WO2005038998A1 - Oscillateur laser a l'etat solide et appareil de faisceau laser a l'etat solide - Google Patents

Oscillateur laser a l'etat solide et appareil de faisceau laser a l'etat solide Download PDF

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Publication number
WO2005038998A1
WO2005038998A1 PCT/JP2003/013280 JP0313280W WO2005038998A1 WO 2005038998 A1 WO2005038998 A1 WO 2005038998A1 JP 0313280 W JP0313280 W JP 0313280W WO 2005038998 A1 WO2005038998 A1 WO 2005038998A1
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Prior art keywords
solid
cooling water
unit
state laser
laser oscillator
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Application number
PCT/JP2003/013280
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English (en)
Japanese (ja)
Inventor
Takeshi Morimoto
Toshiki Koshimae
Toshiaki Watanabe
Kenji Kumamoto
Original Assignee
Mitsubishi Denki Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Denki Kabushiki Kaisha filed Critical Mitsubishi Denki Kabushiki Kaisha
Priority to PCT/JP2003/013280 priority Critical patent/WO2005038998A1/fr
Publication of WO2005038998A1 publication Critical patent/WO2005038998A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing

Definitions

  • the present invention relates to a solid-state laser oscillator and a solid-state laser processing device having a countermeasure for preventing corrosion of a heat sink of a semiconductor laser that excites a solid-state laser medium.
  • FIG. 8 is a schematic configuration diagram showing an oscillator, a processing head, a workpiece, and a laser beam optical path of a conventional solid-state laser processing apparatus. 1 9 Oscillator head.
  • 20 is a resonator
  • 21 is a partial reflection mirror
  • 22 is a total reflection mirror
  • 18 is a semiconductor laser (LD) module as an excitation light source
  • 11 is a solid laser medium (eg, YAG)
  • Reference numeral 23 denotes a cavity containing a pumping light source 18 and a solid-state laser medium 11
  • 24 denotes a laser beam emitted from the resonator 20
  • 25 denotes a magnifying lens
  • 26 denotes a collimating lens
  • 27 is a beam shirt consisting of a reflective mirror 28, a damper 29, etc.
  • 28 is a reflective mirror
  • 29 is a damper
  • 30 is a condenser lens
  • 31 is a fiber holder
  • Reference numeral 32 denotes an optical fiber composed of a condenser lens 30 and a fiber holder 31—an incident portion
  • 33 denotes an optical fiber
  • 34 denotes a processing head
  • 35a and 35b denote processing lenses.
  • Reference numeral 36 denotes a power supply device for supplying power to the oscillator head 19, and 37 a cooling device for circulating cooling water for cooling the module 18 and the solid-state laser medium 11 and performing heat exchange.
  • Reference numeral 38 denotes a workpiece.
  • the combination of the oscillator head 19, the power supply 36 and the cooling device 37 is called an oscillator. Next, the operation of the oscillator will be described. In the oscillator head 19 of FIG.
  • the solid-state laser medium 11 is excited by the excitation light of the excitation light source 18, and is partially reflected by the partial reflection mirror 21 provided so as to sandwich the solid-state laser medium 11.
  • Laser oscillation is generated by mirror 22.
  • the laser beam 24 emitted from the resonator 20 is expanded by passing through a magnifying lens 25, and becomes a parallel beam by passing through a collimating lens 26.
  • the collimated laser beam is an optical fiber. It enters the entrance 32.
  • a beam shirt 27 is provided between the collimating lens 26 and the optical fiber input section 32 so that the laser beam can be cut off when it is not desired to emit the laser beam outside the laser oscillator.
  • the beam shirt 27 consists of a reflecting mirror 28 that reflects the laser beam and a damper 29 that absorbs the laser beam and converts it into heat.
  • the reflective mirror 28 is operable, so that when the reflective mirror is at position A, the laser beam passes through the beam shirt _27, but when the reflective mirror is at position B, the laser is The beam is reflected by the reflecting mirror 28 and reaches the damper 29.
  • the surface of the damper 29 is composed of a laser beam absorber, and converts the energy of one laser beam into heat. Although not shown, the damper 29 is water-cooled to release the absorbed heat.
  • the collimated laser beam incident on the optical fiber input section 32 is condensed by the condensing lens 30 in the optical fiber input section 32, and is held by the fiber holder 31.
  • the light enters the end face 33 of 33 and propagates in the optical fiber.
