WO2004013695A1 - フォトマスク - Google Patents
フォトマスク Download PDFInfo
- Publication number
- WO2004013695A1 WO2004013695A1 PCT/JP2003/001772 JP0301772W WO2004013695A1 WO 2004013695 A1 WO2004013695 A1 WO 2004013695A1 JP 0301772 W JP0301772 W JP 0301772W WO 2004013695 A1 WO2004013695 A1 WO 2004013695A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pattern
- sub
- patterns
- photomask
- virtual
- Prior art date
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70941—Stray fields and charges, e.g. stray light, scattered light, flare, transmission loss
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
Definitions
- the present invention relates to a photomask used for photolithography performed when manufacturing a semiconductor device or the like, a method for designing the same, and a method for manufacturing a semiconductor device using the same.
- various patterns formed on a photomask are transferred to a photosensitive resist formed on a substrate by photolithography. After this transfer, the photosensitive resist is developed, and the wiring layer and the like are processed using the pattern of the photosensitive resist as a mask.
- a projection exposure apparatus using a refractive optical system or a catadioptric optical system is used.
- flare has been reduced by applying a method of coating the lens surface or improving the flatness of the lens surface.
- the present invention has been made in view of such a problem, and a photomask capable of suppressing a difference in a variation amount of a line width due to local flare, a method of designing the same, and a method of manufacturing a semiconductor device using the same
- the aim is to provide a method.
- the first photomask according to the present invention is intended for a photomask used to manufacture a semiconductor device, in which a main pattern to be transferred to a photoconductor is formed.
- a photomask a plurality of sub-patterns are arbitrarily determined as to whether or not transfer to the photoconductor is possible, and at least an irradiation region to be exposed to exposure light is converted into a plurality of virtual regions having a certain shape.
- the aperture ratio is substantially constant among the plurality of virtual regions.
- the second photomask according to the present invention is such that, as compared to the first photomask, a virtual area having a lower total aperture ratio by all the patterns except for the sub-pattern among the plurality of virtual areas,
- the characteristic feature is that the amount of decrease in the aperture ratio due to the formation of is low.
- the first method of designing a photomask according to the present invention includes the steps of: forming a main pattern to be transferred to a photoreceptor; and designing a photomask used for manufacturing a semiconductor device. Intended for how to do.
- a main pattern is determined based on the circuit configuration of the semiconductor device.
- at least the irradiation area to be irradiated with the exposure light is divided into a plurality of virtual areas of an arbitrary constant shape, and a total aperture ratio based on a pattern determined at that time is obtained for each virtual area.
- the transfer to the photoreceptor determines an arbitrary plurality of sub-patterns.
- an aperture ratio is substantially constant between the plurality of virtual regions.
- the method for designing a second photomask according to the present invention is the same as the method for designing a first photomask, wherein in the step of determining the plurality of sub-patterns, The reduction rate of the aperture ratio due to the formation of the sub-pattern is reduced.
- the influence of local flare is substantially uniform over the entire photomask
- the fluctuation of the line width and the like in the transferred pattern formed on the photoconductor is also uniform.
- Such a uniform variation in size can be easily corrected, for example, by adjusting the output energy of an exposure machine, so that a desired pattern can be easily transferred to the photoconductor.
- FIG. 1 is a schematic diagram showing a positional relationship between regions # to C on a photomask.
- 2A to 2C are schematic diagrams showing a method for quantifying local flare.
- FIG. 3 is a graph obtained by the method shown in FIGS. 2A to 2C.
- FIG. 4 is a schematic diagram showing the basic principle of the present invention.
- 5A to 5D are schematic views showing a photomask according to the first embodiment of the present invention.
- 6A to 6D are schematic diagrams showing a photomask according to the second embodiment of the present invention.
- FIGS. 7A to 7D are schematic diagrams showing a photomask according to the third embodiment of the present invention.
- FIGS. 8A to 8D are schematic views showing a photomask according to a fourth embodiment of the present invention. It is.
- FIGS. 9A to 9D are schematic diagrams showing a photomask obtained by inverting the positive type and the negative type from the first embodiment.
- FIG. 1 is a schematic diagram showing a positional relationship between regions A to C on a photomask.
- FIG. 1 it is assumed that an arbitrary region A is separated from arbitrary regions B and C within a range of about 20 ⁇ m.
