JP4799349B2 - Power distribution device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a power distribution device that distributes electricity from a power source (battery or generator) to each auxiliary machine in a vehicle, and is equipped with a fuse for protecting a branched circuit and a relay for switching. In particular, the present invention relates to a power distribution device incorporating an electronic circuit.

When power distribution is performed in an automobile or the like, a power distribution device is used for the purpose of saving space and cost. The power distribution device has a structure in which components such as the connection part to the wire harness, fuses, and relays can be gathered and connected in one place. The wire harness is connected to the power distribution device by a connector containing the connection terminals, and the power supply Connection to the fuse circuit housed in the distribution device and branching of the circuit are performed.
A conventional power distribution device configures a power circuit for high current (a circuit for distributing power from a power source) by stacking a bus bar with a metal plate punched out and an insulating plate that holds and insulates the bus bar. Was. And in a power distribution device incorporating a printed circuit board that constitutes an electronic circuit, a female terminal that incorporates a female terminal on the printed circuit board to electrically connect the power circuit (bus bar) and the electronic circuit (printed circuit board). A built-in connector was attached, and the male terminal of the bus bar was inserted into the connector and connected.
Further, in a power distribution device incorporating a printed circuit board constituting an electronic circuit, a transition conductor having a pressure contact terminal at the tip is mounted on the printed circuit board, a bus bar is connected to the pressure contact terminal at the tip of the transition conductor, and the power circuit and A method for achieving electrical connection with an electronic circuit has been proposed (see, for example, Patent Documents 1 and 2).
Japanese Patent Laid-Open No. 10-322853 Japanese Patent Laid-Open No. 10-322854

However, since the power supply circuit (bus bar) and the electronic circuit (printed circuit board) are electrically connected, there is a problem that the cost increases when the female terminal built-in connector is attached to the printed circuit board. .
In addition, if a power circuit (bus bar) and an electronic circuit (printed circuit board) are electrically connected using a printed circuit board on which a transition conductor having a pressure contact terminal is mounted, the cost can be suppressed, but the electronic circuit In addition to the space required for forming, a space for providing a transition conductor having a pressure contact terminal at the tip is required, which increases the board size of the printed circuit board, and thus increases the power distribution device. was there.

  Therefore, the present invention provides a power distribution device in which an electronic circuit is connected to a power circuit in a power distribution device incorporating an electronic circuit at low cost, high reliability, and a small space.

  The present invention is a power distribution device in which a multilayer wiring board in which a power circuit and an electronic circuit composed of conductor layers having different thicknesses are formed on the same substrate, and has a thickness of 70 μm laminated on a hard core material. A circuit for small current is formed by forming a circuit pattern on the first conductor layer of a multilayer wiring board in which a second conductor layer having a thickness of 200 μm or more is laminated on the following first conductor layer via an insulating layer. In addition, a circuit pattern is formed on the second conductor layer to constitute a circuit for large current, and the first conductor layer is partially exposed.

  According to the present invention, a multi-layered wiring board in which a power circuit composed of a conductor layer having a thickness of 200 μm or more and an electronic circuit composed of a conductor layer having a thickness of 70 μm or less are formed on the same substrate is housed in a housing. A power distribution device incorporating a circuit can be configured, and the power distribution device can be made small. In addition, since the power supply circuit and the electronic circuit are electrically connected through a through hole, the electronic circuit and the power supply circuit can be connected with low cost and high reliability without using a connector or the like. Can be performed in a small space, which contributes to the miniaturization of the power distribution device.

A power distribution device according to an embodiment of the present invention will be described with reference to FIGS.
The power distribution device of the present invention is a power supply incorporating an electronic circuit by housing in a housing 20 a multilayer wiring board 10 in which a power circuit composed of conductor layers having different thicknesses and an electronic circuit are formed on the same substrate. It constitutes a distribution device. Then, a circuit pattern 6b for large current composed of a conductor layer having a thickness of 200 μm or more, preferably 200 to 400 μm is formed on the multilayer wiring board 10 mounted on the power distribution device to constitute a power circuit. An electronic circuit is formed by forming a circuit pattern 6a for small current composed of a conductor layer of 70 μm or less, preferably 18 to 50 μm.

