WO2004068155A1 - プローブ装置及びそれを用いたディスプレイ基板の試験装置 - Google Patents
プローブ装置及びそれを用いたディスプレイ基板の試験装置 Download PDFInfo
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- WO2004068155A1 WO2004068155A1 PCT/JP2004/000631 JP2004000631W WO2004068155A1 WO 2004068155 A1 WO2004068155 A1 WO 2004068155A1 JP 2004000631 W JP2004000631 W JP 2004000631W WO 2004068155 A1 WO2004068155 A1 WO 2004068155A1
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- drive circuit
- probe
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Definitions
- the present invention relates to an electrical characteristic test in a production stage of a liquid crystal display or an organic EL display panel, and in particular, a probe device suitable for an electrical test of a thin film transistor (hereinafter referred to as a TFT) array and a display substrate using the same.
- TFT thin film transistor
- liquid crystal displays In liquid crystal displays, the pursuit of higher pixel count and larger screens is being pursued, and in order to realize the high image quality required in recent years, the active matrix method using TFT (Thin Film Transistor) has become mainstream ing.
- TFT Thin Film Transistor
- self-luminous organic EL also referred to as OLED [Organic Light Emitting Diode]
- OLED Organic Light Emitting Diode
- the stage at which the TFT array is formed on a glass substrate that is, whether the completed TFT array operates electrically before the encapsulation of liquid crystals or the organic EL coating step. It is very important to electrically test the so-called TP array test to improve the yield of the final product in display production. If an electrical failure is found in the TFT circuit that drives a specific pixel at the TFT array test stage, the defect is corrected if the failure can be recovered based on the information on the TFT array test. Treatment will be applied. In addition, if there are many defective parts and it is judged that they are defective in shipping inspection after display assembly in advance, the subsequent processes can be stopped.
- the TFT array is formed on the glass substrate by the number according to the number of pixels of the display, and normally, a plurality of TFTs are used to form a drive circuit for one pixel.
- amorphous silicon or low temperature polysilicon for forming a TFT array.
- Figure 13 shows an example of a typical TFT drive circuit for one pixel in the mainstream liquid crystal display.
- 250 indicates a data line
- 25 1 indicates a gate line
- 25 2 indicates a common line
- 25 3 indicates a liquid crystal
- 25 4 indicates a transparent electrode using 1 0 (indium tin oxide).
- a drive circuit as shown in FIG. 13 formed in a two-dimensional manner on a glass substrate by the number of pixels is called a TFT array. Since the actual TFT array test for liquid crystal is generally performed before the liquid crystal 2 53 is sealed, in FIG. 13, the electrical test of the drive circuit is performed without the liquid crystal 2 5 3.
- the exposed ITO electrodes 24 are two-dimensionally arranged by the number of pixels.
- a test method of such a drive circuit it is common to electrically switch the TFT and measure and judge whether or not a normal potential is generated on the surface of the ITO electrode 24.
- the selected TFT Tr can be set to the on state. At this time, if the same voltage as the voltage applied to the data line is generated in the ITO electrode 24, it can be determined that the TFT Tr is normal.
- an electromagnetic wave source is disposed on the back of the inspection electrode so that an electromagnetic wave such as X-ray generated by the electromagnetic wave source is transmitted through the inspection electrode, and the electromagnetic wave is transmitted by the electromagnetic wave.
- an electromagnetic wave such as X-ray generated by the electromagnetic wave source is transmitted through the inspection electrode, and the electromagnetic wave is transmitted by the electromagnetic wave.
- an object of the present invention is to provide a test apparatus for testing the electrical characteristics of a light emitting diode array formed on a display substrate, in particular, the current driving capability of a current driven TFT array such as an organic EL. It is an object of the present invention to provide a probe means capable of performing measurement without physically contacting the ITO surface prior to the coating step. Another object of the present invention is to provide a test apparatus for a display substrate using such a probe means. Disclosure of the invention
- the probe apparatus comprises a glass display substrate on which a TFT array to be tested is formed, a current injection electrode for injecting a test signal into plasma installed away from the glass display substrate, and a test A plasma generation means for filling the space between the ITO electrode connected to the circuit and the current injection electrode with a plasma, a current injection electrode, and It consists of an array test power supply for applying a voltage between the TF array and a current in the plasma, and a TFT array controller for generating a signal for electrically turning on and off the TFT array sequentially. Be done.
