AU2003244019A1 - Method of cleaning substrate treatment apparatus - Google Patents
Method of cleaning substrate treatment apparatusInfo
- Publication number
- AU2003244019A1 AU2003244019A1 AU2003244019A AU2003244019A AU2003244019A1 AU 2003244019 A1 AU2003244019 A1 AU 2003244019A1 AU 2003244019 A AU2003244019 A AU 2003244019A AU 2003244019 A AU2003244019 A AU 2003244019A AU 2003244019 A1 AU2003244019 A1 AU 2003244019A1
- Authority
- AU
- Australia
- Prior art keywords
- treatment apparatus
- substrate treatment
- cleaning substrate
- cleaning
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002197364A JP3527231B2 (en) | 2002-07-05 | 2002-07-05 | Cleaning method for substrate processing equipment |
JP2002-197364 | 2002-07-05 | ||
PCT/JP2003/008318 WO2004006317A1 (en) | 2002-07-05 | 2003-07-01 | Method of cleaning substrate treatment apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003244019A1 true AU2003244019A1 (en) | 2004-01-23 |
Family
ID=30112396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003244019A Abandoned AU2003244019A1 (en) | 2002-07-05 | 2003-07-01 | Method of cleaning substrate treatment apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3527231B2 (en) |
AU (1) | AU2003244019A1 (en) |
WO (1) | WO2004006317A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070289604A1 (en) * | 2004-04-30 | 2007-12-20 | Yukio Fukunaga | Substrate Processing Apparatus |
JP4718795B2 (en) * | 2004-06-02 | 2011-07-06 | ルネサスエレクトロニクス株式会社 | Processing method in vapor phase growth apparatus |
US8128755B2 (en) | 2010-03-03 | 2012-03-06 | L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Cleaning solvent and cleaning method for metallic compound |
JP5356552B2 (en) * | 2012-01-30 | 2013-12-04 | 株式会社日立国際電気 | Cleaning method, semiconductor device manufacturing method, and substrate processing apparatus |
JP6142676B2 (en) * | 2013-05-31 | 2017-06-07 | セントラル硝子株式会社 | Dry etching method, dry etching apparatus, metal film and device including the same |
TW202221789A (en) * | 2020-11-27 | 2022-06-01 | 南韓商Psk有限公司 | Method and apparatus for treating substrate |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4049423B2 (en) * | 1997-11-06 | 2008-02-20 | キヤノンアネルバ株式会社 | Method for cleaning attached metal film in film forming apparatus |
US5993679A (en) * | 1997-11-06 | 1999-11-30 | Anelva Corporation | Method of cleaning metallic films built up within thin film deposition apparatus |
DE19833448C2 (en) * | 1998-07-24 | 2003-07-17 | Infineon Technologies Ag | Process for cleaning CVD systems |
JP2001176807A (en) * | 1999-12-20 | 2001-06-29 | Hitachi Ltd | Device and method for manufacturing semiconductor device, and cleaning method |
-
2002
- 2002-07-05 JP JP2002197364A patent/JP3527231B2/en not_active Expired - Fee Related
-
2003
- 2003-07-01 AU AU2003244019A patent/AU2003244019A1/en not_active Abandoned
- 2003-07-01 WO PCT/JP2003/008318 patent/WO2004006317A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2004039976A (en) | 2004-02-05 |
WO2004006317A1 (en) | 2004-01-15 |
JP3527231B2 (en) | 2004-05-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |