WO2005030055A1 - 超音波探触子 - Google Patents
超音波探触子 Download PDFInfo
- Publication number
- WO2005030055A1 WO2005030055A1 PCT/JP2004/014770 JP2004014770W WO2005030055A1 WO 2005030055 A1 WO2005030055 A1 WO 2005030055A1 JP 2004014770 W JP2004014770 W JP 2004014770W WO 2005030055 A1 WO2005030055 A1 WO 2005030055A1
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- WO
- WIPO (PCT)
- Prior art keywords
- heat
- conductive material
- heat conductive
- back load
- ultrasonic probe
- Prior art date
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- 239000000523 sample Substances 0.000 title claims abstract description 68
- 239000004020 conductor Substances 0.000 claims description 102
- 239000000463 material Substances 0.000 claims description 102
- 230000005855 radiation Effects 0.000 claims description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 229910002804 graphite Inorganic materials 0.000 claims description 12
- 239000010439 graphite Substances 0.000 claims description 12
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 21
- 230000000694 effects Effects 0.000 abstract description 10
- 238000003745 diagnosis Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 230000002238 attenuated effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/54—Control of the diagnostic device
- A61B8/546—Control of the diagnostic device involving monitoring or regulation of device temperature
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device
Definitions
- the present invention relates to an ultrasonic probe used for an ultrasonic diagnostic device or the like.
- a plurality of piezoelectric elements 21 for transmitting and receiving ultrasonic waves are arranged in a direction orthogonal to the drawing, and the front of each piezoelectric element 21 is arranged.
- a ground electrode 2 and a signal electrode 22 are provided, respectively (for example, see Patent Document 1 below).
- an acoustic matching layer 24 for efficiently transmitting and receiving ultrasonic waves to and from a subject (living body) is provided.
- a back load member 25 having a function of holding the rear load is provided.
- the ground electrode 2 is connected to a grounding electric terminal 23, and the grounding electric terminal 23 is connected to a heat transfer wire 27 via a heat conductive material 26.
- the ultrasonic probe applies an electric signal to the signal electrode 22 and the ground electrode 2 from a main body of the ultrasonic diagnostic apparatus or the like via a signal electric terminal and a ground electric terminal 23 (not shown). Accordingly, the piezoelectric element 21 mechanically vibrates to transmit ultrasonic waves, and the ultrasonic waves reflected from a subject such as a living body are received by the piezoelectric element 21.
- An ultrasonic probe for an ultrasonic diagnostic apparatus using a living body as a subject transmits ultrasonic waves to the living body by directly contacting the inside of the living body, and the reflected wave reflected from the inside of the living body is again used by the ultrasonic probe. Receive it, process that signal in the main unit, This sensor is used for displaying a diagnostic image on a monitor and diagnosing it.
- the surface temperature of the ultrasonic probe in contact with the living body must be set to a temperature that does not affect the living body so that the living body is not adversely affected. .
- the surface temperature of the ultrasonic probe rises when it is not in contact with the living body, that is, when it is not in use, and it continues to transmit signals from the main body and generates heat. It is assumed that the main cause is the dielectric loss of the piezoelectric element 21 and the multiple reflection between the piezoelectric element 21, the acoustic matching layer 24 and the acoustic lens in the probe.
- the surface temperature of the ultrasonic probe is proportional to the transmission signal of the main unit, and in reality, the transmission signal is controlled to be low and adjusted so that the temperature does not rise.
- the transmission signal is controlled to be low and adjusted so that the temperature does not rise.
- there is a proportional relationship between the level of the transmitted signal and the depth at which the living body is diagnosed, and keeping the transmitted signal low also has the disadvantage of making the diagnostic depth shallower. Therefore, it is extremely important to be able to increase the transmission signal (diagnosis depth) and lower the surface temperature of the ultrasound probe.
- the surface temperature of the probe is regulated to ensure safety. And must be managed. For this reason, the voltage transmitted from the ultrasonic diagnostic equipment body is adjusted and controlled so as to be lower than the regulated temperature.
