane resins, phenol resins, unsaturated polyester resins, silicone-based, cyanoacrylate-based, synthetic rubbers such as nitrile rubber, cellulose-based resins, vinyl acetate-based resins, and the like can be used. A plurality of these can be used. Preferably, as disclosed in JP-A-63-63716, an epoxy resin composition comprising a combination of an epoxy resin and a mercaptan curing agent, an epoxy resin composition comprising a combination of a heterocyclic diamine curing agent, In order to obtain strength, an epoxy resin composed of a combination with an aromatic polyamine curing agent can be used. For example, Cemedine Co., Ltd., Cemedine EP-001; Etc. are preferable.

  As the particles, particles of inorganic compounds such as silica, alumina, magnesia, aluminum nitride, boron nitride, silicon carbide, glass and smectite, and particles of synthetic resin such as acrylic resin and styrene resin are preferable. Among these, synthetic resin particles are particularly preferable because the stress caused by elastic deformation does not remain due to relaxation of stress, and durability can be improved. The shape of the particles is not particularly limited, and spherical particles, tabular particles, acicular particles, irregular particles, porous particles, hollow particles, and the like can be used. The dilatancy of the composition is preferably spherical.

  As a content rate of the particle | grains in the composition which has these dilatancy characteristics, it is preferable that it is 30-80 vol%. When the particle content is less than 30 vol%, the dilatancy of the composition is lowered and the thixotropy is increased, and when it exceeds 80 vol%, the viscosity of the composition is rapidly increased and the fluidity is lowered. Thus, if the dilatancy of the composition cannot be obtained, a sufficient durability effect cannot be obtained. Moreover, as an average particle diameter of particle | grains, it is preferable that it is 5-20 micrometers. When the average particle size is less than 5 μm or more than 20 μm, the dilatancy characteristics are deteriorated and sufficient durability performance cannot be obtained as described above.

  As described above, when the composition 41 having the dilatancy characteristic is around the antenna 2b, the antenna 2b is protected as a hard protective layer in the case of a sudden impact. On the other hand, when a stress is slowly applied from the outside, the flexible protective layer has a followability to deformation.

  In particular, it is most preferable that the composition 41 having dilatancy characteristics is covered with the release layer. By having the release layer 42 in this manner, the release layer portion acts as a buffer layer against internal deformation caused by a sudden impact or a slowly applied stress. As the release layer 42, resins such as acrylic resin having a high glass transition temperature, polyvinyl acetal resin, poly vinyl butyral resin, waxes, silicon oils, fluorine compounds, water-soluble polyvinyl pyrrolidone resin, polyvinyl alcohol resin, Examples of such resins include Si-modified polyvinyl alcohol, methyl cellulose resin, hydroxy cellulose resin, silicone resin, paraffin wax, acrylic modified silicone, polyethylene wax, ethylene vinyl acetate, and other polydimethylsiloxane and modified products thereof such as polyester-modified silicone, Oils and resins such as acrylic-modified silicone, urethane-modified silicone, alkyd-modified silicone, amino-modified silicone, epoxy-modified silicone, and polyether-modified silicone, or UV curable Silicon, the use of such curable silicone compound curable silicone is also effective. Other fluorinated compounds include fluorinated olefins and perfluorophosphate ester compounds. Preferred olefinic compounds include dispersions such as polyethylene and polypropylene, and long-chain alkyl compounds such as polyethyleneimine octadecyl. These release agents having poor solubility can be used after being dispersed.

  Typical examples are modified silicone oils and modified silicone polymers. For example, amino-modified silicone oils, epoxy-modified silicone oils, polyester-modified silicone oils, acrylic-modified silicone resins, urethane-modified silicone resins, and curable silicone compounds are also effective. UV curable silicon, reaction curable silicon, and the like are preferable.

