WO2004066348A2 - Organisches elektronikbauteil und verfahren zur herstellung organischer elektronik - Google Patents
Organisches elektronikbauteil und verfahren zur herstellung organischer elektronik Download PDFInfo
- Publication number
- WO2004066348A2 WO2004066348A2 PCT/EP2004/000216 EP2004000216W WO2004066348A2 WO 2004066348 A2 WO2004066348 A2 WO 2004066348A2 EP 2004000216 W EP2004000216 W EP 2004000216W WO 2004066348 A2 WO2004066348 A2 WO 2004066348A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coating
- continuous
- organic
- electronic component
- roll
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 64
- 238000000576 coating method Methods 0.000 claims abstract description 47
- 239000011248 coating agent Substances 0.000 claims abstract description 33
- 238000007639 printing Methods 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010924 continuous production Methods 0.000 claims description 7
- 239000002346 layers by function Substances 0.000 claims description 6
- 239000011368 organic material Substances 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 239000002966 varnish Substances 0.000 claims description 5
- 238000003618 dip coating Methods 0.000 claims description 4
- 238000007756 gravure coating Methods 0.000 claims description 4
- 238000007754 air knife coating Methods 0.000 claims description 3
- 238000007766 curtain coating Methods 0.000 claims description 3
- 238000007765 extrusion coating Methods 0.000 claims description 3
- 238000007767 slide coating Methods 0.000 claims description 3
- 238000010345 tape casting Methods 0.000 claims description 2
- 230000001427 coherent effect Effects 0.000 claims 2
- 238000007646 gravure printing Methods 0.000 claims 1
- 238000007648 laser printing Methods 0.000 claims 1
- 238000007644 letterpress printing Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 10
- 239000012212 insulator Substances 0.000 description 4
- 230000005669 field effect Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000013086 organic photovoltaic Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000007763 reverse roll coating Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/82—Electrodes
- H10K10/84—Ohmic electrodes, e.g. source or drain electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention relates to an organic electronic component and a method for the cost-effective and mass production of organic electronics.
- the non-structured layers are produced by discontinuous coating processes such as spin coating (whereby individual disks are coated) and structured layers by printing or the like in a continuous roll-to-roll process (e.g. DE 10033112.2).
- discontinuous coating processes such as spin coating (whereby individual disks are coated) and structured layers by printing or the like in a continuous roll-to-roll process (e.g. DE 10033112.2).
- Process can be produced because the usual coating techniques, especially spin coating, are not compatible with the rollers.
- the object of the present invention is to provide a method with which the structure of an organic electronic component can be produced in a roll-to-roll process. It is also an object of the present invention to provide an organic electronic component that can be mass-produced continuously.
- the invention therefore relates to a method for producing an organic electronic component which is carried out continuously or at least quasi-continuously.
- the invention relates to a method for producing an organic electronic component, which is carried out completely in a roll-to-roll process. Except- This is the subject of the invention an organic electronic component that can be manufactured in a continuous or at least quasi-continuous mass production process.
- the invention relates to a method for the continuous or at least quasi-continuous production of the organic component, comprising the following production steps:
- a functional organic material conductive, semiconducting or insulating is applied to a substrate that forms a continuous tape, continuous (web feed) or lined up single sheets (sheet feed), using a continuous coating method,
- An organic electronic component is an organic field-effect transistor (OFET), an organic photovoltaic element, an organic diode, in particular an organic light-emitting diode (OLED), or another electronic component that has at least one organic functional layer like the semiconducting one Layer or the conductive layer comprises.
- OFET organic field-effect transistor
- OLED organic light-emitting diode
- a substrate that is a continuous band which can be, for example, a continuous band (web feed) or lined up individual sheets (sheet feed), a functional organic material (conductive) is applied via a continuous coating method, - a structured varnish is printed on this functional layer,
- the conductive layer is structured by this lacquer
- a semiconducting layer is applied to the conductor tracks or electrodes formed in this way using a continuous coating method
- An insulator layer is also applied to the semiconducting layer using a continuous coating method and - An upper electrode is printed on the insulator layer.
- the porous roll coating has a counterpart in screen printing, only that a porous cylinder is used instead of a screen roll.
- the coating liquid either penetrates another role from the inside of the cylinder through the pores and from there onto the tape to be coated or directly onto the tape.
