WO2004102683A1 - Diode lumineuse a emission de lumiere uniformement circulaire - Google Patents

Diode lumineuse a emission de lumiere uniformement circulaire Download PDF

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Publication number
WO2004102683A1
WO2004102683A1 PCT/CN2004/000416 CN2004000416W WO2004102683A1 WO 2004102683 A1 WO2004102683 A1 WO 2004102683A1 CN 2004000416 W CN2004000416 W CN 2004000416W WO 2004102683 A1 WO2004102683 A1 WO 2004102683A1
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WO
WIPO (PCT)
Prior art keywords
emitting diode
light
light emitting
around
concave body
Prior art date
Application number
PCT/CN2004/000416
Other languages
English (en)
French (fr)
Inventor
Peixin Xu
Original Assignee
Peixin Xu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peixin Xu filed Critical Peixin Xu
Priority to US10/554,876 priority Critical patent/US20070145882A1/en
Priority to JP2006508095A priority patent/JP2007524221A/ja
Priority to EP04729814A priority patent/EP1626447A4/en
Publication of WO2004102683A1 publication Critical patent/WO2004102683A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Definitions

  • the present invention relates to a light emitting diode, and more particularly to a light emitting diode that emits light uniformly all around. Background technique
  • light-emitting diode chip technology With the continuous development of light-emitting diode chip technology and the advantages of low-voltage driving, heat generation, and fragility that are unique to light-emitting diodes, they have become more and more widely used in various new lamp fields, especially in various decorations. The application in the lamp is even more remarkable.
  • currently known light emitting diodes generally have a convex arc-shaped coating at the top end. Because the convex arc-shaped coating has a light-concentrating effect, the light emitted is a positive front-end emission type.
  • the angle of view is small, and the light in the effective area of the front end is excessively concentrated and has a dazzling feeling, while the light intensity outside the effective area decreases sharply, and the light seen by the user from all around is weak, which affects its use effect.
  • some people have adopted the method of changing the shape of the coating body, such as designing a convex diamond type, convex polygonal shape, or designing concave-convex dots around the coating body, etc.
  • Some light can also be seen around it by refraction, but because the shape of the top end of the package is always convex, most of the light is still emitted from the front end, and the surrounding light is still weak and the use effect is poor.
  • the Chinese patent with patent number ZL98248959 also discloses a light emitting diode, which uses the method of adding ') and glass beads in the coating.
  • a light emitting diode which uses the method of adding ') and glass beads in the coating.
  • the emitted light hits d and the glass beads, it is due to the relationship of refracted light and many small glass beads.
  • the effect of the light will also cause some light to be emitted from the surrounding of the diode, but because the specific gravity of the small glass beads is different from the specific gravity of the epoxy resin of the coating body, the small glass beads are often unevenly distributed during processing, resulting in uneven light emission. It is difficult to be accepted by manufacturers and consumers because of the uniform phenomenon and the complicated processing steps. Summary of the Invention
  • An object of the present invention is to provide a light emitting diode with uniform light emission, good decoration effect, simple structure, simple fabrication, and low production cost.
  • a light emitting diode that emits light to the surroundings includes a light emitting diode chip, a transparent covering body, and a connecting pin, and is characterized in that the top of the transparent covering body is a recessed recess.
  • the shape of the covering body and the shape of the top concave body can be arbitrarily designed according to requirements.
