WO2005004182A3 - グリーンシートの積層方法と積層セラミック電子部品の製造方法 - Google Patents

グリーンシートの積層方法と積層セラミック電子部品の製造方法 Download PDF

Info

Publication number
WO2005004182A3
WO2005004182A3 PCT/JP2004/008530 JP2004008530W WO2005004182A3 WO 2005004182 A3 WO2005004182 A3 WO 2005004182A3 JP 2004008530 W JP2004008530 W JP 2004008530W WO 2005004182 A3 WO2005004182 A3 WO 2005004182A3
Authority
WO
WIPO (PCT)
Prior art keywords
laminated unit
support sheet
green sheet
electronic component
layering
Prior art date
Application number
PCT/JP2004/008530
Other languages
English (en)
French (fr)
Other versions
WO2005004182A1 (ja
WO2005004182A2 (ja
Inventor
Syogo Murosawa
Shigeki Satou
Original Assignee
Tdk Corp
Syogo Murosawa
Shigeki Satou
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp, Syogo Murosawa, Shigeki Satou filed Critical Tdk Corp
Priority to JP2005511315A priority Critical patent/JP4340657B2/ja
Priority to US10/560,856 priority patent/US7234215B2/en
Publication of WO2005004182A1 publication Critical patent/WO2005004182A1/ja
Publication of WO2005004182A2 publication Critical patent/WO2005004182A2/ja
Publication of WO2005004182A3 publication Critical patent/WO2005004182A3/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Abstract

　グリーンシートおよび／または電極層を含む積層単位が形成された支持シートを巻き取る際には、積層単位が支持シートの裏面に貼り付くことが無く、容易に巻き解すことができ、しかも、積層単位を積層する際には、積層単位から前記支持シートを容易に剥離することができるグリーンシートの積層方法を提供する。 　支持シート２０の表面２０ａに、電極層１２ａおよび／またはグリーンシート１０ａから成る積層単位Ｕ１を積層し、積層単位付き支持シートを形成する。次に、積層単位付き支持シート２０を巻き取り、ロール体Ｒを形成する。ロール体Ｒを巻き解し、積層単位付き支持シート２０を、積層すべき層の上に置き、支持シート２０を積層単位Ｕ１から引きはがし、積層単位Ｕ１を積層する。支持シート２０の裏面２０ｂには、積層単位Ｕ１の幅と同等以上の幅の剥離容易化表面処理が成されており、しかも、剥離容易化表面処理が成されていない粘着可能部分２３が形成してある。 　
PCT/JP2004/008530 2003-06-20 2004-06-17 グリーンシートの積層方法と積層セラミック電子部品の製造方法 WO2005004182A2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005511315A JP4340657B2 (ja) 2003-06-20 2004-06-17 グリーンシートの積層方法と積層セラミック電子部品の製造方法
US10/560,856 US7234215B2 (en) 2003-06-20 2004-06-17 Stacking method of green sheet and a manufacturing method of multilayer ceramic electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-176546 2003-06-20
JP2003176546 2003-06-20

Publications (3)

Publication Number Publication Date
WO2005004182A1 WO2005004182A1 (ja) 2005-01-13
WO2005004182A2 WO2005004182A2 (ja) 2005-01-13
WO2005004182A3 true WO2005004182A3 (ja) 2005-04-14

Family

ID=33562235

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/008530 WO2005004182A2 (ja) 2003-06-20 2004-06-17 グリーンシートの積層方法と積層セラミック電子部品の製造方法

Country Status (6)

