WO2004011553A1 - 硬化性組成物およびサイジングボードのシーリング方法 - Google Patents
硬化性組成物およびサイジングボードのシーリング方法 Download PDFInfo
- Publication number
- WO2004011553A1 WO2004011553A1 PCT/JP2003/008741 JP0308741W WO2004011553A1 WO 2004011553 A1 WO2004011553 A1 WO 2004011553A1 JP 0308741 W JP0308741 W JP 0308741W WO 2004011553 A1 WO2004011553 A1 WO 2004011553A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polymer
- curable composition
- group
- composition according
- weight
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 164
- 238000000034 method Methods 0.000 title claims abstract description 46
- 239000000919 ceramic Substances 0.000 title claims abstract description 17
- 238000007789 sealing Methods 0.000 title claims abstract description 9
- 229920000642 polymer Polymers 0.000 claims abstract description 272
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 145
- 239000004014 plasticizer Substances 0.000 claims abstract description 99
- -1 polyoxy- propylene Polymers 0.000 claims abstract description 98
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 64
- 229920001451 polypropylene glycol Polymers 0.000 claims abstract description 19
- 239000000565 sealant Substances 0.000 claims abstract description 12
- 238000011049 filling Methods 0.000 claims abstract description 6
- 125000005702 oxyalkylene group Chemical group 0.000 claims description 135
- 239000000178 monomer Substances 0.000 claims description 33
- 239000003566 sealing material Substances 0.000 claims description 32
- 239000003054 catalyst Substances 0.000 claims description 30
- 239000000126 substance Substances 0.000 claims description 29
- 238000004513 sizing Methods 0.000 claims description 25
- 125000000524 functional group Chemical group 0.000 claims description 22
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000006116 polymerization reaction Methods 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 11
- 229920001577 copolymer Polymers 0.000 claims description 10
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 8
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 229920001748 polybutylene Polymers 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 abstract description 4
- 229920006222 acrylic ester polymer Polymers 0.000 abstract 1
- 239000000047 product Substances 0.000 description 71
- 150000001875 compounds Chemical class 0.000 description 45
- 239000003822 epoxy resin Substances 0.000 description 34
- 229920000647 polyepoxide Polymers 0.000 description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 22
- 230000000694 effects Effects 0.000 description 21
- 230000015572 biosynthetic process Effects 0.000 description 19
- 125000004432 carbon atom Chemical group C* 0.000 description 18
- 238000003786 synthesis reaction Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- 125000000217 alkyl group Chemical group 0.000 description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 13
- 239000004611 light stabiliser Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 11
- 239000000945 filler Substances 0.000 description 11
- 238000009864 tensile test Methods 0.000 description 11
- 239000006087 Silane Coupling Agent Substances 0.000 description 10
- 230000007423 decrease Effects 0.000 description 10
- 238000009826 distribution Methods 0.000 description 10
- 230000001965 increasing effect Effects 0.000 description 10
- 230000000704 physical effect Effects 0.000 description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 229910000019 calcium carbonate Inorganic materials 0.000 description 8
- 230000018044 dehydration Effects 0.000 description 8
- 238000006297 dehydration reaction Methods 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 8
- 150000004658 ketimines Chemical class 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 8
- 238000010526 radical polymerization reaction Methods 0.000 description 8
- 229920005604 random copolymer Polymers 0.000 description 8
- 150000003377 silicon compounds Chemical class 0.000 description 8
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 239000004793 Polystyrene Substances 0.000 description 7
- 229920000620 organic polymer Polymers 0.000 description 7
- 229920000058 polyacrylate Polymers 0.000 description 7
- 229920002223 polystyrene Polymers 0.000 description 7
- 230000009257 reactivity Effects 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 6
- 230000003078 antioxidant effect Effects 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 230000007062 hydrolysis Effects 0.000 description 6
- 238000006460 hydrolysis reaction Methods 0.000 description 6
- 239000003607 modifier Substances 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000005060 rubber Substances 0.000 description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 5
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 5
- XYYQWMDBQFSCPB-UHFFFAOYSA-N dimethoxymethylsilane Chemical compound COC([SiH3])OC XYYQWMDBQFSCPB-UHFFFAOYSA-N 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 5
- 238000006459 hydrosilylation reaction Methods 0.000 description 5
- 150000004756 silanes Chemical class 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 239000012964 benzotriazole Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000004927 clay Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000691 measurement method Methods 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 235000019198 oils Nutrition 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 238000007665 sagging Methods 0.000 description 4
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- AAPLIUHOKVUFCC-UHFFFAOYSA-N trimethylsilanol Chemical compound C[Si](C)(C)O AAPLIUHOKVUFCC-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- SIXWIUJQBBANGK-UHFFFAOYSA-N 4-(4-fluorophenyl)-1h-pyrazol-5-amine Chemical compound N1N=CC(C=2C=CC(F)=CC=2)=C1N SIXWIUJQBBANGK-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- RRDGKBOYQLLJSW-UHFFFAOYSA-N bis(2-ethylhexyl) 7-oxabicyclo[4.1.0]heptane-3,4-dicarboxylate Chemical compound C1C(C(=O)OCC(CC)CCCC)C(C(=O)OCC(CC)CCCC)CC2OC21 RRDGKBOYQLLJSW-UHFFFAOYSA-N 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- 150000001728 carbonyl compounds Chemical class 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 3
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000005641 methacryl group Chemical group 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 150000003141 primary amines Chemical class 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 150000003335 secondary amines Chemical class 0.000 description 3
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 235000014692 zinc oxide Nutrition 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- AMIMRNSIRUDHCM-UHFFFAOYSA-N Isopropylaldehyde Chemical compound CC(C)C=O AMIMRNSIRUDHCM-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 125000004423 acyloxy group Chemical group 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000003302 alkenyloxy group Chemical group 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 125000005907 alkyl ester group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 125000004104 aryloxy group Chemical group 0.000 description 2
- 150000001540 azides Chemical class 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- FLPKSBDJMLUTEX-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) 2-butyl-2-[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]propanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)C(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)(CCCC)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 FLPKSBDJMLUTEX-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229940114081 cinnamate Drugs 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 2
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 239000010459 dolomite Substances 0.000 description 2
- 229910000514 dolomite Inorganic materials 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000000944 linseed oil Substances 0.000 description 2
- 235000021388 linseed oil Nutrition 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- QYDYPVFESGNLHU-KHPPLWFESA-N methyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC QYDYPVFESGNLHU-KHPPLWFESA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000008029 phthalate plasticizer Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- 150000003606 tin compounds Chemical class 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- 229920006163 vinyl copolymer Polymers 0.000 description 2
- DFUSDJMZWQVQSF-XLGIIRLISA-N (2r)-2-methyl-2-[(4r,8r)-4,8,12-trimethyltridecyl]-3,4-dihydrochromen-6-ol Chemical compound OC1=CC=C2O[C@@](CCC[C@H](C)CCC[C@H](C)CCCC(C)C)(C)CCC2=C1 DFUSDJMZWQVQSF-XLGIIRLISA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 1
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- ITWBWJFEJCHKSN-UHFFFAOYSA-N 1,4,7-triazonane Chemical compound C1CNCCNCCN1 ITWBWJFEJCHKSN-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- FNOBPQZGFPPTCF-UHFFFAOYSA-N 1-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CCC(N)[Si](C)(OC)OC FNOBPQZGFPPTCF-UHFFFAOYSA-N 0.000 description 1
- BAACRKZNNZZIFO-UHFFFAOYSA-N 1-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CCC(S)[Si](C)(OC)OC BAACRKZNNZZIFO-UHFFFAOYSA-N 0.000 description 1
- OPWQHYSPLFFRMU-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-amine Chemical compound CCC(N)[Si](OC)(OC)OC OPWQHYSPLFFRMU-UHFFFAOYSA-N 0.000 description 1
- OWOCLFMXKYUTDH-UHFFFAOYSA-N 1-trimethoxysilylpropane-1-thiol Chemical compound CCC(S)[Si](OC)(OC)OC OWOCLFMXKYUTDH-UHFFFAOYSA-N 0.000 description 1
- GYWCVOZDFNTGAV-UHFFFAOYSA-N 10-octoxy-10-oxodecanoic acid Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(O)=O GYWCVOZDFNTGAV-UHFFFAOYSA-N 0.000 description 1
- BKUSIKGSPSFQAC-RRKCRQDMSA-N 2'-deoxyinosine-5'-diphosphate Chemical compound O1[C@H](CO[P@@](O)(=O)OP(O)(O)=O)[C@@H](O)C[C@@H]1N1C(NC=NC2=O)=C2N=C1 BKUSIKGSPSFQAC-RRKCRQDMSA-N 0.000 description 1
- XPZBNIUWMDJFPW-UHFFFAOYSA-N 2,2,3-trimethylcyclohexan-1-one Chemical compound CC1CCCC(=O)C1(C)C XPZBNIUWMDJFPW-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VVJIVFKAROPUOS-UHFFFAOYSA-N 2,2-bis(aminomethyl)propane-1,3-diamine Chemical compound NCC(CN)(CN)CN VVJIVFKAROPUOS-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 description 1
- ZGHZSTWONPNWHV-UHFFFAOYSA-N 2-(oxiran-2-yl)ethyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCC1CO1 ZGHZSTWONPNWHV-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- MMEDJBFVJUFIDD-UHFFFAOYSA-N 2-[2-(carboxymethyl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=CC=C1CC(O)=O MMEDJBFVJUFIDD-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- WGRZHLPEQDVPET-UHFFFAOYSA-N 2-methoxyethoxysilane Chemical compound COCCO[SiH3] WGRZHLPEQDVPET-UHFFFAOYSA-N 0.000 description 1
- OVEUFHOBGCSKSH-UHFFFAOYSA-N 2-methyl-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound CC1=CC=CC=C1N(CC1OC1)CC1OC1 OVEUFHOBGCSKSH-UHFFFAOYSA-N 0.000 description 1
- RCEJCSULJQNRQQ-UHFFFAOYSA-N 2-methylbutanenitrile Chemical compound CCC(C)C#N RCEJCSULJQNRQQ-UHFFFAOYSA-N 0.000 description 1
- CJNRGSHEMCMUOE-UHFFFAOYSA-N 2-piperidin-1-ylethanamine Chemical compound NCCN1CCCCC1 CJNRGSHEMCMUOE-UHFFFAOYSA-N 0.000 description 1
- SLRMQYXOBQWXCR-UHFFFAOYSA-N 2154-56-5 Chemical compound [CH2]C1=CC=CC=C1 SLRMQYXOBQWXCR-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- VYVFQBFOMKEKBG-UHFFFAOYSA-L 3,3-dibutyl-2,4,3-benzodioxastannepine-1,5-dione Chemical compound O=C1O[Sn](CCCC)(CCCC)OC(=O)C2=CC=CC=C21 VYVFQBFOMKEKBG-UHFFFAOYSA-L 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- OHXAOPZTJOUYKM-UHFFFAOYSA-N 3-Chloro-2-methylpropene Chemical compound CC(=C)CCl OHXAOPZTJOUYKM-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- JMHDUGPVXOVUMR-UHFFFAOYSA-N 3-[ethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[SiH](C)CCCN JMHDUGPVXOVUMR-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- YAXXOCZAXKLLCV-UHFFFAOYSA-N 3-dodecyloxolane-2,5-dione Chemical compound CCCCCCCCCCCCC1CC(=O)OC1=O YAXXOCZAXKLLCV-UHFFFAOYSA-N 0.000 description 1
- JJKMIZGENPMJRC-UHFFFAOYSA-N 3-oxo-3-propan-2-yloxypropanoic acid Chemical compound CC(C)OC(=O)CC(O)=O JJKMIZGENPMJRC-UHFFFAOYSA-N 0.000 description 1
- QJIVRICYWXNTKE-UHFFFAOYSA-N 4-(8-methylnonoxy)-4-oxobutanoic acid Chemical compound CC(C)CCCCCCCOC(=O)CCC(O)=O QJIVRICYWXNTKE-UHFFFAOYSA-N 0.000 description 1
