JP2002334315A - Ic mounted body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC mounted body which has superior rust preventing property by forming a protection film on a transmission and reception part made of metal. SOLUTION: The IC mounted body equipped with a surface base material 11, an adhesive layer 12, and a data storage element 13 composed of a data storage part 13a and the transmission and reception part 13b has the protection film 14 formed on the transmission and reception part 13b. The protection film 14 is used as a resist film for etching the transmission and reception part 13b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package having a data storage element, and more particularly, to an IC package having a protective film in a data transmitting / receiving section.

[0002]

2. Description of the Related Art Conventionally, an automatic recognition management system using a bar code has been used for merchandise management in distribution and sales. The barcode is an information of the arrangement state of images (bars), and the information can be read by a dedicated barcode reader (reader). For this reason, for example, merchandise management and distribution management are performed by attaching a barcode recording merchandise information to the merchandise. However, the barcode has a problem that a large amount of information cannot be recorded, the information cannot be updated, and forgery is easy. Therefore, in recent years, RFID (Radio Frequency
A system called Identification (Radio Frequency Recognition) is drawing attention.

In this system, a large amount of information is stored in a semiconductor (IC) chip, and a planar antenna for transmitting and receiving information is connected to the IC chip. Then, when a radio wave of a predetermined frequency emitted by the reader is received by the antenna,
According to this radio wave, information stored in the internal IC chip is transmitted to the reader via the antenna. Update information from the reader is also transmitted to the IC chip via the antenna, and the stored information of the IC chip is updated (hereinafter, the IC chip and the antenna, and further, a predetermined capacitor, etc. are used). "IC module"
It is written. ).

[0004] This IC module is first put into practical use as an IC card. In this case, an IC card in which the IC module is held in hard plastic is manufactured by sandwiching the IC module with a plastic film or the like and appropriately performing thermocompression bonding. The IC card is provided to the user as appropriate, for example, as an employee ID card. On the other hand, from the viewpoint of merchandise management and distribution management, it is more convenient to be able to attach the IC module to merchandise. Because of this, I
Various adhesive labels incorporating a C module have been proposed.

[0005] Adhesive labels with built-in IC modules are:
A pressure-sensitive adhesive layer is formed on one surface of the surface substrate, and the pressure-sensitive adhesive layer has a data storage and / or arithmetic unit (hereinafter, referred to as a data storage unit).
This will be referred to as “data storage unit”. ) And a transmission / reception unit (antenna) made of metal.

[0006]

Generally, aluminum,
The exposed surface of the transmitting / receiving unit made of a metal such as copper is in direct contact with the object. Therefore, the transmission / reception unit has a problem that when the rust is generated due to the influence of the target object or when the pressure-sensitive adhesive label is displaced by an external force, it is peeled off from the pressure-sensitive adhesive layer. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide an IC package having a protective film formed on a transmitting / receiving section made of metal and exhibiting an excellent rust prevention effect.

[0007]

An object of the present invention is to provide an IC package having a surface base material, an adhesive layer, and a data storage element including a data storage section and a transmission / reception section, wherein the transmission / reception section is protected. The problem can be solved by an IC package having a film formed thereon. It is preferable that the protective film is a resist film for etching of the transmitting and receiving unit.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
FIG. 1 is a sectional view showing a data storage element holding label as a first embodiment of an IC package according to the present invention. FIG. 2 is a plan view showing the data storage element holding label of FIG. In the data storage element holding label 10, an adhesive layer 12 is formed on one surface 11 a of a surface substrate 11, and the data storage element 13 is held on the adhesive layer 12. The exposed surface 12a side of the pressure-sensitive adhesive layer 12, that is, the surface side on which the surface base material 11 is not provided can be stuck to the object 20. The protective film 14 is formed on the entire surface 13c of the transmitting / receiving section.

In the data storage element holding label 10, the data storage element 13 is provided on the exposed surface 12 a of the adhesive layer 12.
It is arranged from the side and held by the adhesive layer 12, and the other surface 13 d of the data storage element is in close contact with the surface of the adhesive layer 12. When the data storage element holding label 10 is attached to the object 20, the protective film 14 of the data storage element 13 comes into contact with the object 20 and the adhesive layer 1
2 is entirely covered with a surface substrate 11. Such a data storage element holding label 10 is generally used in FIG.
As shown in (2), the sheet is stored and distributed with the release paper 15 provided on the surface in contact with the object 20, that is, on the exposed surface 12a side of the adhesive layer 12.