- the plasma is in a state in which the substance is ionized into negative and positive ions by the energy supplied by high frequency or discharge. It is also electrically neutral and is conductive because it causes the movement of ions by the applied electric field. Therefore, it can be used as a conductive medium, and when an electric field is applied between the ITO filled with the plasma and the current injection electrode, a current can be caused to flow through the plasma by ion conduction.
- plasma By using plasma as a conductive medium in this way, it is possible to provide a means by which the current drive capability of the TFT array can be tested without physically contacting the ITO surface.
- the surface of the ITO electrode is exposed to the plasma, and at one end of the plasma, a current injection electrode for passing a test current into the plasma is similarly exposed to the plasma.
- the plasma generating means for generating the conductive medium and the plasma has a plasma density to obtain the conductivity necessary for the test.
- a current of about 1 ⁇ A to about 10 A, preferably about several ⁇ A to about 10 A is required.
- a plasma with high electron temperature is required.
- the data line and the gate line are controlled from the outside to the ITO electrode connected to the drain of the test target TFT using the TFT control device, and the TFT is set to the on state.
- a voltage is applied between the drive line commonly connected to the source of the TFT and the current injection electrode, a current Ip flows between the current injection electrode and the ITO electrode through the plasma.
- the driving circuit in contact with the plasma is sequentially turned on and the current flowing in the plasma is measured, all the electrical characteristics of the TFT array on the display can be tested.
- the current Ip flowing in the plasma current is set to the maximum drive current of the organic EL, the current drive capability of all the TFTs on the panel is tested in advance before actually applying the organic EL to the ITO electrode surface. it can. If the desired current does not flow in the TFT even if it is set to the maximum drive current possessed by the drive circuit, a defect in TF occurs, or if the current does not flow in the plasma despite setting the TFT to be tested on. There is a suspicion that there is a short circuit defect in the TFT under test or a break in the wiring. If the plasma current does not match the current flowing through the TFT, current leakage on the gate line side of the TFT is suspected.
- the probe apparatus of the present invention By using the probe apparatus of the present invention and the display substrate test apparatus using the same, it is possible to provide a test means which does not damage the surface of ⁇ as compared with a physical contact probe using a needle or the like. Furthermore, by simultaneously irradiating a plurality of TFT arrays with plasma simultaneously, it is possible to test at high speed only by electrical switching from outside of the TFT completed array by the TFT completed array control device. In addition, since mechanical alignment of the probe, which is essential when using a physical contact probe to the ITO electrode, is not necessary, it is possible to test all the TFT array in a short time. Today, high-density plasma generation methods are widely used for thin film formation, etching, etc. in silicon LSI processes, and do not react chemically with ITO electrodes by selecting the plasma generation conditions and gas types. It is possible to generate a plasma. In order to prevent damage to the ITO surface, it is preferable to use a glow discharge plasma.
- the present invention generates a plasma of relatively high density between an electrode or wiring connected to a circuit under test and a test electrode, and between the electrode or wiring and the test electrode via the plasma.
- the present invention provides a probe apparatus configured to transmit a test signal to be able to test the circuit under test without making contact with the electrode or wiring.
- the circuit under test is an electronic circuit including a plurality of thin film transistors formed on a substrate.
- the substrate is a display substrate
- the circuit under test and the electrode or wiring constitute a drive circuit for driving one pixel of the display
- the drive circuit is a two-dimensional array on the substrate.
- the plasma is generated so as to be continuous across multiple units of the drive circuit.
- the electrical characteristics of the predetermined drive circuit are tested by turning on only the predetermined drive circuit to be tested and testing and supplying the test signal to the predetermined drive circuit.
- a control electrode is provided between the test electrode and the electrode or wiring, and the passing level of the test signal transmitted through the plasma is controlled by controlling the potential applied to the control electrode. Control.
- the test electrode and two bias power supplies independently connected to each of the circuits under test are provided, and the electric field in the vicinity of the interface between the plasma and each of the test electrode and the electrode or wiring is selected. Configure to be controlled by one or both power supplies.