- VNGLVZLEUDIDQH-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;2-methyloxirane Chemical compound CC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 VNGLVZLEUDIDQH-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- NOSRWEGGPTVXSU-UHFFFAOYSA-N 4-trimethylsilylbutyl prop-2-enoate Chemical compound C[Si](C)(C)CCCCOC(=O)C=C NOSRWEGGPTVXSU-UHFFFAOYSA-N 0.000 description 1
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 1
- IHLDEDLAZNFOJB-UHFFFAOYSA-N 6-octoxy-6-oxohexanoic acid Chemical compound CCCCCCCCOC(=O)CCCCC(O)=O IHLDEDLAZNFOJB-UHFFFAOYSA-N 0.000 description 1
- BDDLHHRCDSJVKV-UHFFFAOYSA-N 7028-40-2 Chemical compound CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O BDDLHHRCDSJVKV-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- RNIHAPSVIGPAFF-UHFFFAOYSA-N Acrylamide-acrylic acid resin Chemical compound NC(=O)C=C.OC(=O)C=C RNIHAPSVIGPAFF-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- BUJRFMKPCASABJ-ARJAWSKDSA-N C(C)(=O)C1=[Si](C=CC=C1)CCCCCCCC\C=C/CCCCCCCC(=O)OC Chemical compound C(C)(=O)C1=[Si](C=CC=C1)CCCCCCCC\C=C/CCCCCCCC(=O)OC BUJRFMKPCASABJ-ARJAWSKDSA-N 0.000 description 1
- FRHRIWRAOMLTLL-UHFFFAOYSA-M C(C)(=O)[O-].C(C)(=O)OCC.C(C)(C)O[Al+]OC(C)C Chemical compound C(C)(=O)[O-].C(C)(=O)OCC.C(C)(C)O[Al+]OC(C)C FRHRIWRAOMLTLL-UHFFFAOYSA-M 0.000 description 1
- KWADETUNAHTOCO-UHFFFAOYSA-N C(C=C/C(=O)OCC1=CC=CC=C1)(=O)OCC1=CC=CC=C1.C(CCC)[Sn]CCCC Chemical compound C(C=C/C(=O)OCC1=CC=CC=C1)(=O)OCC1=CC=CC=C1.C(CCC)[Sn]CCCC KWADETUNAHTOCO-UHFFFAOYSA-N 0.000 description 1
- XDCNZKPPIZVEGT-UHFFFAOYSA-N C(C=C/C(=O)OCCCCCCCC)(=O)OCCCCCCCC.C(CCCCCCC)[Sn]CCCCCCCC Chemical compound C(C=C/C(=O)OCCCCCCCC)(=O)OCCCCCCCC.C(CCCCCCC)[Sn]CCCCCCCC XDCNZKPPIZVEGT-UHFFFAOYSA-N 0.000 description 1
- YBEOXLVXOIMPKL-UHFFFAOYSA-N C1(=CC=CC=C1)CO[Si](OC)(OC)CCCNC1=CC=CC=C1 Chemical compound C1(=CC=CC=C1)CO[Si](OC)(OC)CCCNC1=CC=CC=C1 YBEOXLVXOIMPKL-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 101150065749 Churc1 gene Proteins 0.000 description 1
- 239000004821 Contact adhesive Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 1
- LVGKNOAMLMIIKO-UHFFFAOYSA-N Elaidinsaeure-aethylester Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC LVGKNOAMLMIIKO-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical class ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical class CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical compound [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- ZZEVYBNSSLWUCN-UHFFFAOYSA-N NCCC(CC[Si](OC)(OC)OC)NN Chemical compound NCCC(CC[Si](OC)(OC)OC)NN ZZEVYBNSSLWUCN-UHFFFAOYSA-N 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- ATTZFSUZZUNHBP-UHFFFAOYSA-N Piperonyl sulfoxide Chemical compound CCCCCCCCS(=O)C(C)CC1=CC=C2OCOC2=C1 ATTZFSUZZUNHBP-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 102100038239 Protein Churchill Human genes 0.000 description 1
- BDDBMDPNJAMHRO-SECBINFHSA-N SCCC[Si@H](OCC)C Chemical compound SCCC[Si@H](OCC)C BDDBMDPNJAMHRO-SECBINFHSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- ZVMDAQQBXVFTTI-UHFFFAOYSA-N [Si]OCCC1=CC=CC=C1 Chemical compound [Si]OCCC1=CC=CC=C1 ZVMDAQQBXVFTTI-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- ATMLPEJAVWINOF-UHFFFAOYSA-N acrylic acid acrylic acid Chemical class OC(=O)C=C.OC(=O)C=C ATMLPEJAVWINOF-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- 125000005233 alkylalcohol group Chemical group 0.000 description 1
- SOGAXMICEFXMKE-UHFFFAOYSA-N alpha-Methyl-n-butyl acrylate Natural products CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 150000001500 aryl chlorides Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 1
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- RUOKPLVTMFHRJE-UHFFFAOYSA-N benzene-1,2,3-triamine Chemical compound NC1=CC=CC(N)=C1N RUOKPLVTMFHRJE-UHFFFAOYSA-N 0.000 description 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- ZCGHEBMEQXMRQL-UHFFFAOYSA-N benzyl 2-carbamoylpyrrolidine-1-carboxylate Chemical compound NC(=O)C1CCCN1C(=O)OCC1=CC=CC=C1 ZCGHEBMEQXMRQL-UHFFFAOYSA-N 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- RGTXVXDNHPWPHH-UHFFFAOYSA-N butane-1,3-diamine Chemical compound CC(N)CCN RGTXVXDNHPWPHH-UHFFFAOYSA-N 0.000 description 1
- GHWVXCQZPNWFRO-UHFFFAOYSA-N butane-2,3-diamine Chemical compound CC(N)C(C)N GHWVXCQZPNWFRO-UHFFFAOYSA-N 0.000 description 1
- XXQBIYASOABGRU-UHFFFAOYSA-N butoxy-dimethoxy-propylsilane Chemical compound CCCCO[Si](OC)(OC)CCC XXQBIYASOABGRU-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000003997 cyclic ketones Chemical class 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- NZZIMKJIVMHWJC-UHFFFAOYSA-N dibenzoylmethane Chemical compound C=1C=CC=CC=1C(=O)CC(=O)C1=CC=CC=C1 NZZIMKJIVMHWJC-UHFFFAOYSA-N 0.000 description 1
- XAUKEHTUWXPUBM-IRYVOTIRSA-N dibutyl (z)-but-2-enedioate;dibutyltin Chemical compound CCCC[Sn]CCCC.CCCCOC(=O)\C=C/C(=O)OCCCC XAUKEHTUWXPUBM-IRYVOTIRSA-N 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- YDAQYWWYQPHMAO-UHFFFAOYSA-L dibutyltin(2+);2,3-di(nonyl)phenolate Chemical compound CCCC[Sn+2]CCCC.CCCCCCCCCC1=CC=CC([O-])=C1CCCCCCCCC.CCCCCCCCCC1=CC=CC([O-])=C1CCCCCCCCC YDAQYWWYQPHMAO-UHFFFAOYSA-L 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
- IIFKGJGNMKYHLT-FGSKAQBVSA-N dibutyltin;dimethyl (z)-but-2-enedioate Chemical compound CCCC[Sn]CCCC.COC(=O)\C=C/C(=O)OC IIFKGJGNMKYHLT-FGSKAQBVSA-N 0.000 description 1
- WRZAGCUJZBBAAW-SWJSCKDZSA-N dibutyltin;dioctyl (z)-but-2-enedioate Chemical compound CCCC[Sn]CCCC.CCCCCCCCOC(=O)\C=C/C(=O)OCCCCCCCC WRZAGCUJZBBAAW-SWJSCKDZSA-N 0.000 description 1
- MMFHQUJCZSYDEK-SWLCOABPSA-N dibutyltin;ditridecyl (z)-but-2-enedioate Chemical compound CCCC[Sn]CCCC.CCCCCCCCCCCCCOC(=O)\C=C/C(=O)OCCCCCCCCCCCCC MMFHQUJCZSYDEK-SWLCOABPSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- BEPAFCGSDWSTEL-UHFFFAOYSA-N dimethyl malonate Chemical compound COC(=O)CC(=O)OC BEPAFCGSDWSTEL-UHFFFAOYSA-N 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- QYDYPVFESGNLHU-UHFFFAOYSA-N elaidic acid methyl ester Natural products CCCCCCCCC=CCCCCCCCC(=O)OC QYDYPVFESGNLHU-UHFFFAOYSA-N 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 1
- NUFVQEIPPHHQCK-UHFFFAOYSA-N ethenyl-methoxy-dimethylsilane Chemical compound CO[Si](C)(C)C=C NUFVQEIPPHHQCK-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- ZZRGHKUNLAYDTC-UHFFFAOYSA-N ethoxy(methyl)silane Chemical compound CCO[SiH2]C ZZRGHKUNLAYDTC-UHFFFAOYSA-N 0.000 description 1
- FOAJCPQRBYGAKO-UHFFFAOYSA-N ethoxy-methyl-propylsilane Chemical compound CCC[SiH](C)OCC FOAJCPQRBYGAKO-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000010881 fly ash Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000005003 food packaging material Substances 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000011899 heat drying method Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229960002050 hydrofluoric acid Drugs 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- BKXVGDZNDSIUAI-UHFFFAOYSA-N methoxy(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(OC)C1=CC=CC=C1 BKXVGDZNDSIUAI-UHFFFAOYSA-N 0.000 description 1
- REQXNMOSXYEQLM-UHFFFAOYSA-N methoxy-dimethyl-phenylsilane Chemical compound CO[Si](C)(C)C1=CC=CC=C1 REQXNMOSXYEQLM-UHFFFAOYSA-N 0.000 description 1
- WCYWZMWISLQXQU-UHFFFAOYSA-N methyl Chemical compound [CH3] WCYWZMWISLQXQU-UHFFFAOYSA-N 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- FKUYYVQYKRJRLM-UHFFFAOYSA-N n'-[1-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)C(CC)NCCN FKUYYVQYKRJRLM-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- DRRZZMBHJXLZRS-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]cyclohexanamine Chemical compound CO[Si](C)(OC)CCCNC1CCCCC1 DRRZZMBHJXLZRS-UHFFFAOYSA-N 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- CHDKQNHKDMEASZ-UHFFFAOYSA-N n-prop-2-enoylprop-2-enamide Chemical compound C=CC(=O)NC(=O)C=C CHDKQNHKDMEASZ-UHFFFAOYSA-N 0.000 description 1
- 239000005445 natural material Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- WSGCRAOTEDLMFQ-UHFFFAOYSA-N nonan-5-one Chemical compound CCCCC(=O)CCCC WSGCRAOTEDLMFQ-UHFFFAOYSA-N 0.000 description 1
- JFOJYGMDZRCSPA-UHFFFAOYSA-J octadecanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O JFOJYGMDZRCSPA-UHFFFAOYSA-J 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229910001562 pearlite Inorganic materials 0.000 description 1
- JGQDLMSXMOGEMC-UHFFFAOYSA-N pentane-2,4-diamine Chemical compound CC(N)CC(C)N JGQDLMSXMOGEMC-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007539 photo-oxidation reaction Methods 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000010734 process oil Substances 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006298 saran Polymers 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- LMEWRZSPCQHBOB-UHFFFAOYSA-M silver;2-hydroxypropanoate Chemical compound [Ag+].CC(O)C([O-])=O LMEWRZSPCQHBOB-UHFFFAOYSA-M 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- ACECBHHKGNTVPB-UHFFFAOYSA-N silylformic acid Chemical class OC([SiH3])=O ACECBHHKGNTVPB-UHFFFAOYSA-N 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical class OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- MBYLVOKEDDQJDY-UHFFFAOYSA-N tris(2-aminoethyl)amine Chemical compound NCCN(CCN)CCN MBYLVOKEDDQJDY-UHFFFAOYSA-N 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F13/00—Coverings or linings, e.g. for walls or ceilings
- E04F13/07—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor
- E04F13/08—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements
- E04F13/14—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements stone or stone-like materials, e.g. ceramics concrete; of glass or with an outer layer of stone or stone-like materials or glass
- E04F13/142—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements stone or stone-like materials, e.g. ceramics concrete; of glass or with an outer layer of stone or stone-like materials or glass with an outer layer of ceramics or clays
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F13/00—Coverings or linings, e.g. for walls or ceilings
- E04F13/07—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor
- E04F13/08—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements
- E04F13/0889—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements characterised by the joints between neighbouring elements, e.g. with joint fillings or with tongue and groove connections
- E04F13/0898—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements characterised by the joints between neighbouring elements, e.g. with joint fillings or with tongue and groove connections with sealing elements between coverings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
- C08L43/04—Homopolymers or copolymers of monomers containing silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S528/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S528/901—Room temperature curable silicon-containing polymer
Definitions
- the present invention relates to a method for sealing a curable composition and a sizing pad.
- the present invention provides a novel curable composition containing an oxyalkylene-based polymer having a silicon atom-containing functional group capable of crosslinking by forming a siloxane bond (hereinafter, also referred to as a reactive silicon group), and It relates to the sealing method for ceramic sizing pods.
- an oxyalkylene-based polymer having a silicon atom-containing functional group capable of crosslinking by forming a siloxane bond hereinafter, also referred to as a reactive silicon group
- Room-temperature curable compositions based on oxyalkylene polymers having reactive silicon groups can be used as, for example, building sealing materials (known as modified silicone-based sealing materials). Have. These are required to have various properties, but in addition to mechanical properties such as modulus, elongation at break and breaking strength, long-term weatherability is an important property, and many studies have been made so far. As a result, mechanical properties such as modulus, elongation at break, and breaking strength can be obtained by adding a phthalate ester or a polyether plasticizer to the curable composition. It is known that it can be done.
- the weather resistance can be improved by blending a vinyl polymer having a reactive silicon group with an oxyalkylene polymer having a reactive silicon group so that only the oxyalkylene polymer having a reactive silicon group can be obtained.