1 and 2 are diagrams (partial cross-sectional views) for explaining a multilayer wiring board 10 mounted on a power distribution device, for explaining a power distribution device and a manufacturing method thereof according to a first embodiment of the present invention. is there.
As the multilayer wiring board 10 mounted on the power distribution device, in this embodiment, a first conductor layer 2 (thin film copper foil) having a thickness of 70 μm or less is laminated on the front surface and / or the back surface of the hard core material 1. A multilayer wiring board 10 in which a second conductor layer 4 (thick film copper foil) having a thickness of 200 μm or more was partially laminated on the first conductor layer with an insulating layer 3 interposed therebetween was used.

A circuit that functions as a power supply circuit (rated current of 10 A or more) of the power distribution device needs to be formed to have a thickness of 200 μm or more in order to cope with a large current.
On the other hand, the electronic circuit incorporated in the power distribution device only needs to correspond to a small current (less than the rated current of 10 A), and therefore the circuit thickness does not need to be 200 μm. In a circuit corresponding to a small current, a thickness of 70 μm is sufficient. In addition, the circuit pattern is intricately stretched on the printed circuit board that constitutes the electronic circuit, but when the circuit pattern is formed by etching a conductor layer having a thickness of 200 μm or more, the relationship of the minimum circuit pattern width by the etching process In addition, there is a problem that a board space (projected area of the printed circuit board) for forming the electronic circuit becomes large.
Therefore, the second conductor layer 4 (thick film copper foil) having a thickness of 200 μm or more is partially laminated on the first conductor layer 2 (thin film copper foil) having a thickness of 70 μm or less via the insulating layer 3. Using the multilayer wiring board 10, the second conductor layer 4 having a thickness of 200 μm or more laminated on the outermost layer is etched to form a circuit pattern 6 b for large current to constitute a power circuit, and to the inside The laminated first conductor layer 2 having a thickness of 70 μm or less was etched to form a circuit pattern 6a for small current to constitute an electronic circuit.

For example, as shown in FIG. 1, after laminating a first conductor layer 2 having a thickness of 70 μm or less on the front and back of a hard core material 1, the first conductor layer 2 is etched to form a circuit pattern 6a. After constituting a current circuit (electronic circuit) (see FIG. 1A), a second conductor layer 4 having a thickness of 200 μm or more is laminated on the first conductor layer 2 with an insulating layer 3 interposed therebetween. Then, the second conductor layer 4 is etched to form a circuit pattern 6b to constitute a large current circuit (power supply circuit) (see FIG. 1B).
And as shown in FIG.1 (c), the insulating layer 3 and the 2nd conductor layer 4 which were laminated | stacked on the said 1st conductor layer 2 are removed partially, and the 1st conductor layer 2 (70 micrometers or less in thickness) ( The circuit pattern 6a) for small current is partially exposed. By partially exposing the first conductor layer 2 (circuit pattern 6a for small current), an electronic component (not shown) or the like can be mounted on the small current circuit (electronic circuit) in the exposed portion. And an electronic circuit on which electronic components are mounted can be configured.

For example, as shown in FIG. 2, after laminating the first conductor layer 2 having a thickness of 70 μm or less on the front and back of the hard core material 1, the first conductor layer 2 is etched to form a circuit pattern 6a. After constituting a circuit for small current (see FIG. 2A), a second conductor layer 4 having a thickness of 200 μm or more is partially laminated on the first conductor layer 2 with an insulating layer 3 interposed therebetween. Then, the second conductor layer 4 is etched to form a circuit pattern 6b to constitute a large current circuit (see FIG. 2B).
In the multilayer wiring board 10 shown in FIG. 2 (b), the second conductor layer 4 is partially interposed through the insulating layer 3 so that the first conductor layer 2 (circuit pattern 6a for small current) is partially exposed. Therefore, an electronic component (not shown) or the like can be mounted on the small current circuit (electronic circuit) in the exposed portion, and an electronic circuit mounted with the electronic component can be configured.