- the plasma is generated by being separated on the substrate corresponding to the position of each unit of the drive circuit, and the test electrode is provided at each separated position, and the drive circuit is provided at each position.
- the electrical characteristics of the drive circuit are tested by introducing the test signal.
- the plasma processing apparatus further includes: a plasma generation source generating the plasma; and a chamber structure configured to release at least the electrode or the wiring of the drive circuit while confining the plasma.
- the apparatus further comprises either means for evacuating the plasma or air curtain means at a position along the outer periphery of the chamber structure.
- the plasma has a plasma density capable of setting the current flowing through the circuit under test to approximately 1 A to 10 ⁇ A.
- the plasma is chemically inert to the electrode or wiring.
- the plasma contains at least a component ionizing oxygen.
- a probe apparatus as described above, a signal generation source for generating a test signal provided to the test electrode, the test signal, the plasma and the electrode or each of the drive circuits on the substrate. And a signal comparator for comparing the output signal output from the drive circuit when the test signal flows in through the wiring.
- the test apparatus for a display substrate is an electronic circuit to be tested on a probe apparatus
- a Y moving means is provided for moving in the horizontal two-dimensional direction along the display substrate surface.
- FIG. 1 is a schematic diagram for explaining a first embodiment of the present invention.
- FIG. 2 is a mounting diagram of a drive circuit using a TFT.
- FIG. 3 is a diagram for explaining an example in which the drive circuit for one pixel shown in FIG. 2 is tested using the probe apparatus shown in FIG.
- FIG. 4 is a diagram for explaining the plasma density, the electron temperature, the ITO surface area, and the current Ip flowing in the plasma.
- FIG. 5 is a diagram for explaining voltage-current characteristics of current flowing in plasma.
- FIG. 6 is a diagram for explaining the relationship between pressure and electron temperature in a typical glow discharge plasma.
- FIG. 7 is a schematic diagram for explaining a second embodiment of the present invention.
- FIG. 8 is a schematic diagram for explaining a third embodiment of the present invention.
- FIG. 9 is a view for explaining a structure for confining the plasma inside the probe head.
- FIG. 10 is a view for explaining a block diagram of a TFT array electrical characteristic test apparatus using the probe device of the present invention.
- FIG. 11 is a diagram for explaining the operation procedure of a TFT array electrical characteristics test device.
- FIG. 12 is a diagram for explaining the operation on the TFT array panel of the probe head.
- FIG. 13 is a diagram for explaining a TFT array for driving a liquid crystal and a test method thereof.
- FIG. 1 is a schematic diagram for explaining a first embodiment of the present invention, and shows the basic structure of a display substrate test apparatus 10 using a probe device 5 according to the present invention.
- 7 is a plasma
- 11 is a glass display substrate (hereinafter simply referred to as a display substrate)
- 12 is a TFT
- 13 is an ITO electrode
- 14 is a drive line
- 16 is a current injection electrode. It shows.
- a transparent ITO electrode (tin oxide) electrode 13 is formed on the surface of the display substrate 11.
- the display substrate 11 has a drive circuit corresponding to a pixel, and the above-mentioned ITO electrode 13 is provided corresponding to each drive circuit.
- drive circuits are two-dimensionally arranged on the display substrate 11 to form a pixel, and the above-mentioned ITO electrode 13 and the TFT 12 connected thereto are also two-dimensionally arranged.
- This is called a TFT array.
- FIG. 1 only a part of the TFT array is schematically shown. Further, although a drive circuit constituting one pixel usually includes two or more TFTs, FIG. 1 shows only the TFT 12 in the final stage for convenience.
- the display substrate device 10 is to test the operation of the TFTs of each drive circuit in the display substrate 11.
- the current does not contact the ITO electrodes 1'3 of the display substrate 11, and It provides a means of performing the injection.
- a conductive plasma 7 is formed between the current injection electrode 16 and the ITO electrode 13.
- the plasma generation means is not shown in FIG. 1, at least appropriate pressure reduction means, gas injection means and electrode means are disposed in the vicinity of the display substrate 1 1 for plasma generation.
