WO2004074931A3 - Procede et appareil de nettoyage megasonique de substrats a motifs - Google Patents

Procede et appareil de nettoyage megasonique de substrats a motifs Download PDF

Info

Publication number
WO2004074931A3
WO2004074931A3 PCT/US2004/003179 US2004003179W WO2004074931A3 WO 2004074931 A3 WO2004074931 A3 WO 2004074931A3 US 2004003179 W US2004003179 W US 2004003179W WO 2004074931 A3 WO2004074931 A3 WO 2004074931A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor substrate
patterned substrates
megasonic cleaning
cleaning
acoustic energy
Prior art date
Application number
PCT/US2004/003179
Other languages
English (en)
Other versions
WO2004074931A2 (fr
Inventor
John M Boyd
Michael Ravkin
Fred C Redeker
Randolph E Treur
William Thie
Original Assignee
Lam Res Corp
John M Boyd
Michael Ravkin
Fred C Redeker
Randolph E Treur
William Thie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/371,603 external-priority patent/US7040330B2/en
Priority claimed from US10/377,943 external-priority patent/US7040332B2/en
Application filed by Lam Res Corp, John M Boyd, Michael Ravkin, Fred C Redeker, Randolph E Treur, William Thie filed Critical Lam Res Corp
Priority to CN200480004602.9A priority Critical patent/CN1750892B/zh
Priority to EP04708156A priority patent/EP1599298A4/fr
Priority to JP2006503312A priority patent/JP4733012B2/ja
Publication of WO2004074931A2 publication Critical patent/WO2004074931A2/fr
Publication of WO2004074931A3 publication Critical patent/WO2004074931A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

L'invention concerne un procédé de nettoyage d'un substrat à semi-conducteurs. Ce procédé consiste à générer de l'énergie acoustique orientée dans un sens sensiblement perpendiculaire à une surface d'un substrat à semi-conducteurs. Puis, l'énergie acoustique orientée dans un sens sensiblement parallèle à la surface du substrat à semi-conducteurs est générée. Chaque sens de l'énergie acoustique peut être simultanément généré ou alternativement générée. L'invention se rapporte aussi à un système et un appareil de nettoyage d'un substrat à semi-conducteurs.
PCT/US2004/003179 2003-02-20 2004-02-04 Procede et appareil de nettoyage megasonique de substrats a motifs WO2004074931A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200480004602.9A CN1750892B (zh) 2003-02-20 2004-02-04 半导体基板清洗设备和系统
EP04708156A EP1599298A4 (fr) 2003-02-20 2004-02-04 Procede et appareil de nettoyage megasonique de substrats a motifs
JP2006503312A JP4733012B2 (ja) 2003-02-20 2004-02-04 処理方法及び処理装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/371,603 US7040330B2 (en) 2003-02-20 2003-02-20 Method and apparatus for megasonic cleaning of patterned substrates
US10/371,603 2003-02-20
US10/377,943 2003-02-28
US10/377,943 US7040332B2 (en) 2003-02-28 2003-02-28 Method and apparatus for megasonic cleaning with reflected acoustic waves

Publications (2)

Publication Number Publication Date
WO2004074931A2 WO2004074931A2 (fr) 2004-09-02
WO2004074931A3 true WO2004074931A3 (fr) 2005-01-27

Family

ID=32911940

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/003179 WO2004074931A2 (fr) 2003-02-20 2004-02-04 Procede et appareil de nettoyage megasonique de substrats a motifs

Country Status (5)