- Japanese Patent Application Laid-Open Nos. 59-122, 541, 60-03, 156, and 63-112 These are disclosed in, for example, Japanese Patent Application Laid-Open No. 6-42, Japanese Patent Application Laid-Open No. 6-172631, and Japanese Patent Application Laid-Open No. 7-901171.
- it is a building material used as a hardened wall material that is made by blending organic fibers with the main raw materials such as cement, fly ash, and pearlite.
- sealing material It is inexpensive and has fire resistance. Since gaps (joints) are created between the sizing pods during the construction of the sizing pods, watertight and airtight treatment is performed using a sealing material. In recent years, as the performance guarantee period of buildings such as houses has become longer, the performance of sealing materials has deteriorated over time. Although there is a demand for no elongation, sealing materials, including building sealing materials, generally require high elongation at break. In particular, a high elongation at break is required for a sealing material for ceramic sizing pods that undergoes large shrinkage over time.
- a breaking elongation of 250% or more is required.
- the elongation at break of this value that is, 500% or more, preferably 600% or more is desirable.
- sealing materials for sizing pods are required to have weather resistance because they are directly exposed to the outdoor environment.
- a cured product of a composition containing an oxyalkylene polymer having a reactive silicon group and a vinyl polymer having a reactive gay group has excellent weather resistance, but a vial having a reactive gay group It was found that the cured product was inferior in elongation at break as compared with the composition containing no system polymer. In particular, elongation at break is insufficient as a sealing material used for joints of ceramic sizing boards.
- a plasticizer is required to obtain sufficient elongation at break.
- composition of the composition is limited, such as the necessity of using a large amount of the compound. Therefore, it is necessary to provide a cured product having excellent elongation properties by modifying a polymer such as an oxyalkylene polymer having a reactive gay group or a vinyl polymer having a reactive silicon group. is there.
- plasticizers for buildings (published by the Japan Sealant Manufacturers Association), excellent plasticization is used as a plasticizer for oxyalkylene polymers having a reactive gayne group.
- phthalate ester plasticizers are used, which have an excellent effect.
- plasticizers other than phthalate ester plasticizers has been required due to environmental problems.
- the plasticizing efficiency of the plasticizer is inferior, the effect of improving the polymer will be offset.
- An object of the present invention is to provide a curable composition containing an oxyalkylene polymer having a reactive silicon group, a vinyl polymer having a reactive silicon group, and a non-fluoric acid ester plasticizer.
- the polymer having a reactive silicon group gives the cured product excellent elongation properties
- the non-phthalate plasticizer used is a curable composition having the same plasticization efficiency as the phthalate plasticizer.
- the present invention relates to a sealing method for filling and hardening joints of a ceramic sizing board using the curable composition, wherein the sizing board has sufficient workability and has excellent elongation at break of the cured product. It is to provide a ring method.
- the present inventors In order to improve the elongation at break of a cured product of a curable composition containing an oxyalkylene-based polymer having a reactive silicon group and a vinyl-based polymer having a reactive silicon group, the present inventors have proposed a method for improving the elongation at break. It is very effective to make the number average molecular weight of the oxyalkylene polymer (A) having a silicon group be 160000 or more, and the oxyalkylene polymer plasticizer is used as a plasticizer. The inventors have found that the present invention is excellent, and have reached the present invention. That is, the present invention relates to the following inventions.
- the oxyalkylene polymer (A) is a polyethylene oxide, a polypropylene oxide, a propylene oxide ethylene oxide copolymer, and a polybutylene. And at least one curable composition selected from oxides.
- a curable composition wherein the main chain skeleton of the oxyalkylene polymer (A) is a polymer obtained using a double metal cyanide complex catalyst.
- Curable composition wherein the reactive gay group of the oxyalkylene polymer (A) is a group consisting of one silicon atom and two hydrolyzable groups bonded to this silicon atom.
- the vinyl polymer (B) is polymerized in an oxyalkylene polymer plasticizer (C), and the oxyalkylene polymer plasticizer (C) used in the polymerization is a plasticizer.
- a curable composition used for part or all. A curable composition wherein the weight composition ratio of the oxyalkylene polymer (A) and the vinyl polymer (B) is 90/10 to: L0 / 90.
- the amount of the oxyalkylene polymer plasticizer (C) used is 5 to 150 parts by weight based on 100 parts by weight of the total of the oxyalkylene polymer (A) and the vinyl polymer (B). Composition.
- the amount of the oxyalkylene polymer plasticizer (C) used is 10 to 120 parts by weight with respect to the total of 100 parts by weight of the oxyalkylene polymer (A) and the vinyl polymer (B). Curable composition.
- the amount of the oxyalkylene polymer plasticizer (C) used is 20 to 100 parts by weight based on 100 parts by weight of the total of the oxyalkylene polymer (A) and the vinyl polymer (B). Curable composition.
- a curable composition comprising another plasticizer in addition to the oxyalkylene polymer plasticizer (C).
- a curable composition further containing a scale-like or granular substance having a diameter of 0.1 mm or more.
- a curable composition further comprising a balloon.
- a curable composition having a balloon particle size of 0.1 mm or more having a balloon particle size of 0.1 mm or more.
- a curable composition used as a joint sealant for sizing pods is not limited to, but not limited to, but not limited to,
- a curable composition used as a joint sealant for ceramic sizing pods comprising filling and curing a curable composition as a sealing material.
- the composition of the present invention comprises an oxyalkylene polymer (A) having a reactive silicon group.
- the cured product has a large elongation at break because the number average molecular weight is 160000 or more.
- oxyalkylene polymer plasticizer (C) is used, octyl phthalate is used.
- C oxyalkylene polymer plasticizer
- octyl phthalate is used.
- the cured product has the same or better elongation at break. This effect is extremely useful for sealing materials, especially for sizing boards, in combination with the effect that the molecular weight of the oxyalkylene-based polymer (A) is increased so that the elongation at break is excellent. is there.
- the main chain of the oxyalkylene polymer (A) is essentially
- R is a divalent organic group, and is preferably a linear or branched alkylene group having 1 to 14 carbon atoms.
- Such a polymer is preferred because it has a relatively low glass transition temperature and the resulting cured product has excellent cold resistance.
- R in Formula 1 is preferably a linear or branched alkylene group having 1 to 14 carbon atoms, more preferably 2 to 4 carbon atoms.
- Specific examples of the repeating unit represented by Chemical Formula 1 include:
- the main chain skeleton of the oxyalkylene polymer may be composed of only one type of repeating unit, or may be composed of two or more types of repeating units.
- An example is a xidobutylene oxide copolymer.
- a propylene oxide-based polymer (polypropylene oxide), especially a propylene oxide unit of 80% by weight or more, preferably 90% by weight or more
- the polymer containing propylene oxide as a main component is preferred because it is amorphous and has a relatively low viscosity.
- a method for synthesizing an oxyalkylene polymer for example, a polymerization method using an alcohol catalyst such as KOH, for example, an organic aluminum compound and porphyrin disclosed in Japanese Patent Application Laid-Open No. 61-216623 are disclosed.
- Polymerization method using a transition metal compound-porphyrin complex catalyst such as a complex obtained by the reaction, for example, Japanese Patent Publication No. 46-27250, Japanese Patent Publication No. 5.9-155336, U.S. Patent 3 2 7 8 4 5 7; U.S. Patent 3 2 7 8 4 5 8; U.S. Patent 3 2 7 8 4 5 9; U.S. Patent 3 4 2 7 2 5 6; U.S. Patent 3 4 2 7 3 3 No. 4, U.S.
- a polymerization method using a double metal cyanide complex catalyst such as a polymerization method using phosphazene described in Japanese Patent Application Laid-Open No. 11-0723.
- a polymerization method using a double metal cyanide complex catalyst is preferred.
- Polyoxyalkylenes such as polyoxypropylene having a number average molecular weight of 100,000 or more are preferably produced by a complex metal cyanide complex catalyst from the viewpoint of production cost and the like.
- An oxyalkylene polymer having a reactive silicon group The reactive silicon group contained in the component (A) has a hydroxyl group or a hydrolyzable group bonded to a gay atom and forms a siloxane bond. This is a group that can be crosslinked by As a representative example, (Formula 3)
- R 1 and R 2 are each an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or R ′ 3 S i O— (R 'Is a monovalent hydrocarbon group having 1 to 20 carbon atoms, and three R's may be the same or different.)
- R 'Is a monovalent hydrocarbon group having 1 to 20 carbon atoms, and three R's may be the same or different.
- X When two or more Xs are present, they may be the same or different X represents a hydroxyl group or a hydrolyzable group, and when two or more Xs are present, they are the same
- A represents 0, 1, 2 or 3
- b represents 0, 1 or 2
- m represents an integer of 0 to 19. However, a + (sum of b) ⁇ 1 is satisfied. ).
- the hydrolyzable group represented by X is not particularly limited, and may be any conventionally known hydrolyzable group. Specific examples include a hydrogen atom, a halogen atom, an alkoxy group, an acyloxy group, a ketoximate group, an amino group, an amide group, an acid amide group, an aminooxy group, a mercapto group, and an alkenyloxy group. Of these, a hydrogen atom, an alkoxy group, an acyloxy group, a ketoximate group, an amino group And an amide group, an aminooxy group, a mercapto group and an alkenyloxy group are preferred, and an alkoxy group is particularly preferred from the viewpoint of mild hydrolysis and easy handling.
- the hydrolyzable group or hydroxyl group can be bonded to one silicon atom in the range of 1 to 3 and a + (sum of b) is preferably in the range of 1 to 5.
- a + (sum of b) is preferably in the range of 1 to 5.
- the number of silicon atoms forming the reactive silicon group may be one, or may be two or more.In the case of silicon atoms linked by a siloxane bond or the like, about 20 atoms are present. Is also good. In addition,
- R 1 and X are the same as described above, and a is an integer of 1, 2 or 3).
- R 1 and R 2 in Chemical formulas 3, 4 and 5 include alkyl groups such as methyl group and ethyl group, cycloalkyl groups such as cyclohexyl group, and aryl groups such as phenyl group.
- Ararukiru group such as benzyl radical
- R triorganosiloxy group represented by 3 S i O-'is methyl radical R is a phenyl group,' and the like. Of these, a methyl group is particularly preferred.
- the reactive gayne group include a trimethoxysilyl group, a triethoxysilyl group, a triisopropoxysilyl group, a dimethoxymethylsilyl group, a diethoxymethylsilyl group, and a diisopropoxymethylsilyl group.
- a trimethoxysilyl group a triethoxysilyl group, a triisopropoxysilyl group, a dimethoxymethylsilyl group, a diethoxymethylsilyl group, and a diisopropoxymethylsilyl group.
- a trimethoxysilyl group is more reactive than a dimethoxymethylsilyl group
- a polymer having a toxicsilyl group has higher reactivity and a higher curing speed than a polymer having a dimethoxymethylsilyl group, but the cured product tends to have a smaller elongation at break.
- an oxyalkylene polymer having a trimethoxysilyl group as the oxyalkylene polymer (A)
- a curable composition having a high curing rate can be obtained.
- a curable composition having a high curing rate can be obtained.
- the amount of polymer with high reactivity such as a polymer having trimethoxysilyl group, and the ratio of both groups in the same polymer, etc. are adjusted so that the desired elongation at break and curing speed can be obtained. It is determined as appropriate.
- the introduction of the reactive silicon group may be performed by a known method. That is, an organic polymer having a functional group such as an unsaturated group such as a hydroxyl group or a vinyl group or an epoxy group or an isocyanate group in a molecule is provided with a functional group having a reactivity to the functional group and a reactive silicon group. Are reacted. For example, the following method can be mentioned.
- An organic polymer having a functional group such as a hydroxyl group in a molecule is reacted with an organic compound having an active group and an unsaturated group which are reactive with the functional group, and an organic polymer having an unsaturated group is reacted. Get united.
- an unsaturated group-containing organic polymer is obtained by copolymerization with an unsaturated group-containing epoxy compound. Then, the obtained reaction product is reacted with hydrosilane having a reactive silicon group to effect hydrosilylation.
- hydroxyl-terminated oxyalkylene polymer is alkoxidized, it is reacted with methallyl chloride to produce a methallyloxy-terminated oxyalkylene polymer, and hydrosilation can be performed by reacting with a silane compound such as dimethoxymethylsilane.
- a silane compound such as dimethoxymethylsilane.
- a polymer having a reactive silicon group derived from a methallyloxy group-terminated oxyalkylene polymer can be used in combination with a polymer having a reactive silicon group derived from an acryloxy group-terminated oxyalkylene polymer.
- the polymer (A) obtained by hydrosilylation of an oxyalkylene polymer having an aryloxy terminal or a metallyloxy group terminal has an ether bond at the terminal and has a viscosity of the composition as compared with a polymer having a urethane bond or the like. Lower preferred.
- a method in which a compound having a reactive silicon group is reacted at the terminal of the organic polymer is preferable.
- the oxyalkylene polymer (A) having a reactive silicon group may be linear or branched. If the molecular weight is the same, the use of a linear polymer will result in a larger elongation at break of the cured product compared to a branched polymer, but the viscosity of the composition before curing will increase, making it difficult to handle. Tend to be.