  • the covering body is a cylindrical tube
  • the concave body can be a conical concave body or a semi-circular concave body.
  • the cone angle is generally 100. ⁇ 160. .
  • the covering body is a colored body.
  • the present invention adopts a structure in which the top of the covering body is set as a recessed recess, the optical diffusion characteristics of the recessed recess are used cleverly, so that the light emitted by the light-emitting diode wafer is refracted by the multi-faceted recess
  • the light is evenly emitted from the periphery of the cladding body, so that the periphery of the present invention emits light uniformly, and the structure is simple, the production is simple, the production cost is low, and the decorative effect is good. Most of them are emitted from the front end, the surrounding light is weak, and the use effect is poor.
  • the covering body may be a colored body.
  • the invention emits light uniformly to the surroundings, has a good decorative effect, has a simple structure, is simple to manufacture, and has low production cost, and can be widely used in various new decorative lamp fields.
  • FIG. 1 is a schematic structural diagram of the present invention
  • Fig. 3 is a cross-sectional view of A-A of the present invention.
  • FIG. 4 is a schematic diagram of the optical principle of the use state of the present invention.
  • FIG. 5 is a schematic structural diagram of a blue and white light emitting tube according to the present invention. detailed description
  • the present invention includes a light emitting diode wafer 1, a terminal pin 3, and a transparent cover.
  • an upper portion of the terminal pin 3 is made into an electrode.
  • Position 311 the upper end of the electrode holder 31 is connected to the light emitting diode chip 1 in the recess 311 of the other electrode holder 31 by a wire, as shown in FIG.
  • the top of the covering body is set as a recessed recess. Because it cleverly utilizes the optical diffusion characteristics of the recessed recess, the light emitted by the light-emitting diode wafer 1 is directly directed into the interior.
  • the concave body is recessed, the internal concave body can refract light on multiple sides, so that the light is uniformly emitted from the periphery of the cladding body 2, so that the surrounding area emits light uniformly, and the light intensity is sufficient without glare.
  • the cladding body may be a tube body with a different shape, such as a semicircular tube body, or a cylindrical tube body 2.
  • a cylindrical pipe body 2 is generally used, and the shape of the concave body on the top of the pipe body 2 can be arbitrarily designed according to the needs.
  • the concave body can be a conical concave body 21, and the cone
  • the shaped concave body 21 may be a conical concave body or a diamond-shaped polygonal pyramid concave body; the concave body may also be a semi-circular concave body. As shown in FIG.
  • the concave body 21 when the concave body is a cone-shaped concave body 21, in order to better ensure its use effect, its cone angle cannot be too large or too small, because the light-emitting diode is too large or too small Most of the light that is directly incident on the concave body 21 from the wafer 1 is emitted from the front end, and the insufficient light intensity around it affects its use effect.
  • the cone angle of the concave body 21 is 100. ⁇ 160. It is more suitable when the cone angle is 130. ⁇ 140. The best results.
  • the bag The covering body 2 can be made into colored bodies of various colors according to the needs of users, and the color of the covering body 2 is the same color as the light emitted from the light-emitting diode wafer 1.
  • FIG. 3 when a user needs a light emitting tube of a color other than blue or white, a schematic diagram of the structure of the light emitting diode; as shown in FIG. 5, a user needs a blue or white light emitting
  • the structure of the light-emitting diode is a schematic diagram of the tube.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