- the plasma 7 is generated, the surface of the ITO electrode 13 on the display substrate 11 is substantially in contact with the plasma 7, and the current injection electrode 16 substantially contacts the plasma 7 at the position facing the display substrate 11. I am in touch.
- FIG. 2 is a schematic plan view showing a drive circuit equivalent to one pixel of a TFT array on a display substrate used particularly for an organic EL display.
- the circuits for one pixel shown are arrayed in a two-dimensional array on the surface of the display substrate 11 (see FIG. 1).
- reference numeral 12 denotes a TFT
- 13 denotes an ITO electrode
- 14 denotes a drive line
- 15 denotes a data line
- 17 denotes a gate line
- 18 denotes a TFT
- 19 denotes a capacitance Cs.
- the gate lines, drive lines, TFTs, etc. excluding the ITO electrode 13 are covered with an insulator film, even if exposed to the plasma during the test, they are electrically shorted to each other due to the conductivity of the plasma. Will not cause malfunction.
- FIG. 3 is an illustration of a test of the drive circuit for one pixel shown in FIG. 2 using the probe apparatus shown in FIG.
- a gate line drive circuit 21, a data line drive circuit 22 and a test power supply 23 are newly added.
- the gate line drive circuit 2 1, the data line drive circuit 2 2 and the test power supply 23 are provided in a test apparatus 10 using the probe device 5.
- voltage VI is applied from data line drive circuit 22 to data line 15
- the on-state is obtained by applying voltage V 2 from gate line drive circuit 31 to TFT transistor rl to be tested via gate line 17.
- the transistor Tr2 can be set to the on state.
- a voltage Vp is applied to the drive line 14 by the test power supply 23, a closed circuit is formed via the plasma 7, the ITO electrode 13, and the current injection electrode 16.
- the current Ip flowing through the plasma matches the current lb flowing to Tr2 via drive line 14. If Ip does not coincide with lb, there may be a defect such as a leak of the gate of r2, a leak of ITO and each control line. Be If Ip does not flow at all, a short circuit failure may occur.
- the drive current required to drive each organic EL is about several microamperes to about 10 microamperes, so the lb flowing through r2 has a corresponding current that is normal. You should check that it flows.
- the electrical characteristics of all the TFT arrays on the display panel can be tested by sequentially switching the data line 15 and the gate line 17 by measuring the same procedure as above.
- reference numeral 34 indicates a current injection electrode using a parallel plate.
- the surface area of the ITO electrode is S
- the density of plasma 7 is Ne
- the electron temperature in plasma 7 is Te.
- the surface area of the current injection electrode 34 is much larger than the surface area of each ITO electrode 13, and the current Ip flowing through the plasma is determined by the current flowing through the surface area S of one ITO electrode 13. I assume. Also, in order to simplify the calculation, here, it is assumed to be a completely ionized plasma in which all atoms in the plasma 7 are ionized into electrons and positive ions.
- Equation 2 the saturation current II indicating the intersection of the broken line is expressed by Equation 2.
- ECR plasma source using cyclotron resonance maximum Ne; 18 l / m 3 , maximum electron temperature; 15 eV
- ICP plasma using inductive coupling There are source sources (maximum Ne; 1 x lO pieces Zm 3 , maximum electron temperature: 1 O eV).
- s is proportional to Te 3/2.
- the relationship between the pressure and the electron temperature Te in a general glow discharge plasma shows the characteristics as shown in FIG. 6. Therefore, in order to obtain high conductivity, the pressure as low as the plasma can be generated (for example, 0.1. It is more desirable to generate at about Pa).
- Table 1 shows a comparison of plasma generating gases required to obtain good conductivity.
- a gas having a low ionization field in which atoms are easily ionized at low energy.
- alkali metals such as sodium, potassium and cesium with low ionization field may be mixed with such gas.
- elements with small mass are desirable in order to minimize damage in the case where accelerated positive ions collide with the electrode surface such as ITO.
- a gas in which cations do not chemically bond with the ITO surface As an example, for acids such as ITO, oxygen having a relatively small ionizing electric field and mass without chemical bonding is suitable.
- the present invention can provide means capable of realizing the characteristics of the drive circuit that requires current drive, such as organic EL, in particular, before the organic EL application process, it occurs due to a defect in the TFT array after display assembly. Product defects can be found in advance. In addition, it becomes possible to easily obtain the information necessary for repairing the defective portion, and the defect rate of the TFT array can be remarkably reduced.