- a flare that generates light that passes through the areas B and C is transferred to the pattern formed in the area A and transferred to a photosensitive body such as a photosensitive resist. Affects the pattern formed on the material.
- the line width varies.
- FIGS. 2A to 2C are schematic diagrams showing a method for quantifying local flare
- FIG. 3 is a graph obtained by the method shown in FIGS. 2A to 2C.
- the filled area indicates a light-shielded area
- the other area indicates a transmissive area. The same applies to the figures showing other mask patterns.
- a transmission line pattern having a width of 0.12 ⁇ m as shown in FIG. 2A was used as a reference, and the line width of the pattern formed on the photoreceptor by transferring this reference was measured.
- FIG. 2B exposure was performed using a mask provided with an annular transmission pattern around the reference, and the line width of the line pattern formed on the photoconductor was measured.
- the inner diameter of the circle at this time is 4.14 ⁇ m, and the width of the circle is 2.76 m.
- the inner diameter of the annular transmission pattern is varied while keeping the width of the circle constant, and the line width is measured in the same manner. Specified.
- the aperture ratio substantially increases between these virtual areas. Is constant.
- the aperture ratio is substantially constant means that the aperture ratio is preferably completely constant. However, due to the limitations of the photomask design, the aperture ratio is completely maintained even when the sub-pattern is provided.
- the total aperture ratio of all the patterns except for the ⁇ pattern is low, and the reduction amount of the aperture ratio due to the formation of the sub-pattern is smaller in the virtual region, so that the sub-pattern is added to the main pattern.
- the pattern may be formed on a photomask.
- the irradiation area 1 of the photomask is partitioned into a square virtual area having a side length of 2 m, the virtual area 2 and the virtual area 3 in FIG. If the total aperture ratio of all the patterns except the sub-pattern 2 is lower than that of the virtual region 3, the decrease in the aperture ratio due to the formation of the sub-pattern in the virtual region 2 is This is higher than the decrease in the aperture ratio due to the formation of the middle sub-pattern.
- the aperture ratio due to the formation of the sub-pattern in the virtual region 2 is lower than that of the virtual region 2, the aperture ratio due to the formation of the sub-pattern in the virtual region 2 Sub-pattern in virtual area 3 It is lower than the amount of decrease in the aperture ratio due to the formation.
- the amount of decrease in the aperture ratio due to the formation of the sub-pattern is set for all other virtual regions in the irradiation region 1 as described above. .
- the aperture ratio of all virtual regions in the irradiation region 1 is constant.
- the “amount of decrease in the aperture ratio” is not an absolute value, and a negative value is employed when the aperture ratio is increased due to the formation of the sub-pattern. Then, the magnitude of the decrease is compared using the negative value as it is.
- FIG. 5A to 5D are schematic views showing a photomask according to the first embodiment of the present invention.
- FIG. 5A shows the main pattern of virtual area 2 in FIG. 4, and
- FIG. 5B shows the main pattern of virtual area 3 in FIG.
- FIG. 5C shows a main pattern and a sub-pattern (dummy pattern) in the virtual area 2
- FIG. 5D shows a main pattern and a sub-pattern (dummy pattern) in the virtual area 3.
- These main patterns and sub-patterns are light-shielding patterns.
- the aperture ratios when only the main patterns of the virtual regions 2 and 3 are formed are 60% and 90%, respectively. It is. A conventional photomask is used in this state.
- dummy patterns are formed as sub-patterns in the virtual regions 2 and 3.
- the dummy pattern in the virtual area 2 is a square light-shielding pattern having a side of 0.15 m in length, and the dummy pattern in the virtual area 3 has a side of 0.2 ⁇ in length. This is a square light-shielding pattern.
- the pitch (center-to-center distance) of these dummy patterns is uniform between virtual regions 2 and 3.
- the aperture ratio of each of the virtual regions 2 and 3 is set to 30%.
- dummy patterns of an appropriate size are formed at the same pitch in all other virtual regions, and the aperture ratio of each virtual region is 30%. Is set.
- the table below summarizes the “total aperture ratio of all patterns except for the sub-pattern” and “the decrease in aperture ratio due to the formation of the sub-pattern” in each virtual area.
- the position where the dummy pattern is formed is a position where the operation of the semiconductor device is not affected beyond the allowable range even if it is transferred to the photoconductor. That is, the dummy pattern is formed outside the so-called design data prohibited area (design data prohibited frame). Therefore, a dummy pattern is not formed at a position that causes a short circuit of a wiring or a remarkable increase in parasitic capacitance.