  • the laser beam that has passed through the optical fiber 133 exits from the end surface 33 o of the optical fiber 33 connected to the processing head 34.
  • the laser beam guided to the processing head 34 is condensed by the condensing lenses 35a and 35b and irradiates the workpiece 38, and the processing head 34 or the processing head is processed. Drilling, cutting, welding, etc. by moving 3 8 to the desired position The processing of is carried out.
  • YAG, YLF, ruby, glass, etc. are used as the solid-state laser medium in the solid-state laser oscillator.
  • the resonator of a solid-state laser oscillator using YAG is a YAG rod, which is a solid-state laser medium 11 sandwiched between two mirrors, a partial reflection mirror 3 and a total reflection mirror 14, as shown in Fig. 9.
  • the laser light is extracted by exciting and oscillating a columnar crystal called “LD” 40 obtained from an LD module 18 as an excitation light source.
  • LD columnar crystal
  • the characteristic of the YAG laser is that its wavelength is 1.0 ⁇ m, which is shorter than that of a CO 2 laser, which is 10 times shorter, so that fiber transmission is possible.
  • a CO 2 laser which is 10 times shorter
  • FIG. 10 is a schematic diagram of an LD module 18 used as an excitation light source.
  • Reference numeral 12 denotes an LD, which is assembled so as to be sandwiched between the upper electrode 13a and the lower electrode 13b together with the insulator 39. Then, excitation light is obtained from the LD 12 by applying a voltage between the upper electrode 13 a and the lower electrode 13 b. Since the life of the LD is greatly influenced by the change in the temperature of the LD, the temperature of the LD must be kept as constant and low as possible in order to extend the life of the LD.
  • the wavelength of the LD light changes with the temperature of the LD, and if the wavelength of the LD light changes, the absorptance in the YAG changes, resulting in a change in beam quality and laser output, resulting in unstable processing quality. It is necessary to keep the temperature change of the LD small.
  • the power input to the LD is changed to obtain the desired laser output.
  • Changing the input power of the LD necessarily changes the temperature of the LD, but as mentioned above, the life of the LD is short if the temperature changes greatly.
  • the output wavelength fluctuates. For this reason, in order to efficiently cool the heat generating part and reduce the temperature change of the LD, as shown in Fig. 11, cooling water is supplied to the lower electrode (hereinafter also referred to as LD heat sink) 13b, and the LD heater is cooled.
  • the LD is indirectly cooled while directly cooling Tosink 13b.
  • the thickness of the LD heat sink has been reduced to shorten the distance between the LD and the cooling water, and copper with good thermal conductivity has been used for the LD heat sink.
  • the conventional solid-state laser oscillator described in Japanese Patent Application Laid-Open No. 2002-76500 and Japanese Patent Application Laid-Open No. Some of them control the change of LD wavelength and deterioration of life. Disclosure of the invention
  • the present invention has been made to solve the above-mentioned problems, and it is possible to reduce the thickness of an LD heat sink by reducing the dissolved oxygen concentration during cooling and reducing the corrosion of an LD heat sink. It is an object of the present invention to provide a solid-state laser oscillator capable of improving the cooling effect of an LD and reducing the size of an LD heat sink and a solid-state laser processing apparatus using the solid-state laser oscillator.
  • a deoxygenating device is provided in a circulation path for circulating cooling water for cooling the LD for exciting the solid-state laser medium.
  • a deoxygenation device is provided in a circulation path for circulating cooling water for cooling the LD that excites the solid-state laser medium, thereby reducing the concentration of dissolved oxygen in the cooling water and reducing the LD concentration.
  • the thickness of the LD heat sink can be reduced, the cooling effect of the LD can be improved, and the LD heat sink can be downsized.
  • the cooling effect of the LD is improved, the beam quality and laser output of the laser oscillated from the solid-state laser medium are stabilized, and the processing quality can be stabilized.
  • FIG. 1 is a configuration diagram showing a solid-state laser processing apparatus and an oscillator based on Embodiment 1 of the present invention.
  • FIG. 2 is a configuration diagram showing a part of the solid-state laser oscillator according to the first embodiment of the present invention.
  • FIG. 3 is a flowchart showing the control of the operation of the deoxidizer by the control device.
