EP1599298A4 - Method and apparatus for megasonic cleaning of patterned substrates - Google Patents

Method and apparatus for megasonic cleaning of patterned substrates

Info

Publication number
EP1599298A4
EP1599298A4 EP04708156A EP04708156A EP1599298A4 EP 1599298 A4 EP1599298 A4 EP 1599298A4 EP 04708156 A EP04708156 A EP 04708156A EP 04708156 A EP04708156 A EP 04708156A EP 1599298 A4 EP1599298 A4 EP 1599298A4
Authority
EP
European Patent Office
Prior art keywords
patterned substrates
megasonic cleaning
megasonic
cleaning
patterned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04708156A
Other languages
German (de)
French (fr)
Other versions
EP1599298A2 (en
Inventor
John M Boyd
Michael Ravkin
Fred C Redeker
Randolph E Treur
William Thie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/371,603 external-priority patent/US7040330B2/en
Priority claimed from US10/377,943 external-priority patent/US7040332B2/en
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of EP1599298A2 publication Critical patent/EP1599298A2/en
Publication of EP1599298A4 publication Critical patent/EP1599298A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
EP04708156A 2003-02-20 2004-02-04 Method and apparatus for megasonic cleaning of patterned substrates Withdrawn EP1599298A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/371,603 US7040330B2 (en) 2003-02-20 2003-02-20 Method and apparatus for megasonic cleaning of patterned substrates
US371603 2003-02-20
US377943 2003-02-28
US10/377,943 US7040332B2 (en) 2003-02-28 2003-02-28 Method and apparatus for megasonic cleaning with reflected acoustic waves
PCT/US2004/003179 WO2004074931A2 (en) 2003-02-20 2004-02-04 Method and apparatus for megasonic cleaning of patterned substrates

Publications (2)

Publication Number Publication Date
EP1599298A2 EP1599298A2 (en) 2005-11-30
EP1599298A4 true EP1599298A4 (en) 2007-05-02

Family

ID=32911940

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04708156A Withdrawn EP1599298A4 (en) 2003-02-20 2004-02-04 Method and apparatus for megasonic cleaning of patterned substrates

Country Status (5)

Country Link
EP (1) EP1599298A4 (en)
JP (1) JP4733012B2 (en)
KR (1) KR100952087B1 (en)
TW (1) TWI290729B (en)
WO (1) WO2004074931A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4027465B2 (en) 1997-07-01 2007-12-26 株式会社半導体エネルギー研究所 Active matrix display device and manufacturing method thereof
DE102006033372B4 (en) * 2006-02-17 2010-04-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Ultrasonic actuator for cleaning objects
WO2010027583A1 (en) * 2008-09-03 2010-03-11 Universal Display Corporation Phosphorescent materials
JP5420336B2 (en) * 2009-07-23 2014-02-19 大日本スクリーン製造株式会社 Substrate cleaning apparatus and substrate cleaning method
KR101639635B1 (en) 2010-06-03 2016-07-25 삼성전자주식회사 Method of megasonic cleaning and apparatus of cleaning
JP5183777B2 (en) * 2011-07-12 2013-04-17 株式会社カイジョー Ultrasonic cleaning apparatus and ultrasonic cleaning method
DE102013020518A1 (en) * 2013-12-11 2015-06-11 Forschungszentrum Jülich GmbH Fachbereich Patente Process and device for the polymerization of a composition comprising hydridosilanes and subsequent use of the polymers for the production of silicon-containing layers
US11141762B2 (en) 2015-05-15 2021-10-12 Acm Research (Shanghai), Inc. System for cleaning semiconductor wafers
JP6704714B2 (en) * 2015-11-25 2020-06-03 株式会社ディスコ Cutting equipment
WO2019095126A1 (en) * 2017-11-15 2019-05-23 Acm Research (Shanghai) Inc. Method for cleaning semiconductor wafers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6026832A (en) * 1997-05-26 2000-02-22 Sony Corporation Ultrasonic cleaning apparatus
US6085764A (en) * 1997-07-22 2000-07-11 Tdk Corporation Cleaning apparatus and method
US6188162B1 (en) * 1999-08-27 2001-02-13 Product Systems Incorporated High power megasonic transducer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60249331A (en) * 1984-05-24 1985-12-10 Nec Corp Semiconductor wafer washing apparatus
JP2519869B2 (en) * 1993-08-26 1996-07-31 株式会社プレテック High frequency cleaning equipment
JPH09271729A (en) * 1996-04-05 1997-10-21 Sonic Fueroo Kk Washing method
JP3787024B2 (en) * 1997-12-26 2006-06-21 株式会社カイジョー Ultrasonic cleaning equipment
EP1057546A1 (en) * 1999-06-01 2000-12-06 Applied Materials, Inc. Megasonic cleaner
US6276370B1 (en) 1999-06-30 2001-08-21 International Business Machines Corporation Sonic cleaning with an interference signal
US6468362B1 (en) * 1999-08-25 2002-10-22 Applied Materials, Inc. Method and apparatus for cleaning/drying hydrophobic wafers
US6748961B2 (en) * 2001-03-30 2004-06-15 Lam Research Corporation Angular spin, rinse, and dry module and methods for making and implementing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6026832A (en) * 1997-05-26 2000-02-22 Sony Corporation Ultrasonic cleaning apparatus
US6085764A (en) * 1997-07-22 2000-07-11 Tdk Corporation Cleaning apparatus and method
US6188162B1 (en) * 1999-08-27 2001-02-13 Product Systems Incorporated High power megasonic transducer

Also Published As

Publication number Publication date
EP1599298A2 (en) 2005-11-30
KR20050100405A (en) 2005-10-18
WO2004074931A2 (en) 2004-09-02
TWI290729B (en) 2007-12-01
KR100952087B1 (en) 2010-04-13
WO2004074931A3 (en) 2005-01-27
TW200425231A (en) 2004-11-16
JP2006518550A (en) 2006-08-10
JP4733012B2 (en) 2011-07-27

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Legal Events

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DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20070402

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Ipc: B08B 3/12 20060101ALN20070327BHEP

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