  Next, another embodiment of the IC module will be described with reference to FIGS. FIG. 6 is a side view of the IC module, and FIG. 7 is a plan view of the IC module. In the IC module 2 of this embodiment, a film sheet is used as the substrate 2c, not a non-woven sheet. Thus, as the base material 2c of the IC module 2, various materials such as PET, PET-G, polypropylene, polyethylene, polystyrene, polyethylene naphthalate (PEN), polyimide, nylon, etc. should be used as a film sheet or non-woven fabric. Can do. An IC module 2 in which an IC chip 2a, an antenna 2b, and a reinforcing plate 2d are sandwiched between two opposing non-woven fabrics is preferable from the viewpoint of strength reinforcement of the IC chip 2a and positional accuracy. As a material processed into a nonwoven fabric, a low-shrinkage PET film and a low-shrinkage PEN film are preferable.

The area of the IC chip 2a is preferably 8.5 mm ² or less from the viewpoint of strength, card smoothness and cost, and more preferably in the range of 2.5 mm to 8.5 mm from the viewpoint of workability. The thickness of the IC chip 2a is preferably 50 μm or less from the viewpoint of strength and versatility, and a range of 20 to 50 μm is more preferable from the viewpoint of strength, workability, and cost. If it is thicker than 50 μm, the strength is poor. In order to improve the strength of the IC chip 2a, it is preferable to provide a reinforcing plate made of stainless steel or the like on the IC chip 2a. The reinforcing plate 2d is provided on the IC chip 2a via an adhesive layer 2g. As an adhesive for the adhesive layer 2g, a resin agent generally used is used unless it is contrary to the gist of the present invention. Can be used.

  As the first and second sheet materials 10 and 20 of the IC card of the present invention, polyester resin, polyethylene naphthalate (PEN), ABS resin, polyimide resin, vinyl chloride resin and the like used as various card substrates are used. Resin sheets, thermal transfer paper, high-quality paper, art paper, coated paper, and the like can be used. Among these, white PET is particularly preferable because it has a relatively low load on the environment and is excellent in whiteness and durability.

  In producing the IC card 1, first, a hot melt adhesive is applied to a predetermined thickness on the front and back sheets with an applicator. A hot melt adhesive is preferably used as the adhesive. Even after the hot melt adhesive is once formed into a sheet shape, the function as an adhesive is restored again when heated to a certain temperature. Examples of the hot melt adhesive include moisture curable and photo curable reactive hot melt adhesives, and moisture curable hot melt adhesives are more preferable. Moisture curable reactive hot melt adhesives are disclosed in JP 2000-036026, JP 2000-219855, JP 2000-211278, JP 2000-219855, and Japanese Patent Application 2000-369855. As a coating method, a normal method such as a roller method, a T-die method, or a die method is used. The IC module is mounted between the upper and lower sheets coated with the adhesive. The adhesive applied before mounting may be preheated with a heater or the like. After that, the IC module mounted between the upper and lower sheets is pressed with a press heated to the bonding temperature of the adhesive for a predetermined time, or while the sheet is conveyed in a constant temperature bath at a predetermined temperature instead of pressing with the press. You may crush with a roll. Further, it is effective to perform vacuum pressing in order to prevent bubbles from entering during bonding. After bonding with a press or the like, it is punched into a predetermined shape and cut into a card shape to form a card. Here, after bonding with a press or the like, it is preferable to cut into a sheet and then form a card. When a reactive adhesive is used for the adhesive, it is cut into a card shape after a curing reaction for a predetermined time. However, when cutting into a sheet after cutting into a sheet, the sheet is cut before the adhesive is cured. It is preferable to cut the sheet.

  The IC card 1 of the present invention includes a base film as first and second sheet materials 10 and 20 which are two sheet materials, and an adhesive layer 6 interposed between the first and second base films. , 7. On the outer surface of the first and second base films on the side not through the adhesive layer, there are provided an image receiving layer 11 for recording personal identification information including a name and a face image, and a writable writing layer 21. It is preferable.

