WO2005035829A1 - 耐食アルミ導電性材料及びその製造方法 - Google Patents
耐食アルミ導電性材料及びその製造方法 Download PDFInfo
- Publication number
- WO2005035829A1 WO2005035829A1 PCT/JP2003/013115 JP0313115W WO2005035829A1 WO 2005035829 A1 WO2005035829 A1 WO 2005035829A1 JP 0313115 W JP0313115 W JP 0313115W WO 2005035829 A1 WO2005035829 A1 WO 2005035829A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- treatment
- corrosion
- conductive
- aluminum
- conductive film
- Prior art date
Links
- 238000005260 corrosion Methods 0.000 title claims abstract description 96
- 230000007797 corrosion Effects 0.000 title claims abstract description 94
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 56
- 239000004020 conductor Substances 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 73
- 239000000463 material Substances 0.000 claims abstract description 48
- 238000000576 coating method Methods 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract 5
- 230000007547 defect Effects 0.000 claims description 22
- 229920001971 elastomer Polymers 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 13
- -1 ion phosphate Chemical class 0.000 claims description 9
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000001962 electrophoresis Methods 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 229910019142 PO4 Inorganic materials 0.000 claims description 5
- 239000010452 phosphate Substances 0.000 claims description 5
- 238000010025 steaming Methods 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims description 2
- 238000010335 hydrothermal treatment Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 claims 1
- 238000007751 thermal spraying Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 57
- 238000011156 evaluation Methods 0.000 description 47
- 238000012360 testing method Methods 0.000 description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 19
- 239000007772 electrode material Substances 0.000 description 16
- 239000010931 gold Substances 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 230000010287 polarization Effects 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 238000005755 formation reaction Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 208000037998 chronic venous disease Diseases 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229940085991 phosphate ion Drugs 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910021607 Silver chloride Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- GTKRFUAGOKINCA-UHFFFAOYSA-M chlorosilver;silver Chemical compound [Ag].[Ag]Cl GTKRFUAGOKINCA-UHFFFAOYSA-M 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- SNICXCGAKADSCV-JTQLQIEISA-N (-)-Nicotine Chemical compound CN1CCC[C@H]1C1=CC=CN=C1 SNICXCGAKADSCV-JTQLQIEISA-N 0.000 description 1
- MVKDNXIKAWKCCS-UHFFFAOYSA-N 3-methyl-1h-pyridin-2-one Chemical compound CC1=CC=CN=C1O MVKDNXIKAWKCCS-UHFFFAOYSA-N 0.000 description 1
- 241000206761 Bacillariophyta Species 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 235000009849 Cucumis sativus Nutrition 0.000 description 1
- 240000008067 Cucumis sativus Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 241000237536 Mytilus edulis Species 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 244000082204 Phyllostachys viridis Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003651 drinking water Substances 0.000 description 1
- 235000020188 drinking water Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000001652 electrophoretic deposition Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 150000002641 lithium Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000020638 mussel Nutrition 0.000 description 1
- XIKYYQJBTPYKSG-UHFFFAOYSA-N nickel Chemical compound [Ni].[Ni] XIKYYQJBTPYKSG-UHFFFAOYSA-N 0.000 description 1
- 229960002715 nicotine Drugs 0.000 description 1
- SNICXCGAKADSCV-UHFFFAOYSA-N nicotine Natural products CN1CCCC1C1=CC=CN=C1 SNICXCGAKADSCV-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000011255 nonaqueous electrolyte Substances 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000007774 positive electrode material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000015170 shellfish Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000010129 solution processing Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009747 swallowing Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/18—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/10—Oxidising
- C23C8/16—Oxidising using oxygen-containing compounds, e.g. water, carbon dioxide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/22—Electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Definitions
- the S-Minus is a technique from gold, nickel or gold.
- an electrode formed by forming a conductive film on the surface of a nickel material, a conductive material, and a method for manufacturing the same.