- the photomask according to the first embodiment configured as described above By performing exposure using the photomask according to the first embodiment configured as described above, at any point within the range where the exposure light of the photoconductor is irradiated, the light generated by the low-power flare can be obtained. The amount will be almost uniform. As a result, even if the line width fluctuates, the degree thereof becomes uniform throughout the photomask.
- the size of the dummy pattern is adjusted by keeping the pitch between the dummy patterns constant.
- the pitch between the dummy patterns is adjusted by keeping the size of the dummy pattern constant.
- the aperture ratio may be made uniform between the virtual regions. That is, the lower the aperture ratio of the main pattern, the coarser the sub-pattern may be formed. Further, the aperture ratio may be made uniform between the virtual regions by adjusting the pitch and the size. That is, the smaller the aperture ratio of the main pattern, the smaller the size of the sub-pattern and the coarser the sub-pattern may be formed.
- FIG. 6A to 6D are schematic views showing a photomask according to the second embodiment of the present invention.
- FIG. 6A shows the main pattern of virtual area 2 in FIG. 4, and
- FIG. 6B shows the main pattern of virtual area 3 in FIG.
- FIG. 6C shows a main pattern and a sub-pattern (dummy pattern) of the virtual area 2
- FIG. 6D shows a main pattern and a sub-pattern (dummy pattern) ′ of the virtual area 3.
- These main patterns and sub-patterns are light-shielding patterns.
- the aperture ratios when only the main patterns of the virtual regions 2 and 3 are formed are 60% and 90%, respectively.
- a dummy pattern is formed as a sub-pattern.
- the dummy pattern in the virtual area 2 is a square light-shielding pattern having a side length of 0.05, and the dummy pattern in the virtual area 3 is a 0.08 ⁇ m side length. It is a square light-shielding pattern.
- the size of these dummy patterns is less than the resolution limit and is not transferred to the photoconductor by exposure.
- the pitch (distance between centers) of these dummy patterns is uniform between the virtual regions 2 and 3.
- the aperture ratio of each of the virtual regions 2 and 3 is set to 30%.
- the aperture ratio of each virtual region is set to 30%.
- Table 2 summarizes the “total aperture ratio by all patterns except the sub-pattern” and “the decrease in aperture ratio due to the formation of the sub-pattern” in each virtual area.
- each dummy pattern is smaller than the minimum size to be transferred, unlike the first embodiment, a pattern must not be formed on the photoconductor. A dummy pattern can be provided at the position.
- the size of the dummy pattern is adjusted by keeping the pitch between the dummy patterns constant, but the pitch between the dummy patterns is kept constant by the size of the dummy pattern
- the aperture ratio can be made uniform among the virtual areas. In other words, the lower the aperture ratio of the main pattern, the coarser the sub-pattern can be formed.
- the aperture ratio may be made uniform between the virtual regions by adjusting both the pitch and the size. In other words, the lower the aperture ratio of the main pattern, the smaller the size of the sub-pattern and the coarser the sub-pattern can be formed.
- FIG. 7A to 7D are schematic diagrams illustrating a photomask according to the third embodiment of the present invention.
- FIG. 7A shows a main pattern and a polishing countermeasure pattern in the virtual area 2 in FIG. 4, and
- FIG. 7B shows a main pattern and a polishing countermeasure pattern in the virtual area 3 in FIG.
- FIG. 7C shows a main pattern, a polishing countermeasure pattern and a sub-pattern (dummy pattern) in the virtual area 2
- FIG. 7D shows a main pattern, a polishing countermeasure pattern and the sub-pattern in the virtual area 3. (Dummy pattern).
- These main pattern, anti-polishing pattern and sub-pattern are light-shielding patterns.
- polishing countermeasure patterns have conventionally been formed on photomasks as appropriate.
- a wiring layer, an insulating layer, and the like on a semiconductor substrate are etched using a photosensitive resist on which a pattern is formed as a mask, and then etched into a groove formed by the etching.
- Other materials may be buried and then planarized by CMP (chemical mechanical polishing).
- CMP chemical mechanical polishing
- the main pattern and the polishing countermeasure pattern are formed in both the virtual regions 2 and 3, and only these are formed. Have an aperture ratio of 30% and 50%, respectively.
