WO2004098257A1

WO2004098257A1 - Multilayer printed wiring board and method for manufacturing same

Info

Publication number: WO2004098257A1
Application number: PCT/JP2004/006049
Authority: WO
Inventors: Keiichi Kishimoto; Toshinori Nozaki; Michiaki Miura; Toshiyuki Kijima; Hiroshi Iwachido
Original assignee: Nippon Carbide Kogyo Kabushiki Kaisha; Nci Electronics Co., Ltd.; Micro Integrated Corporation
Priority date: 2003-04-28
Filing date: 2004-04-27
Publication date: 2004-11-11
Also published as: JP2004349277A

Abstract

A multilayer printed wiring board is disclosed which has a layered structure comprising a composite layer (2) as an intermediate layer which is composed of a rigid substrate (21) and a conductor circuit (2a) formed on at least one surface of the rigid substrate on the buildup layer side, a flexible layer (1) which is put on top of one surface of the composite layer and composed of a flexible substrate (11) and a conductor circuit (1a) formed on the front side surface of the flexible substrate, and a buildup layer (3) which is put on top of the other surface of the composite layer and composed of an insulating layer (31) and a conductor circuit (3a) formed on the front side surface of the insulating layer. The conductor circuit of the flexible layer (1), the conductor circuit of the composite layer (2) and the conductor circuit of the buildup layer (3) are electrically connected via a through hole (4) penetrating the multilayer printed wiring board. The conductor circuit of the composite layer (2) and the conductor circuit of the buildup layer (3) are electrically connected through a via hole (5) which is formed in the buildup layer.

Description

FIELD OF THE INVENTION

The present invention relates to a multilayer wiring board and a method of manufacturing the same. More specifically, in a multilayer wiring board having a flexible portion and a rigid portion, a wiring density is improved by providing a build-up layer, so The present invention relates to a flexible composite 'build-up multilayer wiring board and a method for manufacturing the same, which enable mounting of small electronic components and eliminate the need for filling the inside of the via hole with resin or the like, thereby greatly improving the yield. Background art

As a multilayer wiring board having a flexible part and a rigid part, a flex-rigid wiring board is known.

As shown in FIG. 7, the above-mentioned flex-rigid wiring board generally has a structure in which a flexible layer 1 is used as an intermediate layer, and a composite layer 2 and a composite layer 2 are laminated on both sides of the flexible layer 1, respectively. (See, for example, Japanese Patent Application Laid-Open No. 2000-91745 (FIG. 1)). In FIG. 7, 11 is a flexible board, _1a is a conductor circuit, 21 and 21 'are rigid boards, 2a and 2a' are conductor circuits, 4 is a through hole, 6 is a bonding sheet, 7 Is a plating layer, and 8 is a solder resist.

Further, a multilayer wiring board having a structure in which a plurality of rigid printed circuit boards are connected by a flexible printed board is also known (for example, Japanese Patent Application Laid-Open No. H08-116147 (paragraph [0000], FIG. 5 (b)) and Japanese Patent Application Laid-Open No. 8-186380 (paragraph [001], FIG. 3).

Further, with the demand for weight reduction and miniaturization of multilayer wiring boards, finer wiring and higher density are required to mount small electronic components at high density. As a multilayer wiring board that achieves finer wiring and higher density wiring, a multilayer wiring board (build-up multilayer wiring board) using a build-up method has been proposed (see, for example, Japanese Patent Application Laid-Open No. 2003-032). See Japanese Patent Publication No. 3254). The build-up method sequentially repeats a process of forming an insulating layer, a process of forming a via hole in the insulating layer, and a process of forming a conductor circuit (wiring circuit pattern) in the insulating layer including the inside of the via hole. That is what we do.