- the lower limit of the number average molecular weight of the oxyalkylene polymer (A) having a reactive silicon group is 160000.
- the upper limit is preferably 50,000, more preferably 30,000, and even more preferably 25,000.
- the number average molecular weight is less than 16, 000, the resulting cured oxyalkylene polymer (A) having a reactive silicon group has insufficient elongation at break, and the Exceeding this is not preferred because the functional group concentration becomes too low, the curing rate decreases, and the viscosity of the polymer becomes too high, making handling difficult. Further, it is particularly preferred that the number average molecular weight is from 16,000 to 30,000, from the viewpoint of the viscosity of the obtained reactive oxy group-containing oxyalkylene polymer.
- the molecular weight of the oxyalkylene polymer (A) having a reactive silicon group is more effective in improving the elongation at break of the cured product.
- increasing the molecular weight of the polymer will decrease the density of the reactive silicon group.
- the curing rate of the curable composition is expected to decrease.
- the number average molecular weight of the oxyalkylene polymer (A) having a reactive silicon group is 160000 or more, the curing rate hardly decreases.
- the molecular weight of the oxyalkylene polymer (A) having a reactive silicon group is increased, the crosslinking point decreases, and the weather resistance tends to decrease.
- the composition of the present invention is evaluated by a sunshine weather meter. It also has the advantage that little difference in the reduction in weatherability is observed.
- the number average molecular weight of the oxyalkylene polymer (A) having a reactive silicon group is at least 17,000, more preferably at least 18,000, and especially at least 1. It is preferably 9,000 or more.
- the upper limit of the molecular weight is 25,000, more preferably 23,000, and particularly preferably 22,000, from the viewpoint of the viscosity of the composition.
- the oxyalkylene polymer (A) When the number average molecular weight of the oxyalkylene polymer (A) is set to 160000 or more in order to improve the elongation at break of the cured product, the oxyalkylene polymer is required to obtain a sufficient elongation at break. Is preferably a linear polymer having substantially no branch. Further, the reactive silicon group of the oxyalkylene polymer (A) is preferably a group such as a dimethoxymethylsilyl group in which two hydrolyzable groups are bonded to one gayne atom.
- the amount of a group in which two hydrolyzable groups are bonded to one silicon atom such as a dimethoxymethylsilyl group is 50% or more, preferably 70% or more in the oxyalkylene polymer (A). It is more preferably at least 80%, particularly preferably at least 90%.
- the number average molecular weight of the oxyalkylene polymer (A) having a reactive silicon group is as follows.
- the terminal group concentration is measured directly by titration analysis based on the principle of the hydroxyl value measurement method of JISK1557 and the measurement method of the iodine value of JISK070, and the Considering the structure (determined by the number of terminals and the polymerization initiator used) It is defined as the molecular weight corresponding to the number average molecular weight (terminal group molecular weight) obtained by the above.
- a relative measurement method of the number average molecular weight it is possible to prepare a calibration curve of the polystyrene conversion molecular weight obtained by general GPC measurement and the above-mentioned terminal group molecular weight, and convert the GPC molecular weight into the terminal group molecular weight.
- a polymer containing a functional group other than a hydroxyl group or an unsaturated group it can be measured by a relative measurement method.
- the oxyalkylene polymer (A) used in the present invention preferably has at least one, preferably 1.1 to 5 reactive silicon groups on average in one molecule of the polymer. In the case of a substantially linear polymer, it is preferred that 1.2 to 1.6 are present. If the number of reactive silicon groups contained in the molecule is less than one on average, the curability will be insufficient, and if the number is too large, the network structure will be too dense and good mechanical properties will be exhibited. No longer.
- the reactive silicon group of the oxyalkylene polymer (A) used in the present invention may be present as a side chain inside the polyether molecular chain or at a terminal, but the reactive silicon group may be present.
- the group is present as a side chain, the amount of effective network chains contained in the finally formed cured product decreases, so that a rubber-like cured product having a high elastic modulus and low elongation at break is easily obtained.
- the reactive silicon group is present near the end of the molecular chain, the amount of effective network chains contained in the finally formed cured product will increase, and therefore, a rubber exhibiting high strength, high elongation at break and low elastic modulus A cured product is easily obtained.
- the amount of effective network chains contained in the finally formed cured product becomes the largest, so that the tensile elongation has a large elongation at break and a rubber elasticity with high flexibility. This is preferable for use in building sealants that it is desirable to have.
- the vinyl polymer (B) having a reactive silicon group has a large contribution to the increase in viscosity of the obtained composition and tends to reduce workability.
- an oxypropylene-based polymer obtained by using a double metal cyanide complex catalyst as the polymer (A) the increase in viscosity of the obtained composition can be suppressed and the workability can be improved.
- a double metal cyanide complex catalyst is used, a polymer having an MwZMn of 1.6 or less, preferably 1.5 or less can be obtained.
- an oxypropylene polymer obtained using a double metal cyanide complex catalyst is used as the oxypropylene polymer having a reactive silicon group (A)
- a linear polymer having a number average molecular weight of 16,000 or more can be obtained.
- a polymer obtained by a radical polymerization method other than the living radical polymerization method such as a (meth) acrylic random copolymer
- the vinyl polymer (B) having a reactive silicon group is used as the vinyl polymer (B) having a reactive silicon group.
- the viscosity of the composition is expected to be very large, it falls within the range of about 100 Pa ⁇ s or 80 Pa ⁇ s that can be used as a sealant composition.
- a vinyl polymer (B) having a reactive gay group is used in combination with the polymer (A).
- a method for blending a vinyl polymer having a reactive silicon group (B) and an oxyalkylene polymer having a reactive silicon group (A) is disclosed in JP-A-59-122541 and JP-A-59-122541. 1 12642, JP-A-6-172631, JP-A-60-228517, etc., but are not limited thereto. It is not done.
- the monomers used in the vinyl polymer (B) of the present invention include, for example, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methyl acrylate Acrylates and methacrylates such as 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, benzyl acrylate, and benzyl methacrylate (hereinafter acrylate and methacrylic esters) Acid esters are also referred to as (meth) acrylic esters); amide compounds such as acrylamide, methylacrylamide, N-methylolacrylamide, and N-methylolmethacrylamide; epoxy compounds such as glycidyl acrylate and glycidyl methacrylate; Tylaminoethyl acrylate, getylaminoethyl Methacrylate, amino compounds such as Aminoechirubi two ether; other
- the cured product when the cured product requires rubber elasticity and further requires weather resistance, it is desirable that the cured product contains (meth) acrylates, especially alkyl (meth) acrylates, and 50% by weight. As described above, more preferably 70% by weight or more, particularly preferably 80% by weight or more, most preferably 85% or more or 90% by weight or more.
- an acrylate monomer and / or an alcohol derived from an alcohol having 9 or more carbon atoms, preferably 10 or more carbon atoms is referred to as an alkyl (meth) acrylate.
- (meth) acrylic derived from alcohol having 9 or more carbon atoms It is not necessary to use an acid ester monomer, and it is not necessary to use a (meth) acrylate monomer derived from alcohol having 9 or more carbon atoms.
- (Meth) acrylic acid ester monomers such as a combination system of butyl acrylate and ethyl acrylate can also be used.
- the vinyl polymer (B) preferably has a number average molecular weight of 500 to 100,000 in view of easy handling.
- those having a molecular weight of 3,000 to 30,000, particularly those having a molecular weight of 5,000 to 20,000 are preferred.
- those having a molecular weight of 10,000 to 20,000 are more preferred because the elongation properties of the cured product are improved and the weather resistance and workability are good.
- the number average molecular weight is 5,5 to maintain the elongation characteristics at the same level as a polymer with a number average molecular weight of 10,000 to 20,000 and to improve workability. It is also possible to make it between 000 and 12,000, and even between 7000 and 10,000.
- the number average molecular weight of the Bier polymer (B) is measured as a polystyrene equivalent molecular weight by GPC.
- the reactive silicon group contained in the vinyl polymer (B) the above-described reactive silicon group can be used in the same manner, and the preferred reactive silicon group is also the same.
- the number of reactive silicon groups per molecule of vinyl polymer (B) is preferably 1.1 to 5.
- Reactive silicon groups having high reactivity such as trimethoxysilyl group are converted to vinyl polymers. It can be introduced to increase the curing rate of the composition. Details have already been described. It is preferable to introduce a highly reactive functional group such as a trimethoxysilyl group into the Pier polymer because it is easy.
- a method for introducing a reactive silicon group into the vinyl polymer (B) is described in JP-A-63-112642 and the like.
- the skeletal polymer of the vinyl polymer (B) is usually produced by a general radical polymerization method using a radical initiator, and as disclosed in JP-A-2000-178456, a living radical It can also be obtained by a polymerization method or the like.
- the molecular weight distribution (Mw / Mn) is usually 1.8 or more when the number average molecular weight is 10,000 or more, and in the living radical polymerization method, the molecular weight distribution (MwZMn) is less than 1.8 And 1.7 or less and 1.6 or less are obtained.
- the molecular weight distribution (MwZMn) can be measured using GPC (polystyrene conversion).
- the curable composition used with the oxyalkylene polymer (A) having a group has a higher viscosity than the curable composition using only the oxyalkylene polymer (A) having a reactive silicon group, and has higher workability.
- a curable composition having a viscosity that can be used for a sealing material can be obtained.
- a (meth) acrylic polymer having a reactive silicon group is preferred, but when this polymer is obtained by a usual radical polymerization method, (Meth) acrylic acid alkyl ester monomer having an alkyl group having 9 or more carbon atoms, preferably 10 or more carbon atoms, (meth) acrylic acid alkyl ester monomer having an alkyl group having 1 to 8 carbon atoms and reaction It is preferable to use an acrylic and Z or methacrylic monomer having an acidic silicon group to obtain these random copolymers.
- an alkyl (meth) acrylate monomer having an alkyl group having 9 or more carbon atoms is not used. It is preferable to use an acryl- and / or methacryl-based monomer having a reactive silicon group and to obtain these random copolymers. These copolymers may of course contain other monomer units. Further, as a random copolymer having a reactive silicon group, an acryl-based and Z- or methacryl-based monomer having a functional group such as a hydroxyl group instead of a part of an acryl-based or Z- or methacryl-based monomer is used. An acrylic, Z or methacrylic random copolymer in which a random copolymer is produced by the above polymerization method and a reactive gay group is introduced using the functional group can also be used.
- the upper limit of the composition ratio (A) / (B) (weight ratio) of the oxyalkylene polymer having a reactive silicon group (A) and the vinyl polymer having a reactive silicon group (B) is 90%. It is preferably no. 10, more preferably 80/20, further preferably 75 Z25, and particularly preferably 70/30.
- the lower limit is preferably 10 Z 90, more preferably 25/75, and even more preferably 30/70. 'A combination of any of the upper and lower limits of 12 can be used, and a narrower range is more preferable.
- the amount of the oxyalkylene-based polymer (A) having a reactive silicon group is larger than 910, the modified silicone-based In some cases, the weather resistance of the sealing material is insufficient.
- the amount is less than 10/90 and the amount of the vinyl polymer (B) having a reactive gay group is large, the weather resistance is improved, but the viscosity of the composition is increased, and the workability of the composition is increased. May worsen.
- an alkyl acrylate polymer having a reactive silicon group and an alkylester methacrylate polymer having a reactive silicon group are used.
- an oxypropylene polymer having a reactive silicon group is used as the oxyalkylene polymer (A)
- (A) Z (B) is 75/25 to 55 in addition to the above upper and lower weight ratio ranges. A range of / 45 is preferred.
- an oxypropylene polymer having a reactive silicon group having a number average molecular weight of 16,000 or more, particularly 18,000 or more and a molecular weight distribution Mw / Mn of 1.5 or less is used, the above upper and lower limits are used.
- (A) / (B) is preferably in the range of 75Z25 to 55Z45.
- Z (B) is in the range of 75Z25 to 55Z45, both weather resistance and workability can be more sufficiently achieved. More preferably, it is in the range of 70/30 to 55Z45.
- a method using a polymer obtained by polymerizing the biel polymer (B) in an oxyalkylene polymer plasticizer (C) is preferable because the tensile elongation characteristics are further improved.
- the oxyalkylene polymer plasticizer (C) used in the polymerization is used as a part or all of the plasticizer of the curable composition of the present invention.
- the plasticizer (C) include polyoxyethylene, polyoxypropylene, and polyoxybutane. Tylene, polyoxytetramethylene, polyoxyethylene-polyoxypropylene copolymer, polyoxypropylene-polyoxybutylene copolymer and the like are exemplified. Of these, polyoxypropylene is preferred.
- the molecular weight of the oxyalkylene polymer plasticizer (C) acts as a plasticizer for the oxyalkylene polymer (A) having a reactive silicon group, and its molecular weight is determined by the oxyalkylene polymer (C).
- the lower limit is preferably 500, more preferably 800, and still more preferably 1,000.