- a dummy pattern is formed as a sub-pattern in the virtual region 3.
- the dummy pattern is a square light-shielding pattern having a side length of 0.08 // ⁇ .
- the size of this dummy pattern is smaller than the resolution limit, and is not transferred to the photoconductor by exposure.
- the aperture ratio of the virtual area 3 is set to 30%.
- no dummy pattern is formed in the virtual area 2, and the aperture ratio remains at 30%.
- the aperture ratio of all other virtual regions exceeds 30% when only the main pattern and the polishing countermeasure pattern are formed.
- a dummy pattern of an appropriate size smaller than the resolution limit is formed, and the aperture ratio of each virtual region is set to 30%.
- Table 3 summarizes the “total aperture ratio of all patterns except the sub-pattern” and “the decrease in aperture ratio due to the formation of the sub-pattern” in each virtual area.
- each dummy pattern is smaller than the minimum size to be transferred, the dummy pattern should be provided at a position where the pattern should not be formed on the photoconductor. Is possible.
- FIG. 8A to 8D are schematic diagrams illustrating a photomask according to the fourth embodiment of the present invention.
- FIG. 8A shows a main pattern and a polishing countermeasure pattern in virtual area 2 in FIG. 4, and FIG. 8B shows a main pattern and a polishing countermeasure pattern in virtual area 3 in FIG.
- FIG. 8C shows a main pattern, a polishing countermeasure pattern and a sub-pattern (dummy pattern) in the virtual area 2, and
- FIG. 8D shows a main pattern, a polishing countermeasure pattern and the sub-pattern in the virtual area 3. (Dummy pattern).
- These main patterns and polishing countermeasure patterns are light-shielding patterns.
- the sub-pattern includes not only a light-shielding pattern but also a transmission pattern as described later.
- the main pattern and the polishing countermeasure pattern are formed in both the virtual regions 2 and 3, and only these are formed.
- the aperture ratios are 20% and 50%, respectively.
- a dummy pattern composed of a transmission pattern is formed in the virtual area 2 as a sub-pattern.
- the dummy pattern in the virtual region 2 has a size equal to or smaller than the resolution limit and is formed as a hole pattern in the anti-polishing pattern.
- FIG. Are formed.
- Each dummy pattern in the virtual area 3 is a square light-shielding pattern having a side length of 0.08 ⁇ . The size of these dummy patterns is less than the resolution limit and is not transferred to the photoconductor by exposure.
- the aperture ratios of the virtual regions 2 and 3 are set to 30%.
- the aperture ratio exceeds 30% in a state in which only the main pattern and the anti-polishing pattern are formed.
- a dummy pattern consisting of a light-shielding pattern of an appropriate size equal to or smaller than the resolution limit
- the aperture ratio is less than 20% with only the main pattern and the polishing countermeasure pattern formed
- a dummy pattern composed of a transmission pattern of an appropriate size equal to or smaller than the resolution limit is formed in the polishing countermeasure pattern.
- the aperture ratio of each virtual area is set to 30%.
- Table 4 summarizes the “total aperture ratio by all patterns except the sub-pattern” and “the decrease in aperture ratio due to the formation of the sub-pattern” in each virtual area.
- variations in line width due to local flare effects are uniform throughout the photomask.
- the line width can be easily increased or decreased by, for example, adjusting the output energy of the exposure machine. Therefore, it is possible to easily obtain a resist pattern having a desired line width without requiring a complicated photomask pattern correction.
- the force at which the aperture ratio is constant between all the virtual regions is not limited to this.
- the lower the total aperture ratio of all the patterns except for the sub-patterns the lower the reduction rate of the aperture ratio due to the formation of the sub-patterns should be.
- the upper limit of the size of the virtual area can be determined based on the range affected by local flare and the degree of the influence. For example, if you get the graph shown in Figure 3, In this case, the range affected by local flare is considered to be within a circle with a radius of about 20 ⁇ m.
- the shape of the virtual region is preferably a rectangle having a length of about 0.5 ⁇ m to 5 ⁇ m on each side, and particularly a length of 2 ⁇ m on each side. More preferably, it is a rectangular area of about 5 ⁇ m.
- the main pattern (and the pattern for polishing measures) is formed as a light-shielding pattern.
- a photo pattern in which these are formed as transmission patterns is used.
- 9A to 9D are schematic diagrams showing a photomask in which a positive type / negative type is inverted with respect to the first embodiment.