- the voltage transmitted from the ultrasonic diagnostic equipment body is adjusted and controlled so as to be lower than the regulated temperature.
- the above-mentioned transmission voltage and the expansion in the depth direction are in a proportional relationship, and the higher the transmission voltage, the deeper the diagnostic depth can be. Therefore, it is desirable to increase the transmission voltage as much as possible. For these reasons, many attempts have been made recently to reduce the surface temperature of the ultrasonic probe.
- the structure shown in Fig. 8 is one of them, and the heat is radiated by the grounding electrical terminal 23 taken out from the grounding electrode 2 of the piezoelectric element 21 It has a configuration.
- Patent document 1 Japanese Patent Application Laid-Open No. Hei 5-224440 (Fig. 1)
- the heat radiation in the configuration of the conventional ultrasonic probe described above is a heat radiation from a part of the grounding electric terminal 23 of the piezoelectric element 21 and has a problem that it is not necessarily sufficient. Disclosure of the invention
- the present invention has been made in view of the above-described problems of the related art, and provides an ultrasonic probe that can enhance the heat radiation effect and, consequently, increase the transmission voltage of the ultrasonic diagnostic apparatus to further increase the diagnostic depth.
- the purpose is to:
- an ultrasonic probe includes: a piezoelectric element that transmits and receives ultrasonic waves;
- a back load member provided on the back of the piezoelectric element
- a heat conductive material is provided inside or a part of the back load material and has a heat conductivity higher than the heat conductivity of the back load material.
- the ultrasonic probe of the present invention includes a plurality of piezoelectric elements that transmit and receive ultrasonic waves arranged in one direction,
- a back load member provided on the back of the plurality of piezoelectric elements
- One or a plurality of sheet-like heat sources provided parallel to the inside of the back load member along the depth direction and the arrangement direction of the piezoelectric elements and having a heat conductivity higher than the heat conductivity of the back load material. And a conductive material.
- the ultrasonic probe of the present invention has a configuration in which the end of the heat conductive material on the piezoelectric element side is inclined with respect to the surface of the piezoelectric element on the back load material side.
- the heat generated by the piezoelectric element can be absorbed and dissipated by the material with the higher thermal conductivity provided inside the back load material, and the heat can be dissipated.
- the temperature can be reduced. Therefore, since the transmission voltage of the ultrasonic diagnostic apparatus can be increased, it is possible to obtain an ultrasonic probe capable of increasing the diagnostic depth.
- the angle formed by the inclined surface of the end of the heat conductive material on the piezoelectric element side with respect to a direction perpendicular to the back surface of the piezoelectric element is 40 degrees or less, Alternatively, the angle is obtained by subtracting the critical angle of the ultrasonic wave from 90 degrees.
- the heat generated by the piezoelectric element can be absorbed and dissipated by the material with the higher thermal conductivity provided inside the back load material, and the heat can be dissipated.
- the temperature can be reduced. Therefore, since the transmission voltage of the ultrasonic diagnostic apparatus can be increased, it is possible to obtain an ultrasonic probe capable of increasing the diagnostic depth.
- the ultrasonic probe of the present invention has a configuration in which a heat radiation block connected to the heat conductive material and having a heat conductivity higher than that of the back load member is further provided.
- the heat generated by the piezoelectric element is The large material absorbs heat and can radiate heat through the heat radiation block, which can reduce the temperature of the ultrasonic probe surface. Therefore, since the transmission voltage of the ultrasonic diagnostic apparatus can be increased, an ultrasonic probe capable of further increasing the diagnostic depth can be obtained.
- the ultrasonic probe according to the present invention has a configuration in which the heat radiation block is provided on the rear surface of the rear load material, and the heat conductive material is further provided between the heat radiation block and the rear load material.
- the heat generated by the piezoelectric element can be absorbed by a material having a thermal conductivity greater than that of the rear load material provided inside or a part of the rear load material and on the rear surface and radiated through the heat radiation block.