- the advantage over screen printing is that the pores can be made much finer than the openings in the screen, which means that much less viscous (thinner) liquids can be used.
- Porous roll coating is one of the few processes (also only gravure coating) that also allows a structured application (direct structuring) by closing the pores locally, ie it is suitable for both coating and printing.
- Dip coating whereby a continuous strip is drawn through at least one liquid, rod coating, in which a strip is tangentially drawn past a roller or roller that is still wetted with a liquid, blade coating, in which a strip lies against a roller, which leads past a container filled with liquid, the container being closed on two sides, delimited on a third side by the roller and on a fourth side by a doctor blade which lies at a distance above the belt, so that the liquid in the distance is retained in the container and does not adhere to the belt in which the squeegee is located above the belt.
- roller-compatible coating or coating method is air knife coating, which is the same as dip coating except for a blower, through which the liquid on the belt drawn through the liquid is dried at one point and / or blown away.
- air knife coating which is the same as dip coating except for a blower, through which the liquid on the belt drawn through the liquid is dried at one point and / or blown away.
- These four coating processes are already known for producing other polymer layers and are described in the text cited at the beginning and explained by drawings.
- Other roller-compatible coating processes are gravure coating, in which two rollers (or rollers) that are not the same size are operated in the same direction and adjoin one another, the larger one
- roller is passed through a liquid and the tape abuts the smaller roller, the thickness of the wetting, with which the larger roller connects to the smaller one, limited by a squeegee attached to the larger one, another method is reverse roll coating, in which two rollers moving in opposite directions are pressed against one another, one roller with liquid is wetted and the continuous belt is guided along the other roller.
- reverse roll coating in which two rollers moving in opposite directions are pressed against one another, one roller with liquid is wetted and the continuous belt is guided along the other roller.
- coating techniques in general for organic electronics is that thin, homogeneous layers (thickness approximately 0.02 to 2 ⁇ m) can be produced continuously. Since the coating techniques themselves are not structuring, they can only be used in combination with structuring processes, such as printing techniques. By combining roll-compatible coating techniques with roll-to-roll printing processes, you can make all production steps of an organic electronic component roll-compatible.
- a roll-to-roll process is a process that is continuous, that is to say that it can be produced as tape goods in the above-mentioned sense, that is to say both web feed and sheet feed, and that essentially involves rolling for coating and printing and / or used for other processing steps.
- the basic elements of an organic electronic component are referred to as the structure of an organic electronic component, substrate as tape goods in the sense mentioned above, that is to say both web feed and sheet feed, which form the carrier.
- a lower electrode a semiconducting, photovoltaically active and / or emitting layer, insulating layer (s) and upper electrode.
- Mass production is understood to mean a production that allows and / or allows the production of low-cost products such as disposable chips through simple production steps with a high throughput rate, i.e. high number of pieces per unit of time and optimal utilization of the machines, avoiding dwell times in machines etc. only made possible.
- a “continuous * process” means a production that does not process "piece by piece *, but” by the meter * like production on a continuous belt. In the discontinuous process, ie the production “piece by piece *, too much time is spent for low cost production by loading and unloading the piece just produced into and out of the machine.
- the advantages of the assembly line are those that are meant by the term “continuous process *” here.
- a quasi-continuous process can include smaller stops in the production chain, but has at least two contiguous, continuously running production steps.
- the organic electronic component is a field-effect transistor, comprising at least one substrate, a lower electrode comprising source and drain, a semiconducting layer, an insulating layer and an upper electrode.
- Indirect structuring refers to the type of structuring in which a layer (lacquer layer, etc.) that has been applied specifically for structuring a lower layer is first structured.
- a "direct structuring” is accordingly an immediate structuring of a layer.
- pretreatment processes take place before the respective coating and printing processes, for example for cleaning and / or pretreating the surface, for example corona, flame, UV, plasma treatment and / or other processes.
- At least one drying or hardening process takes place after the respective coating and / or printing method, e.g. with heat, UV light, infrared light and / or other processes.
- the figure shows the process steps for the production of the lower electrode (s) 2, the semiconducting layer 7, the insulator layer 8 and the upper electrode 9 on a substrate 1: the band 1 which forms the substrate can be seen, over which it is applied a continuous coating method applied a functional organic material, in particular a conductive polymer, 2.
- the organic functional material can be in one or more organic or inorganic
- Solvents can be dissolved or dispersed, present as a pure material, as a mixture and / or provided with additives.