  • Fig. 4 is a graph showing the relationship between the temperature of water flowing through the deoxygenation unit, the amount of water flowing through the deoxygenation unit, and the vacuum pressure in the deoxygenation unit. It is.
  • FIG. 5 is a flowchart showing a flow for controlling the deoxidizing ability of the deoxidizing apparatus.
  • FIG. 6 is a configuration diagram showing a part of the solid-state laser oscillator according to the second embodiment of the present invention.
  • FIG. 7 is a configuration diagram showing a part of a solid-state laser oscillator based on Embodiment 3 of the present invention.
  • FIG. 8 is a configuration diagram of a conventional solid-state laser processing device and an oscillator.
  • FIG. 9 is a configuration diagram of a resonator in a conventional solid-state laser oscillator.
  • FIG. 10 is a schematic diagram of a conventional LD module.
  • FIG. 11 is a side view and a sectional view of a conventional LD module.
  • FIG. 1 shows a solid-state laser processing apparatus and a solid-state laser oscillator according to a first embodiment for carrying out the present invention.
  • the solid-state laser processing apparatus according to the present invention includes a cooling device 37 for cooling an LD or the like, a deoxygenating device 16 for reducing the concentration of dissolved oxygen in the cooling water, and a control device 1 for controlling the operation thereof. It is equipped with 7.
  • FIG. 2 shows a detailed configuration of the cooling device 37, the deoxygenation device 16 and the control device 17.
  • 1 is a heat exchanger that removes the heat of the LD and cools the warmed cooling water.
  • 3a and 3b are flow meters that determine the flow rate of the cooling water
  • 4a and 4b are filters that remove dust
  • 7 is a hollow fiber membrane, etc.
  • Deoxygenation units that can be constructed
  • 6 is a vacuum pump that reduces the pressure inside the deoxygenation unit
  • 8 is a pressure gauge that measures the vacuum pressure inside the deoxygenation unit
  • 5 is a solenoid valve
  • 9 is a pure unit
  • 10 is Pump for forced circulation of cooling water
  • 17 is a control unit
  • 1 a is a storage unit in the control unit
  • 17 b is a calculation unit in the control unit
  • .17 c is a control unit in the control unit
  • 18 Is an LD module.
  • the LD module 18 constitutes the resonator shown in FIG. 9 and is incorporated in the solid-state laser oscillator and solid-state laser processing apparatus shown in FIG.
  • the cooling water branches off from the cooling water tank 2 via the pump 10 and one is supplied to the LD heat sink 13b through the filter 4b and the LD heat sink 13b
  • the LD 12 takes away the generated heat, and then returns to the cooling water tank 2 through the heat exchanger 1.
  • the other branch via pump 10 passes through valve 15a, pure water 9 and deoxygenation unit 7, and returns to cooling water tank 2.
  • Pure water device 9 is turned LD heat one sink 1 3 b are electrodes as c above, which is provided for keeping the coolant pure hydrated and conductivity low ⁇ , if electrical. Conductivity high cooling This is to prevent the power supply unit and LD 12 from being destroyed when water flows through the LD heat sink 13 b, causing electricity to flow through the cooling water and ground fault.
  • the deoxygenator 16 comprises a vacuum pump 6, a deoxygenating unit 7 composed of a hollow fiber membrane, etc., and a flow meter 3a, a pressure gauge 8, a solenoid valve 5, and a filter 4a for controlling the deoxygenating unit 7. It is added and installed in parallel with LD heat sink 13b.
  • the gas (oxygen) in the cooling water is removed from the cooling water flowing through the deoxygenation unit 7 by reducing the pressure inside the deoxygenation unit by the vacuum pump 6 connected to the deoxygenation unit 7. .
  • the cooling water temperature, The temperature inside the deoxygenation L nit and the amount of cooling water flowing into the deoxygenation unit are measured with a water temperature gauge 14, a pressure gauge 8, and a flow meter 3a, respectively, and the signals from these measuring instruments are controlled by the controller.
  • the operation of the deoxygenator 16 is controlled by transmitting it to 17.
  • the control device 17 compares the data transmitted from the various measuring instruments with the setting values stored in the memory 17a of the storage unit 17a storing various set values, or An operation unit 17b for performing calculations and a control unit 17c for controlling operations such as a pump valve are provided.
  • the pump 10 is started by a signal from the control unit 17c of the control device 17.