In the conventional flex-rigid wiring board as shown in Fig. 7, the flexible layer 1 is not arranged on the surface layer, and is used only for the wiring between the composite layers 2, 2, because of its structure. It is not possible to mount electronic components on the flexible layer 1. In addition, as described in Japanese Patent Application Laid-Open Nos. H08-11616-47 and A multilayer printed circuit board having a structure in which a rigid printed circuit board is connected by a flexible printed circuit board has a flexible printed circuit board disposed on a surface layer, and thus electronic components can be mounted on the flexible printed circuit board. However, since this multilayer wiring board has a structure in which a flexible printed board and a rigid printed board composed of a composite layer are laminated, it is not possible to simultaneously perform through-hole and via-hole plating. For this reason, as shown in Fig. 8, for example, the thickness of the plating layer on the surface side of the composite layer 2 increases, making it difficult to make the conductor circuit of the composite layer 2 thinner, and mounting small electronic components on the composite layer 2. Can not.

Further, as shown in FIG. 8, the above-mentioned “multi-layer wiring board having a structure in which a plurality of rigid printed boards are connected by a flexible printed board” has a structure in which a resin 9 is provided inside the via hole 5 of the composite layer 2. Need to be filled. This resin filling is not possible after lamination with the flexible layer 1, and therefore must be performed before laminating with the flexible layer 1. The filling of the resin is performed by a method such as roll coating or a printing method. In either case, the filled resin protrudes from the inside of the nozzle hole 5 and is polished. Must be removed. The removal of the polishing causes expansion and contraction of the substrate of the composite layer 2, causing a problem that the lamination with the flexible layer 1 has a poor positional accuracy of the circuit and a remarkably poor yield. In FIG. 8, 21 is a rigid board, 2a is a conductor circuit, 4 is a through hole, 5 is a via hole, 6 is a bonding sheet, 7 is a plating layer, and 8 is a solder layer. Zist 9 is a resin filled in the via hole 5.

Also, the build-up method is a method that improves the degree of freedom of wiring and is relatively suitable for finer wiring and higher density wiring. However, in the build-up multilayer printed wiring board described in Japanese Patent Application Laid-Open No. 2003-232534, it is necessary to fill the inside of the via hole with a conductive material such as copper paste. The same problem as the problem caused by the filling of the resin occurs in the “multi-layer wiring board having the structure in which the rigid printed board is connected by the flexible printed board”. Disclosure of the invention

An object of the present invention is to increase the wiring density, enable mounting of small electronic components on both front and back surfaces of a wiring board, and eliminate the need for filling the inside of the via hole with a resin or the like, thereby dramatically improving the yield. An object of the present invention is to provide a multilayer wiring board having a flexible portion and a rigid portion, and a method of manufacturing the same.

As a result of various studies, the present inventors have found that a multilayer wiring board that can achieve the above object can be obtained by arranging a build-up layer on a composite layer of a substrate obtained by laminating a rigid substrate and a flexible substrate material. did.

The present invention has been made based on the above findings, and has a rigid substrate and a composite layer formed of a conductor circuit formed on at least the surface of the rigid substrate on the build-up layer side as an intermediate layer, and one of the composite layers. A flexible substrate made of a conductive circuit formed on a surface of the flexible substrate and a surface layer of the flexible substrate, and an insulating layer and a surface of the surface of the insulating layer on the other surface of the composite layer. A multilayer wiring board having a layered structure in which a build-up layer made of a conductor circuit formed on the substrate is laminated, wherein the conductor circuit of the flexible layer, the conductor circuit of the composite layer, and the conductivity of the build-up layer Body circuit; ^, electrically connected through through-holes penetrating the multilayer wiring board and conducting the composite layer Conductor circuit body circuit and the Birudoatsupu layer are electrically connected via the Baiahoru been made form above Birudoatsupu layer, there is provided a flexible Composite. Build-up multilayer wiring board.