- the sub-patterns are formed such that the lower the total aperture ratio of all the patterns except the sub-pattern is, the smaller the decrease in the aperture ratio due to the formation of the sub-pattern becomes.
- Table 5 summarizes the “total aperture ratio of all patterns except the sub-pattern” and “the decrease in aperture ratio due to the formation of the sub-pattern” in each virtual area. .
- the total aperture ratio (10%) of all the patterns except the sub-pattern of the virtual region 3 is that of the virtual region 2 (40%). Since the sub-pattern of the virtual region 3 was formed, the decrease in the aperture ratio ( ⁇ 60%) was lower than that of the virtual region 2 (_30%).
- a main pattern is determined based on a circuit configuration.
- the design of the polishing countermeasure pattern may be performed together.
- the entire irradiation area is divided into virtual areas, and the total aperture ratio of the main pattern (and the polishing countermeasure pattern), that is, the total aperture rate of all patterns except the sub-patterns, is calculated for each virtual area.
- the lower the total aperture ratio of all the patterns except the sub-patterns is, the lower the aperture ratio due to the formation of the sub-patterns is in the virtual or region. Determine the shape (size) and position (pitch) of the sub-pattern in the photomask.
- a sub-pattern that is transferred to the photoconductor may be provided as in the first embodiment, or a sub-pattern that is not transferred to the photoconductor may be provided as in the second embodiment.
- a sub-pattern may be provided in the polishing countermeasure pattern. In this way, each virtual and region pattern is designed, and the entire photomask design is completed.
- a photosensitive resist is first formed on the impeached layer by coating or the like, and the photomask is used to form the photosensitive resist. Exposure of the resist is performed. Thereafter, the photosensitive resist is developed, and the layer to be processed may be processed using the patterned photosensitive resist as a mask.
- the amount of light generated by local flare can be made substantially uniform at any point within the range where the exposure light of the photoconductor is irradiated. . For this reason, even if the line width changes, the degree of the change becomes uniform over the entire photomask.
- the line width can be easily increased or decreased by, for example, adjusting the output energy of the exposure machine. Therefore, it is possible to easily obtain a resist pattern having a desired line width without requiring complicated correction of a photomask pattern.
- Virtual area 2 Virtual area 3 Total aperture ratio by all patterns except sub-buttons 60% 90% ⁇ Decrease in aperture ratio due to formation of ij pattern 30% 60%
- Virtual area 2 Virtual area 3 Total aperture ratio by all buttons except sub button 40% 10% sub /. Amount of decrease in aperture ratio due to formation of turn-30%-60%
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03705313A EP1526406B1 (en) | 2002-07-31 | 2003-02-19 | Photomask |
US11/006,688 US20050095513A1 (en) | 2002-07-31 | 2004-12-08 | Photomask |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-223967 | 2002-07-31 | ||
JP2002223967A JP4190227B2 (ja) | 2002-07-31 | 2002-07-31 | フォトマスク、その設計方法及びそれを用いた半導体装置の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/006,688 Continuation US20050095513A1 (en) | 2002-07-31 | 2004-12-08 | Photomask |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004013695A1 true WO2004013695A1 (ja) | 2004-02-12 |
Family
ID=31492121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/001772 WO2004013695A1 (ja) | 2002-07-31 | 2003-02-19 | フォトマスク |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1526406B1 (ja) |
JP (1) | JP4190227B2 (ja) |
CN (1) | CN100514184C (ja) |
TW (1) | TWI306547B (ja) |