- Polarization file For example, the electric power of a chimney primary pond.
- Electrode material such as electrodes used in solution processing (anodized film treatment, electrolytic coloring treatment, electrophoresis' painting treatment, etc.) in the manufacturing process of building materials.
- Use conductive materials and methods to resist corrosion are useful for many electrode materials such as electrodes used in solution processing (anodized film treatment, electrolytic coloring treatment, electrophoresis' painting treatment, etc.) in the manufacturing process of building materials.
- the power-on-pole electrode has a relatively high electric resistance ⁇ generally, the power ⁇ in the electrolytic process a is large, and the electrode has poor additivity.
- the electric resistance is relatively high. It is possible to use a low-power, low-power, low-calorie, highly recyclable, and two-cum wood material.
- Helicum is easily corroded chemically and has poor corrosion resistance.
- it is used as a counter electrode (cathode).
- the anode foil that has been etched is used as the cathode foil, and the foil is used as the cathode foil.
- its use is limited, and its service life is 1 to 10 at the counter electrode (cathode) of the anodized film treatment.
- the surface of the gal and nicotine material is highly conductive and corrosion-resistant.
- a conductive film such as a carbon film or a shell metal film of gold, silver or the like is formed.
- the conductive film is relatively thin, such as X. 15 m or less, and in some cases 55 ⁇ m or less, the Defects such as inevitably occur when the electrode material is used as an electrode material for resolving treatment, etc. It starts to corrode due to defects in the steel and does not provide the desired corrosion resistance.
- the m-building is expected to increase the service and increase the weight and the characteristics such as the lightness of the var and nikum materials.
- Electrode for chemical reservoir formed by electrodeposition of electrode material JP-A-5-94,821)
- Polarizing electrode material mainly composed of active ash as a current collector such as carbon dioxide -Positive electrode material for multilayer capacitors Japanese Patent Publication No. 9-55, 342
- Activated ash by electrophoretic deposition on a conductive plate such as a drum Electrode on which a layer mainly composed of is deposited Japanese Patent Application Laid-Open No. 9-74,052
- a conductive layer such as graphite or power-on black is disposed on a current collector such as a drum, and a conductive layer such as a pole active material is further disposed thereon.
- Non-aqueous electrolyte formed by distributing loss of V-electrode material to be used as next pond Japanese Patent Application Laid-Open No. 9-97,625)
- Gazette is known o
- a conductive film is formed on the surface of the rubber material.
- the conductive material is applied to the conductive material, and the properties of the rubber material (conductive lightness, size, etc.) Mouth
- the thickness of the conductive film is 15 ⁇ m or less, and the thickness of the conductive film is 5 ⁇ m or less when exposed to the field ⁇ . Based on defects such as racks and the like, the corrosion problem is solved as much as possible, has excellent corrosion resistance, is easy to manufacture, and can be manufactured at low cost.
- X conductive materials
- an object of the present invention is to provide an excellent property of a rubber material. Defects that inevitably occur in the conductive film formed on the surface are substantially sealed, and the conductive film is thin and has excellent corrosion resistance. O may provide conductive materials o
- Another object of the present invention is to provide a method for inexpensively producing a non-corrosive corrosion-resistant conductive material. That is, the present invention relates to a conductive material formed by forming a conductive film on the surface of an aluminum material made of aluminum or aluminum gold. Corrosion resistant material, characterized in that the conductive film is substantially sealed by hot water treatment or moisture treatment.
- the present invention also relates to a conductive material or an electrically conductive material.
- a film made of Heckum gold a film formed by forming a conductive film on the surface of a nickel material.
- the conductive film to be formed on the surface of the nickel material is described in the present invention. It has m conductivity and corrosion resistance, and has high temperature resistance to hot water and steam used in hot water treatment and treatment.
- a coating of any conductive material formed by any suitable means can be, for example, a force, a boron coating, or gold.