In addition, the present invention provides the above-described flexible composite / build-up of the present invention. As a preferred example of a method for manufacturing a multilayer wiring board, a method for forming a composite layer by forming a predetermined conductor circuit on at least the surface of the rigid board on the build-up layer side, the method for forming a conductor circuit of a flexible layer A step of producing a laminate having a layer structure of a conductor layer, a flexible substrate, a composite layer, an insulating layer of a build-up layer, and a conductor layer for forming a conductor circuit of a build-up layer; Forming a through hole in the layer plate; forming a via hole in the build-up layer; coating a plating layer on the through hole, the via hole, the conductor layer of the flexible layer, and the conductor layer of the build-up layer. The conductor layer and the plating layer of the flexible layer, and the conductor layer and the plating layer of the build-up layer A flexible composite comprising a step of forming a predetermined wiring circuit and a turn, and a step of coating a predetermined portion of each of the flexible layer and the build-up layer on which the wiring circuit pattern is formed with a solder resist. · It is intended to provide a method for manufacturing a build-up multilayer wiring board (hereinafter, referred to as a first manufacturing method of the present invention).

Further, the present invention provides the flexible composite build-up of the present invention described above. As another preferable example of the method for manufacturing a multilayer wiring board, a flexible layer having a conductor layer for forming a conductor circuit on a surface on a surface layer side of the flexible board; and a flexible board having at least a surface on a build-up layer side. A step of manufacturing a laminate comprising a composite layer having a conductor circuit; a step of forming an insulating layer of a build-up layer on the surface of the composite layer on the side of the build-up layer; a step of forming a via hole in the insulating layer Forming a through hole in the laminated plate on which the insulating layer is formed, and covering a through layer with the through hole, the via hole, the conductor layer of the flexible layer, and the insulating layer of the build-up layer. The process, the conductor layer and the plating layer of the flexible layer, and the plating layer of the build-up layer are respectively connected to predetermined wirings. Michino,. A flexible 'composite build-up multi-layer wiring comprising a step of forming a turn, a step of covering a predetermined portion of each of the flexible layer and the build-up layer where the turn circuit is formed and the turn-formed layer with a solder resist. Another object of the present invention is to provide a method for manufacturing a substrate (hereinafter, referred to as a second manufacturing method of the present invention). BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a schematic sectional view showing a first embodiment of the FCB wiring board of the present invention. FIG. 2 is a schematic sectional view showing a second embodiment of the FCB wiring board of the present invention. FIG. 3 is a schematic sectional view showing a third embodiment of the FCB wiring board of the present invention. FIG. 4 is a schematic sectional view showing a fourth embodiment of the FCB wiring board of the present invention. FIG. 5 is a schematic cross-sectional view illustrating an example of a step of manufacturing the FCB wiring board of the first embodiment shown in FIG.

FIG. 6 is a schematic cross-sectional view illustrating an example of a step of manufacturing the FCB wiring board of the third embodiment shown in FIG.

FIG. 7 is a schematic sectional view showing an example of a conventional flex-rigid wiring board. FIG. 8 is a schematic cross-sectional view showing an example of a multilayer wiring board having a structure in which a plurality of rigid printed boards are connected by a flexible printed board. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a flexible composite build-up multilayer wiring board (hereinafter, also referred to as an FCB wiring board) and a method of manufacturing the same according to the present invention will be described in detail with reference to the drawings.

The FCB wiring board A of the first embodiment shown in FIG. 1 has a composite layer composed of a rigid substrate 21 and conductor circuits 2 a and 2 a ′ having a predetermined pattern formed on both surfaces of the rigid substrate 21. 2 is an intermediate layer, a flexible substrate 11 and a conductor circuit having a predetermined pattern formed on the surface of the flexible substrate 11 on the surface of the composite layer on which the conductor circuit 2 a is formed. The flexible layer 1 made of 1a is laminated, and the insulating layer 31 and the predetermined layer formed on the surface of the insulating layer 31 on the surface of the composite layer 2 on which the conductor circuit 2a is formed are formed. It has a layer structure in which a build-up layer 3 composed of a conductor circuit 3a of a pattern is laminated. A through hole 4 is formed at a predetermined location of the FCB wiring board A so as to penetrate the thickness direction of the FCB wiring board A, and a via hole 5 is formed at a predetermined location of the build-up layer 3. .