- the temperature of the ultrasonic probe surface can be reduced. Therefore, since the transmission voltage of the ultrasonic diagnostic apparatus can be increased, an ultrasonic probe that can deepen the diagnostic depth can be obtained.
- the ultrasonic probe of the present invention includes a plurality of piezoelectric elements which are divided by a dividing groove in one direction to transmit and receive ultrasonic waves,
- the split groove is formed in the back load member at a depth that does not reach the heat conductive material.
- the heat generated by the piezoelectric element can be absorbed and dissipated by the material with the higher thermal conductivity provided on the back side of the back load member, and the heat can be dissipated.
- the temperature can be reduced. Therefore, since the transmission voltage of the ultrasonic diagnostic apparatus can be increased, it is possible to obtain an ultrasonic probe capable of increasing the diagnostic depth.
- the ultrasonic probe of the present invention is divided A plurality of piezoelectric elements for transmitting and receiving sound waves,
- a back load member provided on the back of the plurality of piezoelectric elements
- a block-shaped heat conductive material provided on the back surface of the back load material and having a larger thermal conductivity than the back load material;
- the heat generated by the piezoelectric element can be absorbed and dissipated by the material with the higher thermal conductivity provided on the back side of the back load member, and the heat can be dissipated.
- the temperature can be reduced. Therefore, since the transmission voltage of the ultrasonic diagnostic apparatus can be increased, it is possible to obtain an ultrasonic probe capable of increasing the diagnostic depth.
- the ultrasonic probe of the present invention is characterized in that, as the heat conductive material, a polymer filament is formed into a graph eye 1, a high-arrangement PGS graphite sheet, dala fight, carbon nanotube, aluminum nitride, boron nitride, A structure using any of silicon carbide, beryllium oxide, copper, and aluminum was adopted.
- the heat generated by the piezoelectric element can be absorbed and dissipated by a material having a higher thermal conductivity than the back load material, and the temperature of the ultrasonic probe surface can be reduced. Therefore, since the transmission voltage of the ultrasonic diagnostic apparatus can be increased, it is possible to obtain an ultrasonic probe capable of increasing the diagnostic depth.
- the heat generated by the piezoelectric element can be absorbed and dissipated by a material having a higher thermal conductivity than the back load material, and the temperature of the ultrasonic probe surface can be reduced. Since the transmission voltage of the ultrasonic diagnostic apparatus can be increased, the diagnostic depth can be further increased.
- FIG. 1 is a schematic perspective view of an ultrasonic probe according to the first embodiment of the present invention
- FIG. 2 is a schematic plan view of the ultrasonic probe according to the first embodiment of the present invention
- FIG. 3 is a schematic sectional view of an ultrasonic probe according to the second embodiment of the present invention.
- Fig. 4 is an enlarged view of part A in Fig. 3,
- FIG. 5 is a schematic cross-sectional view of an ultrasonic probe according to the third embodiment of the present invention.
- FIG. 6 is a schematic sectional view of an ultrasonic probe according to a fourth embodiment of the present invention.
- FIG. 7 is a schematic sectional view of an ultrasonic probe according to a fifth embodiment of the present invention.
- FIG. 8 is a schematic sectional view of a conventional ultrasonic probe. BEST MODE FOR CARRYING OUT THE INVENTION
- the ultrasonic probe according to the first embodiment is a piezoelectric element that is long in the X direction, is arranged in a plurality in the Y direction, and transmits and receives ultrasonic waves in the Z direction (diagnosis depth direction).
- a plurality of ground electrodes 2 signal electrodes 3, and individual signal electrodes 3 respectively provided on the front and back of each piezoelectric element 1.
- a plurality of signal electrical terminals 4 for taking out signals and a back load material 5 having a function of mechanically holding the piezoelectric element 1 via the signal electrode 3 and attenuating unnecessary ultrasonic signals as necessary 5
- a plurality three in FIG. 1 and FIG.
- a piezoelectric element 1 As the piezoelectric element 1, a piezoelectric ceramic such as a PZT type, a single crystal, or the like is used.
