Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
  • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
  • G06F1/16—Constructional details or arrangements
  • G06F1/1613—Constructional details or arrangements for portable computers
  • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
  • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
  • G06F1/16—Constructional details or arrangements
  • G06F1/1613—Constructional details or arrangements for portable computers
  • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
  • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
  • G06F1/16—Constructional details or arrangements
  • G06F1/1613—Constructional details or arrangements for portable computers
  • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
  • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
  • G06F1/16—Constructional details or arrangements
  • G06F1/20—Cooling means
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
  • G06F1/16—Constructional details or arrangements
  • G06F1/20—Cooling means
  • G06F1/203—Cooling means for portable computers, e.g. for laptops
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
  • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
  • H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating

Definitions

• the present invention relates to a heat dissipating member having excellent heat dissipating properties, and an apparatus, a housing, and a computer support using the heat dissipating member.
• devices that generate heat such as internal combustion engines, heat exchangers such as refrigerators, and electronic devices such as CPUs in combi- ters, have radiated heat radiating units, such as radiating fins and mufflers such as internal combustion engines.
• radiated heat radiating units such as radiating fins and mufflers such as internal combustion engines.
• Various electric motors, heat sinks, etc. are painted black to improve the heat dissipation effect.
• a zero-path structure including a plurality of passbars constituting a power circuit is provided with a heat dissipating member having a busper bonding surface coated with an insulating layer, and Each bus bar is directly bonded to the bus bar bonding surface in a state where the bus bars are arranged in a line, so that the bus bar is efficiently cooled with a simple structure (for example, Japanese Patent Application Laid-Open No. 2003-164604). No. 0).
• Another example is an electrical junction box that supports a current distribution circuit board and a printed circuit board with a gap, eliminates the insulating plate that intervenes, and improves heat dissipation due to the presence of the gap. (For example, JP-A-2000 3-8 7 9 3 8).
• the black paint having the effect of heat dissipation and heat absorption is applied to a base material such as copper or aluminum having a high thermal conductivity.
• the present invention applies the black paint to the base material.
• An object of the present invention is to provide a heat dissipating member that can be expected to have a further heat dissipating effect than the heat dissipating member described above, and a device, a housing, and a computer support using the heat dissipating member. Disclosure of the invention
• the present inventor applied various samples to the base material and tried experiments on the heat radiation state, and found that tourmaline has a very remarkable effect (discovered a specific attribute). I learned. In this way, the present inventor focused on tourmaline has invented a heat radiation member or the like that solves the above-mentioned problems by using the tourmaline powder (by exclusively using this property and palpitations).
• the heat dissipating member according to claim 1 is characterized in that a tourmaline layer containing tourmaline powder as a main component is provided on a surface of a substrate having thermal conductivity.
• a heat radiation member according to claim 2 is characterized in that, in claim 1, the base material is a metal plate.
• the heat dissipating member according to claim 3 is characterized in that tourmaline powder is mixed into a base material.
• the heat generating portion and the heat radiating portion for radiating the heat or the heat generated in the above device are configured using the heat radiating member.
• the heat radiating member according to claim 5 is the device according to claim 4, wherein the device configured using the heat radiating member is a cooling device, and the heat radiating member is a heat exchanger system of the cooling device. It is characterized by being used for.
• the case according to claim 6 is provided with a heat dissipating member having a tourmaline layer mainly composed of tourmaline powder on the surface of a substrate having thermal conductivity, and various types of computers and hard disks. A case that constitutes a device is configured by using the heat dissipating member.
• This tourmaline layer is a liquid powder obtained by dissolving tourmaline powder in a resin-based paint such as acryl or the like on a base material such as iron, non-ferrous metal having high heat conductivity such as copper or aluminum, or a synthetic resin. It is preferable to apply a composition to the substrate, or mix a tourmaline powder into a base material such as a metal or a synthetic resin.
• the color of the heat dissipating member or the tormarin layer thus configured is not particularly limited. This is preferable because improvement of the fruit can be expected.