  • the S 002 valve 15a is opened and water is passed through the pure water device 9 and the deoxygenating unit 7, and the vacuum pump 6 is driven.
  • the following is the operation when the pressure inside the deoxygenating unit is abnormal during the normal operation of the deoxidizer.
  • S012 (One branch of S005)
  • the control unit 17 compares the flow rate set value in the storage unit 17a with the measurement data in the control unit 17 to determine whether the flow rate is normal by comparing it in the calculation unit 17b.
  • the dissolved oxygen concentration in the cooling water can be reduced, and the corrosion of the LD heat sink 13 b is prevented. be able to.
  • This makes it possible to reduce the thickness of the LD heat sink 13b, thereby improving the cooling effect of the LD 12 and miniaturizing the LD heat sink 13b.
  • the cooling effect of the LD is improved, the life of the LD is prolonged, and the maintenance cost can be reduced.
  • the laser wavelength of the LD is stabilized by the improvement of the cooling effect of the LD, the beam quality and laser output of the laser output from the solid-state laser medium 11 are stabilized, and the processing quality is improved.
  • a pressure gauge 8 for measuring the vacuum pressure inside the deoxidizing unit 7 and a flow meter 3a for measuring the flow rate of the cooling water passing through the deoxidizing unit 7, it is possible to know the abnormality of the device quickly. For example, it is possible to prevent the dissolved oxygen concentration from deteriorating due to an abnormality in the deoxidizer 16 and the thermal destruction of the LD 12 beforehand.
  • the deoxidizing capacity of the deoxidizing unit 7 varies greatly depending on the temperature of the water flowing through the deoxidizing unit 7.
  • the deoxidizing capacity of the deoxidizer deteriorates from D01 to D02. This is a characteristic of the hollow fiber membrane used as the deoxygenation unit 7, and the water temperature rises.
  • the deaeration performance is improved because the boundary resistance formed by the laminar flow (the vicinity of the interface, in this case, the difficulty of moving gas between the cooling water and the inner wall of the deoxygenating unit) is reduced.
  • the deaeration capacity decreases due to the large boundary resistance.o
  • the temperature of the cooling water changes significantly due to changes in the installation environment and laser output (LD input power).
  • installation environment specifications of the laser oscillator is 5 ° C ⁇ 35 e C
  • the deoxygenation device 1 6 is normally used when the water temperature is 5 ° C decreases, the deoxidizing ability is decreased by about 20% .
  • the deoxygenator 16 will be large-scale to obtain a sufficient deoxygenation effect over the entire temperature range. Therefore, it is necessary to measure the water temperature and perform control appropriate to the change in deoxygenation capacity.
  • the oxygen removal capacity of the oxygen absorber is changed by the flow rate of the cooling water passing through the oxygen absorber and the vacuum pressure in the oxygen absorber, and the oxygen is passed through the oxygen absorber 7.
  • (1) Correction by cooling water flow rate and (2) Correction by deoxygenation unit internal pressure are applied as control methods to correct the change in deoxygenation capacity with respect to the change in cooling water temperature.
  • the valve 15a as a flow rate adjusting means and controlling the flow rate of the cooling water flowing into the deoxidizing unit 7, the dissolved acid of the cooling water after passing through the hollow fiber membrane deoxidizing unit is adjusted. Reduce the elemental amount to below the target dissolved oxygen concentration D 01 [ppm].
  • S 101 Measure the cooling water temperature with a thermometer 14 (at this time, the cooling water flow rate F 1 [L / min]). Here, it is assumed that the outside air temperature drops rapidly and the cooling water temperature changes from T 1 ° C to T 2 ° C.
  • Control unit 17c of control unit 17 adjusts the opening of pulp 15a so that the cooling water flow rate calculated by operation unit 17b of control unit 17 is reached, and the amount of cooling water To adjust.
  • the flow rate adjusting means of the cooling water flow rate is set to the opening degree of the valve 15a.
  • the total flow rate of the cooling water flowing through the pump 10 must be equal to or greater than the sum of the flow rate into the deoxygenation unit 7 and the minimum cooling water flow required for LD cooling. Absent.
  • the rotation of the vacuum pump 6 is controlled as a pressure adjusting means, and the vacuum pressure in the deoxidizing unit 7 is controlled, so that the hollow fiber membrane deoxygenating unit is passed.