- the continuous coating method comprises a doctor blade 6 which is integrated in a machine 3.
- a coating 5 is applied in a structured manner to the coating 2 via a roller 4, with the aid of which the lower electrode (s) 2 is structured.
- a semiconducting layer 7 is again applied to the structured lower electrode (s) 2 using a machine 3 equipped with a doctor blade 6.
- An insulator layer 8 is placed on this layer again using a coating technique, which is finally structured top electrode 9 is applied (direct structuring).
- the machine 3 is preferably combined with a roller for dip coating, rod coating, knife coating, blade coating, air knife coating, gravure coating, forward and reverse roll coating, slot and extrusion coating, slide coating, curtain coating and / or spray coating , as already mentioned in the literature cited above and in the description.
- a planar layer is used.
- the method according to the invention shows for the first time a possibility with which a continuous roll-to-roll coating can be carried out for the cost-effective mass production of organic electronic components.
- organic electronic components can be manufactured in a continuous mass production process. These include e.g. organic transistors and circuits thereof, organic diodes, organically based capacitors, organic photovoltaic cells, organic sensors and actuators, and combinations thereof.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Thin Film Transistor (AREA)
- Photovoltaic Devices (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE502004003677T DE502004003677D1 (de) | 2003-01-21 | 2004-01-14 | Organisches elektronikbauteil und verfahren zur herstellung organischer elektronik |
EP04701943A EP1586127B1 (de) | 2003-01-21 | 2004-01-14 | Organisches elektronikbauteil und verfahren zur herstellung organischer elektronik |
US10/542,678 US20060160266A1 (en) | 2003-01-21 | 2004-01-14 | Organic electronic component and method for producing organic electronic devices |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10302146.9 | 2003-01-21 | ||
DE10302146 | 2003-01-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004066348A2 true WO2004066348A2 (de) | 2004-08-05 |
WO2004066348A3 WO2004066348A3 (de) | 2005-01-20 |
Family
ID=32747467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/000216 WO2004066348A2 (de) | 2003-01-21 | 2004-01-14 | Organisches elektronikbauteil und verfahren zur herstellung organischer elektronik |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060160266A1 (de) |
EP (1) | EP1586127B1 (de) |
DE (1) | DE502004003677D1 (de) |
WO (1) | WO2004066348A2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007129001A1 (en) * | 2006-04-11 | 2007-11-15 | Nicholas Stone | Conductive polymer electrodes |
WO2007128998A2 (en) * | 2006-04-11 | 2007-11-15 | Nicholas Stone | A method of making an electrical device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10160732A1 (de) * | 2001-12-11 | 2003-06-26 | Siemens Ag | Organischer Feld-Effekt-Transistor mit verschobener Schwellwertspannung und Verwendung dazu |
GB201011280D0 (en) * | 2010-07-05 | 2010-08-18 | Cambridge Entpr Ltd | Patterning |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002005361A1 (en) * | 2000-07-12 | 2002-01-17 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
WO2002005360A1 (de) * | 2000-07-07 | 2002-01-17 | Siemens Aktiengesellschaft | Verfahren zur herstellung und strukturierung organischer-feldeffekt-transistoren (ofet) |
WO2002099908A1 (de) * | 2001-06-01 | 2002-12-12 | Siemens Aktiengesellschaft | Verfahren zur erzeugung von leitfähigen strukturen mittels drucktechnik sowie daraus hergestellte aktive bauelemente für integrierte schaltungen |