As the image receiving layer 11, one that forms a gradation information-containing image by a sublimation type thermal transfer method and a character information-containing image by a sublimation type thermal transfer method or a fusion type thermal transfer method is suitably used. Hereinafter, the components forming the image receiving layer 11 will be described in detail. As the binder for the image receiving layer in the present invention, a conventionally known binder for a sublimation type thermal transfer recording image receiving layer can be appropriately used. As the main binder, various binders such as vinyl chloride resin, polyester resin, polycarbonate resin, acrylic resin, polystyrene resin, polyvinyl acetal resin, and polyvinyl butyral resin can be used. However, if there is a practical requirement for the image formed by the present invention (for example, a predetermined heat resistance is required for the issued ID card), the binder is made to satisfy such requirement. It is necessary to consider the type or combination. Taking heat resistance of the image as an example, if heat resistance of 60 ° C. or higher is required, it is preferable to use a binder having a Tg of 60 ° C. or higher in consideration of bleeding of the sublimable dye. Further, when forming the image receiving layer 11, it may be preferable to contain, for example, a metal ion-containing compound, if necessary. This is particularly the case when the heat transfer compound reacts with the metal ion-containing compound to form a chelate. Examples of the metal ions constituting the metal ion-containing compound include divalent and polyvalent metals belonging to Groups I to VIII of the Periodic Table. Among them, Al, Co, Cr, Cu, Fe, Mg, Mn, Mo, Ni, Sn, Ti, Zn and the like are preferable, and Ni, Cu, Co, Cr, Zn and the like are particularly preferable. As the compound containing these metal ions, inorganic or organic salts of the metal and complexes of the metal are preferable. As a specific example, a complex represented by the following general formula containing Ni2 ⁺ , Cu2 ⁺ , Co2 ⁺ , Cr2 ⁺ and Zn2 ⁺ is preferably used.
[M (Q1) x (Q2) y (Q3) z] P ^+. (L-) P
In the formula, M represents a metal ion, preferably Ni2 ⁺ , Cu2 ⁺ , Cr2 ⁺ , Co2 ⁺ , or Zn2 ⁺ . Q1, Q2 and Q3 each represent a coordination compound capable of coordination with a metal ion represented by M, and may be the same or different from each other. These coordination compounds can be selected from, for example, coordination compounds described in Chelate Science (5) (Nan Edo). L- represents an organic anion group, and specific examples include a tetraphenylboron anion and an alkylbenzenesulfonate anion. x represents an integer of 1, 2 or 3, y represents 1, 2 or 0, and z represents 1 or 0. In these, the complex represented by the above general formula is tetradentate or hexadentate. It is determined by the coordination or by the number of ligands of Q1, Q2 and Q3. p represents 1 or 2. Specific examples of this type of metal source include those exemplified in US Pat. No. 4,987,049. When the metal ion-containing compound is added, the addition amount is preferably 0.5 to 20 g / m ^{2 and} more preferably ¹ to 15 g / m ² with respect to the image receiving layer.

  Further, a release agent may be added to the image receiving layer 11. As the release agent, those compatible with the binder are preferable, and specifically, modified silicone oil and modified silicone polymer are typical, for example, amino-modified silicone oil, epoxy-modified silicone oil, polyester-modified silicone oil, acrylic Examples include modified silicone resins, urethane-modified silicone resins, and waxes.

  A fixed format may be provided on the image receiving layer 11 of the present invention. As a standard format, the printing methods described in Japan Printing Technology Association's “Lithographic Printing Technology”, “New Printing Technology Overview”, “Offset Printing Technology”, “Platemaking / Printing Slightly Illustrated Book”, etc. It is preferable to form by.