Through hole 4, via hole 5, flexible layer 1 conductor circuit 1a and via The conductor circuit 3 a of the build-up layer 3 is covered with the plating layer 7.

The flexible layer 1 and the composite layer 2 are laminated via a bonding sheet 6, and the surface of the flexible layer 1 on the surface side and the surface of the buildup layer 3 on the surface side are solder resist 8 respectively. A predetermined part is covered with. The conductor circuit 1 a of the flexible layer 1, the conductor circuits 2 a and 2 a of the composite layer 2, and the conductor circuit 3 a of the build-up layer 3 are formed by a through hole passing through the FCB wiring board A. It is electrically connected by a plating layer 7 through a metal layer 4.

In addition, the conductor circuit 2a of the composite layer 2 and the conductor circuit 3a of the build-up layer 3 are electrically connected by the plating layer 7 via the via hole 5 formed in the insulating layer 3a of the build-up layer 3. It is connected to the.

Electronic components (not shown) are mounted on the conductive circuit 1 a of the flexible layer 1 exposed from the solder resist 8 and the plating layer of the via hole 5 of the build-up layer 3.

The FCB wiring board B of the second embodiment shown in FIG. 2 has a composite layer 2 in which a conductor circuit 2a is formed only on the surface of the rigid board 21 on the side of the build-up layer. Except for this, the configuration is the same as that of the FCB wiring board A of the first embodiment.

The FCB wiring board C of the third embodiment shown in FIG. 3 has the same structure as that of the third embodiment except that the wiring circuit pattern on the surface layer side of the insulating layer 31 of the build-up layer 3 is formed only by the plating layer 7. The configuration is the same as that of the FCB wiring board A of the first embodiment. The FCB wiring board D of the fourth embodiment shown in FIG. 4 has the same configuration as that of the fourth embodiment except that the composite layer 2 has a conductor circuit 2 a formed only on the surface of the rigid board 21 on the side of the buildup layer. The configuration is the same as that of the FCB wiring board C of the third embodiment.

The above-mentioned flexible substrate 11, rigid substrate 21, conductor circuits 1a, 2a, 2a 'and 3a, bonding sheet 6, plating layer 7, and solder resist 8 are a multilayer wiring board of this type. Any of those usually used may be used, and the forming material and thickness thereof are not particularly limited. For example, as the flexible substrate 11, a foldable film material made of polyimide resin, polyester resin, or the like is used. The rigid substrate 21 is made of a composite material such as FR-4 or BT resin, and has a thickness of 50 to 1,000 m. It is about. Further, as a material for forming the conductor circuit, copper, silver, gold, nigel, chromium, zinc, tin, platinum or the like is used.

In addition, as a material for forming the insulating layer 31 of the build-up layer 3, an insulating material containing glass cloth (examples of insulating materials: FR_4, FR-5, BT resin, polyimide resin, etc.), In addition to sheet materials or film materials made of epoxy resin, polyimide resin, BT resin, PET, etc., thermosetting liquid resin, UV-curing liquid resin, photo-forming liquid resin, etc. are used. The thickness of the insulating layer 31 is about 80-1 or 200 m.

The FCB wiring board of the present invention is not limited to the above-described first to fourth embodiments, and may have a configuration in which, for example, a composite layer is further multilayered as necessary.

Since the FCB wiring board of the present invention configured as described above has a single plating layer, it is easy to make the circuit on both the front and back surfaces of the FCB wiring board thin, and the FCB wiring board can be formed on both the front and back surfaces. Small electronic components can be mounted. In particular, in the first and second embodiments described above, since the circuit thickness of the flexible layer 1 (the total thickness of the conductor circuit thickness and the plating layer thickness) and the circuit thickness of the build-up layer 3 are the same, the FCB wiring The design value of the minimum line width on which a circuit can be formed on both the front and back surfaces of the substrate can be made the same. In addition, the FCB wiring board of the present invention does not require filling of the via holes with resin or the like. Next, a preferred example of the first manufacturing method of the present invention will be described in detail with reference to FIG. 5, which illustrates an example of a step of manufacturing the FCB wiring board A of the first embodiment.