Family Cites Families (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3512052A (en) * | 1968-01-11 | 1970-05-12 | Gen Motors Corp | Metal-insulator-semiconductor voltage variable capacitor with controlled resistivity dielectric |
US3769096A (en) * | 1971-03-12 | 1973-10-30 | Bell Telephone Labor Inc | Pyroelectric devices |
JPS543594B2 (de) * | 1973-10-12 | 1979-02-24 | ||
JPS54101176A (en) * | 1978-01-26 | 1979-08-09 | Shinetsu Polymer Co | Contact member for push switch |
US4442019A (en) * | 1978-05-26 | 1984-04-10 | Marks Alvin M | Electroordered dipole suspension |
EP0239808B1 (de) * | 1986-03-03 | 1991-02-27 | Kabushiki Kaisha Toshiba | Strahlungsdetektor |
GB2215307B (en) * | 1988-03-04 | 1991-10-09 | Unisys Corp | Electronic component transportation container |
US5892244A (en) * | 1989-01-10 | 1999-04-06 | Mitsubishi Denki Kabushiki Kaisha | Field effect transistor including πconjugate polymer and liquid crystal display including the field effect transistor |
US6331356B1 (en) * | 1989-05-26 | 2001-12-18 | International Business Machines Corporation | Patterns of electrically conducting polymers and their application as electrodes or electrical contacts |
US5206525A (en) * | 1989-12-27 | 1993-04-27 | Nippon Petrochemicals Co., Ltd. | Electric element capable of controlling the electric conductivity of π-conjugated macromolecular materials |
FR2664430B1 (fr) * | 1990-07-04 | 1992-09-18 | Centre Nat Rech Scient | Transistor a effet de champ en couche mince de structure mis, dont l'isolant et le semiconducteur sont realises en materiaux organiques. |
FR2673041A1 (fr) * | 1991-02-19 | 1992-08-21 | Gemplus Card Int | Procede de fabrication de micromodules de circuit integre et micromodule correspondant. |
US5408109A (en) * | 1991-02-27 | 1995-04-18 | The Regents Of The University Of California | Visible light emitting diodes fabricated from soluble semiconducting polymers |
JPH0580530A (ja) * | 1991-09-24 | 1993-04-02 | Hitachi Ltd | 薄膜パターン製造方法 |
US5173835A (en) * | 1991-10-15 | 1992-12-22 | Motorola, Inc. | Voltage variable capacitor |
US5486851A (en) * | 1991-10-30 | 1996-01-23 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Illumination device using a pulsed laser source a Schlieren optical system and a matrix addressable surface light modulator for producing images with undifracted light |
JP2709223B2 (ja) * | 1992-01-30 | 1998-02-04 | 三菱電機株式会社 | 非接触形携帯記憶装置 |
JP3457348B2 (ja) * | 1993-01-15 | 2003-10-14 | 株式会社東芝 | 半導体装置の製造方法 |
FR2701117B1 (fr) * | 1993-02-04 | 1995-03-10 | Asulab Sa | Système de mesures électrochimiques à capteur multizones, et son application au dosage du glucose. |
US5567550A (en) * | 1993-03-25 | 1996-10-22 | Texas Instruments Incorporated | Method of making a mask for making integrated circuits |
EP0722563A4 (de) * | 1993-08-24 | 1998-03-04 | Metrika Lab Inc | Neues elektronisches einweg-assaygerät |
JP3460863B2 (ja) * | 1993-09-17 | 2003-10-27 | 三菱電機株式会社 | 半導体装置の製造方法 |
FR2710413B1 (fr) * | 1993-09-21 | 1995-11-03 | Asulab Sa | Dispositif de mesure pour capteurs amovibles. |
US5556706A (en) * | 1993-10-06 | 1996-09-17 | Matsushita Electric Industrial Co., Ltd. | Conductive layered product and method of manufacturing the same |
KR100350817B1 (ko) * | 1994-05-16 | 2003-01-24 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 유기반도체물질로형성된반도체장치 |
JP3246189B2 (ja) * | 1994-06-28 | 2002-01-15 | 株式会社日立製作所 | 半導体表示装置 |
US5574291A (en) * | 1994-12-09 | 1996-11-12 | Lucent Technologies Inc. | Article comprising a thin film transistor with low conductivity organic layer |
US5630986A (en) * | 1995-01-13 | 1997-05-20 | Bayer Corporation | Dispensing instrument for fluid monitoring sensors |
JP3068430B2 (ja) * | 1995-04-25 | 2000-07-24 | 富山日本電気株式会社 | 固体電解コンデンサ及びその製造方法 |
