WO2005007931A1 - 金属充填方法および金属充填装置 - Google Patents
金属充填方法および金属充填装置 Download PDFInfo
- Publication number
- WO2005007931A1 WO2005007931A1 PCT/JP2004/009984 JP2004009984W WO2005007931A1 WO 2005007931 A1 WO2005007931 A1 WO 2005007931A1 JP 2004009984 W JP2004009984 W JP 2004009984W WO 2005007931 A1 WO2005007931 A1 WO 2005007931A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- work
- molten metal
- metal
- substrate
- workpiece
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/50—Controlling or regulating the coating processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1527—Obliquely held PCB
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Coating With Molten Metal (AREA)
- Electrodes Of Semiconductors (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005511826A JPWO2005007931A1 (ja) | 2003-07-23 | 2004-07-07 | 金属充填方法および金属充填装置 |
EP04747450A EP1655389A4 (en) | 2003-07-23 | 2004-07-07 | METAL LOADING PROCESS AND DEVICE |
CN2004800208926A CN1826432B (zh) | 2003-07-23 | 2004-07-07 | 金属填充方法及金属填充装置 |
US11/333,345 US20060113057A1 (en) | 2003-07-23 | 2006-01-18 | Metal filling process and metal filling apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003200625 | 2003-07-23 | ||
JP2003-200625 | 2003-07-23 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/333,345 Continuation US20060113057A1 (en) | 2003-07-23 | 2006-01-18 | Metal filling process and metal filling apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005007931A1 true WO2005007931A1 (ja) | 2005-01-27 |
Family
ID=34074484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/009984 WO2005007931A1 (ja) | 2003-07-23 | 2004-07-07 | 金属充填方法および金属充填装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060113057A1 (ja) |
EP (1) | EP1655389A4 (ja) |
JP (1) | JPWO2005007931A1 (ja) |
CN (1) | CN1826432B (ja) |
WO (1) | WO2005007931A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8048479B2 (en) | 2006-08-01 | 2011-11-01 | Qimonda Ag | Method for placing material onto a target board by means of a transfer board |
DE102006035865B3 (de) * | 2006-08-01 | 2008-03-06 | Infineon Technologies Ag | Verfahren zum Platzieren von Material auf einer Zielplatte mithilfe einer Transferplatte sowie eine integrierte Schaltung und eine zur Durchführung des Verfahrens geeignete Vorrichtung |
JP6033782B2 (ja) * | 2011-09-21 | 2016-11-30 | 住友精密工業株式会社 | 金属充填装置 |
CN106335194A (zh) * | 2016-08-29 | 2017-01-18 | 昆山三景科技股份有限公司 | 三维显示屏产品硅化工艺积液不良的改善方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6279576U (ja) * | 1985-11-05 | 1987-05-21 | ||
JPH05273760A (ja) * | 1992-03-26 | 1993-10-22 | Matsushita Electric Works Ltd | レジスト膜形成方法 |
JP2002158191A (ja) * | 2000-11-22 | 2002-05-31 | Fujikura Ltd | 微細空間への金属充填装置および金属充填方法 |
JP2003126773A (ja) * | 2001-10-29 | 2003-05-07 | Kowa Industry Co Ltd | 粉体塗装方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2671264A (en) * | 1952-05-24 | 1954-03-09 | Rca Corp | Method of soldering printed circuits |
DE3632378A1 (de) * | 1986-09-24 | 1988-03-31 | Schering Ag | Verfahren zum fuehren von plattenfoermigen gegenstaenden, sowie dazugehoerige vorrichtung |
CN1227880A (zh) * | 1999-01-15 | 1999-09-08 | 河北银达交通工业集团有限公司 | 热浸锌生产线生产工艺及装置 |
US6779585B2 (en) * | 2002-09-25 | 2004-08-24 | Honda Giken Kogyo Kabushiki Kaisha | Method for controlling ladle motion to reduce aluminum oxide formation |
-
2004
- 2004-07-07 EP EP04747450A patent/EP1655389A4/en not_active Withdrawn
- 2004-07-07 CN CN2004800208926A patent/CN1826432B/zh not_active Expired - Fee Related
- 2004-07-07 WO PCT/JP2004/009984 patent/WO2005007931A1/ja active Application Filing
- 2004-07-07 JP JP2005511826A patent/JPWO2005007931A1/ja active Pending
-
2006
- 2006-01-18 US US11/333,345 patent/US20060113057A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6279576U (ja) * | 1985-11-05 | 1987-05-21 | ||
JPH05273760A (ja) * | 1992-03-26 | 1993-10-22 | Matsushita Electric Works Ltd | レジスト膜形成方法 |
JP2002158191A (ja) * | 2000-11-22 | 2002-05-31 | Fujikura Ltd | 微細空間への金属充填装置および金属充填方法 |
JP2003126773A (ja) * | 2001-10-29 | 2003-05-07 | Kowa Industry Co Ltd | 粉体塗装方法 |
Also Published As
Publication number | Publication date |
---|---|
US20060113057A1 (en) | 2006-06-01 |
EP1655389A1 (en) | 2006-05-10 |
CN1826432B (zh) | 2012-03-07 |
EP1655389A4 (en) | 2008-10-15 |
CN1826432A (zh) | 2006-08-30 |
JPWO2005007931A1 (ja) | 2006-08-31 |
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