  The writing layer 21 can be formed of a binder and an additive. For example, binders include shellac, rosin and derivatives thereof, nitrified cotton and fiber derivatives, polyamide resin, polyacrylate resin, polyvinyl chloride resin, polyvinyl acetate resin, polystyrene resin, petroleum resin, cyclized rubber, chlorinated rubber, chlorine Polypropylene, urethane resin, epoxy resin, polyester resin, acrylic resin, vinyl chloride, vinyl chloride-vinyl acetate copolymer, butyral resin, vinylidene chloride resin, water-soluble resin, and the like can be used. Further, a UV curable resin containing a prepolymer which is copolymerized and cured by ultraviolet rays may be used. Examples of the copolymerizable compound used therefor include polyol acrylate, polyester acrylate, epoxy acrylate, urethane acrylate, and alkyd acrylate. Among these, polyester resins, polyacrylate resins, polyvinyl chloride resins, polyvinyl acetate resins, polyamide resins, and polystyrene resins are preferably used. In addition, as said resin, you may make it use 1 type from the said compound etc., or 2 or more types in mixture. As the additive, an inorganic fine powder, a porous material, or the like can be used. For example, silica (precipitating or gel type), talc, kaolin, clay, alumina white, diatomaceous earth, titanium oxide, calcium carbonate, barium sulfate and the like can be used. Two or more of these may be mixed. As a particle diameter, a thing of 1-10 micrometers can be used, Preferably it is preferable that an average particle diameter is 1-8 micrometers. The weight ratio of the multi-additive to the binder is preferably 20 to 100 parts by weight with respect to 100 parts by weight of the resin in terms of solid content. Other additives may include wax, surfactant, solvent and water, and are not particularly limited. The thickness of the writing layer is preferably 5 to 40 μm, more preferably 5 to 30 μm. In the case of forming the writing layer, an adhesive layer or a cushion layer may be provided in order to improve the adhesion to the support.

  EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, the aspect of this invention is not limited to this. In the following, “part” means “part by weight”.

[Example 1]
"Creating an IC module"
To copper wire for winding type antenna coil, silicon release agent (made by Toray Dow Corning Silicone, SRX-211 (trade name: catalyst SRX-212 is 1 part by weight with respect to 100 parts by weight of SRX-211) Spray coating, followed by drying and curing in a hot air circulating oven at 180 ° C. for 30 seconds to produce a wound-type antenna coil covered with a release layer. As a composition having a resin material “Ultite 1540: Toho Kasei Kogyo Co., Ltd.” containing 30 vol% of particles “polymethyl methacrylate (PMMA) particles having an average particle size of 5 μm” around the antenna coil by potting coating Furthermore, a silicone oil is sprayed on the outer surface of the dilatancy composition. A release layer was provided Ingu.

Next, an IC chip having a thickness of 50 μm and a 3 × 3 mm square is brought into close contact with a 120 × m 4 × 4 mm square plate reinforcing plate made of SUS301. Bonded and joined. Further, an IC module was produced by sandwiching from both sides with a nonwoven fabric made of polyethylene terephthalate fiber.
"Creating an IC card"
The first sheet material has a sublimation type thermal transfer image receiving layer shown below on one surface side of a white PET film support having a thickness of 188 μm. The image-receiving layer for sublimation thermal transfer is composed of a material that traps and fixes the dye when the sublimation dye ink is heated and thermally diffused by the thermal head. Dissolve the vinyl chloride powder in the methyl ethyl ketone solvent and use the gravure coater many times. It was formed by coating and then drying to evaporate the solvent. The thickness of the image receiving layer for sublimation thermal transfer is 2.5 μm.

  On the image receiving layer thus created, as shown in FIG. 8, a standard format print (XX employee ID, name, ruled line, ID number, affiliation) was used on the image receiving layer using a resin relief plate. The dry offset printing method was used.

  The second sheet material has a writing layer on one side of the white PET film support having the same thickness as the first sheet material and having a thickness of 188 μm. The writing layer is obtained by diffusing calcium carbonate and silica fine particles in a polyester emulsion. Similarly to the image receiving layer of the first sheet material, the writing layer is dissolved with a solvent, applied with a gravure coater, etc., and then dried to remove the solvent. Vaporized to form. The thickness of the writing layer is almost the same as that of the image receiving layer.