The embodiment shown in FIG. 5 is a production example in which a bonding sheet made of an epoxy resin, a polyimide resin, a BT resin, or the like is used as a forming material of the insulating layer 31 of the build-up layer 3.

First, a composite layer 2 having predetermined conductor circuits 2a and 2a 'formed on both surfaces of a rigid substrate 21 as shown in FIG.

The formation of the conductor circuits 2a and 2a 'in the composite layer 2 may be performed by a known method such as a subtractive method, an additive method, and a semi-additive method. Next, as shown in FIG. 5②, a flexible layer 1 having a copper layer 1b as a conductor layer for forming a conductor circuit on the surface of the flexible substrate 11 on the surface layer side, a bonding sheet 6, A bonding sheet 31 having an insulating property to form an insulating layer of the composite layer 2 and the build-up layer 3, and a copper foil 3 b as a conductor layer for forming a conductor circuit of the build-up layer 3 are used. Then, they are arranged in this order and laminated to produce a laminate.

The flexible layer 1 and the composite layer 2 are bonded by a bonding sheet 6, and the composite layer 2 and the build-up layer 3 are bonded by a bonding sheet 3 having insulation. The bonding sheet 6 is a perforated sheet in which unnecessary portions are cut out.

Next, as shown in Fig. 5③, through holes 4 are formed at predetermined positions of the laminated plate.

The formation of the through hole 4 may be performed by a known means, for example, drilling, laser drilling, etching, or the like.

Next, as shown in FIG. 5B, a via hole 5 is formed at a predetermined position of the build-up layer 3 of the laminate.

The formation of the via hole 5 may be performed by the same means as the formation of the through hole 4.

Next, as shown in FIG. 5⑤, the through hole 4, the via hole 5, the conductor layer (copper foil) 1b of the flexible layer 1 and the conductor layer (copper foil) 3b of the build-up layer 3 are removed. Cover with plating layer 7.

The plating layer 7 may be formed by a known means such as electroless plating or vapor deposition.

By the plating layer 7, the conductor layer 1 b of the flexible layer 1, the conductor circuits 2 a and 2 a of the composite layer 2, and the conductor layer 3 b of the build-up layer 3, The conductive circuit 2 a of the composite layer 2 and the conductive layer 3 b of the build-up layer 3 are electrically connected by the plating layer 7 of the via hole 5.

Next, as shown in FIG. 5⑥, the above-mentioned flexible The conductor layer 1b of the metal layer 1 and the conductor layer 3b of the build-up layer 3 are formed in predetermined wiring circuit patterns, respectively, to produce the conductor circuit 1a and the conductor circuit 3a.

The formation of the wiring circuit patterns of the conductor layers 1b and 3b is performed by using a photosensitive etching resist film and removing the conductor other than the wiring portion by etching.

Next, as shown in FIG. 5A, predetermined portions of the flexible layer 1 and the build-up layer 3 on which the wiring circuit patterns are formed are covered with a solder register 8.

After the coating, unnecessary portions of the composite layer 2 and the build-up layer 3 are removed by drilling, laser processing, etching, or the like, as shown in FIG. 5A, to obtain the FCB wiring board A of the first embodiment.

The first manufacturing method of the present invention is not limited to the embodiment shown in FIG. 5. For example, the conductor circuit 1 a of the flexible layer 1 and the conductor circuit 3 a of the build-up layer 3 It may be formed before lamination with the composite layer 2 instead of after the formation of the through-hole 4, and the formation of the through-hole 4 and the formation of the via-hole 5 may be performed first.

