WO2005029574A1 - Collet, microsoudeuse de puces et procede de collecte de puces - Google Patents

Collet, microsoudeuse de puces et procede de collecte de puces Download PDF

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Publication number
WO2005029574A1
WO2005029574A1 PCT/JP2003/011936 JP0311936W WO2005029574A1 WO 2005029574 A1 WO2005029574 A1 WO 2005029574A1 JP 0311936 W JP0311936 W JP 0311936W WO 2005029574 A1 WO2005029574 A1 WO 2005029574A1
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WO
WIPO (PCT)
Prior art keywords
collet
chip
vacuum suction
bonding
flake
Prior art date
Application number
PCT/JP2003/011936
Other languages
English (en)
Japanese (ja)
Inventor
Nobuhiro Nagamoto
Original Assignee
Nec Machinery Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Machinery Corporation filed Critical Nec Machinery Corporation
Priority to JP2005509046A priority Critical patent/JPWO2005029574A1/ja
Priority to AU2003266534A priority patent/AU2003266534A1/en
Priority to PCT/JP2003/011936 priority patent/WO2005029574A1/fr
Priority to CN03826807.8A priority patent/CN1802735A/zh
Publication of WO2005029574A1 publication Critical patent/WO2005029574A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

L'invention permet d'empêcher les puces à semi-conducteur de se fissurer lors des opérations de collecte et de soudage. Elle décrit ainsi un outil de soudage (10) comprenant un porte-collet (20) et un collet (30). Le porte-collet (20) comprend un trou d'aspiration (21) central, présentant des trous filetés (22, 23) destinés à la fixation du porte-collet (20) à un élément de support, ainsi qu'une unité dépendante (24) inférieure dans laquelle est formée un évidement (25). Le collet (30) possède une surface plate (31) sur l'extrémité inférieure, une pluralité de trous traversants d'aspiration (33) s'étendant verticalement, une protubérance (33) conçue pour s'adapter dans l'évidement (25), et une bride (34) s'appuyant sur la surface inférieure de l'unité dépendante (24). Un espace (26) est formé de sorte que la dimension de la profondeur (H1) de l'évidement (25) et la dimension de la hauteur (H2) de la protubérance (33) correspondent à H1> H2, et que la communication s'établissent entre les trous d'aspiration (21, 32), via l'espace (26). La pluralité de tous d'aspiration (32) aspirent la périphérie de la puce, de manière à la saisir et réaliser la soudure.
PCT/JP2003/011936 2003-09-18 2003-09-18 Collet, microsoudeuse de puces et procede de collecte de puces WO2005029574A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005509046A JPWO2005029574A1 (ja) 2003-09-18 2003-09-18 コレット、ダイボンダおよびチップのピックアップ方法
AU2003266534A AU2003266534A1 (en) 2003-09-18 2003-09-18 Collet, die bonder, and chip pick-up method
PCT/JP2003/011936 WO2005029574A1 (fr) 2003-09-18 2003-09-18 Collet, microsoudeuse de puces et procede de collecte de puces
CN03826807.8A CN1802735A (zh) 2003-09-18 2003-09-18 筒夹、芯片附着装置及芯片的拾取方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/011936 WO2005029574A1 (fr) 2003-09-18 2003-09-18 Collet, microsoudeuse de puces et procede de collecte de puces

Publications (1)

Publication Number Publication Date
WO2005029574A1 true WO2005029574A1 (fr) 2005-03-31

Family

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Application Number Title Priority Date Filing Date
PCT/JP2003/011936 WO2005029574A1 (fr) 2003-09-18 2003-09-18 Collet, microsoudeuse de puces et procede de collecte de puces

Country Status (4)

Country Link
JP (1) JPWO2005029574A1 (fr)
CN (1) CN1802735A (fr)
AU (1) AU2003266534A1 (fr)
WO (1) WO2005029574A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009289785A (ja) * 2008-05-27 2009-12-10 Renesas Technology Corp 半導体集積回路装置の製造方法
EP2381465A1 (fr) * 2010-04-22 2011-10-26 Kulicke & Soffa Die Bonding GmbH Interface de tête d'outil pour un outil de manipulation de composants
JP2012256931A (ja) * 2012-08-24 2012-12-27 Renesas Electronics Corp 半導体集積回路装置の製造方法
CN102881622A (zh) * 2012-01-11 2013-01-16 日月光半导体制造股份有限公司 用于覆晶接合的热压头
KR20190114128A (ko) * 2018-03-29 2019-10-10 삼성전자주식회사 칩 이송 장치 및 이를 이용한 칩 이송 방법
WO2021039566A1 (fr) 2019-08-26 2021-03-04 リンテック株式会社 Procédé de fabrication de stratifié