一种向四周发光均勾的发光二极管 技术领域
本发明涉及一种发光二极管， 特别是一种向四周发光均匀的发光二极管。 背景技术
随着发光二极管芯片技术的不断发展和发光二极管本身所特有的低压驱 动、 不发热、 不易破碎等优点， 使得其在各种新型灯器领域中的应用越来越广 泛， 尤其是在各种装饰灯中的应用更加显著。 然而目前公知的发光二极管一般 其顶端为向外凸的圆弧状包覆体， 因外凸的圆弧状包覆体有聚光的作用， 因此 所发出的光都为正前端发射型， 光线视角小， 且前端有效区内光线过分集中， 有刺眼的感觉， 而有效区外光强骤減， 使用者从四周看到的光线 ^艮弱， 影响其 使用效果。 为改变这些缺点， 有人采用把包覆体的形状加以改变的方法， 如设 计为外凸钻石型、 外凸多角形或在包覆体周围设计有凹凸状的点等， 这些结构 虽然因光线的折射作用， 其四周也能看到一些光， 但是由于其包 ^隻体顶端形状 始终为外凸型， 因此大部分的光还是从前端射出， 四周的光线仍然较弱， 使用 效果较差。 专利号为 ZL98248959的中国专利也公开过一种发光二极管， 采用 在包覆体中添加 ')、玻璃珠的方法， 当发射光碰到 d、玻璃珠时因折射光的关系和 许多小玻璃珠的作用， 也会使一部份光从二极管四周发射出来， 但由于小玻璃 珠的比重与包覆体的环氧树脂的比重不同，在加工时小玻璃珠常常会分布不均 匀， 造成发光不均的现象， 而且加工工序烦瑣， 因此也难以被生产厂家及消费 者所接受。 发明内容
本发明的目的是针对上述存在的问题， 提供一种向四周发光均匀、 装饰效 果好， 且结构简单、 制作简易、 生产成本低的发光二极管。
本发明的技术方案是这样实现的：
一种向四周发光的发光二极管， 包括发光二极管晶片、 透明包覆体、 接线 脚， 其特点是所述透明包覆体顶部为内陷凹体。
所述包覆体的形状及其顶部凹体的形状可根据需要任意设计，如所述包覆 体为圆柱管状，其凹体可设为锥状凹体或半圆形凹体，且当凹体为锥状凹体时， 为使其向四周发光均勾， 一般其锥角为 100。~160。。
为增强其装饰效果， 所述包覆体为有色体。
本发明由于采用将包覆体顶部设置为内陷凹体的结构，巧妙地利用了内陷 凹体的光学扩散特性，使发光二极管晶片所发出的光线经内陷凹体的多面折射 而从包覆体的四周均匀发射出来，从而使本发明四周发光均匀，且其结构简单、 制作简易、 生产成本低、 装饰效果好， 有效地解决了现有发光二极管的光线为 正前端发射或大部分从前端射出， 四周光线较弱、 使用效果差等问题。 同时为 进一步增强其装饰效果， 所述包覆体可设为有色体。 本发明向四周发光均匀， 装饰效果好， 并且结构简单、 制作简易、 生产成本低， 可广泛的应用于各种新 型装饰灯领域中。
以下结合附图对本发明作进一步详细的描述； 附图说明
图 1为本发明的结构示意图；
图 2为本发明的俯视图；
图 3为本发明的 A-A剖视图；
图 4为本发明的使用状态光学原理示意图；
图 5是本发明为蓝色、 白色发光管的结构示意图。 具体实施方式
如图 1及图 3所示， 本发明包括发光二极管晶片 1、 接线脚 3、 透明包覆 体， 为使接线脚 3不易从透明包覆体中脱出， 所述接线脚 3的上部做成电极支 架 31 ,其中所述包覆体为采用环氧树脂材料制成，为使发光二极管晶片 1所发 出的光线更加集中向前， 上述一电极支架 31 上设有可容置发光二极管晶片 1 的凹位 311 , 上述电极支架 31的上端用一导线与另一电极支架 31凹位 311内 的发光二极管晶片 1相连， 如图 4所示， 为使其能满足使用者的需要， 可向四 周发光， 并且发光均匀， 增强装饰效果， 所述包覆体顶部设为内陷凹体， 由于 其巧妙地利用了内陷凹体的光学扩散特性，从而使上述发光二极管晶片 1所发 出的光线直射到内陷凹体时， 所述内陷凹体可把光线进行多面折射， 使光线从 包覆体 2的四周均匀发射出来， 从而使其四周发光均匀， 且光强足而不刺眼， 光线效果独特、 装饰性强。 同时所述包覆体可为不同形状的管体， 如可为半圆 状管体； 也可为圆柱状管体 2。 为使其使用方便， 一般釆用圆柱状管体 2, 且 所述管体 2顶部凹体的形状可根据需要任意设计，如所述凹体可设为锥状凹体 21 , 且所述锥状凹体 21可为圆锥状凹体或仿钻状的多边形棱锥凹体； 所述凹 体也可设为半圆形凹体。 如图 3所示， 当所述凹体为锥状凹体 21时， 为更好 的保证其使用效果， 其锥角不能太大也不能太小， 因为锥角太大或太小则发光 二极管晶片 1直射到凹体 21上的光线则大部份从前端射出，其四周光强不足， 影响其使用效果，根据光学原理得知， 上述凹体 21的锥角为 100。~160。时较合 适， 其中其锥角在 130。~140。时效果最佳。 为进一步增强其装饰效果， 所述包 覆体 2可根据使用者的需要制成各种不同颜色的有色体，且所述包覆体 2的颜 色与发光二极管晶片 1所发出的光为同色。 如图 3所示， 为使用者需要的是除 蓝色或白色以外的其它颜色发光管时， 所述发光二极管的结构示意图； 如图 5 所示，为使用者需要的是蓝色或白色发光管时，所述发光二极管的结构示意图。