According to the first manufacturing method of the present invention, the plating on the surfaces of the flexible layer 1 and the build-up layer 3 is performed once, and the circuit thickness of the flexible layer 1 (the total thickness of the conductor circuit thickness and the plating layer thickness) Since the circuit thickness of the build-up layer 3 is the same and the plating of the through hole 4 and the via hole 5 can be performed simultaneously, the design value of the minimum line width that can form a circuit on both the front and back sides of the FCB wiring board Can be the same. Also, since the connection between the build-up layer 3 and the composite layer 2 can be performed by the via hole 5 formed in the insulating layer 31 of the build-up layer 3, there is no need to fill the inside of the via hole with resin or the like. .

Next, a preferable example of the second manufacturing method of the present invention will be described in detail with reference to FIG. 6, which illustrates an example of a process of manufacturing the FCB wiring board C of the third embodiment.

In the embodiment shown in FIG. 6, as a material for forming the insulating layer 31 of the build-up layer 3, a thermosetting liquid resin, a UV-curable liquid resin, a photo-imaging liquid resin, or the like is used. This is a production example when a mold liquid resin is used.

First, the copper foil on the flexible layer side of the rigid board 21 on which the copper foil b as the conductor layer for forming the conductor circuit is formed on both surfaces is formed in a predetermined wiring circuit pattern. Then, a composite layer 2 as shown in Fig. 6 (2), which is a conductor circuit 2a, is formed.

The formation of the conductor circuit 2 a ′ of the composite layer 2 is performed by a method of removing a conductor other than the wiring portion by etching using a photosensitive etching resist film.

Next, as shown in FIG. 6②, a flexible layer 1 in which a copper foil 1 b as a conductor layer for forming a conductor circuit is laminated on the surface of the flexible substrate 11 on the surface layer side, and a bonding sheet. 6. The composite layers 2 are arranged in this order and laminated to produce a laminate.

The flexible layer 1 and the composite layer 2 are bonded by a bonding sheet 6. The bonding sheet 6 is a perforated sheet in which unnecessary portions are cut out.

Next, as shown in Fig. 6③, the copper foil on the surface of the rigid board 21 on the side of the build-up layer is formed in a predetermined wiring circuit pattern by the same method as the method of forming the conductor circuit 2a '. Circuit 2a is produced.

Next, as shown in FIG. 6A, the insulating layer 31 of the build-up layer 3 is formed on the surface of the composite layer 2 on the side of the build-up layer.

The formation of the insulating layer 31 of the build-up layer 3 is performed by applying and curing the above-mentioned curable liquid resin.

Next, as shown in FIG. 6A, via holes 5 are formed at predetermined locations in the insulating layer 31 of the build-up layer 3.

The formation of the via hole 5 may be performed by a known means, for example, drilling, laser drilling, or etching.

Next, as shown in FIG. 6A, a through hole 4 is formed at a predetermined position of the laminate on which the insulating layer 31 is formed.

The formation of the through hole 4 can be performed by the same means as the formation of the via hole 5. Good.

Next, as shown in FIG. 6⑦, the through-hole 4, the via-hole 5, the conductor layer (copper foil) 1b of the flexible layer 1 and the insulating layer of the build-up layer 3

3 1 is covered with a plating layer 7.

The flexible layer 1, the composite layer 2, and the build-up layer 3 are electrically connected by the plating layer 7.

Next, as shown in FIG. 6A, the conductor layer 1b and the plating layer 7 of the flexible layer 1 and the plating layer 7 of the build-up layer 3 are formed in a predetermined wiring circuit pattern, respectively. The body circuit 1a and the conductor circuit 3a are produced.

The wiring circuit; The formation of the turns is performed by using a photosensitive etching resist film and removing a conductor other than the wiring portion by etching.

Next, as shown in FIG. 6A, a predetermined portion of each of the flexible layer 1 and the build-up layer 3 on which the wiring circuit pattern is formed is covered with a solder resist 8.

After the coating, unnecessary portions of the composite layer 2 and the build-up layer 3 are removed by drilling, laser processing, etching, or the like, as shown in FIG. 6C, to obtain the FCB wiring board C of the third embodiment.

