WO2004103671A1 - 金型表面装飾方法及び金型 - Google Patents
金型表面装飾方法及び金型 Download PDFInfo
- Publication number
- WO2004103671A1 WO2004103671A1 PCT/JP2004/007320 JP2004007320W WO2004103671A1 WO 2004103671 A1 WO2004103671 A1 WO 2004103671A1 JP 2004007320 W JP2004007320 W JP 2004007320W WO 2004103671 A1 WO2004103671 A1 WO 2004103671A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mold
- photomask
- shape
- pattern
- photo resist
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Definitions
- the present invention relates to a mold and a mold surface decoration method used for resin molding including injection molding. Background art
- a resin molded product molded by injection molding or the like can have various faces depending on the surface decoration of the mold.
- a photolithographic film-shaped photomask is cut out according to the plan view developed based on the shape of the mold, and the photomasks 11, 12, 13 are cut off. create.
- the photomasks 11, 12 and 13 cut out as shown in B in Fig. 3 are brought into close contact with the mold 20 coated with the photo resist, and the photomasks are connected. Laminate the seams with tape, etc., and expose and develop.
- the development state of the photo resist was checked, and the discontinuous portion of the joint portion of the photo mask was corrected, followed by etching to form a pattern on the mold 20.
- Japanese Patent Application Laid-Open No. 51-638866 published by the Japan Patent Office discloses a method for forming irregularities by etching on the surface of one side of a core of an injection molding die. ..
- the masking method using a photo resist is more likely to form a pattern with higher accuracy than the above-described masking.
- it is necessary to cut a pattern on a three-dimensional mold for example, it is necessary to cut and join the photomask on the three-dimensional mold. Therefore, it is impossible to perform complete transcription. Therefore, as shown in FIG. 3C, a seam 20a remained in the pattern on the mold surface, and there was a problem in appearance. In addition, joining these photomasks had to rely on humans, which was a very time-consuming task.
- An object of the present invention is to provide a mold having a three-dimensional shape as a whole or a part thereof.
- the purpose is to transfer the pattern easily without a seam of the photomask. Disclosure of the invention
- a photo resist is applied to the surface of a mold
- the photomask formed into the shape is brought into close contact with the mold on which the photo resist has been applied, and exposure and development are performed.
- a method for decorating a surface of a mold comprising engraving a pattern formed on the photomask by etching the developed mold.
- the process of forming the film-shaped photomask into a shape similar to the shape of the die includes converting the heated photomask into a predetermined shape. This is a treatment to bring them into close contact.
- the third invention is a resin molding die
- a film-shaped photomask formed into a shape similar to the shape of the mold is brought into close contact with the photo resist applied to the surface of the mold, and exposure and development for etching are performed.
- the mold has a shape formed by engraving a pattern formed on the photomask.
- FIG. 1 is a perspective view showing an example of the shape of a mold.
- FIG. 2 is an explanatory diagram showing a process of decorating a mold surface according to the embodiment of the present invention.
- FIG. 3 is an explanatory view showing a process of decorating a mold surface according to a conventional technique.
- FIG. 1 is a perspective view showing an example of the shape of a mold to which the present embodiment is applied.
- the mold 1 is a mold for molding a diaphragm used for a speaker. It has a conical three-dimensional curved surface la.
- FIG. 2 shows an example of the working process of the mold surface decoration processing according to the present embodiment.
- the design of the pattern is a grid in this example. This design is created by CAD (Computer Aided Design) and photoengraved on 100,100 m thick polyester film. This is the patterned photomask 2.
- the temperature and time at that time shall be 170-180 ° C for about 20-30 seconds, and the temperature shall not break the formed pattern.
- the temperature and time depend on the thickness of the film used for the photomask 2 and are not limited to the conditions shown.
- the heated photomask 2 is In order to mold into the same shape as mold 1, it is brought into close contact with mold 4 for molding using a vacuum molding method, and molded.
- a photomask 2 ′ molded into the same shape as the mold is coated with a photoresist and dried, and closely adhered to the mold 1.
- the substrate is spray-developed with, for example, a 1% aqueous solution of sodium carbonate at 20 ° C.
- a seamless pattern can be transferred onto the mold 1 '.
- the procedure can be simplified.
- the mold on which the pattern has been transferred in this way is sprayed with an aqueous solution of ferric chloride and washed with water. Then, an etched mold 1 "engraved with a predetermined pattern shown in H of FIG. 2 is formed.
- the formed diaphragm has a uniform pattern drawn on the conical surface and over the entire surface. That is, as in the conventional example, the seam 20a as shown in FIG. 3C does not remain, and the pattern as drawn in the photomask 2 does not appear. It will be drawn on the molded part.
- the film used for the photomask according to this embodiment is a general-purpose polyester film coated with a photosensitive material, and has a thickness of at least 250 ⁇ m / ⁇ m. Less desirable, vacuum forming -It is necessary to be able to be molded by molding technology such as. Of course, other materials and thicknesses are not limited as long as they can be vacuum formed.