Claims

权利要求:
1. 一种向四周发光均匀的发光二极管， 包括发光二极管晶片（1)、接线脚 (3)、 透明包覆体， 其特征在于所述透明包覆体顶部为内陷凹体。
2.根据权利要求 1所述的发光二极管，其特征在于所述透明包覆体为圓柱 管体（2)， 且所述管体（2)顶部的凹体为锥状凹体（21)。
3.根据权利要求 2所述的发光二极管， 其特征在于所述管体（2)顶部的 凹体为圆锥状凹体。
4.根据权利要求 2所述的发光二极管， 其特征在于所述管体（2)顶部的 凹体为仿钻状的多边形棱锥凹体。
5. 根据权利要求 1或 2所述的发光二极管，其特征在于所述锥状凹体 (21 ) 的锥角为 100°〜160°。
6.根据权利要求 5所述的发光二极管， 其特征在于所述锥状凹体（21 )的 锥角为 130°〜140。。
7.根据权利要求 1所述的发光二极管，其特征在于所述透明包覆体为圓柱 管体（2)， 且所述管体（2)顶部的凹体为半圆形凹体。
8.根据权利要求 1所述的发光二极管， 其特征在于所述包覆体为有色体， 且所述包覆体的颜色与发光二极管晶片 （1)所发出的光为同色。
9.根据权利要求 1所述的发光二极管， 其特征在于所述接线脚（3)上部 做成电极支架（31 ), 其中一电极支架（31 )上设有可容置发光二极管晶片 ( 1 ) 的凹位（311 )。
PCT/CN2004/000416 2003-04-30 2004-04-28 Diode lumineuse a emission de lumiere uniformement circulaire WO2004102683A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/554,876 US20070145882A1 (en) 2003-04-30 2004-04-28 Light-emitting diode emitting uniformly light all around
JP2006508095A JP2007524221A (ja) 2003-04-30 2004-04-28 表面全体が均一に発光するｌｅｄ
EP04729814A EP1626447A4 (en) 2003-04-30 2004-04-28 LIGHT-EMITTING DIODE WITH UNIFORMLY CIRCULAR LIGHT EMITTING

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNU032257163U CN2632475Y (zh) 2003-04-30 2003-04-30 一种向四周发光均匀的灯串
CN03225716.3 2003-04-30

Publications (1)

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WO2004102683A1 true WO2004102683A1 (fr) 2004-11-25

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PCT/CN2004/000416 WO2004102683A1 (fr) 2003-04-30 2004-04-28 Diode lumineuse a emission de lumiere uniformement circulaire

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US (1) US20070145882A1 (zh)
EP (1) EP1626447A4 (zh)
JP (1) JP2007524221A (zh)
CN (1) CN2632475Y (zh)
WO (1) WO2004102683A1 (zh)

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US20070145882A1 (en) 2007-06-28
EP1626447A1 (en) 2006-02-15
CN2632475Y (zh) 2004-08-11
EP1626447A4 (en) 2008-07-30

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