WO2004079496A3 - Systeme pour fabriquer des circuits electriques au moyen d'un support de debit de liquide - Google Patents

Systeme pour fabriquer des circuits electriques au moyen d'un support de debit de liquide Download PDF

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Publication number
WO2004079496A3
WO2004079496A3 PCT/IL2004/000201 IL2004000201W WO2004079496A3 WO 2004079496 A3 WO2004079496 A3 WO 2004079496A3 IL 2004000201 W IL2004000201 W IL 2004000201W WO 2004079496 A3 WO2004079496 A3 WO 2004079496A3
Authority
WO
WIPO (PCT)
Prior art keywords
supporter
electrical circuits
fluid flow
circuits employing
fabricating electrical
Prior art date
Application number
PCT/IL2004/000201
Other languages
English (en)
Other versions
WO2004079496A2 (fr
Inventor
Yamamoto Shigeru
Raanan Adin
Original Assignee
Orbotech Ltd
Yamamoto Shigeru
Raanan Adin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd, Yamamoto Shigeru, Raanan Adin filed Critical Orbotech Ltd
Publication of WO2004079496A2 publication Critical patent/WO2004079496A2/fr
Publication of WO2004079496A3 publication Critical patent/WO2004079496A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

La présente invention concerne un système et un procédé pour soutenir un substrat plat lors de sa fabrication, au moyen d'un support de débit de liquide qui fonctionne à une première pression de liquide, avec un premier volume d'écoulement. Une entrée de liquide à faible volume et à haute pression est transformée afin de réduire la pression et d'augmenter le volume. Le système et le procédé selon cette invention sont utilisés pour soulever des circuits électriques en cours de fabrication, tels que des écrans plats.
PCT/IL2004/000201 2003-03-03 2004-03-02 Systeme pour fabriquer des circuits electriques au moyen d'un support de debit de liquide WO2004079496A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003055361A JP3995617B2 (ja) 2003-03-03 2003-03-03 空気浮上装置
JP2003-055361 2003-03-03

Publications (2)

Publication Number Publication Date
WO2004079496A2 WO2004079496A2 (fr) 2004-09-16
WO2004079496A3 true WO2004079496A3 (fr) 2006-05-04

Family

ID=32958661

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2004/000201 WO2004079496A2 (fr) 2003-03-03 2004-03-02 Systeme pour fabriquer des circuits electriques au moyen d'un support de debit de liquide

Country Status (3)

Country Link
JP (1) JP3995617B2 (fr)
TW (1) TW200505780A (fr)
WO (1) WO2004079496A2 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7908885B2 (en) 2004-11-08 2011-03-22 New Way Machine Components, Inc. Non-contact porous air bearing and glass flattening device
JP4664117B2 (ja) * 2005-03-03 2011-04-06 住友重機械工業株式会社 搬送物浮上ユニット、搬送物浮上装置、及びステージ装置
JP4869612B2 (ja) * 2005-03-25 2012-02-08 東京エレクトロン株式会社 基板搬送システムおよび基板搬送方法
JP4830339B2 (ja) * 2005-04-27 2011-12-07 株式会社Ｉｈｉ 搬送装置
JP4553376B2 (ja) 2005-07-19 2010-09-29 東京エレクトロン株式会社 浮上式基板搬送処理装置及び浮上式基板搬送処理方法
JP4700430B2 (ja) * 2005-07-26 2011-06-15 シーケーディ株式会社 非接触支持装置の検査方法
JP4917780B2 (ja) * 2005-09-08 2012-04-18 住友化学株式会社 露光装置
JP4535972B2 (ja) * 2005-09-09 2010-09-01 株式会社ブイ・テクノロジー ワークステージ及び露光装置
JP4594241B2 (ja) * 2006-01-06 2010-12-08 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びコンピュータプログラム
JP2007182304A (ja) * 2006-01-06 2007-07-19 Tokyo Electron Ltd 基板搬送装置、基板搬送方法及びコンピュータプログラム
JP2007194508A (ja) * 2006-01-20 2007-08-02 Tokyo Electron Ltd 基板搬送装置、基板搬送方法及びコンピュータプログラム
JP2007283428A (ja) * 2006-04-14 2007-11-01 Yokogawa Electric Corp ワーク加工装置およびワーク移送システム
JP2008140953A (ja) * 2006-12-01 2008-06-19 Tanken Seal Seiko Co Ltd 浮上装置
JP5221508B2 (ja) * 2009-12-25 2013-06-26 東京エレクトロン株式会社 基板処理装置
JP5485928B2 (ja) * 2011-03-09 2014-05-07 東京エレクトロン株式会社 基板浮上搬送装置及び基板処理装置
JP2014218342A (ja) * 2013-05-09 2014-11-20 オイレス工業株式会社 支持用エアプレートおよびその気体流抵抗器
JP2015034078A (ja) * 2013-08-09 2015-02-19 オイレス工業株式会社 支持用エアプレートおよびその気体流抵抗器
CN115070493A (zh) * 2022-07-25 2022-09-20 南通康弘机械制造有限公司 一种数控机床加工用加工接料机构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3589704A (en) * 1968-11-12 1971-06-29 Ibm Holders for irregularly formed integrated circuit devices
US6590633B1 (en) * 1997-03-25 2003-07-08 Nikon Corporation Stage apparatus and method for producing circuit device utilizing the same
US6625877B1 (en) * 1998-01-27 2003-09-30 Fuji Machine Mfg. Co., Ltd. Apparatus for supporting electric-component mounter
US6666928B2 (en) * 2001-09-13 2003-12-23 Micell Technologies, Inc. Methods and apparatus for holding a substrate in a pressure chamber
US6711797B1 (en) * 1999-06-21 2004-03-30 Dek International Gmbh Hydraulic tooling fixture

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3589704A (en) * 1968-11-12 1971-06-29 Ibm Holders for irregularly formed integrated circuit devices
US6590633B1 (en) * 1997-03-25 2003-07-08 Nikon Corporation Stage apparatus and method for producing circuit device utilizing the same
US6625877B1 (en) * 1998-01-27 2003-09-30 Fuji Machine Mfg. Co., Ltd. Apparatus for supporting electric-component mounter
US6711797B1 (en) * 1999-06-21 2004-03-30 Dek International Gmbh Hydraulic tooling fixture
US6666928B2 (en) * 2001-09-13 2003-12-23 Micell Technologies, Inc. Methods and apparatus for holding a substrate in a pressure chamber

Also Published As

Publication number Publication date
JP2004262608A (ja) 2004-09-24
WO2004079496A2 (fr) 2004-09-16
TW200505780A (en) 2005-02-16
JP3995617B2 (ja) 2007-10-24

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