The data storage element 13 used here is not particularly limited, and one having a thickness of 50 to 500 μm is used. Generally, the transmission and reception of a substantially flat plate as shown in FIGS. One having a unit 13b and a data storage unit 13a protruding from one surface of the transmission / reception unit 13b is used. As such a data storage element 13, an IC module put into practical use in an IC card or the like can be used. For example, an IC module 30 as shown in FIG. 4 can be exemplified. The IC module 30 has an antenna coil 17 formed on a substrate 16 corresponding to the transmission and reception unit 13b having a substantially flat plate shape.
An IC chip 18 corresponding to the data storage unit 13a is arranged on one surface of the IC chip. Then, the antenna coil 17
Are connected by an anisotropic conductive tape 17a.
The C chip 18 and the antenna coil 17 maintain conductivity. Further, the transmission / reception unit 13b is not limited to the antenna coil 17, and may be a plate antenna formed on a substrate.

In the IC module 30, a metal film made of a metal such as aluminum or copper is formed on the substrate 16, and both ends of the antenna coil 17 are connected in advance with an anisotropic conductive tape 17a, and are etched. A pattern of the protective film 14 is provided on a portion where the antenna coil 17 and the anisotropic conductive tape 17a remain in the processing, and a portion other than the pattern is dissolved and removed in an acid or alkali solution,
The antenna coil 17 is used. The antenna coil 17 remains covered with the protective film 14, and its surface is protected.

The antenna coil 17 is made of aluminum,
Metallized film of copper, gold, zinc, nickel, tin, various alloys, or aluminum foil, copper foil, gold foil manufactured by electrolytic method, rolling method, precision rolling method, stamping method (mainly for arts and crafts) And metal foils such as silver foil, zinc foil, nickel foil, tin foil, and various alloy foils. In general, it is preferable that these metal vapor-deposited films or metal foils are subjected to an easy-adhesion treatment on a side to be adhered to the substrate 16. The larger the unevenness due to the easy bonding process, the higher the bonding strength, but if too large, the strength of the metal deposition film or metal foil may be weak. In addition, since the surface of a metal vapor-deposited film or metal foil is usually oxidized by air, it is preferable to perform an antioxidant treatment, and it is preferable to provide a protective film 14.

In general, as a metal forming a metal deposition film or a metal foil used for an etching pattern, aluminum and copper can be mentioned. Aluminum is preferable because it has higher stretchability than copper and is easily connected when mechanically processed. The melting point of aluminum is 660.
C., which is about 400.degree. C. lower than that of copper at about 1080.degree. Therefore, the antenna coil 17 and I
The amount of heat applied when the C chip 18 is connected by welding can be reduced, and when a heat-sensitive film is used as the substrate 16, damage to the film can be reduced, which is preferable. Since the antenna coil 17 is covered with the protective film 14, the antenna coil 17 and the IC
Since air can be shut off when the tip 18 is welded, it is possible to weld aluminum that is difficult in air.

Since aluminum has a higher metal dissolution reactivity during etching than copper, the antenna coil 17
Is made of aluminum, the production efficiency is high. Further, aluminum is called an amphoteric metal and can be dissolved by not only acids but also alkalis. Etching of aluminum is performed with either an acid or alkali solution.

The protective film 14 can be provided by bonding films, applying or printing a resin for forming the protective film, or the like. The protective film 14 may be provided on the substrate 16 as well as on the metal deposition film or the metal foil. When a metal deposition film or a metal foil is chemically etched, a protective film provided before the etching step to leave a necessary pattern is called a resist.

When the protective film 14 is formed of a film, the film is bonded on a metal deposition film or a metal foil. As a method of laminating the films, there are a method of using a film provided with an adhesive in advance, and a method of heat sealing with heat. When the protective film 14 is applied, a method of immersing the IC module 30 in an impregnation tank, when using a coating head such as a gravure, bar, air knife, slit die, etc., are usually used such as spin coating, spray coating, and vapor deposition. It is possible to provide by the method which is. If the protective film 14 is too thick, the connection cannot be made or becomes unstable in the case of welding, and if the protective film 14 is too thin, the protective performance at the time of etching deteriorates. Therefore, the thickness of the protective film is preferably 0.1 to 20 μm. .