- Shell metal film such as silver (Ag), platinum (Pt) and paradum (Pd), silver, and nitrided nitride.
- Conductive coatings such as materials selected from the composites of conductive and non-conductive materials, and conductive 'paint conductive resin, etc. can also be mentioned as examples.
- wet X is to illustrate various methods such as dry method treatment, thermal spray treatment, electrophoresis treatment, etc.
- the thickness of the conductive film is not particularly limited, but the effect of the present invention is remarkably exhibited because the conductive film is relatively thin. Is a place where defects such as cracks and cracks inevitably occur.
- 15 ⁇ m or less is preferable. ⁇ Is 10 ⁇ m or less, more preferably 5 ⁇ m or less.
- the thickness of the conductive film becomes less than 15 ⁇ ra, the number of defects in the pinholes and cracks is reduced based on the thickness of the conductive film, but the weight becomes larger.
- Defects such as pinholes and cracks that inevitably occur in the conductive film are small in size, and water molecules can enter. Things that are large enough to be Ultra-small defects that are subject to encapsulation by the heat 7k treatment or steaming treatment of the present invention so that water molecules do not escape are insignificant from the viewpoint of corrosion resistance. It does not mean that it is a defect. ⁇
- a conductive skin is provided on the surface of the rubber material.
- the obtained conductive material is subjected to hot water treatment or water treatment.
- the pinholes and clumps inevitably exist in the conductive film. It seals virtually all defects, such as cucumbers, with zero. It seals it virtually with zero.
- J means that water molecules can enter during water treatment or steaming treatment. Water molecules enter into defects such as pinholes and cracks having a size larger than the minimum size, so that the surface of the base material of the damper material becomes a damper. When molecules enter the core material, the formation of hydrate on the surface of the -'comb material to substantially close the defect and insulate it is possible. Defects such as minute pinholes and cracks that cannot be removed are not considered to be a problem.
- the hot water treatment or the water treatment is performed by passing an anoremy conductive material obtained by forming a conductive film on the surface of a varnish or a humid material. . c or more
- the water used in the above-mentioned hot water treatment or steam treatment preferably has a PH value at 25 ° C of 3 to 12 or more preferably 4 to 9. If the pH value of this water is lower than 3 or higher than 12, it will occur at the same time as the formation reaction of the aluminum water aerosol.
- reaction speed of the dissolution reaction of dium becomes faster and the formation of hydrated aluminum hydrate becomes slower.
- the water used in the above hot water treatment has a phosphate ion concentration of 25 ppm or less (hereinafter referred to as “phosphate ion concentration (P)”). Is less than 10 ppm, and its silicate concentration is shown as C or less as silicon (Si) and silicate concentration (S i)] 25 ppm or less, preferably ⁇ 1
- the aluminum conductive material obtained after the above-mentioned hot water treatment or water vapor treatment is dried if necessary, and then dried. It is used for various electrode materials as a corrosion-resistant aluminum conductive material.
- the corrosion-resistant aluminum conductive material of the present invention does not impair the properties (such as conductivity, heat resistance, light weight, and cycle performance) of the rubber material.
- properties such as conductivity, heat resistance, light weight, and cycle performance
- the sample to be measured is placed in the acetic acid aqueous solution of ⁇ -3 facing the platinum counter electrode, and the silver electrode is used as a reference electrode.
- the Showa electrode is immersed in a saturated aqueous solution of lithium chloride.
- a salt bridge is used between the saturated aqueous solution of chlorinated lithium and the sample.
- the platinum counter electrode and the silver-silver chloride electrode were brought into contact with a potentiostat (Hokutoden Co., Ltd. electrochemical measurement system HZ-3000). Then, the anode is scanned from the potential of the natural electrode to the potential of oxygen generation, and the peak current of the current flowing through the electrode is measured and the polarization current ( ⁇ A / cm 2 ).