- the upper limit is preferably 150, 000, more preferably 100, 000, even more preferably 8, 000, and particularly preferably 5, 000. Any combination of the upper limit and the lower limit of 12 can be used, and a narrow range is more preferable.
- the lower limit is 5,000 or less, more preferably 4,0000 or less, still more preferably the lower limit is 50,000, and the upper limit is 5,000, particularly preferably the lower limit. Is 800 and the upper limit is 5,000. If the molecular weight is too low, the plasticizer flows out over time due to heat or rainfall, and the initial physical properties cannot be maintained for a long time, and the weather resistance tends to be unable to be improved. On the other hand, if the molecular weight is too high, the viscosity tends to be high and the workability tends to be poor.
- the number average molecular weight is the same as the molecular weight used for the oxyalkylene polymer (A) and corresponds to the number average molecular weight obtained by the end group analysis.
- a polymer having Mw / Mn of 1.6 or less, more preferably 1.5 or less can be used.
- the molecular weight distribution (MwZMn) is measured using GPC (polystyrene conversion).
- the oxyalkylene polymer used as the component (C) may be one produced by a usual polymerization method using a caustic alkali, but may be a polymer obtained by using a double metal cyanide complex such as zinc hexacyanocopartate as a catalyst. Those manufactured by law can also be used.
- the oxyalkylene polymer used as the component (C) a polymer having a hydroxyl group at a terminal can be used. Further, in order to improve the stickiness of the surface of the cured product and the coatability of the alkyd paint on the surface of the cured product, the terminal is an aryl group as described in JP-A-11-279598. It is also possible to use a polymer blocked with a group such as Wear.
- a polymer having no reactive silicon group can be used, but a reactive silicon group may be introduced. In this case, it becomes a reactive plasticizer and can prevent elution of the plasticizer.
- the amount of the reactive silicon group to be introduced is preferably less than one per molecule of the polymer.
- the amount of the plasticizer (C) used is 100 parts by weight in total of the oxyalkylene polymer having a reactive silicon group (A) and the vinyl polymer having a reactive gay group (B).
- the lower limit is preferably 5 parts by weight, more preferably 10 parts by weight, and further preferably 20 parts by weight.
- the upper limit is preferably 150 parts by weight, more preferably 120 parts by weight, and even more preferably 100 parts by weight. If the amount is less than 5 parts by weight, the effect as a plasticizer is difficult to be exhibited, and if it exceeds 150 parts by weight, the mechanical strength of the cured product tends to be insufficient.
- These plasticizers can be added at the time of polymer production.
- a curing catalyst may or may not be used.
- conventionally known curing catalysts can be widely used.
- Specific examples thereof include titanium compounds such as tetrabutyl titanate, tetrapropyl titanate, and titanium tetraacetyl acetate; dibutyltin dilaurate, dibutyltin maleate, dibutyltin phthalate, dibutyltin dioctate, and dibutyltin getyl.
- Zirconium compounds such as cetonat; lead octylate; butylamine, octylamine, dibutylamine, monoethanolamine, jetanolamine, triethanolamine, diethylenetriamine, triethylenetetramine, oleylamine, cyclohexylamine, benzylamine, Getylaminopropylamine, xylylenediamine, triethylenediamine, guanidine, diphenyldazine, 2,4,6-tris (dimethylaminomethyl) phenol, morpholine, N-methylmorpholine, 2-ethyl- Amine compounds such as 4-methylimidazole, 1,8-diazabicyclo (5,4,0) indene-7 (DBU), or salts of these amine compounds with carboxylic acids, etc .; From polyamines and polybasic acids Low molecular weight polyamide resin; reaction product of excess polyamine and epoxy compound; amino such as T-aminopropyl trimeth
- the amount of these curing catalysts used is based on 100 parts by weight of the total amount of the oxyalkylene-based polymer (A) having a reactive silicon group and the vinyl-based polymer (B) having a reactive silicon group.
- the content is preferably about 0.1 to 20 parts by weight, more preferably about 1 to 10 parts by weight. If the amount of the curing catalyst used is too small, the curing speed becomes slow, and the curing reaction does not easily proceed sufficiently. On the other hand, if the amount of the curing catalyst used is too large, local heat generation or foaming occurs during curing, and it becomes difficult to obtain a good cured product, which is not preferable.
- the condensation catalyst of the general formula R a S i (OR) 4 _ a (wherein, R is independently, substituted C 1-2 0 Or a non-substituted hydrocarbon group, and a is any one of 0, 1, 2, and 3.)).
- the silicon compound include, but are not limited to, phenyltrimethoxysilane, phenylmethyldimethoxysilane, phenyldimethylmethoxysilane, diphenyldimethoxysilane, and diphenyldimethoxysilane. 08741
- R in the general formulas such as phenylethoxysilane and triphenylmethoxysilane be an aryl group having 6 to 20 carbon atoms because the effect of accelerating the curing reaction of the composition is large.
- diphenyldimethoxysilane / diphenyljetoxysilane is particularly preferable because of its low cost and easy availability.
- the amount of the silicon compound is based on 100 parts by weight of the total amount of the oxyalkylene polymer having a reactive silicon group (A) and the vinyl polymer having a reactive silicon group (B). About 0.1 to 20 parts by weight, more preferably 0.1 to 10 parts by weight. If the amount of the silicon compound falls below this range, the effect of accelerating the curing reaction may be reduced. On the other hand, if the amount of the silicon compound exceeds this range, the hardness and tensile strength of the cured product may decrease.
- a silane coupling agent a reactant of the silane coupling agent, or a compound other than the silane coupling agent can be added as an adhesion-imparting agent.
- the silane coupling agent include, but are not limited to, iso-isopropyl propyl trimethoxy silane, sodium i-sodium propyl triethoxy silane, i-isocyanate propyl methyl ethoxy silane, and i-isocyanate propyl methyl dimethoxy silane.
- Isocyanate group-containing silanes aminopropyltrimethoxysilane, aminopropyltriethoxysilane, aminopropylpyrmethyldimethylethoxysilane, aminopropylmethylethoxysilane, N-(/ 3-aminoethyl) 1-aminopropyltrimethoxysilane, N— ( ⁇ -aminoethyl) 1-aminopropylmethyldimethoxysilane, ⁇ - ( ⁇ -aminoethyl) -aminopropyltriethoxysilane, ⁇ — ( ⁇ — Aminoethyl) —Araminopro Methyl ethoxysilane, aureidopropyltrimethoxysilane, phenylphenylaminopropyltrimethoxysilane, benzylbenzylaminopropyltrimethoxysilane, vinylvinylaminopropyl Amino group-containing
- silane coupling agent used in the present invention usually has a total amount of 100% by weight of the oxyalkylene-based polymer (A) having a reactive silicon group and the Bier-based polymer (B) having a reactive gayne group. Parts are used in the range of 0.1 to 20 parts by weight. In particular, it is preferably used in the range of 0.5 to 10 parts by weight.
- the effect of the silane coupling agent added to the curable composition of the present invention is as follows: various adherends, that is, inorganic substrates such as glass, aluminum, stainless steel, zinc, copper, and mortar; When used for organic substrates such as polyethylene, polypropylene, and polyproponate, it shows a remarkable effect of improving adhesiveness under non-primer or primer treatment conditions. When used under non-primer conditions, the effect of improving the adhesion to various adherends is particularly remarkable.
- Specific examples other than the silane coupling agent include, but are not particularly limited to, epoxy resins, phenolic resins, sulfur, alkyl titanates, aromatic polyisocyanates, and the like.
- the adhesiveness imparting agent may be used alone, 3 008741
- the composition of the present invention can contain various fillers.
- fillers include reinforcing fillers such as fumed silica, precipitated silica, crystalline silica, fused silica, dolomite, caic anhydride, hydrated gay acid, and carbon black; heavy carbon dioxide, calcium colloid, Magnesium carbonate, diatomaceous earth, calcined clay, clay, talc, titanium oxide, bentonite, organic bentonite, ferric oxide, aluminum fine powder, flint powder, zinc oxide, active zinc white, shirasu balloon, glass micro balloon, phenolic resin
- fillers such as resin powders such as organic micro-balloons of vinylidene chloride resin, PVC powder, and PMMA powder; and fibrous fillers such as asbestos, glass fibers, and filaments.
- the amount used is 100 parts by weight of the total amount of the oxyalkylene polymer having a reactive silicon group (A) and the vinyl polymer having a reactive silicon group (B). 1 to 300 parts by weight, preferably 10 to 200 parts by weight.
- a high-strength cured product by using these fillers mainly use fumed silica, precipitated silica, crystalline silica, fused silica, dolomite, gaelic anhydride, hydrated keic acid and lye pump rack, surface A filler selected from treated fine calcium carbonate, calcined clay, clay, activated zinc white, and the like is preferable, and an oxyalkylene polymer (A) having a reactive silicon group and a vinyl polymer having a reactive silicon group are preferred. A preferable result can be obtained if it is used in an amount of 1 to 200 parts by weight with respect to 100 parts by weight in total with the combination (B).
- a filler selected mainly from titanium oxide, calcium carbonate, magnesium carbonate, talc, ferric oxide, zinc oxide, shirasu balloon, etc. Is 5 to 200 parts by weight based on a total of 100 parts by weight of the vinyl polymer having a reactive silicon group (B) and the oxyalkylene polymer having a reactive silicon group (A).
- a favorable result can be obtained if used within the range.
- the higher the specific surface area of calcium carbonate the greater the effect of improving the breaking strength, breaking elongation and adhesiveness of the cured product.
- these fillers may be used alone or in combination of two or more. You may.
- Fatty acid surface treated colloidal calcium carbonate can be used in combination with calcium carbonate having a particle size of 1 or more, such as heavy calcium carbonate without surface treatment.
- an organic balloon or an inorganic balloon In order to improve the workability of the composition (e.g., sharpness) and to make the surface of the cured product dull, it is preferable to add an organic balloon or an inorganic balloon. These fillers can be surface-treated, and may be used alone or as a mixture of two or more. In order to improve workability (such as sharpness), the particle size of the balloon is preferably 0.1 or less. In order to make the surface of the hardened material opaque, 5 to 30 Om is preferable.
- the composition of the present invention is suitably used for joints of the outer wall of a house, such as a sizing board, particularly a ceramic sizing pod, because the cured product has good weather resistance. It is desirable that the designs of the materials are in harmony. In particular, high-quality exterior walls are being used as exterior walls due to the inclusion of sputter paint, colored aggregate, and the like.
- the composition of the present invention contains a scale-like or granular substance having a diameter of 0.1 mm or more, preferably about 0.1 to 5.Omm, the cured product is in harmony with such a high-grade exterior wall.
- the appearance of this cured product is an excellent composition that lasts for a long time. When a granular substance is used, the surface becomes sandy or sandstone-like, and when a flaky substance is used, the surface becomes uneven due to the scale.
- Preferred diameters, compounding amounts, materials and the like of the flaky or granular substance are as follows as described in JP-A-9-153063.
- the diameter is 0.1 mm or more, preferably about 0.1 to 5. Omm, and an appropriate size is used according to the material and pattern of the outer wall. 0.2mm ⁇ 5 Om m or 0.5mn! A size of about 5.0 mm can be used. In the case of a flaky material, the thickness is 1 / 10th of the diameter or less: about LZ5 thin (about 0.01 to 1.00 mm).
- the scaly or granular substance is premixed in the main sealing material and transported to the construction site as a sealing material, or is mixed into the main sealing material at the construction site when used.
- the scaly or granular substance is 1 to 100 parts by weight of the sealing material composition. About 200 parts by weight are blended. The amount is appropriately selected depending on the size of the individual scale-like or granular material, the material and pattern of the outer wall, and the like.
- the scaly or granular substance use is made of natural substances such as ky sand, My power, and inorganic substances such as synthetic rubber, synthetic resin, and alumina. In order to enhance the design when filling the joints, it is colored in an appropriate color according to the material and pattern of the outer wall.
- JP-A-9-153063 Preferred finishing methods and the like are described in JP-A-9-153063. If a balloon (preferably having an average particle size of 0.1 mm or more) is used for the same purpose, the surface becomes sandy or sandstone-like, and the weight can be reduced. Preferred diameters, compounding amounts, materials, and the like of the balloon are as described in JP-A-10-251618 as follows.
- the balloon is a spherical filler and has a hollow inside.
- the material of the balloon include inorganic materials such as glass, shirasu, and silica, and organic materials such as phenolic resin, urea resin, polystyrene, and saran, but are not limited thereto. Instead, an inorganic material and an organic material can be combined, or a plurality of layers can be formed by lamination.
- An inorganic, organic, or composite balloon can be used.
- the same balloon may be used, or a plurality of balloons of different materials may be mixed and used.
- the balloon one whose surface is processed or coated can be used, and that whose surface is treated with various surface treatment agents can be used. For example, coating of an organic balloon with calcium carbonate, talc, titanium oxide, or the like, or surface treatment of an inorganic balloon with a silane coupling agent may be mentioned.
- the balloon preferably has a particle size of 0.1 mm or more. Those having a thickness of about 0.2 mm to 5.0 mm or about 0.5 mm to 5.0 mm can also be used. If it is less than 0.1 mm, even if it is added in a large amount, it may only increase the viscosity of the composition and may not give a rough feeling.
- the blending amount of the balloon depends on the intended sanding or sandstone Can be easily determined by the degree of In general, it is desirable to blend a composition having a particle size of 0.1 mm or more in a volume concentration of 5 to 25 V 1% in the composition.
- volume concentration of the balloon When the volume concentration of the balloon is less than 5 V o 1%, there is no roughness, and when it exceeds 25 vol%, the viscosity of the sealing material becomes high, workability becomes poor, and the modulus of the cured product becomes high, The basic performance of the sealing material tends to be impaired.
- a particularly preferred volume concentration to balance with the basic performance of the sealing material is 8 to 22 V o 1%.
- an anti-slip agent as described in JP-A-2000-154368 and a cured product surface as described in JP-A-2001-164237 are added to the uneven state.
- Specific examples of balloons that can be added with an amine compound for making the state of matte, especially a primary or secondary amine having a melting point of 35 ° C. or more are described in JP-A-2-129262 and JP-A-Heisei 2-129262.
- the cured product can form irregularities on the surface and improve the design.
- Preferred diameters, blending amounts, materials and the like of the cured sealing material particles are as described in JP-A-2001-115142, as follows.
- the diameter is preferably about 0.1 to 1 mm, more preferably about 0.2 to 0.5 mm.
- the compounding amount is preferably 5 to 100% by weight, more preferably 20 to 50% by weight in the curable composition.
- the material include urethane resin, silicone, modified silicone, and polysulfurized rubber, and are not limited as long as they are used as a sealing material. Modified silicone-based sealing materials are preferable.
- composition of the present invention may optionally contain other plasticizer components in addition to the oxyalkylene polymer plasticizer.
- the plasticizer is not particularly limited.
- dibutyl phthalate, diheptyl phthalate may be used for the purpose of adjusting physical properties and adjusting properties.
- Phthalates such as di-, di (2-ethylhexyl) phthalate and butylbenzyl phthalate; non-aromatic compounds such as octyl adipate, octyl sebacate, dibutyl sebacate, and isodecyl succinate Basic acid esters; Aliphatic esters such as oleic acid methyl ester and methyl acetylsilinoleate; Phosphate esters such as tricresyl phosphate and tributyl phosphate; Trimellitic acid esters; Chlorinated paraffins; Hydrocarbon-based oils such as alkyl diphenyl, partially hydrogenated terphenyl, etc .; Process oils; Epoxy plasticizers such as epoxidized soybean oil and benzyl epoxystearate; Polyester-based plasticizers; Acrylic ester diacrylamide Plasticizer having acrylic component such as polymer of acrylic monomer such as Can be used alone or as a mixture of two or more
- plasticizers can be added at the time of polymer production.
- the weight ratio of the oxyalkylene polymer plasticizer to the plasticizer other than the other plasticizer is 90 /. 10 to: L 0 Z 90, more preferably 70/30 to 30/70.
- the plasticizer having an acrylic component is a polymer of an acryl monomer such as acrylate acrylamide. Preferred are polymers, including copolymers of acrylic esters, and copolymers of acrylic esters with other monomers. Specific examples of the acrylate ester include acrylate esters used for producing the component (B) of the present invention. Alkyl acrylates are preferred, and alkyl acrylates having an alkyl group having 1 to 8 carbon atoms, such as butyl acrylate and ethyl acrylate, are particularly preferred.
- the viscosity and slump properties of the curable composition and the mechanical properties such as tensile strength and elongation at break of the cured product obtained by curing the composition can be adjusted, and the acrylic component is not included in the molecule. Good weather resistance can be maintained for a long time as compared with the case where a plasticizer is used.
- a plasticizer having an acrylic component particularly an acrylic polymer obtained by the SGO process described later, is used, compared with a case where a plasticizer other than a plasticizer having an acrylic component is used, the cured product is damaged. This has the effect of increasing elongation.
- a polymer having a number average molecular weight of 160000 or more is used as the oxyalkylene polymer (A), and particularly, a sealing material having a large elongation at break of a cured product required for a sealing material for a sizing pad.
- a plasticizer using a plasticizer having an acrylic component in combination is a very suitable plasticizer.
- the number average molecular weight of the plasticizer having an acrylic component is preferably from 500 to 150, more preferably from 800 to 100, and more preferably from 1,000. 88, 000. If the molecular weight is too low, the plasticizer flows out over time due to heat or rainfall, and the initial physical properties cannot be maintained for a long time, and the weather resistance tends to be unable to be improved. On the other hand, if the molecular weight is too high, the viscosity tends to increase, and the workability tends to deteriorate.
- the plasticizer having an acrylic component acts as a plasticizer, it can be obtained from either or both the pinyl polymer (B) having a reactive silicon group and the oxyalkylene polymer (A) having a reactive silicon group. Usually, the viscosity is small. In particular, it is desirable that the plasticizer having an acryl component has a lower viscosity than the oxyalkylene polymer (A) having a reactive silicon group.
- the plasticizer having an acrylic component is either an oxyalkylene polymer having a reactive silicon group (A) or a vinyl polymer having a reactive silicon group (B) or both.
- the number average molecular weight is as small as 1, 000 or more, more preferably, 2, 000 or more, particularly 3, 000 or more.
- the number average molecular weight of the plasticizer having an acryl component is measured as a molecular weight in terms of polystyrene by GPC.
- the molecular weight distribution (MwZMn) is measured using GPC (polystyrene conversion).
- plasticizer having an acrylic component examples include (meth) acrylic compounds having a molecular weight distribution of 1.8 or less produced by living radical polymerization proposed in JP-A-2000-178486. Examples thereof include, but are not limited to, a polymer.
- polymers produced by the SGO process manufactured by Toagosei Co., Ltd. and Johnson Polymer Co., Ltd. described in “Industrial Materials”, August 1998, p. SGO polymers can be obtained by continuous bulk polymerization of acrylate monomers at high temperature and pressure. Usually liquid at room temperature and has functional groups Use one that does not exist. These may be used alone or in combination of two or more.
- the plasticizer having an acrylic component may be an acryl-based polymer having no reactive gay group or an acryl-based polymer having a reactive silicon group. Utilizing the hydroxyl group of the polymer by the SGO process containing a hydroxyl group, the reactive silicon group is introduced in the same manner as the method of introducing the reactive gay group in the oxyalkylene polymer (A) having the reactive gay group. Can be introduced.
- the acrylic polymer having a reactive silicon group acts as a reactive plasticizer, and has the effect of eliminating the plasticizer pread in the cured product.
- a plasticizer having an acryl component such as an acryl polymer having an average of one or less reactive gay group in the molecule is preferable.
- a physical property modifier for adjusting the bow I tension property of the resulting cured product may be added.
- the physical property modifier is not particularly limited. Examples thereof include alkylalkoxysilanes such as methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane and n-propyltrimethoxysilane; and glycidoxypropylmethyldiisoproponoxysilane.
- the hardness of the composition of the present invention when it is cured can be increased, or, on the contrary, the hardness can be reduced to give elongation at break.
- the physical property modifiers may be used alone or in combination of two or more.
- a compound having a monovalent silanol group in the molecule is produced by hydrolysis.
- the compound has an effect of reducing the modulus of the cured product without deteriorating the stickiness of the surface of the cured product.
- a compound that generates trimethylsilanol is preferable.
- Examples of the compound which produces a compound having a monovalent silanol group in the molecule by hydrolysis include the compounds described in JP-A-5-117215. Also disclosed are compounds which are derivatives of alkyl alcohols such as hexanol, octanol and decanol and which produce silicon compounds which generate R 3 Si ⁇ H such as trimethylsilanol by hydrolysis.
- a silicon compound which is a derivative of an oxyalkylene polymer as described in Japanese Patent Application Laid-Open No. Hei 7-258534 and generates R 3 SiOOH such as trimethylsilanol by hydrolysis is used.
- the resulting compound can also be mentioned.
- a polymer having a crosslinkable hydrolyzable silicon-containing group and a silicon-containing group which can be converted to a monosilanol-containing compound by hydrolysis described in JP-A-6-2796993 is disclosed. Can also be used.
- the physical property modifier is used in an amount of 0.1 to 100 parts by weight based on 100 parts by weight of the total amount of the oxyalkylene polymer (A) having a reactive gay group and the vinyl polymer (B) having the reactive gay group. It is used in an amount of 20 parts by weight, preferably 0.5 to 10 parts by weight.
- a thixotropic agent may be added to the curable composition of the present invention, if necessary, to prevent sagging and improve workability.
- the anti-sagging agent is not particularly limited, and examples thereof include polyamide waxes; hydrogenated castor oil derivatives; and metal stones such as calcium stearate, aluminum stearate, and barium stearate. These thixotropy-imparting agents (anti-sagging agents) may be used alone or in combination of two or more.
- the thixotropy-imparting agent is used in an amount of 0.1 parts by weight based on 100 parts by weight of the total amount of the oxyalkylene polymer (A) having a reactive silicon group and the vinyl polymer (B) having a reactive silicon group. Used in the range of 1 to 20 parts by weight. P2003 / 008741
- a compound containing an epoxy group in one molecule can be used.
- the resilience of a cured product can be improved.
- the compound having an epoxy group include epoxidized unsaturated oils and fats, epoxidized unsaturated fatty acid esters, alicyclic epoxy compounds, compounds shown in epichlorohydrin derivatives, and mixtures thereof.
- epoxidized soybean oil, epoxidized linseed oil, di- (2-ethylhexyl) 4,5-epoxycyclohexane-1,2-dicarboxylate (E-PS), epoxy Cutyl stearate, epoxybutyl stearate and the like can be mentioned.
- E-PS is particularly preferred.
- a compound having one epoxy group in the molecule is used in an amount of 0.5 to 50 parts by weight based on 100 parts by weight of the total amount of the oxyalkylene polymer (A) having a reactive silicon group and the vinyl polymer (B) having a reactive silicon group. It is preferred to use in the range of parts by weight.
- Photocurable substances can be used in the composition of the present invention. When a photocurable substance is used, a film of the photocurable substance is formed on the surface of the cured product, and the stickiness of the cured product and the weather resistance of the cured product can be improved.
- a photocurable substance is a substance in which the molecular structure undergoes a chemical change in a very short time due to the action of light to cause a physical change such as curing.
- Many compounds of this kind are known, such as organic monomers, oligomers, resins, and compositions containing them, and any commercially available compounds can be employed. Typical examples thereof include unsaturated acryl compounds, polyvinyl citrates, and azide resins.
- Unsaturated acrylic compounds include monomers or oligomers having one or several acrylic or methylacrylic unsaturated groups, or mixtures thereof, such as propylene (or butylene, ethylene) glycol di (meth) Monomers such as acrylate and neopentyl glycol di (meth) acrylate, or oligomers having a molecular weight of 10,000 or less are exemplified.
- Aronix M-210 specialty acrylate (bifunctional) Aronix M-210, Aronix M-215, Aronix M-220, Aronix M-233, Aronix M-240, Aronix M-245; Aronix M-305, Aronix M-309, Aronix M-310, Aronix M-315, Aronix M-320, Aronix M-325, and (Polyfunctional) Aronix M-400.
- Government Compounds containing functional groups are preferable, and compounds containing three or more functional groups on average in one molecule are preferable. (All of Aronix are products of Toa Gosei Chemical Industry Co., Ltd.)
- polyvinyl cinnamate examples include a photosensitive resin having a cinnamoyl group as a photosensitive group, which is obtained by esterifying polyvinyl alcohol with gay cinnamate, and also includes many poly cinnamate derivatives.
- Azide resin is known as a photosensitive resin having an azide group as a photosensitive group.
- a photosensitive resin see March 17, 1972) Nihon Shuppan, published by The Printing Society of Japan, page 93-, page 106-, page 117-), and these are used singly or in combination, and if necessary, may be added with a sensitizer. can do. In some cases, the effect may be enhanced by adding a sensitizer such as ketones or nitrates, or an accelerator such as amines.
- the amount of the photocurable substance used is determined by the amount of the oxyalkylene polymer having a reactive
- the amount is preferably from 0.01 to 20 parts by weight, more preferably from 0.5 to 10 parts by weight, based on 100 parts by weight of the total amount of A) and the vinyl polymer having a reactive silicon group (B). Part range is preferred. If the amount is less than 0.01 part by weight, the effect of enhancing the weather resistance is small. If the amount is more than 20 parts by weight, the cured product becomes too hard and cracks occur, which is not preferable.
- Oxygen curable substances can be used in the composition of the present invention.
- the oxygen-curable substance include unsaturated compounds that can react with oxygen in the air.They react with the oxygen in the air to form a cured film near the surface of the cured product, giving the surface a sticky or curable surface. It acts to prevent the adhesion of dust.