That is, in the multilayer wiring board 10 shown in FIG. 1 and FIG. 2, a circuit pattern 6b (power supply circuit) for large current having a thickness of 200 μm or more is formed on the outermost layer (second conductor layer 4), and the inner layer thereof A circuit pattern 6a (electronic circuit) for small current having a thickness of 70 μm or less is formed on the (first conductor layer 2). Since the inner layer (first conductor layer 2) is partially exposed, an electronic component can be mounted on the circuit pattern 6a (electronic circuit) for small current formed in the exposed portion.
In addition, in the wiring board in which the circuit pattern for large currents is formed, a technique of providing a heat-dissipating thin film conductor layer (about 18 to 70 μm) on the inner side (inner layer) is known. Therefore, in the present invention, the first conductor layer 2 having a thickness of 70 μm or less laminated inside the second conductor layer 4 having a thickness of 200 μm or more via the insulating layer 3 is used as an inner layer for heat dissipation in the unexposed portion. It was configured to function as an electronic circuit in the exposed portion.

Further, by forming the through-hole 7 in the multilayer wiring board 10, the second conductor layer 4 that is the outermost layer and the first conductor layer 2 laminated on the inside through the insulating layer 3 can be electrically connected. (See FIG. 1 (c) and FIG. 2 (b)). The through hole 7 is plated with through holes. Alternatively, the hole may be filled with a conductive substance.
That is, a circuit pattern (power circuit) 6b for large current formed by etching the second conductor layer 4 and the first conductor layer 2 are formed by etching through the through holes 7 formed in the multilayer wiring board 10. The continuity with the small current circuit pattern (electronic circuit) 6a is ensured, and the electronic circuit and the power supply circuit are electrically connected without using a connector or the like.

An electronic circuit is incorporated by housing a multilayer wiring board 10 in which a power supply circuit (circuit pattern 6b for large current) and an electronic circuit (circuit pattern 6a for small current) are conducted through a through hole 7 in a housing. When the power distribution device is configured, the electronic circuit and the power circuit can be connected with low cost and high reliability without using a connector or the like, and the circuits can be connected in a small space. Can contribute to downsizing
In order to protect the power supply circuit and the electronic circuit, it is preferable to provide an insulating coating on the exposed surface of each circuit pattern.

Next, a power distribution device and a method for manufacturing the same according to a second embodiment of the present invention will be described with reference to FIGS.
FIG. 3 is a diagram (partial cross-sectional view) for explaining a bent multilayer wiring board 10 ′ mounted on the power distribution device, and FIG. 3 is a diagram showing the power distribution device on which the bending multilayer wiring substrate 10 ′ is mounted. (Sectional view).

The second embodiment constitutes a power distribution device incorporating an electronic circuit by housing a bent multilayer wiring board 10 ′ in a housing 20.
As shown in FIG. 3A, the bent multilayer wiring board 10 ′ mounted on the power distribution device has a thickness of about 100 μm on the first conductor layer 2 laminated on the surface of the hard core material 1. The second conductor layer 41 is laminated via a bonding sheet (insulating sheet) 31, and the second conductor layer 42 is arranged on the first conductor layer 2 laminated on the back surface of the hard core material 1 via the insulating layer 32. In the multilayer wiring board in which layers are laminated, the core material 1 is removed from a part of the multilayer wiring board to form a thin portion (bent portion 8) composed of only the bonding sheet 31 and the second conductor layer 41 having a thickness of about 100 μm. In addition, the thin portion (bending portion 8) can be bent.