It is preferable to use the resist pattern at the time of etching as it is as the protective film 14, since the step of removing the protective film 14 can be omitted and the manufacturing cost can be reduced. For the resist pattern, various inks having good adhesion with a metal deposition film or metal foil suitable for each printing method can be used. The characteristics of the ink used depend on whether the etchant used is acidic or alkaline.
It is preferable not to use resins, pigments, and other additives that react with the etching solution and deteriorate the performance of the resist film. Some inks are resistant to both acidity and alkalinity, and such inks can be used.
As a resist film, an ink to be used is one cured by radiation such as UV (ultraviolet light) or EB (electron beam) or cured by ion, moisture, drying, heat or the like. As a printing method, a method used in a standard method such as gravure printing, offset printing, screen printing, letterpress printing, or the like can be used.

The metal deposition film and the metal foil may come into contact with each layer constituting the data storage element holding label 10. Therefore, when a substance which promotes corrosion existing in the material constituting each layer, for example, sodium ions, halogen ions, etc., is contained, if a protective film is provided, these ions can be blocked, so that the durability is improved. It is preferable because the property is improved.

Protective film 14 as resist at the time of etching
Is used, only the upper surface of the metal deposition film or metal foil pattern left by etching is covered with the protective film 14, and the metal foil is exposed on the side surfaces, so that the protective film is provided on the entire surface. Although complete protection is not possible as compared with the case, the thickness of the metal deposition film or the metal foil is extremely thin compared to the width of the pattern of the antenna coil 17, and the performance is not greatly reduced.

The pattern of the antenna coil 17 is formed as follows.
It can be performed as follows. A photosensitive resin layer is provided on a metal vapor-deposited film or a metal foil of the IC module 30, and the pattern of the antenna coil 17 is exposed to light by using a mask of the pattern of the antenna coil 17 formed of a negative or positive photographic film or a chrome film. The pattern of the antenna coil 17 is directly drawn on the metal vapor-deposited film or the metal foil of the IC module 30 by various methods such as printing on the resin layer or printing or lettering. Using the pattern of the antenna coil 17 thus formed as a mask, unnecessary metal portions other than the pattern portion of the antenna coil 17 are melted by so-called etching using an etching solution such as a ferric chloride solution or a caustic soda solution. And required antenna coil 17 by metal deposition film or metal foil
The IC module 30 is manufactured by forming the above pattern.

The area of the metal deposition film or metal foil portion remaining on the IC module 30 depends on the shape of the pattern of the antenna coil 17, but it is thermally fused when assembling a data storage element holding label, which will be described later.
In the case where the metal layer is bonded to another coating layer, the area of the metal deposition film or metal foil portion remaining after etching is 90% of the entire area of the IC module 30 so that the bonding portion between the resin materials can be sufficiently secured. It is preferable to make the following.

As the surface substrate 11, cellophane, polyethylene, polypropylene, soft polyvinyl chloride, hard polyvinyl chloride, polyester (for example, polyethylene terephthalate, ethylene glycol, 1,
It is obtained by polymerizing 4-cyclohexanedimethanol and terephthalic acid, and the ethylene glycol residue in the dialcohol residue in the polymer is 80 to 95 mol%,
4 to 20 mol% of 4-cyclohexanedimethanol residues
A film mainly composed of a resin such as a polyester resin), a polystyrene, a polyurethane, a foamed film mainly composed of these resins, and foamed by blending a foaming agent. And / or organic pigments, and films such as porous films formed with voids by stretching, synthetic papers, non-woven fabrics,
Or high quality paper, art paper, coated paper, cast coated paper, kraft paper, polyethylene laminated paper, impregnated paper,
Paper such as foamed paper and water-soluble paper, as well as thermal recording paper,
Known insulating sheets such as an ink jet recording sheet and a recording sheet such as a thermal transfer receiving sheet may be used, and these may be used alone or a plurality of these may be appropriately laminated and used.

On the outer surface of the surface substrate 11, printing is performed to provide a predetermined design effect or to write necessary information, and information about the object 20 is printed and displayed. It is preferable to be able to do so. In particular, it is preferable to provide an area that can be printed by various printers on the surface substrate 11 because individual information can be printed by a computer or the like. For example, if at least a part of the surface substrate 11 can be printed by a thermal printer as thermal recording paper, or if at least a part of the surface substrate 11 has predetermined ink receptivity and can be printed by an inkjet printer, Good. In particular, it is preferable to form a rewritable recording paper such as a reversible thermosensitive recording paper because display information can be updated. The thickness of the surface substrate 11 is usually 30.
３００300 μm.