- oxygen-curable substances include drying oils such as tung oil and linseed oil, and various alkyd resins obtained by modifying the compounds; acrylic polymers modified with the drying oil; Resin, silicon resin; 1,2-polybutadiene, 1,4-polybutadiene, 1,4-polybutadiene, C5-C obtained by polymerizing or copolymerizing gen-based compounds such as butadiene, chloroprene, isoprene, and 1,3-pentadiene NBR, SBR obtained by copolymerizing a liquid polymer such as a polymer of 8 gen, or a monomer such as acrylonitrile or styrene, which has copolymerizability with these gen-based compounds, so that the gen-based compound is mainly used.
- drying oils such as tung oil and linseed oil, and various alkyd resins obtained by modifying the compounds
- acrylic polymers modified with the drying oil Resin, silicon resin
- modified products thereof maleated modified products, boiled oil modified products, etc.
- These may be used alone or in combination of two or more.
- tung oil and liquid gen-based polymers are particularly preferred.
- the effect may be enhanced when a catalyst or a metal dryer that promotes the oxidation-hardening reaction is used in combination.
- these catalysts and metal dryers include metal salts such as cobalt naphthenate, lead naphthenate, zirconium naphthenate, cobalt octoate, and zirconium octoate, and amine compounds.
- the amount of the oxygen-curable substance used is based on 100 parts by weight of the total amount of the oxyalkylene polymer (A) having a reactive silicon group and the vinyl polymer (B) having a reactive silicon group. It is preferably used in the range of 0.1 to 20 parts by weight, more preferably 1 to 10 parts by weight. When the amount is less than 0.1 part by weight, the improvement of the stainability becomes insufficient, and when the amount exceeds 20 parts by weight, the tensile properties of the cured product tend to be impaired. As described in JP-A-3-16053, it is preferable to use an oxygen-curable substance in combination with a photocurable substance.
- An antioxidant can be used in the composition of the present invention.
- the use of an antioxidant can enhance the weather resistance of the cured product.
- examples of the antioxidant include a hindered phenol system, a monophenol system, a bisphenol system, and a polyphenol system. Among them, a hindered phenol system is particularly preferable.
- Tinuvin 622LD, Tinuvin 144, CHIMASS0RB944LD, CHIMASS0RB1 19FL (all manufactured by Ciba Specialty Chemicals Co., Ltd.); -68 (all manufactured by Asahi Denka Kogyo Co., Ltd.); SANOL LS-770, SANOL LS-765, SANOL LS-292, SANOL LS-2626, SANOL LS-11, SANOL LS-744 (ALL A hindered amine-based light stabilizer disclosed in Sankyo Co., Ltd.) can also be used. Specific examples of the antioxidant are also described in Japanese Patent Application Laid-Open No. 4-2833259 and Japanese Patent Application Laid-Open No. 9-194731.
- the amount of the antioxidant used is 0 with respect to 100 parts by weight of the total amount of the oxyalkylene polymer (A) having a reactive silicon group and the vinyl polymer (B) having a reactive silicon group. It should be used in the range of 1 to 10 parts by weight. 8741
- Light stabilizers can be used in the compositions of the present invention.
- the use of a light stabilizer can prevent photo-oxidation degradation of the cured product.
- Benzotriazoles, hindered amines, benzoate compounds and the like can be exemplified as light stabilizers, and particularly preferred are hindered amides.
- the light stabilizer is used in an amount of 0.1 part by weight based on 100 parts by weight of the total amount of the oxyalkylene polymer having a reactive silicon group (A) and the vinyl polymer having a reactive silicon group (B).
- the amount is preferably in the range of 1 to 10 parts by weight, more preferably 0.2 to 5 parts by weight. Specific examples of the light stabilizer are also described in JP-A-9-194473.
- a hinderdamine-based light stabilizer is used. It is preferable to use a tertiary amine-containing hindered amine light stabilizer for improving the storage stability of the composition.
- Tinuvin 622LD Tinuvin 144, CHI ASS0RB1 19FL (all manufactured by Ciba Specialty Chemicals Co., Ltd.); ADK STAB LA-57, ADK STAB LA-62, ADK STAB LA-67, ADK STAB LA-63 (all manufactured by Asahi Denka Kogyo Co., Ltd.); Sanol LS-765, LS-292, LS-2626, LS-1114, LS-744 (all manufactured by Sankyo Co., Ltd.), etc. Light stabilizers.
- An ultraviolet absorber can be used in the composition of the present invention.
- the use of an ultraviolet absorber can enhance the surface weather resistance of the cured product.
- Examples of the ultraviolet absorber include benzophenone-based, benzotriazole-based, salicylate-based, substituted tolyl-based, and metal chelate-based compounds, and benzotriazole-based compounds are particularly preferred.
- the amount of the ultraviolet absorber used is based on 100 parts by weight of the total amount of the oxyalkylene polymer having a reactive silicon group (A) and the Bier polymer having a reactive gay group (B). It is preferably used in the range of 0.1 to 10 parts by weight, more preferably 0.2 to 5 parts by weight. It is preferable to use a combination of a phenol-based or hindered phenol-based antioxidant, a hinderamine-based light stabilizer and a benzotriazole-based ultraviolet absorber. 8741
- Epoxy resins such as epichlorohydrin-bisphenol A-type epoxy resin, epichlorohydrin-bisphenol F-type epoxy resin, flame-retardant epoxy resins such as glycidyl ether of tetrabromobisphenol A, and Nopolak type Epoxy resin, hydrogenated bisphenol A epoxy resin, darisidyl ether epoxy resin of bisphenol A propylene oxide adduct, glycidyl ether ester epoxy resin of p-hydroxybenzoic acid, m-aminophenol epoxy resin, diamino Diphenylmethane epoxy resin, urethane-modified epoxy resin, various alicyclic epoxy resins, N, N-diglycidyl dilin, N, N-diglycidyl-o-toluidine, triglycidyl isocyanurate, polyalkylene glycol Diglycidylue Examples include
- Epoxy resins can be used. Those containing at least two epoxy groups in the molecule are preferable in terms of high reactivity during curing and easy formation of a three-dimensional network in the cured product. More preferred are bisphenol A type epoxy resins and nopolak type epoxy resins.
- the ratio of the ((A) + (B)) epoxy resin is less than 100, the effect of improving the impact strength / toughness of the cured epoxy resin becomes difficult to obtain, and ((A) + (B))
- the ratio of the epoxy resin exceeds 100/1, the strength of the oxyalkylene-based polymer cured product becomes insufficient.
- the preferred use ratio varies depending on the use of the curable resin composition and the like, and thus cannot be unconditionally determined.For example, when the impact resistance, flexibility, toughness, peel strength, etc. of the cured epoxy resin are to be improved.
- the component (A) + (B) is preferably used in an amount of 1 to 100 parts by weight, more preferably 5 to 100 parts by weight, based on 100 parts by weight of the epoxy resin.
- the epoxy resin is used in an amount of 1 to 200 parts by weight, more preferably 5 to 100 parts by weight, based on 100 parts by weight of the component (A) and the component (B). Is good.
- a curing agent for curing the epoxy resin can be used in combination.
- the epoxy resin curing agent that can be used is not particularly limited, and a commonly used epoxy resin curing agent can be used. Specifically, for example, triethylenetetramine, tetraethylenepentamine, getylaminopropylamine, N-aminoethylpiperidine, m-xylylenediamine, m-phenylenediamine, diaminodiphenylmethane, diamino Primary and secondary amines such as diphenylsulfone, isophoronediamine, and amine-terminated polyether; tertiary amines such as 2,4,6-tris (dimethylaminomethyl) phenol and tripropylamine; Salts of secondary amines; polyamide resins; imidazoles; dicyandiamides; boron trifluoride complex compounds, phthalic anhydride, hexahydrophthalic anhydr
- the amount used is in the range of 0.1 to 300 parts by weight based on 100 parts by weight of the epoxy resin.
- Ketimine can be used as a curing agent for the epoxy resin. Ketimine exists stably in the absence of water, and is decomposed into primary amine and ketone by moisture, and the generated primary amine serves as a room temperature curing agent for epoxy resins. When ketimine is used, a one-pack type composition can be obtained. Such ketimines can be obtained by a condensation reaction between an amine compound and a carbonyl compound.
- amine compounds and carbonyl compounds may be used for the synthesis of ketimines.
- examples of amine compounds include ethylenediamine, propylenediamine, trimethylenediamine, tetramethylenediamine, 1,3-diaminobutane, and 2,3. 3 008741
- Diamines such as diaminobutane, pentamethylenediamine, 2,4-diaminopentane, hexamethylenediamine, p-phenylenediamine, p, p′-biphenylenediamine; 1,2,3—triamino Polyvalent amines such as propane, triaminobenzene, tris (2-aminoethyl) amine and tetra (aminomethyl) methane; polyalkylenepolyamines such as diethylenetriamine, triethylenetriamine and tetraethylenepentamine; polyoxyalkylenes Polyamines; aminosilanes such as aminopropyltriethoxysilane, N-(] 3-aminoethyl) aminopropyltrimethoxysilane, N- (3-aminoethyl) aminopropylmethyldimethoxysilane And the like can be used.
- Examples of the carbonyl compound include aldehydes such as acetaldehyde, propionaldehyde, n-butylaldehyde, isobutyraldehyde, getylacetaldehyde, dalioxal, and benzaldehyde; cyclopentanone, trimethylcyclobenzene, cyclohexanone.
- aldehydes such as acetaldehyde, propionaldehyde, n-butylaldehyde, isobutyraldehyde, getylacetaldehyde, dalioxal, and benzaldehyde
- cyclopentanone trimethylcyclobenzene, cyclohexanone.
- Trimethylcyclohexanone, and other cyclic ketones Trimethylcyclohexanone, and other cyclic ketones; acetone, methylethyl ketone, methylpropyl ketone, methylisopropylketone, methylisobutylketone, getylketone, dipropylketone, diisopropylpyruketone, dibutylketone, diisobutylketone, etc.
- the imino group When an imino group is present in the ketimine, the imino group may be reacted with styrene oxide; daricidyl ether such as butyldaricidyl ether, arylidicidyl ether; glycidyl ester; These ketimines may be used alone or in combination of two or more, and are used in an amount of 1 to 100 parts by weight with respect to 100 parts by weight of the epoxy resin. And ketimine.
- additives may be added to the curable composition of the present invention, if necessary, for the purpose of adjusting various physical properties of the curable composition or the cured product.
- additives include, for example, flame retardants, curability modifiers, radical inhibitors, metal deactivators, ozone 3008741
- Examples include anti-deterioration agents, phosphorus-based peroxide decomposers, lubricants, pigments, foaming agents, solvents, and fungicides. These various additives may be used alone or in combination of two or more. Specific examples other than the specific examples of the additives mentioned in the present specification include, for example, JP-B-4-169659, JP-B-7-108928, JP-A-63-254149, JP-A-64-22904, It is described in each gazette of JP-A-2001-72854.
- the curable composition of the present invention can be prepared as a one-component type in which all the components are pre-mixed, sealed and stored, and cured by the moisture in the air after the application, and a curing catalyst is separately used as a curing agent. It is also possible to prepare a two-component type in which components such as a filler, a plasticizer, and water are blended in advance, and the blended material and the polymer composition are mixed before use.
- the curable composition is a one-component type, all the components are pre-blended.
- the water-containing compound component it is preferable to use after dehydration and drying before use, or to dehydrate it by reducing the pressure during compounding and kneading.
- the curable composition is of a two-component type, it is not necessary to blend a curing catalyst with a main ingredient containing a polymer having a reactive gayne group.
- a heat drying method is preferable for a solid substance such as a powder, and a liquid substance is preferably a vacuum dehydration method or a dehydration method using synthetic zeolite, activated alumina, silica gel or the like.
- an isocyanate compound may be blended to react the isocyanate group with water to perform dehydration.
- lower alcohols such as methanol and ethanol; n-propyltrimethoxysilane, vinyltrimethoxysilane, vinylmethyldimethoxysilane, amercaptopropylmethyldimethoxysilane, and amercaptopropylmethylethoxysilane
- an alkoxysilane compound such as aglycidoxypropyltrimethoxysilane, the storage stability is further improved.
- a dehydrating agent particularly a silicon compound that can react with water, such as vinyltrimethoxysilane
- a polyoxyalkylene having a reactive silicon group (A) and a vinyl polymer having a reactive silicon group (B) 0.1 to 20 weight per 100 parts by weight Part t, preferably in the range of 0.5 to 10 parts by weight, is preferred.
- the solvent was distilled off from the polymerization composition obtained by polymerization to obtain a solvent-free polymer (C) having a molecular weight of 3000 and a weight ratio of polyoxypropylene glycol to vinyl polymer of 55:30.
- the polymerization conversion rate of the polymerization reaction was 99%.