US5652645A (en) * | 1995-07-24 | 1997-07-29 | Anvik Corporation | High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates |
GB2310493B (en) * | 1996-02-26 | 2000-08-02 | Unilever Plc | Determination of the characteristics of fluid |
DE19629656A1 (de) * | 1996-07-23 | 1998-01-29 | Boehringer Mannheim Gmbh | Diagnostischer Testträger mit mehrschichtigem Testfeld und Verfahren zur Bestimmung von Analyt mit dessen Hilfe |
US6344662B1 (en) * | 1997-03-25 | 2002-02-05 | International Business Machines Corporation | Thin-film field-effect transistor with organic-inorganic hybrid semiconductor requiring low operating voltages |
US5946551A (en) * | 1997-03-25 | 1999-08-31 | Dimitrakopoulos; Christos Dimitrios | Fabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectric |
KR100248392B1 (ko) * | 1997-05-15 | 2000-09-01 | 정선종 | 유기물전계효과트랜지스터와결합된유기물능동구동전기발광소자및그소자의제작방법 |
JP4509228B2 (ja) * | 1997-08-22 | 2010-07-21 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 有機材料から成る電界効果トランジスタ及びその製造方法 |
WO1999013441A2 (en) * | 1997-09-11 | 1999-03-18 | Precision Dynamics Corporation | Radio frequency identification tag on flexible substrate |
US6251513B1 (en) * | 1997-11-08 | 2001-06-26 | Littlefuse, Inc. | Polymer composites for overvoltage protection |
US5997817A (en) * | 1997-12-05 | 1999-12-07 | Roche Diagnostics Corporation | Electrochemical biosensor test strip |
EP0958663A1 (de) * | 1997-12-05 | 1999-11-24 | Koninklijke Philips Electronics N.V. | Zwischenverstärker zur identifikation |
US6083104A (en) * | 1998-01-16 | 2000-07-04 | Silverlit Toys (U.S.A.), Inc. | Programmable toy with an independent game cartridge |
CA2319428C (en) * | 1998-01-28 | 2004-10-12 | Thin Film Electronics Asa | A method for generation of electrical conducting or semiconducting structures in three dimensions and methods for erasure of the same structures |
US6087196A (en) * | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
US6045977A (en) * | 1998-02-19 | 2000-04-04 | Lucent Technologies Inc. | Process for patterning conductive polyaniline films |
US6033202A (en) * | 1998-03-27 | 2000-03-07 | Lucent Technologies Inc. | Mold for non - photolithographic fabrication of microstructures |
US5967048A (en) * | 1998-06-12 | 1999-10-19 | Howard A. Fromson | Method and apparatus for the multiple imaging of a continuous web |
US6215130B1 (en) * | 1998-08-20 | 2001-04-10 | Lucent Technologies Inc. | Thin film transistors |
US6506438B2 (en) * | 1998-12-15 | 2003-01-14 | E Ink Corporation | Method for printing of transistor arrays on plastic substrates |
US6321571B1 (en) * | 1998-12-21 | 2001-11-27 | Corning Incorporated | Method of making glass structures for flat panel displays |
CN1098936C (zh) * | 1999-02-22 | 2003-01-15 | 新日本制铁株式会社 | 镀层附着性能及压力成形性能优异的高强度镀锌钢板、高强度合金化镀锌钢板及其制造工艺 |
AU5646800A (en) * | 1999-03-02 | 2000-09-21 | Helix Biopharma Corporation | Card-based biosensor device |
US6207472B1 (en) * | 1999-03-09 | 2001-03-27 | International Business Machines Corporation | Low temperature thin film transistor fabrication |
US6383664B2 (en) * | 1999-05-11 | 2002-05-07 | The Dow Chemical Company | Electroluminescent or photocell device having protective packaging |
US6517995B1 (en) * | 1999-09-14 | 2003-02-11 | Massachusetts Institute Of Technology | Fabrication of finely featured devices by liquid embossing |
US6340822B1 (en) * | 1999-10-05 | 2002-01-22 | Agere Systems Guardian Corp. | Article comprising vertically nano-interconnected circuit devices and method for making the same |
US6335539B1 (en) * | 1999-11-05 | 2002-01-01 | International Business Machines Corporation | Method for improving performance of organic semiconductors in bottom electrode structure |
US6284562B1 (en) * | 1999-11-17 | 2001-09-04 | Agere Systems Guardian Corp. | Thin film transistors |