The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 12 includes
There is no particular limitation, and a rubber-based adhesive obtained by adding a tackifier resin such as rosin and rosin ester to natural rubber, an acrylic adhesive composed of a copolymer of acrylic acid and its ester, and a vinyl ether-based adhesive Emulsion-type, solvent-type, hot-melt-type pressure-sensitive adhesives such as urethane-based pressure-sensitive adhesives can be used, and depending on the application, use pressure-sensitive adhesives for permanent adhesion, strong adhesion, cold food, re-peeling, etc. it can. Further, a rust preventive may be added to the pressure-sensitive adhesive layer 12, so that the corrosion of the transmitting and receiving unit 13b due to the components of the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 12 can be prevented. The pressure-sensitive adhesive layer 12 is usually formed with a thickness of 5 to 50 μm, preferably 7 to 30 μm.

The pressure-sensitive adhesive layer 12 is formed by adding a masking agent to the pressure-sensitive adhesive and imparting a masking property, so that the color of the object 20 can be adjusted even if the opacity of the surface substrate 11 used is low. The data storage element holding label 10 having a high concealing property can be obtained without affecting the appearance. If the concealability of the data storage element holding label 10 is high, it is difficult to determine the location of the data storage element 13 from the outside, and it is possible to prevent fraudulent acts such as impersonation of the data storage element 13. As the concealing agent, aluminum, titanium oxide, carbon black coloring agent, or the like is used. The pressure-sensitive adhesive layer 12 includes
If necessary, auxiliaries such as a tackifier, a crosslinking agent, a pigment, and an ultraviolet absorber may be added.

The pressure-sensitive adhesive layer 12 is formed on the surface substrate 11.
As a method, apply an adhesive on release paper in advance and dry it.
After drying, the surface substrate 11 is laminated thereon,
Of transferring the pressure-sensitive adhesive layer 12 on the surface substrate 11
The adhesive is applied directly to the substrate and dried to provide the adhesive layer 12
There are methods. The adhesive layer 12 is made of a reverse roll coat.
, Knife coater, bar coater, slot die coater,
Lip coater, air knife coater, reverse gravure
Coater, bariogravure coater, etc. on release paper or
It is applied on the surface substrate 11 and then dried. Adhesive
Is 5 to 50 g / m2 in dry weight.^Two, More preferred
7 to 30 g / m^TwoIt is. 5g / m^TwoLess than, subject
In some cases, the adhesion to the object 20 may be insufficient.
0 g / m ^TwoIf it exceeds, the adhesive may protrude or
When adhering to the object 20, cohesive failure occurs when peeling from release paper.
May cause.

Substrate 16 used for data storage element 13
When the transmitting and receiving unit 13b is the antenna coil 17, polyethylene terephthalate (hereinafter, “PET”)
Abbreviated. ), Polypropylene (hereinafter abbreviated as “PP”), polyethylene (hereinafter abbreviated as “PE”), or a resin having a thickness of 20 to 100 μm. As a method of forming the antenna coil 17 on the substrate 16, a method of attaching a coil made of a wire such as silver or copper, or etching a vapor-deposited film of copper or aluminum formed on the substrate 16 into a coil shape. And a method of printing conductive ink or the like in a coil shape or the like. Examples of the substrate used for the plate antenna include films and paper such as PET, PP, and PE. Examples of a method for forming the plate antenna include a method of printing a conductive ink or the like, a method of depositing a metal such as copper or aluminum, and the like. Usually, the IC chip 18 has a length of 0.5 to 10 mm and a thickness of 5 to 10 mm.
Those having a size of about 0 to 300 μm are used.

Examples of the release paper 15 include high-density paper such as glassine paper, clay-coated paper, kraft paper, and high-quality paper laminated with a resin film such as PE, so-called poly-laminate paper, or kraft paper or fine paper. Emulsion-type, solvent-type or non-solvent-type on resin-coated base paper provided with a filler layer containing a water-soluble polymer such as polyvinyl alcohol and starch and a pigment as main components, or a film such as PP or PET. After applying a silicone resin, a fluororesin or the like to a dry weight of about 0.05 to 3 g / m ² , a release agent layer formed by heat curing, electron beam curing, ultraviolet curing, or the like is appropriately used. . The thickness of the release paper 15 is not limited, but is usually 30 to
It is 300 μm.