Country Link
EP (1) EP1599298A4 (fr)
JP (1) JP4733012B2 (fr)
KR (1) KR100952087B1 (fr)
TW (1) TWI290729B (fr)
WO (1) WO2004074931A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4027465B2 (ja) 1997-07-01 2007-12-26 株式会社半導体エネルギー研究所 アクティブマトリクス型表示装置およびその製造方法
DE102006033372B4 (de) * 2006-02-17 2010-04-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Ultraschallaktor zur Reinigung von Objekten
WO2010027583A1 (fr) * 2008-09-03 2010-03-11 Universal Display Corporation Matières phosphorescentes
JP5420336B2 (ja) * 2009-07-23 2014-02-19 大日本スクリーン製造株式会社 基板洗浄装置および基板洗浄方法
KR101639635B1 (ko) 2010-06-03 2016-07-25 삼성전자주식회사 메가소닉 세정 방법 및 세정 장치
JP5183777B2 (ja) * 2011-07-12 2013-04-17 株式会社カイジョー 超音波洗浄装置及び超音波洗浄方法
DE102013020518A1 (de) * 2013-12-11 2015-06-11 Forschungszentrum Jülich GmbH Fachbereich Patente Verfahren und Vorrichtung zur Polymerisation einer Zusammensetzung enthaltend Hydridosilane und anschließenden Verwendung der Polymerisate zur Herstellung von siliziumhaltigen Schichten
US11752529B2 (en) 2015-05-15 2023-09-12 Acm Research (Shanghai) Inc. Method for cleaning semiconductor wafers
JP6704714B2 (ja) * 2015-11-25 2020-06-03 株式会社ディスコ 切削装置
CN111386157B (zh) * 2017-11-15 2022-12-27 盛美半导体设备(上海)股份有限公司 用于清洗半导体晶圆的方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077070A (ja) * 1999-06-01 2001-03-23 Applied Materials Inc メガソニック洗浄装置
US6276370B1 (en) * 1999-06-30 2001-08-21 International Business Machines Corporation Sonic cleaning with an interference signal
US20020139389A1 (en) * 2001-03-30 2002-10-03 Treur Randolph E. Angular spin, rinse, and dry module and methods for making and implementing the same
US6468362B1 (en) * 1999-08-25 2002-10-22 Applied Materials, Inc. Method and apparatus for cleaning/drying hydrophobic wafers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60249331A (ja) * 1984-05-24 1985-12-10 Nec Corp 半導体ウエハ洗浄装置
JP2519869B2 (ja) * 1993-08-26 1996-07-31 株式会社プレテック 高周波洗浄装置
JPH09271729A (ja) * 1996-04-05 1997-10-21 Sonic Fueroo Kk 洗浄方法
JPH10323635A (ja) * 1997-05-26 1998-12-08 Sony Corp 超音波洗浄装置
US6085764A (en) * 1997-07-22 2000-07-11 Tdk Corporation Cleaning apparatus and method
JP3787024B2 (ja) * 1997-12-26 2006-06-21 株式会社カイジョー 超音波洗浄装置
US6188162B1 (en) * 1999-08-27 2001-02-13 Product Systems Incorporated High power megasonic transducer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077070A (ja) * 1999-06-01 2001-03-23 Applied Materials Inc メガソニック洗浄装置
US6276370B1 (en) * 1999-06-30 2001-08-21 International Business Machines Corporation Sonic cleaning with an interference signal
US6468362B1 (en) * 1999-08-25 2002-10-22 Applied Materials, Inc. Method and apparatus for cleaning/drying hydrophobic wafers
US20020139389A1 (en) * 2001-03-30 2002-10-03 Treur Randolph E. Angular spin, rinse, and dry module and methods for making and implementing the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1599298A4 *

Also Published As

Publication number Publication date
WO2004074931A2 (fr) 2004-09-02
TWI290729B (en) 2007-12-01
JP4733012B2 (ja) 2011-07-27
TW200425231A (en) 2004-11-16
EP1599298A2 (fr) 2005-11-30
JP2006518550A (ja) 2006-08-10
KR20050100405A (ko) 2005-10-18
EP1599298A4 (fr) 2007-05-02
KR100952087B1 (ko) 2010-04-13

Similar Documents

Publication Publication Date Title
WO2006025967A3 (fr) Traitement de semiconducteur utilisant un gaz hydrogene excite en combinaison avec un nettoyage par voie humide
ATE478439T1 (de) Verfahren zur rauhätzung von siliziumsolarzellen
MY140300A (en) Enhanced wafer cleaning method
EP1555690A4 (fr) Substrat de type silicium sur isolant colle, procede de production correspondant et dispositif a semiconducteur
EP1363319A3 (fr) Procédé de transfert d'un laminé et procédé de fabrication d'un dispositif semiconducteur
ATE361379T1 (de) Oberflächenbeschichtungsverfahren
WO2004006296A3 (fr) Corps stratifie, procede et dispositif pour fabriquer un substrat ultramince a l'aide du corps stratifie
AU2003281409A1 (en) Solar power generation apparatus and its manufacturing method
TW200711004A (en) Method of forming buried isolation regions in semiconductor substrates and semiconductor devices with buried isolation regions
WO2002001613A3 (fr) Procede et appareil pour nettoyer des tranches de silicium
WO2003092041A3 (fr) Procede pour fabriquer un substrat presentant une couche utile sur un support a haute resistivite
WO2004074931A3 (fr) Procede et appareil de nettoyage megasonique de substrats a motifs
TW200623247A (en) A substrate processing apparatus and method
TW200746265A (en) Methods and apparatus for epitaxial film formation
TW200507048A (en) Method of manufacturing a thermoelectric device and thermoelectric device obtained by means of such a method
TW200520139A (en) Method and apparatus for joining adhesive tape to back face of semiconductor wafer
JP2000294524A5 (fr)
WO2004111727A3 (fr) Procedes d'elimination d'une photoresine d'un substrat
TW200738357A (en) Method and apparatus for cleaning a semiconductor substrate
AU2003211282A1 (en) Plate-shaped silicon manufacturing method, substrate for manufacturing plate-shaped silicon, plate-shaped silicon, solar cell using the plate-shaped silicon, and solar cell module
AU2003217723A1 (en) High efficiency vacuum cleaning apparatus and method
WO2005010949A3 (fr) Solution au bilan thermique
WO2006012174A3 (fr) Systeme et procede de nettoyage et de gravure d'un substrat
DE60134997D1 (de) Hydrophile oberfläche mit temporären schutzverkleidungen
AU2003302960A1 (en) Silicon wafer for solar cell and the same manufacturing method

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2004708156

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2006503312

Country of ref document: JP

Ref document number: 20048046029

Country of ref document: CN

Ref document number: 1020057015366

Country of ref document: KR

DPEN Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101)
WWP Wipo information: published in national office

Ref document number: 1020057015366

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2004708156

Country of ref document: EP