In this embodiment as well, as shown in FIG. 3B, a circuit pattern 6a for small current is formed on the first conductor layer 2 having a thickness of 70 μm or less to constitute an electronic circuit, as in the first embodiment. In addition, a power supply circuit was formed in which the circuit pattern 6b for large current was formed on the second conductor layers 41 and 42 having a thickness of 200 μm or more.
Further, the first conductor layer (copper foil or the like) 2 having a thickness of 70 μm or less provided inside the second conductor layers 41 and 42 having a thickness of 200 μm or more is partially exposed, and the first conductor layer ( An electronic component or the like can be mounted on a circuit (electronic circuit) formed in a portion where the circuit pattern 6a) for small current is exposed.
In the embodiment shown in FIG. 3B, by removing the insulating layer 32 and the second conductor layer 42 laminated on the back side of the core material 1 on one side (right side) with the bent portion 8 interposed therebetween, The first conductor layer 2 having a thickness of 70 μm or less that is bonded to the back surface of the core material 1 is partially exposed.

Similarly to the first embodiment, a circuit pattern (power circuit) 6b for large current formed by etching the second conductor layers 41 and 42 through the through holes 7 formed in the bent multilayer wiring board 10 ', and , Ensuring electrical conductivity with the circuit pattern (electronic circuit) 6a for small current formed by etching the first conductor layer 2, and electrically connecting the electronic circuit and the power supply circuit without using a connector or the like did.
As shown in FIG. 4, a circuit pattern (power circuit) 6b for a large current having a thickness of 200 μm or more and a circuit pattern (electronic circuit) 6a for a small current having a thickness of 70 μm or less are formed on the same substrate. Further, the bent multilayer wiring board 10 ′ in which the circuit patterns having different layer thicknesses are conducted through the through holes 7 is bent at the bent portion 8, and the bent multilayer wiring board 10 ′ is accommodated in the housing 20. Thus, a power distribution device incorporating an electronic circuit is configured.

  In the bent multilayer wiring board 10 ′, a portion where the first conductor layer having a thickness of 70 μm or less is partially exposed to expose the circuit pattern 6 a (electronic circuit) for small current is the bent multilayer wiring board 10. It is preferable to arrange so that 'is bent inside when bent at the bent portion 8. Thereby, when the electronic component 9 is mounted on the circuit pattern 6a for small current to configure the electronic circuit, the electronic component 9 is formed in the inner space generated by bending the bending type multilayer wiring board 10 ′ at the bent portion 8. The electronic component 9 can be protected from external damage and the like.

In the power distribution device shown in FIG. 4, the bent multilayer wiring board 10 ′ housed in the housing 20 is a thin-walled portion consisting of only one layer of the bonding sheet 31 and one layer of the second conductor layer 41, that is, the bent portion 8. It is bent. A circuit pattern (power circuit) 6b for a large current and a circuit pattern (electronic circuit) 6a for a small current are formed on the same multilayer substrate 10 'on the same substrate, and the power circuit and the electronic circuit The circuit is conducted through the through hole 7.
Further, a connection terminal 12 (for example, a connection terminal for electrically connecting a connector, a fuse or the like to a wiring circuit) for connecting another electrical component to the power distribution device is attached to the bent multilayer wiring board 10 '. In addition, an electronic circuit 6a is formed in an inner space generated by bending the bent multilayer wiring board 10 ', and an electronic component 9 is disposed in the electronic circuit.
In order to protect the power supply circuit and the electronic circuit, it is preferable to provide an insulating coating 11 on the exposed surface of each circuit pattern.

  As described above, according to the present invention, a power distribution device incorporating an electronic circuit can be easily created, and a power supply circuit and an electronic circuit can be provided at low cost and high reliability without using a connector or the like. Can be connected. Moreover, there is no problem that the substrate size is increased by forming a power circuit composed of a conductor layer having a thickness of 200 μm or more and an electronic circuit composed of a conductor layer having a thickness of 70 μm or less on the same substrate. The device can be made smaller.