- the value of the polarization current should be 10 ⁇ A / cm 2 or less, preferably 6 / A / cm 2 or less. Particularly, it is used as an electrode material, and is preferably 5 ⁇ A / cm 2 or less, and is preferably ⁇ 3 ⁇ A / cm 2 or less.
- a 4.5 R hemispherical steel rod was used as the contact probe, and a load of 10 O gf was applied to the contact probe. Then, the electrical resistance between the contact plug and the base aluminum material was measured with a low resistance meter (Low Resistance Meter 3540 manufactured by Oki Electric Co., Ltd.). Conducted 50 times when the resistance value was 5 ⁇ or less with conduction, and evaluated the conductivity by the number of times the conduction was measured.
- a low resistance meter Low Resistance Meter 3540 manufactured by Oki Electric Co., Ltd.
- 0 or more is preferably 45/50 or more.
- the adhesion was evaluated by evaluating the corrosion resistance of the conductive material after the corrosion resistance evaluation test based on the peeling of the conductive film.
- A5052 is degreased, and then subjected to a juncture treatment.
- the nickel nickel plating having a thickness of 2 ⁇ m is formed on the surface by electrolytic nickel plating (electrolytic Ni plating).
- electrolytic gold plating treatment electrolytic Au plating treatment
- Example 1 Specimen with a size of 50 ram in length and 50 mm in width from the corrosion-resistant aluminum plate strength obtained in Example 1 in which aluminum and aluminum plates (corrosion-resistant aluminum conductive material) were prepared. And the scanning potential is reduced.
- the potential of the test piece is polarized with respect to the silver / silver chloride electrode as 0 to 100 raV vs. Ag / AgCl, the peak current is measured as the polarization current, and the corrosion resistance evaluation test is performed. I did. The result is 5
- 1-methyl-2-2-pyroylone containing 10 g of carbon black having an average particle size of 0.5 ⁇ and 2 g of PVDF
- the degreased and frosted plate was used as the anode in the same manner as in Example 1, and the carbon electrode was used as the cathode.
- a force of 10 V was applied between the electrodes for 1 minute to perform force-bon electrophoresis, and a carbon film of 1 ⁇ m thickness was formed on the surface of the aluminum plate.
- Example 2 corrosion-resistant conductive material
- the bulls are shown in Table 1.
- methyl-2-pyridone a mixture of force-pour black having an average particle size of 0.5 m and vinylidene polyfluoride in a cr ratio of 1: 1.
- step 1 rub it on the surface of the degreased aluminum plate, apply a force-bon coating process, and then dry at 200 ° C for 2 minutes. A 1- ⁇ m-thick porbon-containing film was formed on the surface of the aluminum plate.
- Example 3 Aluminum plate (corrosion resistant 5: conductive material) was manufactured.
- Example 3 With respect to the obtained corrosion-resistant aluminum and aluminum sheet of Example 3, a corrosion resistance evaluation formula test, a conductivity evaluation test, and a comprehensive evaluation were performed in the same manner as in Example 1 described above.
- Methane and ethylene were applied at a ratio of 1: 3 on the surface of the defatted varnish plate as in Example 1 above.
- the mixed gas thus introduced is introduced under a reduced pressure of 0.15 MPa, and a carbon CVD process is performed to discharge the gas and form a carbon film on the surface of the aluminum plate. Line layer, aluminum plate A 1- ⁇ m-thick force and a carbon film were formed on the surface.
- Example 4 With respect to the obtained corrosion-resistant aluminum plate of Example 4, a corrosion resistance evaluation test, a conductivity evaluation test, and a combined evaluation were performed in the same manner as in Example 1 described above.
- Platinum spray treatment was performed for 10 minutes by electron beam evaporation under a reduced pressure of 6 Torr to form a platinum film with a thickness of 3 ⁇ ra.
- Hot water of c (pH: 5.5 ⁇ concentration of phosphoric acid (P): 2 ppm, concentration of silicon silicate (Si): lppm) Hold in 1 for 30 minutes to perform hot water treatment, ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ .
- Example 5 The corrosion resistance evaluation test and the corrosion resistance evaluation test were performed in the same manner as in Example 1 described above, except that the corrosion resistant aluminum sheet of Example 5 was prepared, in which a corrosion resistant aluminum conductive sheet was prepared. Conducted conductivity evaluation test and comprehensive evaluation
- Example 1 2ppra, silicate concentration: Degree (Si): lppm) for 45 minutes Except that the hot water treatment was carried out, the corrosion resistance of Example 1 and
- RJ were used to prepare the corrosion resistant metal and the damper plate of Example 6 (corrosion resistant metal and conductive material). ⁇ Corrosion resistance evaluation test, conductivity evaluation test, and final 1 1 evaluation were performed as in Example 1 above and
- Example 7 In hot water at 100 ° C with a phosphoric acid concentration of 30 ppm as phosphorus (Pi [: 2 '.; Silicon silicate concentration (Si): 1 ppm)
- the corrosion-resistant aluminum plate (corrosion-resistant, conductive material) of Example 7 was treated in the same manner as in Example 1 except that the hot water treatment was performed while the temperature was maintained for 45 minutes.
- Comparative Example 5 The corrosion resistance of Comparative Example 5 was the same as in Example 1 above, except that a gold plating film having a thickness of 8 zm was formed by electrolytic Au plating and no hot water treatment was performed.
- An aluminum plate corrosion resistant aluminum conductive material
- a corrosion resistance evaluation test, a conductivity evaluation test, and a comprehensive evaluation were performed in the same manner as in Example 1 above.
- Electrolytic Ni plating with a thickness of 3 ⁇ m is performed instead of Au plating, and steam treatment at 120 ° C is performed instead of hot water treatment (Phosphorus ion concentration (P): 2 ppm , Silicate ion. Concentration (Si): 1 ppm), except that the corrosion-resistant aluminum plate of Example 9 (corrosion-resistant aluminum conductive material) was prepared in the same manner as in Example 1 above. With respect to the corrosion-resistant aluminum plate of Example 9 obtained above, the potential of the material was set to the anode side from the natural electrode potential to 0 mV with respect to the silver-silver chloride electrode. Except for scanning, a corrosion resistance evaluation test, a conductivity evaluation test, and a total evaluation were performed in the same manner as in Example 1 above.
- Comparative Example 6 A corrosion-resistant aluminum plate (corrosion-resistant aluminum conductive material) of Comparative Example 6 was prepared in the same manner as in Example 9 except that the steam treatment at 120 ° C was not performed. In the same manner as in Example 9, a corrosion resistance evaluation test, a conductivity evaluation test, and a comprehensive evaluation were performed.