CN100375310C (zh) * | 1999-12-21 | 2008-03-12 | 造型逻辑有限公司 | 喷墨制作的集成电路 |
US6706159B2 (en) * | 2000-03-02 | 2004-03-16 | Diabetes Diagnostics | Combined lancet and electrochemical analyte-testing apparatus |
WO2002009478A1 (fr) * | 2000-07-24 | 2002-01-31 | Tdk Corporation | Dispositif luminescent |
EP1309994A2 (de) * | 2000-08-18 | 2003-05-14 | Siemens Aktiengesellschaft | Verkapseltes organisch-elektronisches bauteil, verfahren zu seiner herstellung und seine verwendung |
DE10045192A1 (de) * | 2000-09-13 | 2002-04-04 | Siemens Ag | Organischer Datenspeicher, RFID-Tag mit organischem Datenspeicher, Verwendung eines organischen Datenspeichers |
KR20020036916A (ko) * | 2000-11-11 | 2002-05-17 | 주승기 | 실리콘 박막의 결정화 방법 및 이에 의해 제조된 반도체소자 |
KR100390522B1 (ko) * | 2000-12-01 | 2003-07-07 | 피티플러스(주) | 결정질 실리콘 활성층을 포함하는 박막트랜지스터 제조 방법 |
US20020170897A1 (en) * | 2001-05-21 | 2002-11-21 | Hall Frank L. | Methods for preparing ball grid array substrates via use of a laser |
US6870180B2 (en) * | 2001-06-08 | 2005-03-22 | Lucent Technologies Inc. | Organic polarizable gate transistor apparatus and method |
JP2003089259A (ja) * | 2001-09-18 | 2003-03-25 | Hitachi Ltd | パターン形成方法およびパターン形成装置 |
US7351660B2 (en) * | 2001-09-28 | 2008-04-01 | Hrl Laboratories, Llc | Process for producing high performance interconnects |
US6812509B2 (en) * | 2002-06-28 | 2004-11-02 | Palo Alto Research Center Inc. | Organic ferroelectric memory cells |
US6870183B2 (en) * | 2002-11-04 | 2005-03-22 | Advanced Micro Devices, Inc. | Stacked organic memory devices and methods of operating and fabricating |
US7011983B2 (en) * | 2002-12-20 | 2006-03-14 | General Electric Company | Large organic devices and methods of fabricating large organic devices |
-
2004
- 2004-01-14 DE DE502004003677T patent/DE502004003677D1/de not_active Expired - Lifetime
- 2004-01-14 EP EP04701943A patent/EP1586127B1/de not_active Expired - Fee Related
- 2004-01-14 WO PCT/EP2004/000216 patent/WO2004066348A2/de active IP Right Grant
- 2004-01-14 US US10/542,678 patent/US20060160266A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002005360A1 (de) * | 2000-07-07 | 2002-01-17 | Siemens Aktiengesellschaft | Verfahren zur herstellung und strukturierung organischer-feldeffekt-transistoren (ofet) |
WO2002005361A1 (en) * | 2000-07-12 | 2002-01-17 | 3M Innovative Properties Company | Encapsulated organic electronic devices and method for making same |
WO2002099908A1 (de) * | 2001-06-01 | 2002-12-12 | Siemens Aktiengesellschaft | Verfahren zur erzeugung von leitfähigen strukturen mittels drucktechnik sowie daraus hergestellte aktive bauelemente für integrierte schaltungen |
Non-Patent Citations (1)
Title |
---|
ROGERS J A ET AL: "PRINTING PROCESS SUITABLE FOR REEL-TO-REEL PRODUCTION OF HIGH-PERFORMANCE ORGANIC TRANSISTORS AND CIRCUITS" ADVANCED MATERIALS, VCH VERLAGSGESELLSCHAFT, WEINHEIM, DE, Bd. 11, Nr. 9, 5. Juli 1999 (1999-07-05), Seiten 741-745, XP000851834 ISSN: 0935-9648 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007129001A1 (en) * | 2006-04-11 | 2007-11-15 | Nicholas Stone | Conductive polymer electrodes |
WO2007128998A2 (en) * | 2006-04-11 | 2007-11-15 | Nicholas Stone | A method of making an electrical device |
WO2007128998A3 (en) * | 2006-04-11 | 2008-03-20 | Nicholas Stone | A method of making an electrical device |
US8673681B2 (en) | 2006-04-11 | 2014-03-18 | Novalia Ltd. | Electrical device fabrication |
US8685260B2 (en) | 2006-04-11 | 2014-04-01 | Novalia Ltd. | Conductive polymer electrodes |
Also Published As
Publication number | Publication date |
---|---|
EP1586127B1 (de) | 2007-05-02 |
WO2004066348A3 (de) | 2005-01-20 |
US20060160266A1 (en) | 2006-07-20 |
EP1586127A2 (de) | 2005-10-19 |
DE502004003677D1 (de) | 2007-06-14 |
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