- the applied photosensitive material is not particularly limited. However, when vacuum-forming a patterned film, it follows the elongation of the base polyester film and resists heat during molding. However, a material having heat resistance that does not rupture the formed pattern is desired.
- the photo resist that can be used in this embodiment is:
- the light source used for resist exposure does not have sufficient exposure in the vertical direction of the mold with respect to the direction of the light source. Therefore, it is desirable to use a device that can change the angle even slightly. There is no particular limitation.
- the present invention is applied to a mold for forming a diaphragm used for a speaker.
- the pattern formed on the surface of the mold does not have to be the uniform pattern described above, and characters and symbols may be drawn on the surface as patterns.
- a pattern can be uniformly and easily carved on the surface of a mold having a three-dimensional curved surface, and a molded article having an excellent appearance can be realized.
- the three-dimensional design width which was impossible until now, is expanded, and it is possible to provide products with added value.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/521,141 US7468141B2 (en) | 2003-05-23 | 2004-05-21 | Method for decorating die surface as well as die |
EP04734420A EP1627718A4 (en) | 2003-05-23 | 2004-05-21 | METHOD OF DECORATING THE SURFACE OF A MOLD AND MOLD THUS DECORATED |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-146741 | 2003-05-23 | ||
JP2003146741A JP2004345286A (ja) | 2003-05-23 | 2003-05-23 | 金型表面装飾方法及び金型 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004103671A1 true WO2004103671A1 (ja) | 2004-12-02 |
Family
ID=33475307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/007320 WO2004103671A1 (ja) | 2003-05-23 | 2004-05-21 | 金型表面装飾方法及び金型 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7468141B2 (ja) |
EP (1) | EP1627718A4 (ja) |
JP (1) | JP2004345286A (ja) |
KR (1) | KR20060011814A (ja) |
CN (1) | CN1697726A (ja) |
TW (1) | TWI244430B (ja) |
WO (1) | WO2004103671A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004345286A (ja) * | 2003-05-23 | 2004-12-09 | Sony Corp | 金型表面装飾方法及び金型 |
US20070190256A1 (en) * | 2006-02-14 | 2007-08-16 | Darby Richard J | Method and assembly for colorizing a substrate material and product created thereby |
US20080297740A1 (en) * | 2007-05-29 | 2008-12-04 | Phong Huynh | Projection system and method of use thereof |
JP4966262B2 (ja) * | 2008-07-02 | 2012-07-04 | 新日本製鐵株式会社 | 熱間プレス成形用金型の製造方法及び製造装置 |
TWI424277B (zh) * | 2009-01-19 | 2014-01-21 | Nippon Steel & Sumitomo Metal Corp | Vacuum press forming exposure apparatus and exposure method |
US20120006480A1 (en) * | 2009-03-31 | 2012-01-12 | Dic Corporation | Method for manufacturing decorated molding |
TWI392596B (zh) * | 2009-08-06 | 2013-04-11 | Jaclo Industry Co Ltd | 可直接於輪圈表面形成花紋或標章之自行車輪圈製造方法 |
CN102259406A (zh) * | 2010-05-25 | 2011-11-30 | 鸿富锦精密工业(深圳)有限公司 | 壳体的制作方法 |
CN102799076B (zh) * | 2012-08-06 | 2016-01-13 | 深圳光启创新技术有限公司 | 一种用于非平面基材的曝光方法及曝光装置 |
JP6287458B2 (ja) * | 2014-03-27 | 2018-03-07 | 大日本印刷株式会社 | マスクデータ作成装置、マスクデータ作成方法、プログラム、記録媒体 |
KR101695618B1 (ko) * | 2015-03-30 | 2017-01-16 | 재영솔루텍 주식회사 | 화학적 에칭을 이용한 금속-플라스틱 결합체 제조 방법 |
EP3093709A1 (en) * | 2015-05-14 | 2016-11-16 | Morphotonix Sarl | Tool surface nano-structure patterning process |
Citations (3)
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JPS5163866A (ja) * | 1975-10-23 | 1976-06-02 | Mitsubishi Electric Corp | Shashutsuseikeiyokanagatanoseizohoho |
JPS6024016A (ja) * | 1984-02-28 | 1985-02-06 | Nippon Seiko Kk | フオトエツチング用マスクの製造方法 |
JPH07319146A (ja) * | 1994-05-26 | 1995-12-08 | Hitachi Cable Ltd | フォトマスク及びその製造方法 |
Family Cites Families (30)
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US2284929A (en) * | 1940-10-02 | 1942-06-02 | Alexander P Stewart | Method of making die spotting devices |