- the present invention relates to an electrically conductive material formed by forming a conductive film on the surface of a rubber material, wherein the conductive film has a relatively thin film thickness. Based on the unavoidable defects such as pinholes and cracks, the corrosion problem can be surely solved by a simple method using hot water treatment or water treatment. It does not take advantage of the excellent properties (such as conductivity, additivity, light weight, and cyclic properties) of rubber and nickel materials, and imparts excellent corrosion resistance. Therefore, it is useful for various applications such as various electrode materials that require excellent conductivity and corrosion resistance, and has high industrial value.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
- Prevention Of Electric Corrosion (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/574,689 US20070114670A1 (en) | 2003-10-14 | 2003-10-14 | Corrosion-resistant aluminum conductive material and process for producing the same |
AU2003272992A AU2003272992A1 (en) | 2003-10-14 | 2003-10-14 | Corrosion-resistant aluminum conductive material and process for producing the same |
CN200380110536A CN100575554C (zh) | 2003-10-14 | 2003-10-14 | 耐蚀铝导电性材料及其制造方法 |
JP2005509473A JP4371111B2 (ja) | 2003-10-14 | 2003-10-14 | 耐食アルミ導電性材料及びその製造方法 |
PCT/JP2003/013115 WO2005035829A1 (ja) | 2003-10-14 | 2003-10-14 | 耐食アルミ導電性材料及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/013115 WO2005035829A1 (ja) | 2003-10-14 | 2003-10-14 | 耐食アルミ導電性材料及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005035829A1 true WO2005035829A1 (ja) | 2005-04-21 |
Family
ID=34430868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/013115 WO2005035829A1 (ja) | 2003-10-14 | 2003-10-14 | 耐食アルミ導電性材料及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070114670A1 (ja) |
JP (1) | JP4371111B2 (ja) |
CN (1) | CN100575554C (ja) |
AU (1) | AU2003272992A1 (ja) |
WO (1) | WO2005035829A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010261069A (ja) * | 2009-04-30 | 2010-11-18 | Sumitomo Osaka Cement Co Ltd | 溶射膜及びその製造方法 |
US9238860B2 (en) | 2012-12-17 | 2016-01-19 | Fujigiken Co., Ltd. | Method of carrying out post-treatment to sprayed coating and agent used for the same |
DE102016113559A1 (de) * | 2016-07-22 | 2018-01-25 | Schöck Bauteile GmbH | Bauelement zur Wärmedämmung |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012204636A1 (de) * | 2012-03-22 | 2013-09-26 | Nanogate Ag | Behandlung einer anodisch oxidierten Oberfläche |
CN103551560B (zh) * | 2013-09-29 | 2015-07-01 | 鞍钢实业微细铝粉有限公司 | 一种改性铝粉的制造方法 |
CN103966624B (zh) * | 2014-04-30 | 2017-01-04 | 电子科技大学 | 一种制备电化学电解电极的方法 |
KR101790703B1 (ko) * | 2016-07-19 | 2017-10-26 | (주)아인스 | 소수성 양극 산화 피막 및 이의 형성 방법 |
CN107164749A (zh) * | 2017-05-16 | 2017-09-15 | 东南大学 | 一种用于铝合金表面制备铝磷酸盐涂层的涂料及使用方法 |
CN107058992B (zh) * | 2017-05-16 | 2019-03-29 | 东南大学 | 一种用于铸造铝合金表面制备复合涂层的涂料及使用方法 |
CN106967972A (zh) * | 2017-05-16 | 2017-07-21 | 东南大学 | 一种用于在铸造铝合金表面制备涂层的涂料及其使用方法 |
JP6988584B2 (ja) * | 2018-03-06 | 2022-01-05 | トヨタ自動車株式会社 | 正極、非水電解質二次電池、および正極の製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5039336A (ja) * | 1973-08-13 | 1975-04-11 | ||
JPH1041062A (ja) * | 1996-05-16 | 1998-02-13 | Sumitomo Electric Ind Ltd | 電磁加熱器用金属板及び容器並びにその製造方法 |
-
2003
- 2003-10-14 JP JP2005509473A patent/JP4371111B2/ja not_active Expired - Fee Related
- 2003-10-14 WO PCT/JP2003/013115 patent/WO2005035829A1/ja active Application Filing
- 2003-10-14 US US10/574,689 patent/US20070114670A1/en not_active Abandoned