- FIG. 7 is a schematic diagram for explaining a second embodiment of the present invention.
- reference numeral 55 is a current control electrode
- 56 is an anode
- 57 is a probe head
- 58 is a magnet
- 59 is a gas flow
- 51 is an anode bias
- 52 is a TFT.
- the power supply biases are shown respectively.
- the example of FIG. 7 shows an ECR plasma source using cyclotron resonance
- the magnet 58 is an electromagnet.
- a microwave source for plasma excitation is also required, but is omitted in Figure 7.
- the type of plasma source is not limited to the ECR plasma source as long as it satisfies the plasma density and the electron temperature shown in the first embodiment of the present invention.
- the plasma 7 generated by the plasma source is filled in the inside of the probe head 57 and is substantially in contact with the surface of the display substrate 11.
- the ITO surface is charged to a negative potential, and furthermore, the neutral state of the plasma near the ⁇ surface is broken and the cation is increased. become.
- the region where the neutral state of the plasma collapses is usually called the ion sheath (sheath) because the ions increase in this way.
- a positive electric field is generated inside the sheath with respect to the ITO surface charged to a negative potential. This electric field accelerates positive ions toward the ITO surface.
- a current corresponding to the number of accelerated cations flows into the on-state TFT 12 through the plasma 7.
- the acceleration field by the diode sheath is excessively large, it is possible that a current equal to or greater than the design allowable value may flow to the TFT 12 and the TFT 12 may be destroyed.
- An anode bias 51 is connected to one power S, and a TFT power supply bias 52 is connected to a power supply voltage of the TFT array 1 2. Both bias voltages are set to conditions that allow normal operation without destruction of the TFT by reducing excess current due to the case electric field.
- the current control electrode 55 controls the current required for the test.
- the shape of the current control electrode 55 for this purpose is preferably, for example, a net shape or a grid shape.
- the plasma density and the electron temperature required for the test of the TFT 12 are the same as the conditions shown in the first embodiment. Further, the test method of the TFT and the judgment standard of the non-defective product or the defect are also the same as in the first embodiment.
- the second embodiment of the present invention it is possible to avoid excessive current injection to the TFT by the ion sheath generated on the surface of the ITO electrode, and appropriate current without destroying the TFT from the excess current. It becomes possible to control to the value.
- FIG. 8 is a schematic view similar to FIG. 7 illustrating a third embodiment of the present invention.
- reference numeral 62 is a signal switch
- 63 is a plasma blowout hole
- 64 is a current injection electrode.
- the plasma source in FIG. 8 is equivalent to the second embodiment described in FIG.
- the bottom of the probe head 67 is provided with a plasma blowout hole 63 from which the plasma inside the probe head 6 blows out on the surface of the ITO electrode 13 by the pressure of the gas 59. .
- the center position of the plasma blowout hole 63 is aligned with the center position of each ITO electrode 13 and is arrayed in two dimensions in the same manner as the ITO electrode 13.
- the plasma can be concentrated and irradiated only in the vicinity of the surface of the ITO electrode 13.
- a current injection electrode 64 is disposed at the center of each plasma blowout hole 83, and a signal from the current injection electrode 64 is led to a signal switch 22.
- the current injection electrode 84 can be placed close to the ITO electrode 13 to reduce the conductive resistance of the air gap passing through the plasma.
- the density of the plasma blown out from the plasma blowout hole 63 is low at the outer periphery of the blowout hole, the conductive resistance between the current injection electrodes 84 can be increased.
- the probe head 67 is positioned so that all the current injection electrodes 64 correspond to the center position of the ITO electrode 13.
- the drive line 14 of the TFT in the on state is connected to the signal switch 62 via the power supply Vp, and selects the signal of the current injection electrode 64 in synchronization with this. Effects of anode bias 51, TFT power supply bias 52 and setting conditions The same applies to the second embodiment.
- the third embodiment of the present invention it becomes possible to selectively detect the signal from the ITO electrode 13 of interest, and noise such as leakage current of the adjacent TFT is tested through the plasma. It does not conduct to the target TFT. Therefore, it is possible to provide a test means with high detection accuracy.