FIG. 5 is a sectional view showing a data storage element holding label as a second embodiment of the IC package according to the present invention. In such a data storage element holding label 10, as shown in FIG. 5, the second adhesive layer is formed on the surface of the data storage element 13 that does not have the first adhesive layer 12c, that is, on the protective film 14. The agent layer 12d may be laminated. By providing the second pressure-sensitive adhesive layer 12d, the second pressure-sensitive adhesive layer 12d more strongly adheres to the object 20 and is hardly peeled off, and the second pressure-sensitive adhesive layer 12d acts as a buffer material, and the data storage element 13 is more damaged. It becomes difficult to do. As the pressure-sensitive adhesive or the like forming the second pressure-sensitive adhesive layer 12d, those exemplified for the pressure-sensitive adhesive layer 12 can be similarly used.

FIG. 6 is a sectional view showing a data storage element holding label as a third embodiment of the IC package according to the present invention. In this embodiment, the data storage element holding label 10
The data storage element 13 is embedded in the surface base 11 side by using a material having elasticity and a thickness greater than that of the data storage element 13 as the surface base material 11, and the other surface of the data storage element 13 is used. A protective film 14 is formed on 13c, and the surface facing the object 20 and the exposed surface 12a of the adhesive layer 12 are flush with each other. In this embodiment, the data storage element 13 is embedded on the surface substrate 11 side, and furthermore,
Since the pressure-sensitive adhesive layer 12 exists between the data storage element 13 and the surface substrate 11, the data storage element holding label 10
When the impact from the side and above is applied, the destruction of the data storage unit 13a can be preferably prevented. Further, the outer surface of the surface substrate 11 becomes flat.

FIG. 7 is a sectional view showing an IC card as a fourth embodiment of the IC package according to the present invention. The IC card 40 has a protective film 14 formed on one surface 13c of the data storage element 13 and a first adhesive layer 33 formed on one surface 31a of one surface substrate 31. The data storage element 33 is held by the first adhesive layer 33. Furthermore, the exposed surface 33a of the first pressure-sensitive adhesive layer 33
The side, that is, the side on which the surface base material 31 is not provided, is adhered to the second pressure-sensitive adhesive layer 34 formed on one surface 32 a of the other surface base material 32.

The surface substrates 31 and 32 are obtained by polymerizing polyester (for example, polyethylene terephthalate, polybutylene terephthalate, ethylene glycol, 1,4-cyclohexane dimethanol and terephthalic acid), A polyester resin having 80 to 95 mol% of ethylene glycol residues and 5 to 20 mol% of 1,4-cyclohexanedimethanol residues), acrylonitrile, soft polyvinyl chloride, hard polyvinyl chloride, polycarbonate,
Acrylonitrile-butadiene-styrene copolymer (hereinafter abbreviated as "ABS") resin, a film mainly composed of a resin such as cellophane, polyethylene, polypropylene, polystyrene, polyurethane, and the like; A foamed film blended and foamed, a film such as a porous film blended with an inorganic and / or organic pigment containing these resins as a main component, and forming a void by a stretching treatment, a synthetic paper, a nonwoven fabric, or Fine paper, art paper, coated paper, cast coated paper, kraft paper, polyethylene laminated paper, impregnated paper, foamed paper, water-soluble paper and other papers, as well as thermal recording paper, inkjet recording paper, thermal transfer receiving sheets, etc. Well-known insulating sheets such as recording sheets, metal sheets, etc. can be used alone or as a mixture. It is. In addition, the surface base materials 31, 32
On the other surfaces 31b and 32b, desired patterns, explanatory characters, and the like may be printed by offset printing, silk screen printing, or the like. The IC card is formed into a card by punching after the respective layers constituting the IC card are laminated. Printing on the surface base materials 31 and 32 may be performed before or after punching.

As the pressure-sensitive adhesive constituting the first pressure-sensitive adhesive layer 33 and the second pressure-sensitive adhesive layer 34, the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 12 is used.