A moisture curable hot melt is applied to the surface of the first sheet material opposite to the surface having the image receiving layer and the surface of the second sheet material opposite to the surface having the writing layer with a T-die type applicator. Adhesive (Sekisui Chemical Co., Ltd. product: Sdyne 2013MK) is applied, the IC module is sandwiched between the first and second sheet materials, 5 mmf under the condition of 120 ° C. using an end plate flat heat press. This was thermocompression bonded at / cm ² and punched out into a card shape to produce an IC card having a thickness of 760 μm including an IC chip and an antenna coil.
[Example 2]
"Creating an IC module"
After spray coating silicon mold release agent (made by Toray Dow Corning Silicone, SRX-211 (trade name: 1 part by weight of catalyst SRX-212 with respect to 100 parts by weight of SRX-211) on aluminum antenna pattern) The aluminum antenna coil was dried and cured by heat treatment for 30 seconds in a hot air circulation oven at 180 ° C. to prepare an aluminum antenna coil covered with a release layer, and then a resin material “Ultite 1540 as a composition having dilatancy characteristics. : Toho Kasei Kogyo Co., Ltd. ", 80% by volume of silica particles with an average particle size of 20 μm” were provided around the antenna coil by potting application, and silicon oil was applied to the outer surface of the dilatancy composition. A release layer was provided by spray coating.

Next, the antenna coil is placed on a transparent polyethylene terephthalate sheet having a thickness of 38 μm as a flat substrate, and the bumps of the IC chip having a length of 3.0 mm, a width of 3.0 mm, and a thickness of 100 μm are connected to both terminals of the aluminum antenna. An IC module was manufactured by bonding with a silver paste, and providing a reinforcing plate made of stainless steel with a length of 5 mm, a width of 5 mm, and a thickness of 100 μm on the IC chip through an adhesive layer on the opposite side.
“Creation of IC card” was performed in the same manner as in Example 1.
[Comparative Example 1]
"Creating an IC module"
A resin material “Ultite 1540: Toho Kasei Kogyo Co., Ltd.” containing 20 vol% of particles “alumina particles having an average particle diameter of 2 μm” was provided around the antenna coil by potting coating. Next, the antenna coil is placed on a transparent polyethylene terephthalate sheet having a thickness of 38 μm as a flat substrate, and the bumps of the IC chip having a length of 3.0 mm, a width of 3.0 mm, and a thickness of 100 μm are connected to both terminals of the aluminum antenna. An IC module was manufactured by bonding with a silver paste, and providing a reinforcing plate made of stainless steel with a length of 5 mm, a width of 5 mm, and a thickness of 100 μm on the IC chip through an adhesive layer on the opposite side. “Creating an IC card” was the same as in Example 1.
[Comparative Example 2]
"Creating an IC module"
Potting a copper wire for a wound type antenna coil containing 85 vol% of particles “polymethyl methacrylate (PMMA) particles with an average particle size of 30 μm” in a resin material “Ultite 1540: Toho Kasei Kogyo Co., Ltd.” It was provided around the antenna coil by coating. Next, an IC chip having a thickness of 50 μm and a 3 × 3 mm square is brought into close contact with a 120 × m 4 × 4 mm square plate reinforcing plate made of SUS301. Bonded and joined. Further, an IC module was produced by sandwiching from both sides with a nonwoven fabric made of polyethylene terephthalate fiber. “Creating an IC card” was the same as in Example 1.
An IC card was prepared by providing personal identification information consisting of name and face image on the IC card as follows.

(Face image formation)
The image receiving layer and the ink side of the following sublimation type thermal transfer recording ink sheet are overlapped, and the output from the ink sheet side is 0.23 W / dot, pulse width is 0.3 to 4.5 ms, dot density is 16 dots. A person image having gradation in the image was formed on the image receiving layer side by heating under the condition of / mm. In this image, the dye and the nickel of the image receiving layer form a complex.