- 2003-10-14 CN CN200380110536A patent/CN100575554C/zh not_active Expired - Fee Related
- 2003-10-14 AU AU2003272992A patent/AU2003272992A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5039336A (ja) * | 1973-08-13 | 1975-04-11 | ||
JPH1041062A (ja) * | 1996-05-16 | 1998-02-13 | Sumitomo Electric Ind Ltd | 電磁加熱器用金属板及び容器並びにその製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010261069A (ja) * | 2009-04-30 | 2010-11-18 | Sumitomo Osaka Cement Co Ltd | 溶射膜及びその製造方法 |
US9238860B2 (en) | 2012-12-17 | 2016-01-19 | Fujigiken Co., Ltd. | Method of carrying out post-treatment to sprayed coating and agent used for the same |
DE102016113559A1 (de) * | 2016-07-22 | 2018-01-25 | Schöck Bauteile GmbH | Bauelement zur Wärmedämmung |
Also Published As
Publication number | Publication date |
---|---|
CN100575554C (zh) | 2009-12-30 |
US20070114670A1 (en) | 2007-05-24 |
AU2003272992A1 (en) | 2005-04-27 |
CN1860254A (zh) | 2006-11-08 |
JPWO2005035829A1 (ja) | 2006-12-21 |
JP4371111B2 (ja) | 2009-11-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FI56859C (fi) | Foerfarande foer framstaellning av en elektrod foer anvaendning vid elektrolys | |
CA1110578A (en) | Bipolar unit | |
JP4861168B2 (ja) | オーステナイト系ステンレス鋼を基材とする燃料電池用セパレータ | |
WO2005035829A1 (ja) | 耐食アルミ導電性材料及びその製造方法 | |
JP2009506202A (ja) | 被覆物品 | |
JP6700260B2 (ja) | 二層コーティングを備える電極、その使用方法および製造方法 | |
JP4667202B2 (ja) | 燃料電池構成部品用の耐食絶縁性被膜付きアルミニウム材 | |
Zahedi et al. | The effect of anodising time on the electrochemical behaviour of the Ti/TiO 2 NTs/IrO 2-RuO 2-Ta 2 O 5 anode | |
Liu et al. | Self-assembled super-hydrophobic multilayer films with corrosion resistance on copper substrate | |
JP2007162123A (ja) | 亀裂のない耐食の硬質クロム及びクロム合金層の堆積方法 | |
Gao et al. | Properties of hydrophobic carbon–PTFE composite coating with high corrosion resistance by facile preparation on pure Ti | |
CN109868483A (zh) | 一种带抗腐蚀保护层的水电解池金属双极板及制备和应用 | |
RU2288973C1 (ru) | Электрод и способ его изготовления | |
Mazhari Abbasi et al. | Optimizing the TiO2 content to obtain the highest corrosion resistance in Ir-Ru-Ta-based mixed metal oxide coating in oxygen evolution reaction application | |
Correa-Borroel et al. | Organosilanes and polypyrrole as anticorrosive treatment of aluminium 2024 | |
Lee et al. | Electrophoretic deposition of titanium nitride onto 316 stainless steel as a bipolar plate for fuel cell application | |
JP6168723B2 (ja) | 表面処理アルミニウム材及びその製造方法 | |
RU2441945C1 (ru) | Способ получения супергидрофобных защитных покрытий на титане и его сплавах | |
Grishina et al. | Characterization of the properties of thin Al2O3 films formed on structural steel by the sol-gel method | |
KR20170032215A (ko) | 표면 처리 알루미늄재 및 그 제조 방법, 및, 당해 표면 처리 알루미늄재/수지층의 접합체 | |
KR102473966B1 (ko) | 열교환기 및 그의 구성 부품의 부식방지 효율 향상을 위한 기능성 스테인리스 스틸 (sus 316) 표면개발 | |
JP2003073853A (ja) | 耐食性に優れる表面処理アルミニウム材及びその製造方法 | |
KR102465483B1 (ko) | 내식성 향상을 위한 기능성 초발수 스테인리스 스틸 표면 개발 기술 | |
TW201236251A (en) | Separator for fuel cell and manufacturing method therefor | |
KR102624269B1 (ko) | 도로 구조물 또는 건축 구조물용 기능성 스테인리스 스틸 316l 소재 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200380110536.9 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2005509473 Country of ref document: JP |
|
122 | Ep: pct application non-entry in european phase | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2007114670 Country of ref document: US Ref document number: 10574689 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 10574689 Country of ref document: US |