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102676997A (zh) * 2012-06-11 2012-09-19 上海宏力半导体制造有限公司 一种物理气相沉积设备
CN103066001B (zh) * 2012-12-28 2015-04-22 无锡中微高科电子有限公司 共晶焊机拾取芯片用的万向调平吸嘴
KR101570764B1 (ko) * 2014-02-27 2015-11-20 주식회사 페코텍 반도체 다이 본딩용 콜렛
JP5929947B2 (ja) * 2014-02-28 2016-06-08 株式会社安川電機 吸着パッド、ロボットハンドおよびロボット
JP6316873B2 (ja) * 2016-05-31 2018-04-25 株式会社新川 ダイの実装方法
JP6889614B2 (ja) * 2017-05-31 2021-06-18 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP2019046961A (ja) * 2017-09-01 2019-03-22 Tdk株式会社 吸着ノズル及びこれを備える外観検査装置、並びに、回路基板の製造方法
JP6967411B2 (ja) * 2017-09-19 2021-11-17 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット
CN109366348A (zh) * 2018-11-28 2019-02-22 沛顿科技（深圳）有限公司 一种可拆装陶瓷吸盘底座
CN110039566B (zh) * 2019-04-11 2021-07-16 深圳市森镁环保回收有限公司 一种具有除尘功能的可靠性高的芯片分拣设备
CN110328764A (zh) * 2019-04-15 2019-10-15 南宁聚信众信息技术咨询有限公司 一种用于切割工序的可靠性高的稳定型芯片拾取装置
CN110323175B (zh) * 2019-04-16 2023-01-06 深圳市正鸿泰科技有限公司 一种具有吸力调节功能的便捷型芯片分拣设备
CN111702797A (zh) * 2020-06-28 2020-09-25 江苏核电有限公司 核电站用蒸汽发生器集流管异物抓取工具及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233592A (ja) * 1998-02-12 1999-08-27 Rohm Co Ltd 真空吸着式コレットの構造
JPH11300673A (ja) * 1998-04-17 1999-11-02 Rohm Co Ltd 真空吸着式コレットの構造
JP2001196443A (ja) * 2000-01-14 2001-07-19 Sharp Corp 半導体チップのピックアップ装置およびピックアップ方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233592A (ja) * 1998-02-12 1999-08-27 Rohm Co Ltd 真空吸着式コレットの構造
JPH11300673A (ja) * 1998-04-17 1999-11-02 Rohm Co Ltd 真空吸着式コレットの構造
JP2001196443A (ja) * 2000-01-14 2001-07-19 Sharp Corp 半導体チップのピックアップ装置およびピックアップ方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009289785A (ja) * 2008-05-27 2009-12-10 Renesas Technology Corp 半導体集積回路装置の製造方法
EP2381465A1 (fr) * 2010-04-22 2011-10-26 Kulicke & Soffa Die Bonding GmbH Interface de tête d'outil pour un outil de manipulation de composants
CN102881622A (zh) * 2012-01-11 2013-01-16 日月光半导体制造股份有限公司 用于覆晶接合的热压头
JP2012256931A (ja) * 2012-08-24 2012-12-27 Renesas Electronics Corp 半導体集積回路装置の製造方法
KR20190114128A (ko) * 2018-03-29 2019-10-10 삼성전자주식회사 칩 이송 장치 및 이를 이용한 칩 이송 방법
KR102486822B1 (ko) 2018-03-29 2023-01-10 삼성전자주식회사 칩 이송 장치 및 이를 이용한 칩 이송 방법
WO2021039566A1 (fr) 2019-08-26 2021-03-04 リンテック株式会社 Procédé de fabrication de stratifié

Also Published As

Publication number Publication date
JPWO2005029574A1 (ja) 2006-11-30
CN1802735A (zh) 2006-07-12
AU2003266534A1 (en) 2005-04-11

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