The second manufacturing method of the present invention is not limited to the embodiment shown in FIG. 6. For example, the formation of the conductor circuit 2a of the composite layer 2 is performed at the time of forming the conductor circuit 2a. The formation of the through hole 4 and the formation of the via hole 5 may be performed in any order.

According to the second manufacturing method of the present invention, since the surface of the flexible layer 1 and the build-up layer 3 have only one plating, the circuit on both the front and back sides of the FCB wiring board can be easily thinned, In addition, since the connection between the build-up layer 3 and the composite layer 2 can be established by the via hole 5 formed in the insulating layer 31 of the build-up layer 3, there is no need to fill the inside of the via hole with resin or the like. . Industrial applicability

According to the present invention, the wiring density is improved, small electronic components can be mounted on both the front and back surfaces of the wiring board, and it is not necessary to fill the inside of the via hole with resin or the like, and the yield is dramatically improved. Thus, it is possible to provide a multilayer wiring board having a flexible portion and a rigid portion, and a method of manufacturing the same.

Claims

The scope of the claims

1. A rigid substrate and a composite layer composed of a conductor circuit formed on at least the surface of the rigid substrate on the side of the build-up layer are used as an intermediate layer, and one surface of the composite layer is provided with a flexible substrate and a surface of the flexible substrate on the surface side of the flexible substrate. A flexible layer composed of a conductor circuit formed on the surface is laminated, and a build-up layer composed of an insulating layer and a conductor circuit formed on the surface of the insulating layer on the other surface of the composite layer Wherein the conductor circuit of the flexible layer, the conductor circuit of the composite layer, and the conductor circuit of the build-up layer penetrate the multilayer wiring board. Are electrically connected through a through-hole, and the conductor circuit of the composite layer and the conductor circuit of the build-up layer are Through Baiahoru formed serial buildup layer are electrically connected, a flexible 'composite built-up multilayer wiring board.

2. The flexible composite build-up multilayer wiring board according to claim 1, wherein the composite layer has conductor circuits formed on both surfaces of a rigid substrate.

3. The flexible composite build-up multilayer wiring board according to claim 1, wherein the composite layer has a conductor circuit formed only on the surface of the rigid board on the side of the build-up layer.

4. A step of forming a predetermined conductive circuit on at least the surface of the rigid substrate on the build-up layer side to form a composite layer; a conductive layer for forming a conductive circuit of a flexible layer; a flexible substrate; A step of producing a laminate having a layer structure of a composite layer, an insulating layer of a build-up layer, and a conductor layer for forming a conductor circuit of the build-up layer; a step of forming a through hole in the laminate; Forming a via hole in the build-up layer, forming a via hole in the through-hole, the via hole, the conductor layer of the flexible layer, and the conductor layer of the build-up layer. Forming a conductive layer and a plating layer of the flexible layer, and forming a conductive layer and a plating layer of the build-up layer into a predetermined wiring circuit pattern; and forming the wiring circuit pattern. A method of manufacturing a flexible 'composite / build-up multilayer wiring board, comprising a step of coating predetermined portions of the flexible layer and the build-up layer with a solder resist.

5. Laminated plate composed of a flexible layer having a conductor layer for forming a conductor circuit on the surface side of the flexible substrate and a composite layer having a conductor circuit on at least the surface of the rigid substrate on the build-up layer side Forming an insulating layer of a build-up layer on the surface of the composite layer on the side of the build-up layer; forming a via hole in the insulating layer; Forming a through hole, covering the through hole, the via hole, the conductive layer of the flexible layer and the insulating layer of the build-up layer with a plating layer, Forming the plating layer and the plating layer of the build-up layer into a predetermined wiring circuit pattern, respectively; The flexible layer down is formed and a predetermined portion of their respective of the build-up layer has a step of coating by solder one resist Furekishibu Le composite build-up multilayer wiring board manufacturing method of.