- FIG. 9 is a schematic view showing a cross-sectional view of the periphery of the probe head 57.
- the reference numeral 75 indicates a TFT array area formed on the display substrate 11
- 7 6 indicates a circuit area
- 7 indicates a pad area.
- Reference numeral 78 is an exhaust flow path formed in the probe head 17
- reference numeral 79 is a nitrogen gas flow path.
- the exhaust channel 78 always exhausts the plasma 7 to the outside so that the plasma 7 does not leak from the gap with the display substrate 11.
- nitrogen gas is blown from the nitrogen gas flow path 79 onto the surface of the display substrate 11 to confine the plasma lamp 7 inside the probe head 57.
- the plasma 7 can be maintained at a high density only in the TFT array region 75, thereby providing a probe device which is not affected by the plasma in the pad region 77 and the circuit region 76.
- the structure of this probe head is applicable to both the first and second embodiments of the present invention.
- FIG. 10 shows a configuration diagram of a test apparatus of a TFT array using the probe device according to the first to third embodiments of the present invention described above.
- reference numeral 130 is a probe head
- 13 1 is a ⁇ , ⁇ stage
- 132 is a vacuum vessel
- 133 is a plasma monitor
- 134 is a vacuum gauge
- 135 is a 35
- Correction bias controller 1 3 6 is load lock / plasma controller
- 1 3 7 is stage / port position controller
- 1 3 8 is array test pattern generator
- 1 3 9 is array driver
- 14 1 is a D / A converter
- 14 2 is a voltage-to-current converter
- 14 3 and 14 are a single pass filter
- 14 4 and 14 are a matrix
- 1 4 7 is a current-to-voltage converter
- 14 8 is an A / D converter
- 1 4 9 is a digital comparator.
- Fig. 11 shows the operation procedure of the test device shown
- the display substrate 1 to be tested is mounted on the ⁇ , ⁇ stage 1 31 It can move in two dimensions in the Y direction.
- the plasma 7 generated from the probe head 130 can be moved to an arbitrary area.
- the movement of the eyelid and eyelid stage and the up and down control of the probe head 130 are performed by a stage / probe position controller 137.
- the outer periphery of the probe head 130 may be provided with an exhaust passage 78 and a nitrogen gas passage 79 for preventing the plasma described in FIG. 9 from leaking to the outside of the probe.
- the inside of the apparatus is housed inside a vacuum vessel 132, and the plasma monitor 133 monitors the density and electron temperature of the plasma generated from the plasma source.
- the vacuum gauge 134 monitors the degree of vacuum inside the vacuum vessel 132.
- another vacuum vessel is added so that the vacuum can be maintained at all times without the need to return the inside of the vacuum vessel 1 2 3 to the atmospheric pressure (Fig. 10).
- the load lock is provided between the vacuum vessels. After the substrate is introduced into the vacuum vessel 132, it is confirmed by the vacuum gauge 134 that the desired degree of vacuum has been reached, and then a gas is introduced into the probe head 130. Supply a high frequency to generate plasma.
- the load lock / plasma controller 136 provides a series of controls for this.
- the array test pattern generator 138 electrically selects the matrix sequentially via the data line and the gate line and sets it in the on state.
- the signal of the array test pattern generator is converted to the logic level of the external interface of the display substrate 11 to be tested by the array readout 1 3 9.
- the signals for array driver 1 3 9 are performed using physical contact to pad area 7 7 using, for example, a metal needle.
- the correction bias controller 135 has functions of an anode bias 51 and a TFT power supply bias 52 shown in FIG. 7 and FIG. 8 in order to correct an excessive potential difference due to the ion sheath generated in the plasma. .
- the plasma current controller 140 controls the test current injected into the plasma. From the plasma current controller 140, the digital control signal is converted to an analog voltage by the D / A converter 141, and then converted to current by the voltage-to-current converter 142 as required.
- the low-pass filter 143 has the purpose of removing the high frequency power supplied to the plasma source so that it does not generate noise in the test signal by mixing in the test device side.
- Matrix 14 4 selectively controls plasma current to any current injection electrode inside the probe head ⁇ 30 The purpose is to supply the test current generated from the unit 140 and has the function of the signal switch 62 in the second embodiment of the present invention.