(Formation of character information)
The image receiving layer and the ink side of the following ink sheet for melt type thermal transfer recording are superposed from the ink sheet side using a thermal head, and the output is 0.5 W / dot, the pulse width is 1.0 ms, and the dot density is 16 dots / mm. Character information was formed by heating with.

“Creation of ink sheet for sublimation thermal transfer recording”
A 6 μm-thick polyethylene terephthalate sheet with anti-fusion processing on the back side is coated with a yellow ink layer forming coating liquid, a magenta ink layer forming coating liquid, and a cyan ink layer forming coating liquid each having a thickness of 1 μm. Thus, ink sheets of three colors of yellow, magenta and cyan were obtained.

<Coating liquid for yellow ink layer formation>

<Coating liquid for magenta ink layer formation>

<Cyan ink layer forming coating solution>

"Creation of ink sheet for melt type thermal transfer recording"
An ink sheet was obtained by applying and drying an ink layer forming coating solution having the following composition to a polyethylene terephthalate sheet having a thickness of 6 μm that had been processed to prevent fusing on the back surface to a thickness of 2 μm.

<Ink layer forming coating solution>

"Evaluation"
The finished IC card was evaluated for the repeated bending test, twist test, and communication test and shown in Table 1.
table 1

"Repeated bending test"
Using a sag test apparatus of JIS K6404-6, bending was repeated 100 times each with n = 100 at an amplitude of 50 mm, a gap of 30 mm, and 120 times / minute. The state after the test was visually evaluated according to the following criteria.

    ○: No peeling of the sheet material.

    Δ: The sheet material peeled off at a level of 1 × 1 mm square or less.

X: Detachment exceeding Δ level can be confirmed.
"Torsion test"
It was held without tightening both ends in the card long side direction, and 1000 cycles were carried out at ± 15 ° centered on the card short side position. Evaluation was carried out according to the same criteria as the above “repetitive bending test”.
"Communication test"
The IC card of the card after the above “repeated bending test” and “twist test” is tested with “IC card reader / writer: manufactured by Denshi Wave Co., Ltd.” to determine whether communication (read / write performance) is a problem. Went.

        ○: Read and write can be performed without problems.

        ×: Read / write is not possible.

  The present invention can be applied to information recording media such as non-contact type electronic cards and IC cards that store personal information etc. that require safety (security) such as counterfeiting and alteration prevention, and bend resistance and twist resistance. Excellent durability.

It is a top view which shows the structure of an IC card. It is sectional drawing which shows the layer structure of an IC card typically. It is a side view of an IC module. It is a top view of an IC module. It is an enlarged view of the part by which an antenna is arrange | positioned. It is a side view of an IC module. It is a top view of an IC module. It is a print diagram of a fixed format.

Explanation of symbols

1 IC card
2 IC module
2a IC chip
2b antenna
2c Substrate
2d reinforcement plate
40, 42 release layer
41, Composition having kudailatancy characteristics

Claims (7)

In an information recording medium in which an IC module having an IC chip and an antenna connected to the IC chip is arranged,
An information recording medium wherein the antenna is covered with a release layer.   2. The information recording medium according to claim 1, wherein the periphery of the antenna is covered with a composition having a dilatancy characteristic.   3. The information recording medium according to claim 2, wherein the composition having the dilatancy characteristic is covered with a release layer. In an IC card formed by bonding an IC module and an adhesive between two sheet materials,
4. An IC card, wherein at least the IC module is the IC module according to any one of claims 1 to 3.   5. The IC card according to claim 4, wherein the adhesive is a reactive hot melt adhesive.   6. The IC card according to claim 4, wherein an image receiving layer for recording personal identification information including a name and a face image is provided on at least one of the sheet materials. 7. One of the sheet materials is provided with personal identification information including at least a name and a face image, and has a writing layer capable of writing on the other sheet material. IC card.