Country Link
US (1) US7234215B2 (ja)
JP (1) JP4340657B2 (ja)
KR (1) KR100766184B1 (ja)
CN (1) CN100557733C (ja)
TW (1) TWI237279B (ja)
WO (1) WO2005004182A2 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7491283B2 (en) * 2002-12-27 2009-02-17 Tdk Corporation Production method of multilayer electronic device
WO2004095479A1 (ja) * 2003-04-18 2004-11-04 Tdk Corporation 積層電子部品用の積層体ユニットの製造方法
WO2004095478A1 (ja) * 2003-04-18 2004-11-04 Tdk Corporation 積層電子部品用の積層体ユニットの製造方法
CN105206793B (zh) 2009-08-24 2017-12-22 赛昂能源有限公司 用于电化学电池的剥离系统
KR101716344B1 (ko) * 2011-06-28 2017-03-15 조인셋 주식회사 페라이트 시트 어셈블리 및 그 제조방법
EP2973779A1 (en) 2013-03-15 2016-01-20 Basf Se Protected electrode structures
WO2014151385A1 (en) 2013-03-15 2014-09-25 Sion Power Corporation Protected electrode structures and methods
US10490796B2 (en) 2014-02-19 2019-11-26 Sion Power Corporation Electrode protection using electrolyte-inhibiting ion conductor
KR102316170B1 (ko) 2014-02-19 2021-10-21 시온 파워 코퍼레이션 전해질-억제 이온 전도체를 포함하는 복합체를 사용한 전극 보호
TWI660376B (zh) * 2017-08-09 2019-05-21 日商創想意沃股份有限公司 電子部件的製造方法及裝置以及電子部件
WO2021177179A1 (ja) * 2020-03-04 2021-09-10 Tdk株式会社 剥離フィルムロール、セラミック部品シート及びその製造方法、並びに、セラミック部品及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0862837A (ja) * 1994-08-18 1996-03-08 Konica Corp 画像形成材料
JPH1167577A (ja) * 1997-08-21 1999-03-09 Matsushita Electric Ind Co Ltd 積層型セラミック電子部品の製造方法
JPH11238646A (ja) * 1997-12-03 1999-08-31 Tdk Corp 積層セラミック電子部品およびその製造方法
JP2001044064A (ja) * 1999-07-28 2001-02-16 Matsushita Electric Ind Co Ltd セラミック電子部品の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297522A (en) * 1979-09-07 1981-10-27 Tme, Inc. Cable shield
DE3137853A1 (de) * 1981-09-23 1983-04-07 Josef Dr. 8022 Grünwald Oberbach Strahlenschutzdecke
JPH01167577A (ja) * 1987-12-24 1989-07-03 Daido Steel Co Ltd アーク溶解装置
DE69835934D1 (de) 1997-12-03 2006-11-02 Tdk Corp Mehrlagiges keramisches Elektronikbauteil und dessen Herstellungsverfahren
US6245171B1 (en) * 1998-11-23 2001-06-12 International Business Machines Corporation Multi-thickness, multi-layer green sheet lamination and method thereof
JP2003095740A (ja) * 2001-09-20 2003-04-03 Nippon Electric Glass Co Ltd ガラスセラミック誘電体材料および焼結体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0862837A (ja) * 1994-08-18 1996-03-08 Konica Corp 画像形成材料
JPH1167577A (ja) * 1997-08-21 1999-03-09 Matsushita Electric Ind Co Ltd 積層型セラミック電子部品の製造方法
JPH11238646A (ja) * 1997-12-03 1999-08-31 Tdk Corp 積層セラミック電子部品およびその製造方法
JP2001044064A (ja) * 1999-07-28 2001-02-16 Matsushita Electric Ind Co Ltd セラミック電子部品の製造方法

Also Published As

Publication number Publication date
CN1839452A (zh) 2006-09-27
US20060130320A1 (en) 2006-06-22
KR100766184B1 (ko) 2007-10-10
KR20060026878A (ko) 2006-03-24
TWI237279B (en) 2005-08-01
TW200509164A (en) 2005-03-01
US7234215B2 (en) 2007-06-26
CN100557733C (zh) 2009-11-04
JPWO2005004182A1 (ja) 2007-09-20
JP4340657B2 (ja) 2009-10-07
WO2005004182A2 (ja) 2005-01-13

Similar Documents

Publication Publication Date Title
CA2386172A1 (en) Patterned laminates and electrodes with laser defined features
WO2005004182A3 (ja) グリーンシートの積層方法と積層セラミック電子部品の製造方法
WO2005004182A1 (ja) グリーンシートの積層方法と積層セラミック電子部品の製造方法
AU2003223799A1 (en) Method of formation and charge of the negative polarizable carbon electrode in an electric double layer capacitor
CA2435421A1 (en) Method for making an article comprising a sheet and at least an element directly mounted thereon
WO2003095175A3 (en) Embossing method and apparatus
SG91948A1 (en) Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
AU2003285111A1 (en) Electrophoretic or electromagnetophoretic display device with several layers of display cells, and manufacturing method
EP0717457A3 (en) Metallic porous sheet for a battery electrode substrate, and method of production
CA2534402A1 (en) Porous materials embedded with nanospecies, methods of fabrication thereof, and methods of use thereof
AU2003228268A1 (en) Improved polyvinyl alcohol film and method of producing the same
SG114747A1 (en) Etching composition for laminated film including reflective electrode and method for forming laminated wiring structure
WO2004049443A3 (en) Camouflaged circuit structure
WO2006099538A3 (en) Devices with ultrathin structures and method of making same
WO2003090294A3 (en) Composite films for electrochemical devices
EP1155667A3 (en) Absorbent article with silicone compound layer
EP1748508A4 (en) BATTERY ELECTRODE PLATE AND MANUFACTURING METHOD THEREFOR
EP1563895A4 (en) COMPOSITE POROUS MEMBRANE AND PROCESS FOR PRODUCING THE SAME
AU2003248359A1 (en) Ceramic multilayer substrate manufacturing method and unfired composite multilayer body
TW200606967A (en) Method for manufacturing multilayer electronic component
WO2004028794A3 (en) Dimensionally stable laminate with removable web carrier and method of manufacture
WO2007056168A3 (en) Article including removable concealing layers and methods of printing the same
WO2005105423A3 (en) Embossing rollers with surface treatment, method for the production thereof and embossing unit comprising said rollers
AU2003220945A1 (en) Anisotropic conductive sheet and its manufacturing method
EP1487055A4 (en) ANISOTROPIC CONDUCTIVE SHEET AND METHOD OF MANUFACTURING THE SAME

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200480023717.2

Country of ref document: CN

AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2005511315

Country of ref document: JP

ENP Entry into the national phase

Ref document number: 2006130320

Country of ref document: US

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 10560856

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 1020057024428

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 1020057024428

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 10560856

Country of ref document: US

122 Ep: pct application non-entry in european phase