It is a figure which shows the manufacture example of the multilayer wiring board 10 mounted in a power distribution device. It is a figure which shows another example. It is a figure which shows the manufacturing method of bending | flexion type multilayer wiring board 10 'mounted in a power distribution device. It is a figure which shows the power distribution device carrying bending type | mold multilayer wiring board 10 '.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Core material 2 1st conductor layer 3,32 Insulating layer 31 Bonding sheet (insulating sheet)
4, 41, 42 Second conductor layer 6a Circuit pattern for small current 6b Circuit pattern for large current 7 Through hole 8 Bent part 9 Electronic component 10 Multilayer wiring board 10 'Bending multilayer wiring board 11 Insulation coating 12 Connection terminal 20 housing

Claims (6)

A power distribution device including a multilayer wiring board (10) in which a power circuit and an electronic circuit configured by conductor layers having different thicknesses are formed on the same substrate,
A multilayer in which a second conductor layer (4) having a thickness of 200 μm or more is laminated on a first conductor layer (2) having a thickness of 70 μm or less laminated on a hard core material (1) via an insulating layer (3). A circuit pattern (6a) is formed on the first conductor layer (2) of the wiring board (10) to form a small current circuit, and a circuit pattern (6b) is formed on the second conductor layer (4). A power distribution device comprising a circuit for high current and partially exposing the first conductor layer (2).   The power distribution device according to claim 1, wherein an electronic component is mounted on a portion where the first conductor layer (2) is exposed. The second conductor layer (41) is laminated on the first conductor layer (2) laminated on the surface of the hard core material (1) via the bonding sheet (31), and the hard core material (1). A circuit pattern on the first conductor layer (2) of the multilayer wiring board in which the second conductor layer (42) is laminated via the insulating layer (32) on the first conductor layer (2) laminated on the back surface of (6a) is formed to constitute a small current circuit, and a circuit pattern (6b) is formed on the second conductor layer (41, 42) to constitute a large current circuit,
Further, the core material is removed from a part of the multilayer wiring board to form a bent portion (8) including only the bonding sheet (31) and the second conductor layer (41), and the bent portion (8) is bent. The power distribution device according to claim 1 or 2, wherein a bending type multilayer wiring board (10 ') is mounted. A step of laminating a first conductor layer (2) having a thickness of 70 μm or less on a hard core material (1) and forming a circuit pattern (6a) on the first conductor layer to form a small current circuit;
A second conductor layer (4) having a thickness of 200 μm or more is laminated on the first conductor layer via an insulating layer (3), and a second conductor layer (layered on the first conductor layer via the insulating layer) ( 4) forming a circuit pattern (6b) to form a large current circuit;
Partially exposing the first conductor layer by removing the layer on the first conductor layer (2),
A power supply comprising a multilayer wiring board (10) in which a power circuit and electronic circuits composed of conductive layers having different thicknesses are formed on the same substrate, and the multilayer wiring board (10) is housed in a housing. A method for manufacturing a dispensing device. A step of laminating a first conductor layer (2) having a thickness of 70 μm or less on a hard core material (1) and forming a circuit pattern (6a) on the first conductor layer to form a circuit for small current;
A second conductor layer (4) having a thickness of 200 μm or more is partially laminated on the first conductor layer via an insulating layer (3), and is partially laminated on the first conductor layer via an insulating layer. Forming a circuit pattern (6b) on the second conductor layer (4) to form a circuit for high current,
A power supply comprising a multilayer wiring board (10) in which a power circuit and electronic circuits composed of conductive layers having different thicknesses are formed on the same substrate, and the multilayer wiring board (10) is housed in a housing. A method for manufacturing a dispensing device. The second conductor layer (41) is laminated via the bonding sheet (31) on the first conductor layer (2) laminated on the surface of the hard core material (1), and the hard core material (1) The core sheet is removed from a part of the multilayer wiring board in which the second conductor layer (42) is laminated on the first conductor layer (2) laminated on the back surface via the insulating layer (32), and the bonding sheet (31) is removed. And forming a bent multilayer wiring board (10 ') by forming a bent portion (8) consisting only of the second conductor layer (41),
A bent multilayer wiring board (10 ') in which a power supply circuit and an electronic circuit composed of conductive layers having different thicknesses are formed on the same substrate is bent at the bent portion (8) and stored in a housing. A method of manufacturing a power distribution device according to claim 4 or 5.

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