- the current of the TFT set to the on state by the array test pattern generator 138 is led to the current-to-voltage converter 147 via the matrix 14 5 and the low pass filter 146.
- the purpose of the low pass filter 1 4 6 is similar to that of the low pass filter 1 4 3.
- the current converted into a voltage by the current-voltage converter 1 4 7 is converted into a digital signal by the A / D converter 1 4 8 and then compared with the plasma current 1 4 0 input in the digital comparator 1 4 9 Be done. If the input current and the current detected through the plasma and TFT are located, it is determined that the TFT under test is operating well. In the case of non-coincidence, it is determined to be defective. By performing this series of judgment operations automatically for all the TFT arrays, it is possible to test the electrical characteristics of the TFT array at high speed.
- FIG. 12 is a view of the glass display substrate 11 viewed from the top of the probe head 130 to explain the movement of the probe head 130 shown in FIG. If the display panel to be tested is large, as shown in Fig. 12, the test is performed by sequentially moving the position of the probe 130 relative to one another, and finally all the TFT arrays have been tested. Do.
- the shape of the probe head 130 for this purpose is not limited to the square illustrated in FIG. 12. For example, it has a rectangle covering the TFT array area in the vertical direction of the figure, and from the left side to the right side of the figure. Even with a configuration that covers all the TFT array with one movement toward the head, the object of the present invention can be sufficiently achieved.
- a plurality of probe heads 130 shown in FIG. 10 can be provided in order to support mass production testing of such a plurality of display panels. In this case, testing the displays in parallel can significantly reduce the test time.
- the probe apparatus using the three embodiments of the present invention and the display substrate testing apparatus using the same are suitable for testing the electrical characteristics of a TFT array on a glass substrate.
- the probe device using the present invention and the display substrate testing device using the same are not limited to the TFT array formed on the glass substrate, for example, resin It can also be applied to the testing of TFT arrays formed on a substrate or silicon substrate.
- the probe device of the present invention is not limited to display substrate test applications, and can be widely applied to the characteristic test of other electronic circuits.
- the source of the plasma is single but the source may be plural, and in particular, it may be possible to generate a predetermined number of plasmas corresponding to each drive circuit. it can. Again, the measurements for each drive circuit can be made independently.
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US10/540,646 US7151384B2 (en) | 2003-01-27 | 2004-01-23 | Probe device and display substrate testing apparatus using same |
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JP2003018042A JP2004264035A (ja) | 2003-01-27 | 2003-01-27 | プローブ装置及びそれを用いたディスプレイ基板の試験装置 |
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PCT/JP2004/000631 WO2004068155A1 (ja) | 2003-01-27 | 2004-01-23 | プローブ装置及びそれを用いたディスプレイ基板の試験装置 |
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Country | Link |
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US (1) | US7151384B2 (ja) |
JP (1) | JP2004264035A (ja) |
KR (1) | KR20050089095A (ja) |
CN (1) | CN1742210A (ja) |
TW (1) | TW200416637A (ja) |
WO (1) | WO2004068155A1 (ja) |
Families Citing this family (21)