US2816025A (en) * | 1953-07-23 | 1957-12-10 | Croname Inc | Photoetching embossing dies |
US3504063A (en) * | 1958-05-09 | 1970-03-31 | Jerome H Lemelson | Article decoration apparatus and method |
US3462524A (en) * | 1964-12-29 | 1969-08-19 | Jerome H Lemelson | Molding techniques and apparatus |
JPS51140619A (en) * | 1975-05-30 | 1976-12-03 | Pioneer Electronic Corp | Vibration member for acoustic convertor |
US4053348A (en) * | 1976-06-16 | 1977-10-11 | Jerobee Industries, Inc. | Die and method of making the same |
JPS5768992A (en) * | 1980-10-17 | 1982-04-27 | Pioneer Electronic Corp | Diaphragm for speaker |
JPS57178810A (en) * | 1981-04-30 | 1982-11-04 | Nissha Printing Co Ltd | Manufacture of molding die |
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US4447286A (en) * | 1982-04-05 | 1984-05-08 | Jerobee Industries, Inc. | Die and method of making same |
US4579634A (en) * | 1982-04-05 | 1986-04-01 | Jerobee Industries, Inc. | Die and method of making same |
US4437924A (en) * | 1982-04-19 | 1984-03-20 | Jerobee Industries, Inc. | Method of making fine-line die |
DE3742457A1 (de) | 1987-12-15 | 1989-06-29 | Dynamit Nobel Ag | Herstellverfahren fuer kunststoff-formteile mit dekorativ-gepraegter oberflaechenbeschichtung |
US4985116A (en) * | 1990-02-23 | 1991-01-15 | Mint-Pac Technologies, Inc. | Three dimensional plating or etching process and masks therefor |
US5153084A (en) * | 1990-09-10 | 1992-10-06 | General Electric Company | Process for preparing a photo-mask for imaging three-dimensional objects |
ES2091406T3 (es) * | 1991-05-23 | 1996-11-01 | Cca Inc | Procedimiento de fabricacion de un articulo moldeado con dibujo. |
US5344729A (en) * | 1992-06-26 | 1994-09-06 | Martin Marietta Corporation | Conformal photomask for three-dimensional printed circuit board technology |
US5650249A (en) * | 1992-11-18 | 1997-07-22 | The Boeing Company | Method for making precision radomes |
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JP2001347534A (ja) * | 2000-06-08 | 2001-12-18 | Suzuka Fuji Xerox Co Ltd | ガラス製成形型を用いた光硬化性樹脂製プラスチック成形品の製造方法 |
US6416908B1 (en) * | 2000-06-29 | 2002-07-09 | Anvik Corporation | Projection lithography on curved substrates |
US6627092B2 (en) * | 2001-07-27 | 2003-09-30 | Hewlett-Packard Development Company, L.P. | Method for the fabrication of electrical contacts |
US6916181B2 (en) * | 2003-06-11 | 2005-07-12 | Neoconix, Inc. | Remountable connector for land grid array packages |
JP2004322392A (ja) * | 2003-04-23 | 2004-11-18 | Nissan Motor Co Ltd | 樹脂成形品 |
JP2004345286A (ja) * | 2003-05-23 | 2004-12-09 | Sony Corp | 金型表面装飾方法及び金型 |
-
2003
- 2003-05-23 JP JP2003146741A patent/JP2004345286A/ja active Pending
-
2004
- 2004-05-20 TW TW093114284A patent/TWI244430B/zh not_active IP Right Cessation
- 2004-05-21 EP EP04734420A patent/EP1627718A4/en not_active Withdrawn
- 2004-05-21 KR KR1020057000880A patent/KR20060011814A/ko not_active Application Discontinuation
- 2004-05-21 CN CNA2004800005264A patent/CN1697726A/zh active Pending
- 2004-05-21 WO PCT/JP2004/007320 patent/WO2004103671A1/ja active Application Filing
- 2004-05-21 US US10/521,141 patent/US7468141B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5163866A (ja) * | 1975-10-23 | 1976-06-02 | Mitsubishi Electric Corp | Shashutsuseikeiyokanagatanoseizohoho |
JPS6024016A (ja) * | 1984-02-28 | 1985-02-06 | Nippon Seiko Kk | フオトエツチング用マスクの製造方法 |
JPH07319146A (ja) * | 1994-05-26 | 1995-12-08 | Hitachi Cable Ltd | フォトマスク及びその製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1627718A4 * |
Also Published As
Publication number | Publication date |
---|---|
KR20060011814A (ko) | 2006-02-03 |
US20050244535A1 (en) | 2005-11-03 |
TW200510155A (en) | 2005-03-16 |
CN1697726A (zh) | 2005-11-16 |
TWI244430B (en) | 2005-12-01 |
US7468141B2 (en) | 2008-12-23 |
EP1627718A4 (en) | 2009-07-29 |
EP1627718A1 (en) | 2006-02-22 |
JP2004345286A (ja) | 2004-12-09 |
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