  • S201 Measure the cooling water temperature with a thermometer 14 (at this time, the pressure inside the deoxidizing unit P1 [Pa]).
  • P1 the pressure inside the deoxidizing unit
  • the dissolved oxygen concentration in the cooling water after passing through the hollow fiber membrane deoxygenating unit is controlled to the specified value D 0 1 [ppm] or less, and the deoxygenating capacity decreases due to the change in cooling water temperature. Supplement. It is desirable to use the two control methods depending on the cooling water path configuration. Of course, they can be used together. ⁇
  • the flow rate of the deoxidizer 17 and that of the deionizer 9 are the same. If the flow rate is reduced to secure the dissolved oxygen concentration, the flow rate to the deionizer 9 is reduced, and the cooling is performed. The conductivity of the water increases. If the conductivity of the cooling water rises, there is a concern that L 12 and power supply may be destroyed due to ground fault. For this reason, in a configuration such as the present embodiment in which the purifier 9 wants to secure a flow rate, it is more appropriate to control the dissolved oxygen concentration by the deoxidizer 16 by controlling the rotation speed of the vacuum pump 6 and controlling the vacuum pressure. I have.
  • thermometer 14 for measuring the temperature of the cooling water is provided to measure the temperature of the water, and a pressure adjusting means (for example, a vacuum pump 6) for adjusting the vacuum pressure in the deoxygenating unit 7 according to the change in the temperature of the water.
  • a pressure adjusting means for example, a vacuum pump 6
  • the water flow rate adjusting means for example, valve 15 and pump 10
  • Embodiment 2 A solid-state laser processing apparatus and a solid-state laser processing apparatus according to Embodiment 2 for carrying out the present invention.
  • the configuration of the solid-state laser oscillator is the same as that of the first embodiment shown in FIG. However, since the detailed configurations of the cooling device 37, the deoxygenation device 16 and the control device 17 are different, they will be described with reference to FIG. Regarding the installation of the deoxidizer 16, in addition to FIG. 2, there is an installation case as shown in FIG. 6 and FIG. 7 described in the third embodiment. In FIG. 6, the deoxidizer 16 is connected to the LD heat sink 13 b And the water purifier 9 are installed in parallel.
  • valve 15a can be closed and the deoxidizer 16 can be replaced while the pure water device 9 is operating.
  • a pump is installed in series with the flow meter 3a, and the flow rate of the cooling water flowing into the deoxidizer ⁇ 6 can be controlled independently by controlling the rotation speed of the pump. It can be used as a flow control means instead of the valve 15a.
  • the configurations of the solid-state laser processing apparatus and the solid-state laser oscillator according to the third embodiment for carrying out the present invention are the same as those in FIG. 1 of the first embodiment.
  • the detailed configurations of the cooling device 37, the deoxygenation device 16 and the control device 17 are different, they will be described with reference to FIG.
  • the deoxidizer 16 is installed in series with the LD heat sink 13b and the filter 4b.
  • the advantage is that the installation method shown in FIGS. 2 and 6 can be used to reliably control the dissolved oxygen concentration.
  • the deoxygenator 16 is installed in series with the LD heat sink, the water in the cooling water tank circulates several times to reduce the dissolved oxygen concentration.
  • Dissolved oxygen concentration can be controlled more quickly and more reliably than the methods shown in Figs.
  • a large number of deoxygenating units 7 are required and the size becomes large.
  • the oscillator cooling water amount is determined from the cooling efficiency of the LD 12, and a larger amount of cooling water flows through the deoxidizer 16 than in the first and second embodiments.
  • the dissolved oxygen concentration of the cooling water after passing through one deoxygenating unit increases, so in order to achieve the specified dissolved oxygen concentration, increase the number of deoxygenating units or reduce the degree of pressure reduction. I have to increase it.
  • An increase in the number of deoxygenating units increases cost and size, and so control by vacuum pressure is more advantageous.
  • the solid-state laser oscillator and the solid-state laser processing apparatus according to the present invention are suitable for use in processing such as drilling, cutting, and welding with a laser beam.