A specific example will be described below with reference to FIGS. (Example 1) PE having a transparent thickness of 50 μm as a substrate 16
T film (manufactured by Teijin Limited) was used. On this substrate 16,
A 20 μm-thick aluminum foil (manufactured by Toyo Aluminum Co., Ltd.) having irregularities on the bonding surface was bonded by a dry lamination method with a polyester-based adhesive to obtain a circuit substrate. A heat-drying property (trade name: Resist Brytop A, manufactured by Dainippon Ink) was printed on the circuit substrate by gravure printing in a desired antenna circuit pattern to form a protective film 14 in an etching step. The antenna coil 17 was formed by etching the aluminum foil portion on which no resist was printed with a caustic soda solution.

Next, the IC chip 18 is pressed against the antenna coil 17 formed on the circuit substrate with two electrodes of a resistance welding machine with a load of 200 g while the protective film 14 remains. Welded through electricity. The protection film 14 is broken, and the IC chip 18 is bonded to and electrically connected to the antenna coil 17 provided below, so that the IC module 3
0 was obtained.

An acrylic pressure-sensitive adhesive (trade name: SVP101, manufactured by Seiden Chemical Co., Ltd.) was prepared as a pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 12, and the acrylic pressure-sensitive adhesive was peeled off using a hand applicator to remove commercially available glassine. After coating on paper and drying at 100 ° C. for 2 minutes, a commercially available thermosensitive paper having an IC module 30 adhered to the back surface was attached to obtain a data storage element holding label 10.

Example 2 A data storage element holding label 10 was obtained in the same manner as in Example 1 except that the connection between the antenna coil 17 and the IC chip was mechanically processed.

(Overview of Card Reading Test Procedure) The data storage element holding label 10 obtained in the first and second embodiments.
Was measured. Network analyzer 10
1 (model R3754B, manufactured by Advantest Co., Ltd.), the resonance frequency of the data storage element holding label 10 was measured by a measuring instrument connected to a loop antenna having a diameter of 5 cm.
It was confirmed that the frequency was 3.56 MHz. Next, the communication distance of the data storage element holding label 10 was measured. It was confirmed that communication was possible from a distance of 90 mm using a reader / writer (manufactured by Siemens) connected to a personal computer. As described above, it was confirmed that the data storage element holding label 10 satisfies the required resonance frequency and communication distance.

[0039]

As described above, the IC package according to the present invention is an IC package including a surface base material, an adhesive layer, and a data storage element including a data storage section and a transmission / reception section. Thus, since the protective film is formed on the transmitting / receiving section, an excellent rust-preventing effect is exhibited on the transmitting / receiving section made of metal. Therefore, the data storage element holding label having such a configuration can maintain its performance for a long time,
Suitable for the system. Further, since the transmitting / receiving section is protected by the protective film, the transmitting / receiving section is not peeled or damaged by an unintended external impact. In addition, since the protective film is an etching resist film for the transmission / reception unit, it is not necessary to form a protective film again, and a step of removing the etching resist film can be omitted. Can be reduced.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of an IC package according to the present invention.
It is sectional drawing which shows a data storage element holding label.

FIG. 2 is a plan view showing the data storage element holding label of FIG. 1;

FIG. 3 shows a first embodiment of an IC package according to the present invention.
FIG. 4 is a cross-sectional view showing a data storage element holding label and showing a state where release paper is provided.

FIG. 4 is a plan view illustrating one mode of a data storage element.

FIG. 5 shows a second embodiment of the IC package according to the present invention.
It is sectional drawing which shows a data storage element holding label.

FIG. 6 shows a third embodiment of the IC package according to the present invention.
It is sectional drawing which shows a data storage element holding label.

FIG. 7 shows a fourth embodiment of the IC package according to the present invention.
It is sectional drawing which shows an IC card.

[Explanation of symbols]

10: data storage element holding label, 11: surface substrate, 1
2: adhesive layer, 13: data storage element, 13a: data storage section, 13b: transmission / reception section, 14: protective film, 20: target

Continued on the front page (72) Inventor Yasuhito Tai 4-7-5 Ginza, Chuo-ku, Tokyo Oji Paper Co., Ltd. F-term (reference) 2C005 MA11 MB10 NA06 PA04 4M109 AA02 BA03 DB15 ED01 EE20 GA03 5B035 BA05 BB09 CA01 CA23

Claims (2)

[Claims] 1. An IC comprising a surface base material, an adhesive layer, and a data storage element including a data storage unit and a transmission / reception unit.
An integrated circuit, wherein a protective film is formed on the transmitting / receiving unit.
Implementation body. 2. The IC package according to claim 1, wherein the protective film is a resist film for etching the transmitting and receiving unit.