WO (1) | WO2004013695A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005015313A1 (en) * | 2003-08-04 | 2005-02-17 | Carl Zeiss Smt Ag | Illumination mask for range-resolved detection of scattered light |
JP2009054817A (ja) * | 2007-08-28 | 2009-03-12 | Kawasaki Microelectronics Kk | 半導体集積回路およびダミーパターンの配置方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7234130B2 (en) * | 2004-02-25 | 2007-06-19 | James Word | Long range corrections in integrated circuit layout designs |
JP2007019098A (ja) | 2005-07-05 | 2007-01-25 | Elpida Memory Inc | 露光装置及び露光方法 |
KR100712996B1 (ko) * | 2005-09-20 | 2007-05-02 | 주식회사 하이닉스반도체 | 패턴더미를 갖는 반도체소자 및 패턴더미를 이용한반도체소자의 제조방법 |
JP4689471B2 (ja) * | 2006-01-06 | 2011-05-25 | エルピーダメモリ株式会社 | 回路パターン露光方法及びマスク |
JP2007234716A (ja) * | 2006-02-28 | 2007-09-13 | Nikon Corp | 露光方法 |
JP5407623B2 (ja) * | 2009-07-16 | 2014-02-05 | 富士通セミコンダクター株式会社 | マスクパターン評価方法、マスクパターン補正方法及びマスクパターン発生装置 |
CN102466977B (zh) * | 2010-11-11 | 2015-05-13 | 上海微电子装备有限公司 | 用于测量投影物镜畸变的标记结构及方法 |
WO2015045710A1 (ja) * | 2013-09-26 | 2015-04-02 | シャープ株式会社 | 表示パネル及びそれを備えた表示装置 |
TWI690768B (zh) * | 2019-01-25 | 2020-04-11 | 力晶積成電子製造股份有限公司 | 光罩的設計方法與半導體微影製程 |
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US5948573A (en) * | 1997-02-21 | 1999-09-07 | Sony Corporation | Method of designing mask pattern to be formed in mask and method of manufacturing integrated circuit |
JP2000195787A (ja) * | 1998-12-30 | 2000-07-14 | Hyundai Electronics Ind Co Ltd | 半導体素子の微細パタ―ン形成方法 |
JP2001125252A (ja) * | 1999-10-25 | 2001-05-11 | Fujitsu Ltd | 半導体集積回路の露光方法及び露光装置 |
JP2001272766A (ja) * | 2000-03-27 | 2001-10-05 | Toshiba Corp | フォトマスクの製造方法 |
JP2002189279A (ja) * | 2000-12-19 | 2002-07-05 | Sony Corp | フォトマスクの製造方法、フォトマスクの製造装置およびフォトマスク |
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JP2000124305A (ja) * | 1998-10-15 | 2000-04-28 | Mitsubishi Electric Corp | 半導体装置 |
JP2002296754A (ja) * | 2001-03-29 | 2002-10-09 | Toshiba Corp | マスクの製造方法 |
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2002
- 2002-07-31 JP JP2002223967A patent/JP4190227B2/ja not_active Expired - Fee Related
-
2003
- 2003-02-19 WO PCT/JP2003/001772 patent/WO2004013695A1/ja active Application Filing
- 2003-02-19 EP EP03705313A patent/EP1526406B1/en not_active Expired - Fee Related
- 2003-02-19 CN CNB038146347A patent/CN100514184C/zh not_active Expired - Fee Related
- 2003-02-25 TW TW092103939A patent/TWI306547B/zh not_active IP Right Cessation
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US5948573A (en) * | 1997-02-21 | 1999-09-07 | Sony Corporation | Method of designing mask pattern to be formed in mask and method of manufacturing integrated circuit |
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JP2001272766A (ja) * | 2000-03-27 | 2001-10-05 | Toshiba Corp | フォトマスクの製造方法 |
JP2002189279A (ja) * | 2000-12-19 | 2002-07-05 | Sony Corp | フォトマスクの製造方法、フォトマスクの製造装置およびフォトマスク |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2005015313A1 (en) * | 2003-08-04 | 2005-02-17 | Carl Zeiss Smt Ag | Illumination mask for range-resolved detection of scattered light |
US7408631B2 (en) | 2003-08-04 | 2008-08-05 | Carl Zeiss Smt Ag | Device for the range-resolved determination of scattered light, operating method, illumination mask and image-field mask |
US7755748B2 (en) | 2003-08-04 | 2010-07-13 | Carl Zeiss Smt Ag | Device and method for range-resolved determination of scattered light, and an illumination mask |
JP2009054817A (ja) * | 2007-08-28 | 2009-03-12 | Kawasaki Microelectronics Kk | 半導体集積回路およびダミーパターンの配置方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100514184C (zh) | 2009-07-15 |
TWI306547B (en) | 2009-02-21 |
EP1526406B1 (en) | 2011-11-09 |
EP1526406A1 (en) | 2005-04-27 |
JP2004062088A (ja) | 2004-02-26 |
EP1526406A4 (en) | 2006-05-31 |
JP4190227B2 (ja) | 2008-12-03 |
TW200401953A (en) | 2004-02-01 |
CN1662851A (zh) | 2005-08-31 |
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