Abstract

L'invention concerne un oscillateur laser à l'état solide et un appareil de faisceau laser à l'état solide utilisant l'oscillateur laser à l'état solide. La concentration d'oxygène dissous dans l'eau de refroidissement en vue du refroidissement d'un puits LD de l'oscillateur est réduite de manière à réduire la corrosion de celui-ci. Ceci permet de réduire l'épaisseur du puits, d'améliorer son effet refroidissant et de réduire sa taille.
PCT/JP2003/013280 2003-10-17 2003-10-17 Oscillateur laser a l'etat solide et appareil de faisceau laser a l'etat solide WO2005038998A1 (fr)

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PCT/JP2003/013280 WO2005038998A1 (fr) 2003-10-17 2003-10-17 Oscillateur laser a l'etat solide et appareil de faisceau laser a l'etat solide

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103633554A (zh) * 2013-11-08 2014-03-12 苏州长光华芯光电技术有限公司 一种应用于大功率半导体激光器在线纯化冷水控温装置
WO2018216274A1 (fr) * 2017-05-22 2018-11-29 パナソニックＩｐマネジメント株式会社 Dispositif d'oscillation laser et appareil d'usinage au laser

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JP2003110186A (ja) * 2001-09-30 2003-04-11 Shibaura Mechatronics Corp 半導体レーザモジュール及び半導体レーザ励起固体レーザ装置
JP2003258366A (ja) * 2002-03-06 2003-09-12 Hamamatsu Photonics Kk 半導体発光装置

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CN103633554A (zh) * 2013-11-08 2014-03-12 苏州长光华芯光电技术有限公司 一种应用于大功率半导体激光器在线纯化冷水控温装置
WO2018216274A1 (fr) * 2017-05-22 2018-11-29 パナソニックＩｐマネジメント株式会社 Dispositif d'oscillation laser et appareil d'usinage au laser
CN110679047A (zh) * 2017-05-22 2020-01-10 松下知识产权经营株式会社 激光振荡装置以及激光加工装置
JPWO2018216274A1 (ja) * 2017-05-22 2020-03-26 パナソニックＩｐマネジメント株式会社 レーザ発振装置およびレーザ加工装置

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