• the base material is made of metal and tolmaline powder is mixed with such a metal base material
• tolmaline is originally characterized by applying heat of 90 ° C or more. Since it is known that the metal is ruptured, it is extremely preferable that the metal serving as the base material is a metal having a low melting point of 900 ° C. or less.
• FIG. 1 is a cross-sectional view of the heat radiation member according to the first embodiment.
• FIG. 2 is an explanatory diagram showing an outline of an experiment on a heat radiation effect.
• FIG. 3 is a conceptual diagram in a case where the heat radiation member is applied to a refrigerator.
• FIG. 4 is a conceptual diagram when the heat radiation member is applied to a desktop computer.
• FIG. 5 is a conceptual diagram when the heat radiation member is applied to a notebook computer.
• FIG. 6 is a conceptual diagram in a case where a heat radiation member is applied to an electric motor.
• FIG. 7 is a side view of the support for a notebook computer. BEST MODE FOR CARRYING OUT THE INVENTION
• reference numeral 1 denotes a heat radiating member
• reference numeral 11 denotes a base material
• reference numeral 12 denotes a torumarin layer.
• the heat dissipating member 1 includes a base material 11 made of a thin copper plate having a high thermal conductivity, and tourmaline formed on the upper surface of the base material 11 and mainly composed of tourmaline. And a tourmaline layer 1 and 2.
• the tourmaline layer 12 is formed by dissolving a tourmaline powder having a particle size of about 3 to 7 micrometer in a resin-based paint such as acryl or the like. It is composed by solidifying with multiple coatings.
• the liquid in which the tourmaline powder is mixed is not limited to the above-mentioned resin paint such as acrylic resin, but may be a well-known heat-resistant paint. That is, the liquid is solidified, and easily solidified from the base material 11. Any liquid material may be used as long as it does not peel off. Further, a configuration in which a solidified material is attached may be used.
• tourmaline powder may be mixed with a base material 11 made of synthetic resin or the like in a desired amount so that the tourmaline powder may be used to form a member.
• a mixing step with a synthetic resin material is required, but the heat radiation member 1 having a desired shape can be easily manufactured simply by using conventional molding means such as injection molding.
• the base material 11 used in the experiment was a 0.7 mm copper plate, and the heat radiating member 1 constituted by providing the tourmaline layer 12 only on the upper surface of the base material 11 and the base material 11 With black coating only on the upper surface of the sample (hereinafter, comparative sample A) Then, the heat release state of the substrate 11 as it is (hereinafter, comparative sample B) was compared.
• the outline of the experiment was as follows. One end of the surface opposite to the tourmaline layer 12 and the black painted surface (comparative sample B only, no orientation of the temperature sensor attachment surface) Then, select one of the heat radiating member 1 and one of the comparative sample A or the comparative sample B, and simultaneously place two on the household electric heater (hot plate) D. At this time, the heat dissipating member 1 is placed so that the tourmaline layer 12 and the black paint are on the top, and the temperature sensor C is kept away from the electric heater so that the temperature sensor C is not affected by the heat of the household electric heater D itself. And comparative sample A and comparative sample B are placed on household heater D.
• the components placed on the household electric heater D are raised to an appropriate temperature, and the temperature rises away from the household electric heater D at that time.
• the state of heat radiation from the upper surface can be grasped.
• the material, mounting conditions, and heating conditions of the base material 11 are uniform, there is no black coating layer, tormarin layer 12, and no formed layer formed on the surface of the base material 11, and heat radiation of each member The effect can be grasped.
• the temperature difference was 8.2 ° C, and it was confirmed that the heat dissipating member 1 had a more effective heat dissipating effect.
• the reason why the sampled temperature is not set is that the temperature was measured under limited facilities, but as described above, the heat radiation member 1 according to the present embodiment is It has been confirmed that the heat radiation effect has a remarkable effect. Since the heat radiating member 1 configured as described above is formed in a thin plate shape, it can be easily cut and bent, and can be processed so as to be suitable for various heat radiating portions.
• the tormaline layer 1 illustrated in the first embodiment is not necessarily formed of the thin plate-shaped heat radiating member 1 illustrated in the first embodiment, but is formed on a substrate 11 formed of a required shape and material. It is composed of the heat dissipating member 1 formed with 2, or mixed with tolmaline powder in the base material.
• the heat exchanger system E of the refrigerator car includes a compressor el, a refrigerant tank e2, a cooled room e3, a heat dissipation function unit e4, and a pipe member e5 connecting them. It has a well-known structure provided, and each of these components is composed of a heat radiating member 1 in which a tourmaline layer 12 is formed on a substrate 11 formed in a required shape.