- the ground electrode 2 and the signal electrode 3 are formed on the front and back surfaces of the piezoelectric element 1 by depositing gold or silver, sputtering, or baking silver.
- one or more acoustic matching layers are provided on the front side of the piezoelectric element 1 as necessary to efficiently transmit and receive ultrasonic waves via the ground electrode 2. May be provided with an acoustic lens for converging the ultrasonic beam.
- the ultrasonic wave transmitted from the piezoelectric element 1 also propagates to the back load material 5 and the heat conductive material 6, but the ultrasonic wave transmitted to the back load material 5 and the heat conductive material 6 is unnecessary.
- the piezoelectric element 1 is attenuated by absorption or scattering in the back load member 5 so as not to return to the piezoelectric element 1 again.
- Ultrasonic waves are generated by the plurality of sheet-like heat conductive members 6 provided in the back load member 5 so as to extend in the depth direction and in parallel along the arrangement direction of the piezoelectric elements 1. It is structured to scatter the back load material 5 so that it does not return to 1.
- FIGS. 1 and 2 three heat conductive members 6 are placed inside the back load member 5.
- One or more heat conductive members 6 may be provided inside or a part of the back load member 5, but ultrasonic waves from the piezoelectric element 1 may be provided by heat transfer. It is necessary to make the number of sheets such that the conductive material 6 is reflected and has no adverse effect.
- the heat conductive material 6 is configured so as to be continuously connected in the same direction as the arrangement direction Y of the piezoelectric elements 1 and is separated in a direction X orthogonal thereto. This is to make the structure easy to uniformly absorb the heat generated from the individual piezoelectric elements 1.
- the heat conductive material 6 may be provided in the direction X orthogonal to the arrangement direction Y of the piezoelectric elements 1, but in this case, the number of the piezoelectric elements 1 is the same or the piezoelectric elements 1 are skipped by one. It is necessary to provide the heat conductive material 6 at intervals of several or several. As still another method, a configuration in which a large number of needle-like heat conductive members 6 are two-dimensionally arranged inside the back load member 5 may be used.
- the heat conductive material 6 has a heat conductivity at least larger than that of the back load material 5.
- synthetic rubber filled with ferrite powder, or a polymer such as epoxy resin or urethane rubber is filled with glass or a polymer hollow body to increase the attenuation of tantalum, alumina, or damping.
- the heat conductive material 6 is effective if a material having a heat conductivity larger than at least the back load material 5 is used. Further, in order to further improve the heat radiation effect, a material having a thermal conductivity of 10 times or more of the back load material 5 may be used.
- the material of the thermal conductive material 6 include high-arrangement PGS graphite sheet, graphite, which is a polymer film made of graphite, carbon nanotubes, aluminum nitride, boron nitride, silicon carbide, beryllium oxide, copper and aluminum. It is desirable to use a material having such a high thermal conductivity (60 to 600 W / mK).
- the heat conductive material 6 when configured to be in direct contact with the signal electrode 3 of the piezoelectric element 1, a material that can be electrically insulated is used, but the signal electrode 3 and the heat conductive material 6 can be electrically insulated.
- a material that can be electrically insulated is used, but the signal electrode 3 and the heat conductive material 6 can be electrically insulated.
- the heat conductive material 6 can be realized by using either an electrically conductive or insulating material.
- the heat absorbed by the heat conductive material 6 is transmitted to the heat radiating block 7 to radiate the heat.
- the heat radiating block 7 may be made of the same material as the heat conductive material 6.
- the heat dissipating block 7 may be configured as a single body or may be configured so as to be adhered.
- the heat conductive material 6 is configured so that heat can be transmitted from the back surface of the back load material 5 to the heat radiation block 7, but the heat conductive material 6 is stretched to the side surface of the back load material 5, and this stretching is performed.
- the heat radiating block 7 does not need to be on the back of the back load member 5, but is provided on the side of the back load member 5 or on a separate place. Even so, the same effect can be obtained.