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JP4791023B2 (ja) * | 2004-11-08 | 2011-10-12 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Tftの検査装置および検査方法 |
US20060139041A1 (en) * | 2004-12-23 | 2006-06-29 | Nystrom Michael J | System and method of testing and utilizing a fluid stream |
JP2006194699A (ja) * | 2005-01-12 | 2006-07-27 | Tokyo Cathode Laboratory Co Ltd | プロービング装置 |
JP2006194787A (ja) * | 2005-01-14 | 2006-07-27 | Oht Inc | センサ、検査装置および検査方法 |
DE102006054777B4 (de) * | 2006-11-17 | 2014-12-11 | Siemens Aktiengesellschaft | Verfahren zur Untersuchung der Funktion von in ein Substrat integrierten Bauelementen |
JP5327551B2 (ja) * | 2008-04-21 | 2013-10-30 | オー・エイチ・ティー株式会社 | 回路検査装置及びその回路検査方法 |
KR101002429B1 (ko) * | 2008-10-06 | 2010-12-21 | 주식회사 탑 엔지니어링 | 어레이 테스트 장치 |
CN101719352B (zh) * | 2008-10-09 | 2012-07-25 | 北京京东方光电科技有限公司 | 液晶盒成盒后检测装置和方法 |
JP2010147204A (ja) * | 2008-12-18 | 2010-07-01 | Oht Inc | プラズマを用いたスクリーニング装置及びそのスクリーニング方法 |
JP2010190603A (ja) * | 2009-02-16 | 2010-09-02 | Hioki Ee Corp | プローブ、プローブユニットおよび測定装置 |
KR101278349B1 (ko) * | 2009-11-12 | 2013-06-25 | 삼성전기주식회사 | 기판의 회로 검사장치 및 검사방법 |
CN102467863B (zh) * | 2010-11-17 | 2014-09-03 | 北京京东方光电科技有限公司 | Tft-lcd电学不良测试电路和测试方法 |
JP2014521932A (ja) | 2011-07-15 | 2014-08-28 | オーボテック リミテッド | 電子ビーム誘導プラズマプローブを用いた電子装置の電気検査 |
WO2013134422A1 (en) * | 2012-03-06 | 2013-09-12 | Northwestern University | Probe assembly and method for contactless electrical characterization of buried conducting layers |
US8761941B2 (en) | 2012-06-12 | 2014-06-24 | Roche Diagnostics Operations, Inc. | Method for displaying medical data by a medical device during display failure |
KR102011873B1 (ko) * | 2013-05-02 | 2019-10-22 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치의 제조 방법 |
US9063146B2 (en) | 2013-10-25 | 2015-06-23 | Roche Diagnostics Operations, Inc. | System and method for display type detection of a handheld medical device |
CN103730384A (zh) * | 2013-12-13 | 2014-04-16 | 深圳市华星光电技术有限公司 | 一种tft电性量测方法及装置 |
CN104317081A (zh) * | 2014-11-17 | 2015-01-28 | 合肥京东方光电科技有限公司 | 一种点灯设备 |
CN109243343B (zh) * | 2018-09-12 | 2024-04-05 | 江西兴泰科技股份有限公司 | 一种电子纸用tft玻璃基板检测方法及装置 |
CN112578307A (zh) * | 2019-09-29 | 2021-03-30 | 成都辰显光电有限公司 | 发光器件测试装置、系统及测试方法 |
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- 2003-01-27 JP JP2003018042A patent/JP2004264035A/ja active Pending
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2004
- 2004-01-19 TW TW093101395A patent/TW200416637A/zh unknown
- 2004-01-23 CN CNA2004800028514A patent/CN1742210A/zh active Pending
- 2004-01-23 US US10/540,646 patent/US7151384B2/en not_active Expired - Fee Related
- 2004-01-23 WO PCT/JP2004/000631 patent/WO2004068155A1/ja active Application Filing
- 2004-01-23 KR KR1020057013745A patent/KR20050089095A/ko not_active Application Discontinuation
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JPH022969A (ja) * | 1987-12-21 | 1990-01-08 | Siemens Ag | 配線板の電気的機能試験装置の制御装置 |
JPH11174106A (ja) * | 1997-12-12 | 1999-07-02 | Ishikawajima Harima Heavy Ind Co Ltd | 液晶駆動基板の検査装置及びその検査方法 |
WO2000024048A1 (en) * | 1998-10-19 | 2000-04-27 | Applied Materials, Inc. | Method of etching patterned layers useful as masking during subsequent etching or for damascene structures |
JP2001093871A (ja) * | 1999-09-24 | 2001-04-06 | Tadahiro Omi | プラズマ加工装置、製造工程およびそのデバイス |
JP2001272431A (ja) * | 2000-02-02 | 2001-10-05 | Delaware Capital Formation Inc | 間隔が密なテスト部位のための走査式試験機 |
Also Published As
Publication number | Publication date |
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JP2004264035A (ja) | 2004-09-24 |
US7151384B2 (en) | 2006-12-19 |
CN1742210A (zh) | 2006-03-01 |
US20060087327A1 (en) | 2006-04-27 |
KR20050089095A (ko) | 2005-09-07 |
TW200416637A (en) | 2004-09-01 |
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