EP1599298A4 - Verfahren und vorrichtung zur megaschall-reinigung von gemusterten substraten - Google Patents

Verfahren und vorrichtung zur megaschall-reinigung von gemusterten substraten

Info

Publication number
EP1599298A4
EP1599298A4 EP04708156A EP04708156A EP1599298A4 EP 1599298 A4 EP1599298 A4 EP 1599298A4 EP 04708156 A EP04708156 A EP 04708156A EP 04708156 A EP04708156 A EP 04708156A EP 1599298 A4 EP1599298 A4 EP 1599298A4
Authority
EP
European Patent Office
Prior art keywords
patterned substrates
megasonic cleaning
megasonic
cleaning
patterned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04708156A
Other languages
English (en)
French (fr)
Other versions
EP1599298A2 (de
Inventor
John M Boyd
Michael Ravkin
Fred C Redeker
Randolph E Treur
William Thie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/371,603 external-priority patent/US7040330B2/en
Priority claimed from US10/377,943 external-priority patent/US7040332B2/en
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of EP1599298A2 publication Critical patent/EP1599298A2/de
Publication of EP1599298A4 publication Critical patent/EP1599298A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
EP04708156A 2003-02-20 2004-02-04 Verfahren und vorrichtung zur megaschall-reinigung von gemusterten substraten Withdrawn EP1599298A4 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US371603 2003-02-20
US10/371,603 US7040330B2 (en) 2003-02-20 2003-02-20 Method and apparatus for megasonic cleaning of patterned substrates
US10/377,943 US7040332B2 (en) 2003-02-28 2003-02-28 Method and apparatus for megasonic cleaning with reflected acoustic waves
US377943 2003-02-28
PCT/US2004/003179 WO2004074931A2 (en) 2003-02-20 2004-02-04 Method and apparatus for megasonic cleaning of patterned substrates

Publications (2)

Publication Number Publication Date
EP1599298A2 EP1599298A2 (de) 2005-11-30
EP1599298A4 true EP1599298A4 (de) 2007-05-02

Family

ID=32911940

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04708156A Withdrawn EP1599298A4 (de) 2003-02-20 2004-02-04 Verfahren und vorrichtung zur megaschall-reinigung von gemusterten substraten

Country Status (5)

Country Link
EP (1) EP1599298A4 (de)
JP (1) JP4733012B2 (de)
KR (1) KR100952087B1 (de)
TW (1) TWI290729B (de)
WO (1) WO2004074931A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4027465B2 (ja) 1997-07-01 2007-12-26 株式会社半導体エネルギー研究所 アクティブマトリクス型表示装置およびその製造方法
DE102006033372B4 (de) * 2006-02-17 2010-04-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Ultraschallaktor zur Reinigung von Objekten
JP5420336B2 (ja) * 2009-07-23 2014-02-19 大日本スクリーン製造株式会社 基板洗浄装置および基板洗浄方法
KR101639635B1 (ko) 2010-06-03 2016-07-25 삼성전자주식회사 메가소닉 세정 방법 및 세정 장치
JP5183777B2 (ja) * 2011-07-12 2013-04-17 株式会社カイジョー 超音波洗浄装置及び超音波洗浄方法
DE102013020518A1 (de) * 2013-12-11 2015-06-11 Forschungszentrum Jülich GmbH Fachbereich Patente Verfahren und Vorrichtung zur Polymerisation einer Zusammensetzung enthaltend Hydridosilane und anschließenden Verwendung der Polymerisate zur Herstellung von siliziumhaltigen Schichten
US11752529B2 (en) 2015-05-15 2023-09-12 Acm Research (Shanghai) Inc. Method for cleaning semiconductor wafers
JP6704714B2 (ja) * 2015-11-25 2020-06-03 株式会社ディスコ 切削装置
CN111386157B (zh) * 2017-11-15 2022-12-27 盛美半导体设备(上海)股份有限公司 用于清洗半导体晶圆的方法
US11433436B2 (en) * 2020-11-19 2022-09-06 Applied Materials, Inc. Carousel for ultrasonic cleaning and method of using thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6026832A (en) * 1997-05-26 2000-02-22 Sony Corporation Ultrasonic cleaning apparatus
US6085764A (en) * 1997-07-22 2000-07-11 Tdk Corporation Cleaning apparatus and method
US6188162B1 (en) * 1999-08-27 2001-02-13 Product Systems Incorporated High power megasonic transducer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60249331A (ja) * 1984-05-24 1985-12-10 Nec Corp 半導体ウエハ洗浄装置
JP2519869B2 (ja) * 1993-08-26 1996-07-31 株式会社プレテック 高周波洗浄装置
JPH09271729A (ja) * 1996-04-05 1997-10-21 Sonic Fueroo Kk 洗浄方法
JP3787024B2 (ja) * 1997-12-26 2006-06-21 株式会社カイジョー 超音波洗浄装置
EP1057546A1 (de) * 1999-06-01 2000-12-06 Applied Materials, Inc. Megaschallreinigungsvorrichtung
US6276370B1 (en) * 1999-06-30 2001-08-21 International Business Machines Corporation Sonic cleaning with an interference signal
US6468362B1 (en) * 1999-08-25 2002-10-22 Applied Materials, Inc. Method and apparatus for cleaning/drying hydrophobic wafers
US6748961B2 (en) 2001-03-30 2004-06-15 Lam Research Corporation Angular spin, rinse, and dry module and methods for making and implementing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6026832A (en) * 1997-05-26 2000-02-22 Sony Corporation Ultrasonic cleaning apparatus
US6085764A (en) * 1997-07-22 2000-07-11 Tdk Corporation Cleaning apparatus and method
US6188162B1 (en) * 1999-08-27 2001-02-13 Product Systems Incorporated High power megasonic transducer

Also Published As

Publication number Publication date
KR20050100405A (ko) 2005-10-18
WO2004074931A2 (en) 2004-09-02
WO2004074931A3 (en) 2005-01-27
TW200425231A (en) 2004-11-16
JP4733012B2 (ja) 2011-07-27
KR100952087B1 (ko) 2010-04-13
EP1599298A2 (de) 2005-11-30
JP2006518550A (ja) 2006-08-10
TWI290729B (en) 2007-12-01

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Legal Events

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DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20070402

RIC1 Information provided on ipc code assigned before grant

Ipc: B08B 3/12 20060101ALN20070327BHEP

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Effective date: 20100628

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