- the heat generated by the piezoelectric element 1 and the heat generated by the multiple reflections of the ultrasonic waves can be transferred by the heat conductive material 6 provided inside or a part of the back load material 5. Since heat can be absorbed and dissipated by the radiation block 7 connected to the probe, the surface temperature of the ultrasonic probe can be reduced. Therefore, the transmission voltage of the ultrasonic diagnostic apparatus can be increased, and the diagnostic depth can be further increased.
- the piezoelectric element 1 mechanically vibrates due to the voltage applied to the signal electrode 3 and the ground electrode 2 (see FIG. 1) provided on the front and rear surfaces of the piezoelectric element 1, respectively, and the signal is applied to the ground electrode 2 and the signal electrode. Since ultrasonic waves are generated on both sides of the electrode 3, the generated ultrasonic waves also propagate to the back load material 5 and to the heat conductive material 6, and conduct heat as shown in the ultrasonic wave 8 in FIG. The ultrasonic waves 8 reflected from the inclined surface at the tip of the material 6 and further reflected from the inclined surface at the tip of the heat conductive material 6 propagate through the back load material 5 again.
- the angle of the inclined surface of the tip of the heat conductive material 6 (the direction in which the ultrasonic waves 8 transmitted from the piezoelectric element 1 propagates in the depth direction of the back load material 5 (perpendicular to the back surface of the piezoelectric element 1))
- the angle is set to an angle of about 45 degrees or more
- the ultrasonic wave 8 propagates in the direction of the adjacent heat conducting material 6 at an angle of about 45 degrees and is reflected again, and the ultrasonic wave 8 returns to the piezoelectric element 1 And may reduce the resolution of ultrasound images.
- the angle is set to 45 degrees or more, the ultrasonic wave 8 returns to the piezoelectric element 1 similarly.
- the angle of the inclined surface at the tip of the heat conductive material 6 is 45 degrees or less in principle, the reflected ultrasonic waves 8 will not return to the piezoelectric element 1, but the ultrasonic waves 8 are diffused. In this case, the ultrasonic wave 8 may return to the piezoelectric element 1 even when the angle is 45 degrees or less. Therefore, the angle of the inclined surface at the tip of the heat conductive material 6 is set to 40 degrees or less in consideration of the diffusion of the ultrasonic waves 8. With this angle, the ultrasonic wave 8 does not return to the piezoelectric element 1. 3 and 4, the heat conductive material 6 is shown in a configuration in which the slope is provided on both sides ( ⁇ X directions).
- the heat conductive material 6 has a very small attenuation coefficient of the ultrasonic wave, so that there is a possibility that the ultrasonic wave propagated in the heat conductive material 6 returns to the piezoelectric element 1 again. Therefore, if possible, it is desirable to adopt a configuration that does not allow ultrasonic waves to propagate inside the heat conductive material 6.
- the sound speed C1 of the back load material 5 is about 190 OmZs
- the sound speed C2 of the heat conductive material 6 is about 320 OmZs.
- Calculating the critical angle 0 from these sound velocities C l and C 2 gives 36.4 degrees.
- the angle between the ultrasonic wave 8 propagating almost perpendicularly from the piezoelectric element 1 to the back load material 5 and the inclined surface of the heat conductive material 6 is 90 degrees-one critical angle 0.
- the configuration may be such that the angle of the inclined surface at the tip of the heat conductive material 6 is (90 degrees-critical angle 0) or less. Even if a combination other than the materials of the back load material 5 and the heat conductive material 6 used as an example is used, if the material described in the first embodiment is used, the sound speed of the heat conductive material 6 is faster than the sound speed of the back load material 5. Therefore, the above equation (1) holds.
- the heat generated by the piezoelectric element 1 and the heat generated by the multiple reflection can be transmitted by the heat conductive material 6 provided inside or a part of the back load material 5, Moreover, even if the ultrasonic waves 8 in the back load member 5 are reflected from the heat conductive member 6, they do not return to the piezoelectric element 1 again, so that the resolution can be prevented from deteriorating. This has the effect of reducing the surface temperature. Therefore, the transmission voltage of the ultrasonic diagnostic apparatus can be increased, and the diagnostic depth can be further increased.
- the configuration is described in which the inclined surface at the tip of the heat conductive material 6 is provided on both sides (the soil X direction). In addition, the inclined surface of the heat conductive material 6 is provided only on one side. However, the same effect can be obtained by using a conical configuration.
- FIG. 5 An ultrasonic probe according to a third embodiment of the present invention is shown in FIG.
- the configuration in FIG. 5 is the same as the configuration and operation described in the first embodiment, and thus is omitted here, and the features of the third embodiment will be described.
- the heat conductive material 16 is further provided between the heat radiating block 17 and the back load material 15.
- the heat conductive material 16 As the heat conductive material 16, a material larger than the heat conductivity of the back load material 15 is used, and the heat absorbed by the heat conductive material 16 is dissipated by the heat dissipating block 17. There is no problem if 17 can be composed of a body, but depending on the material, it may not always be possible to combine them. For example, when a high-arrangement PGS graphite sheet made of a polymer film having a very high thermal conductivity (600 to 80 OWZm k) is used as the heat conductive material 16, However, the heat radiation block 17 cannot be made of the same material.
- the heat conductive material 16 has a smaller contact area with the heat radiating block 17, so by increasing the efficiency of transferring heat from the heat conductive material 16 to the heat radiating block 17, the heat conductive material
- the configuration in which 16 is provided up to the back of the load material 15 is adopted.
- Such a configuration can be easily formed by using a sheet-like material of a high-arrangement PGS graphite obtained by converting the above-mentioned polymer film into a graphite as the material of the heat conductive material 16. Further, the heat radiation block 17 is provided by using a material different from the heat conductive material 16. With this configuration, the contact area between the heat conductive material 16 and the heat radiation block 17 can be increased. Therefore, effective heat radiation can be performed.
- the piezoelectric element 11 mechanically vibrates due to the voltage applied to the signal electrode 13 and the ground electrode 12 provided on both sides of the piezoelectric element 11, and both sides (the ground electrode 12 side and the signal electrode 13 side) Ultrasonic waves are generated, but the generated ultrasonic waves 8 are attenuated inside the rear load member 15 so as not to return to the piezoelectric element 11.
- a heat conductive material 16 is provided inside or a part of the back load material 15, and absorbs heat generated from the piezoelectric element 11 and radiates heat.
- the configuration in which the heat conductive material 16 is provided in the form of a sheet has been described.
- the heat conductive material 16 is added from a block as shown in FIG. The same effect can be obtained by providing the heat conductive material 16 in the shape thereof.
- FIG. 6 An ultrasonic probe according to a fourth embodiment of the present invention is shown in FIG.
- the configuration in FIG. 6 is the same as the cross-sectional view of the piezoelectric element 1 shown in FIG. 1 viewed from the X direction. Since the configuration and operation are the same as those described in the first embodiment, they are omitted here, and the features of the fourth embodiment will be described.
- a back load member 5 is provided on the signal electrode 3 side with respect to the piezoelectric element 1 having the signal electrode 3 and the ground electrode 2 on both surfaces, and a block-like heat conduction is provided on the back surface of the back load member 5.
- the material 6 is provided, and the piezoelectric element 1 is divided into a plurality of pieces by providing a dividing groove 9 by machining or the like. This is a commonly used array type.
- a cut is made to a part of the depth of the back load member 5. This is necessary so that when the divided piezoelectric elements 1 are individually vibrated individually, vibration is not transmitted to the adjacent piezoelectric elements 1 through the back load material 5, that is, to reduce acoustic cross-talk. It is.
- the block-shaped heat conductive material 6 provided on the back of the back load material 5 The configuration is such that the elements 1 are continuously connected in the arrangement direction, because heat is absorbed as much as possible to facilitate heat dissipation.