• the refrigerator configured using the heat dissipating member 1 as described above has an improved heat dissipating effect, thereby improving the heat exchange rate, and is an extremely suitable refrigerator.
• thermos state Inside the normal computer F, the case (housing) f1 and the chassis f 2 and between the devices f 3, the metal plating is exposed or the metal material itself is exposed. However, in this state, the heat generated inside is repeatedly reflected between the members, making it difficult for the heat to escape to the outside, a structure close to a so-called thermos state.
• the case (housing) f 1, the chassis f 2, each device f 3 such as HDD and DVD, and each component such as the CPU f 4 are composed of the heat radiation member 1 having the tourmaline layer 12.
• the internal temperature of Computer F can be reduced.
• Computer F shown in Fig. 4 can be applied to notebook PC G as shown in Fig. 5, which is a desktop personal computer.
• the normal notebook PC case (housing) g1 is made of metal or non-metallic material such as polycarbonate. Therefore, by forming the case gl by mixing tourmaline powder, the internal heat is dissipated and consumed, and the internal temperature of the notebook PC G can be prevented from rising.
• the plating is applied, or the metal material itself is exposed. In such a state, the heat generated inside hardly escapes to the outside.
• the chassis and the like are made up of the heat radiating member 1, thereby promoting internal heat radiation and consuming internal heat, thereby preventing a rise in temperature inside the device.
• the housing (housing) h1 of the electric motor H may be constituted by the heat radiating member 1.
• the support base 3 on which the existing notebook computer N is placed may be constituted by the heat radiating member 1.
• the heat radiating member 1 is placed on the notebook computer N.
• the supporting base 3 is formed by bending and forming an approximately L-shape in a side view at a suitable height.
• the heat transferred to the case (housing) ⁇ ⁇ of the notebook computer N is further transmitted to the support 3, and this support 3
• the heat is efficiently dissipated from Therefore, the heat dissipation effect can be further improved without any modification to the existing notebook computer N.
• the heat dissipating member 1 may be applied to a new component that further improves the heat dissipating effect without any modification to the existing one.
• the present invention can be applied to various other devices such as broadcasting equipment, video, communication equipment, routers, switches, amplifiers, etc., in addition to the personal computer described above.
• it can also be applied to other single devices and parts such as the heat generating part of the liquid crystal panel, the solar cell light receiving part, various transformers, electric motors, heat radiating parts such as cooling devices, refrigerant compressors, cooler heat radiating parts, in-vehicle radiators, vehicle mounted parts It is.
• the tourmaline layer may be provided not only on the upper surface or the surface in contact with the outside world, but also on both surfaces of the base material, or may be provided inside so as to have a sandwich structure.
• the color of the tourmaline layer is not particularly limited, nor is the material of the base material particularly limited.
• the shape is not particularly limited, such as a thin plate shape, a rod shape, and the like.
• the heat radiating member is provided with the substrate and the tourmaline layer, it can be manufactured extremely inexpensively and easily. A large heat dissipation effect can be obtained.
• the temperature of the cooling device decreases due to the improvement of the heat dissipating effect (improvement of heat exchange), and an extremely suitable cooling device can be provided.

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• Engineering & Computer Science (AREA)
• Theoretical Computer Science (AREA)
• Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• General Engineering & Computer Science (AREA)
• Human Computer Interaction (AREA)
• General Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Mechanical Engineering (AREA)
• Mathematical Physics (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Other Surface Treatments For Metallic Materials (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Laminated Bodies (AREA)

Priority Applications (6)

Applications Claiming Priority (1)

Publications (1)

Family

ID=34131284

Family Applications (2)

Family Applications After (1)

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Citations (3)

Family Cites Families (4)

• 2003
  • 2003-08-11 AU AU2003254937A patent/AU2003254937A1/en not_active Abandoned
  • 2003-08-11 WO PCT/JP2003/010213 patent/WO2005015111A1/ja active Application Filing
• 2004
  • 2004-08-11 JP JP2005513009A patent/JP4404855B2/ja not_active Expired - Fee Related
  • 2004-08-11 WO PCT/JP2004/011557 patent/WO2005015112A1/ja active Application Filing
  • 2004-08-11 CN CNB2004800229392A patent/CN100476341C/zh not_active Expired - Fee Related
  • 2004-08-11 US US10/568,042 patent/US20060201659A1/en not_active Abandoned

Patent Citations (3)

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