- the heat conductive material 6 is formed in a block configuration as described above, if the heat conductive material 6 is present at the depth of the division groove 9 to the back load material 5, as described above, the heat conductive material 6 is formed in another adjacent piezoelectric element 1. Vibration propagates through the back load material 5 and the heat conductive material 6, and acoustic crosstalk increases.
- the heat conducting material 6 is made of a material that propagates acoustically and has low attenuation, the acoustic crosstalk can be reduced by using a structure that is provided at a depth that does not cover the dividing groove 9 of the piezoelectric element 1. Can be prevented.
- the same materials as those described in the first embodiment are used for the back load member 5 and the heat conductive member 6 described here.
- heat generated by the plurality of arranged piezoelectric elements 1 and heat generated by multiple reflection can be conducted by the heat conductive material 6 provided inside or a part of the back load material 5.
- the influence of acoustic crosstalk due to the heat conductive material 6 is reduced, deterioration of resolution can be prevented, and the surface temperature of the ultrasonic probe can be reduced. Therefore, the transmission voltage of the ultrasonic diagnostic apparatus can be increased, and the diagnostic depth can be further increased.
- a dividing groove 9 is formed at a depth reaching the block-shaped heat conducting material 6, and is formed on the surface of the heat conducting material 6 by the dividing groove 9. Even when the back load member 5 is formed on the uneven surface, the above-described effects can be obtained.
- the ultrasonic probe of the present invention can be used for an ultrasonic diagnostic apparatus as well as other apparatuses for obtaining an ultrasonic tomographic image.
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- Medical Informatics (AREA)
- Animal Behavior & Ethology (AREA)
- Radiology & Medical Imaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Biophysics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Mechanical Engineering (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/573,686 US7755255B2 (en) | 2003-09-30 | 2004-09-30 | Ultrasonic probe |
EP04773644.2A EP1671588B1 (en) | 2003-09-30 | 2004-09-30 | Ultrasonic probe |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-342274 | 2003-09-30 | ||
JP2003342274A JP4624659B2 (ja) | 2003-09-30 | 2003-09-30 | 超音波探触子 |
Publications (1)
Publication Number | Publication Date |
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WO2005030055A1 true WO2005030055A1 (ja) | 2005-04-07 |
Family
ID=34386246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2004/014770 WO2005030055A1 (ja) | 2003-09-30 | 2004-09-30 | 超音波探触子 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7755255B2 (ja) |
EP (1) | EP1671588B1 (ja) |
JP (1) | JP4624659B2 (ja) |
CN (1) | CN100563577C (ja) |
WO (1) | WO2005030055A1 (ja) |
Cited By (2)
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US8574159B2 (en) | 2006-07-10 | 2013-11-05 | Nihon Dempa Kogyo Co., Ltd. | Thermally enhanced ultrasonic probe |
JP2016058376A (ja) * | 2014-09-04 | 2016-04-21 | ザ・ボーイング・カンパニーThe Boeing Company | 高輝度放電ランプ組立体及び方法 |
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- 2004-09-30 EP EP04773644.2A patent/EP1671588B1/en not_active Expired - Lifetime
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8574159B2 (en) | 2006-07-10 | 2013-11-05 | Nihon Dempa Kogyo Co., Ltd. | Thermally enhanced ultrasonic probe |
JP2016058376A (ja) * | 2014-09-04 | 2016-04-21 | ザ・ボーイング・カンパニーThe Boeing Company | 高輝度放電ランプ組立体及び方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1671588A4 (en) | 2013-08-07 |
CN100563577C (zh) | 2009-12-02 |
US7755255B2 (en) | 2010-07-13 |
EP1671588B1 (en) | 2015-03-25 |
EP1671588A1 (en) | 2006-06-21 |
CN1859871A (zh) | 2006-11-08 |
JP4624659B2 (ja) | 2011-02-02 |
US20070276248A1 (en) | 2007-11-29 |
JP2005103078A (ja) | 2005-04-21 |
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