- Examples 1 to 3 100 weight parts of the solvent-free polymer (A) obtained in Synthesis Example 4 was used as a plasticizer with a number average molecular weight of 1,000 (Dio 1000), 3,000 (Ac) Tocol P-23), 55 parts by weight of PPG (polypropylene glycol) having a molecular weight of 10,000 (compounded using a complex metal cyanide complex), calcium carbonate (trade name: White Inuhua CCR, manufactured by Shiraishi Industry Co., Ltd.) 120 parts by weight, titanium oxide (manufactured by Ishihara Sangyo Co., Ltd., trade name: Thaibek R_820) 20 parts by weight, thixotropic agent (manufactured by Kusumoto Kasei Co., Ltd., trade name: Dispalon # 6500) 2 parts by weight 1 part by weight, benzotriazole-based UV absorber (Chipa Specialty Chemicals Co., Ltd., trade name: Tinuvin 327), hindered
- Example 4 Instead of using 100 parts by weight of the solvent-free polymer (A) obtained in Synthesis Example 4 and 55 parts by weight of PPG plasticizer in Example 1, 100 parts by weight of the polymer obtained in Synthesis Example 2 And 85 parts by weight of the solvent-free polymer (C) obtained in Synthesis Example 6 A dumbbell (JIS No. 3 type) for a tensile test was prepared in the same manner as in Example 1 except that it was used.
- Example 5 In addition to the composition of Examples 1 and 4, 1 part by weight of a balloon (outer shell component, acrylic resin, particle size: 30 to 50 ⁇ m, trade name: EXPANCEL 511DE) was added, and a dumbbell for a tensile test was added. (JIS No. 3 type) was prepared.
- Comparative Example 3 In addition to the composition of Comparative Example 1, 1 part by weight of a balloon (outer shell component, acrylic resin, particle size: 30-50 microns, trade name: EXPANCEL 51 IDE) is added, and a dumbbell for tensile test (JIS No. 3 type) ) was prepared.
- a balloon outer shell component, acrylic resin, particle size: 30-50 microns, trade name: EXPANCEL 51 IDE
- a dumbbell for tensile test JIS No. 3 type
- Example 1 Tensile test was conducted in the same manner as in Example 1 except that a plasticizer having an acryl component (trade name: UP-1020, manufactured by Toagosei Co., Ltd.) was used instead of the PPG plasticizer in Example 1. A dumbbell (JIS No. 3 type) was manufactured.
- a dumbbell for tensile test (JIS No. 3 type) was prepared and the same as in Reference Example 1 except that the above polymer was used. Using the dumbbells for tensile tests in Reference Examples 1 and 2,
- the cured product of the curable composition of the present invention has excellent elongation properties. Further, according to the sizing port sealing method of filling and hardening the joints of the ceramic sizing pod used in the present invention, sufficient workability is obtained and the cured product has excellent elongation at break.
- the curable composition of the present invention is particularly useful as an elastic sealant, and can be used as a sealant for buildings, ships, automobiles, roads, and the like. It is especially useful as a sealant for sizing boards that require weather resistance and workability. In addition, it can adhere to a wide range of substrates, such as glass, porcelain, wood, metal, and resin moldings, alone or with the help of a primer, so it can be used as various types of sealing compositions and adhesive compositions It is. It can be used as a contact adhesive in addition to a normal adhesive. Furthermore, it is also useful as a food packaging material, casting rubber material, molding material, and paint.
- the number average molecular weight is 16, 000 to 25, 000
- the molecular chain is substantially Alkoxy acrylate and Z or methyl acrylate, which are linear, random copolymers and oxypropylene polymers having a reactive silicon group at the molecular chain end
- a curable composition containing a plasticizer which is an oxypropylene-based polymer having a molecular weight smaller than that of an alkylester polymer and an oxypropylene-based polymer component having a reactive gay group, is used for ceramic sizing boards. It is very suitable as a sealing material.
- this curable composition is an oxyalkylene-based polymer having a reactive silicon group, and a high-viscosity, high-molecular-weight, linear oxypropylene-based polymer having a molecular weight of 160000 or more.
- a random copolymer (meth) acrylic polymer which also has a high viscosity as the Bier polymer having a reactive gay group, it has a viscosity range that can be used as a sealing material.
- the curing speed is not much different from the case where an oxypropylene polymer having a small molecular weight is used.
- the lower limit of the more preferable number average molecular weight range of the oxypropylene polymer having a reactive silicon group in this composition is 17,000, more preferably 18,000, particularly 19,0. 0 0 and the upper limit is 2 3, 0 0 0, especially 2 2, 0 0 0.
- the most preferred range is from 19,000 to 22,00, but other combinations of lower and upper limits are also preferred.
- the molecular weight of the oxyalkylene polymer plasticizer (C) is preferably 5,000 or less, more preferably 4,000 or less.
- compositions a so-called SGO obtained by subjecting an acrylate monomer as a plasticizer, which is an alkyl acrylate polymer having a molecular weight smaller than that of the component (B), by continuous bulk polymerization at a high temperature and a high pressure is used.
- an acrylate monomer as a plasticizer which is an alkyl acrylate polymer having a molecular weight smaller than that of the component (B)
- Polymers from the process can also be used in combination.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Structural Engineering (AREA)
- Civil Engineering (AREA)
- Ceramic Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB038171619A CN1320057C (zh) | 2002-07-25 | 2003-07-09 | 固化性组合物与披叠板的密封方法 |
EP03771261.9A EP1533341B1 (en) | 2002-07-25 | 2003-07-09 | Curable composition and sealing method for ceramic siding boards |
US10/522,028 US7473441B2 (en) | 2002-07-25 | 2003-07-09 | Curable composition and sealing method for ceramic siding boards |
AU2003252494A AU2003252494A1 (en) | 2002-07-25 | 2003-07-09 | Curable composition and sealing method for ceramic siding boards |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002217338 | 2002-07-25 | ||
JP2002-217338 | 2002-07-25 | ||
JP2002-217337 | 2002-07-25 | ||
JP2002217337 | 2002-07-25 | ||
JP2002-303581 | 2002-10-17 | ||
JP2002-303580 | 2002-10-17 | ||
JP2002303580A JP2004107607A (ja) | 2002-07-25 | 2002-10-17 | 硬化性組成物 |
JP2002303581A JP4275925B2 (ja) | 2002-07-25 | 2002-10-17 | サイジングボードのシーリング方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004011553A1 true WO2004011553A1 (ja) | 2004-02-05 |
Family
ID=31192277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/008741 WO2004011553A1 (ja) | 2002-07-25 | 2003-07-09 | 硬化性組成物およびサイジングボードのシーリング方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7473441B2 (ja) |
EP (1) | EP1533341B1 (ja) |
CN (1) | CN1320057C (ja) |
AU (1) | AU2003252494A1 (ja) |
WO (1) | WO2004011553A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7652119B2 (en) * | 2004-11-11 | 2010-01-26 | Kaneka Corporation | Curable composition |
US7868084B2 (en) * | 2003-04-11 | 2011-01-11 | Kaneka Corporation | Curable composition |
CN114149848A (zh) * | 2021-11-18 | 2022-03-08 | 上海应用技术大学 | 一种稳定剂改性的中性笔尾塞油及其制备方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1710270A4 (en) * | 2004-01-30 | 2007-02-21 | Kaneka Medix Corp | METHOD FOR PRODUCING HYDROLYZABLE SILICON GROUPS CONTAINING OXYALKYLENE POLYMER AND CURING COMPOSITION THEREOF |
WO2007072825A1 (ja) * | 2005-12-20 | 2007-06-28 | Asahi Glass Company, Limited | 室温硬化性組成物 |
DE102006048041A1 (de) * | 2006-10-09 | 2008-04-10 | Henkel Kgaa | Zusammensetzungen aus teilweise silylterminierten Polymeren |
DE102008020979A1 (de) * | 2008-04-25 | 2009-10-29 | Henkel Ag & Co. Kgaa | Härtbare Zusammensetzungen enthaltend silylierte Polyurethane |
FR2940312B1 (fr) * | 2008-12-18 | 2011-02-25 | Bostik Sa | Composition adhesive pelable apres reticulation |
EP2488586B1 (en) * | 2009-10-16 | 2017-11-01 | Kaneka Corporation | Curable composition |
JP5993367B2 (ja) * | 2011-04-15 | 2016-09-14 | 株式会社カネカ | 建築用外装材 |
WO2013074265A1 (en) * | 2011-11-14 | 2013-05-23 | Henkel Corporation | Adhesive compositions |
EP2951234A2 (en) * | 2013-02-01 | 2015-12-09 | 3M Innovative Properties Company | Coating compositions and articles made therefrom |
CN105324436B (zh) * | 2013-05-30 | 2018-08-28 | 株式会社钟化 | 固化性组合物及其固化物 |
CN105246979B (zh) * | 2013-05-30 | 2018-12-14 | 株式会社钟化 | 固化性组合物 |
CN105308145B (zh) * | 2013-06-14 | 2018-11-30 | 积水富乐株式会社 | 粘接剂组合物 |
WO2019058794A1 (ja) * | 2017-09-20 | 2019-03-28 | 東亞合成株式会社 | 硬化性組成物、シーリング材組成物、及び接着剤組成物 |
CN111094443B (zh) * | 2017-09-20 | 2022-07-05 | 东亚合成株式会社 | 固化性组合物、密封材料组合物、及粘接剂组合物 |
US11149446B2 (en) * | 2018-09-10 | 2021-10-19 | Champion Link International Corporation | Floor panel comprising a ceramic material or a natural stone |
CN109111124A (zh) * | 2018-09-12 | 2019-01-01 | 江苏世泰实验器材有限公司 | 一种防粘连盖玻片及其制备方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04266986A (ja) * | 1991-02-21 | 1992-09-22 | Sekisui Chem Co Ltd | シーリング材 |
JPH1112455A (ja) * | 1997-06-24 | 1999-01-19 | Sekisui Chem Co Ltd | 室温硬化性組成物 |
JP2001172609A (ja) * | 1999-12-16 | 2001-06-26 | Yokohama Rubber Co Ltd:The | シーリング材組成物 |
JP2002069288A (ja) * | 2000-08-25 | 2002-03-08 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2002129004A (ja) * | 2000-10-26 | 2002-05-09 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2002155201A (ja) * | 2000-11-20 | 2002-05-28 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2002179904A (ja) * | 2000-12-15 | 2002-06-26 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2002194204A (ja) * | 2000-12-27 | 2002-07-10 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2002201350A (ja) * | 2001-01-09 | 2002-07-19 | Sekisui Chem Co Ltd | 室温硬化性組成物 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5470813A (en) | 1993-11-23 | 1995-11-28 | Arco Chemical Technology, L.P. | Double metal cyanide complex catalysts |
JPH07233316A (ja) | 1994-02-23 | 1995-09-05 | Asahi Glass Co Ltd | 硬化性組成物 |
US5900384A (en) | 1996-07-18 | 1999-05-04 | Arco Chemical Technology L.P. | Double metal cyanide catalysts |
JPH11116686A (ja) * | 1997-10-09 | 1999-04-27 | Kanegafuchi Chem Ind Co Ltd | 硬化性組成物 |
EP1391484B1 (en) * | 2001-04-19 | 2006-08-30 | Kaneka Corporation | Curable composition |
-
2003
- 2003-07-09 US US10/522,028 patent/US7473441B2/en not_active Expired - Fee Related
- 2003-07-09 EP EP03771261.9A patent/EP1533341B1/en not_active Expired - Lifetime
- 2003-07-09 WO PCT/JP2003/008741 patent/WO2004011553A1/ja active Application Filing
- 2003-07-09 CN CNB038171619A patent/CN1320057C/zh not_active Expired - Lifetime
- 2003-07-09 AU AU2003252494A patent/AU2003252494A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04266986A (ja) * | 1991-02-21 | 1992-09-22 | Sekisui Chem Co Ltd | シーリング材 |
JPH1112455A (ja) * | 1997-06-24 | 1999-01-19 | Sekisui Chem Co Ltd | 室温硬化性組成物 |
JP2001172609A (ja) * | 1999-12-16 | 2001-06-26 | Yokohama Rubber Co Ltd:The | シーリング材組成物 |
JP2002069288A (ja) * | 2000-08-25 | 2002-03-08 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2002129004A (ja) * | 2000-10-26 | 2002-05-09 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2002155201A (ja) * | 2000-11-20 | 2002-05-28 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2002179904A (ja) * | 2000-12-15 | 2002-06-26 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2002194204A (ja) * | 2000-12-27 | 2002-07-10 | Asahi Glass Co Ltd | 硬化性組成物 |
JP2002201350A (ja) * | 2001-01-09 | 2002-07-19 | Sekisui Chem Co Ltd | 室温硬化性組成物 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1533341A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7868084B2 (en) * | 2003-04-11 | 2011-01-11 | Kaneka Corporation | Curable composition |
US7652119B2 (en) * | 2004-11-11 | 2010-01-26 | Kaneka Corporation | Curable composition |
CN114149848A (zh) * | 2021-11-18 | 2022-03-08 | 上海应用技术大学 | 一种稳定剂改性的中性笔尾塞油及其制备方法 |
CN114149848B (zh) * | 2021-11-18 | 2023-04-28 | 上海应用技术大学 | 一种稳定剂改性的中性笔尾塞油及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1533341A1 (en) | 2005-05-25 |
AU2003252494A1 (en) | 2004-02-16 |
EP1533341A4 (en) | 2010-07-07 |
US7473441B2 (en) | 2009-01-06 |
CN1668698A (zh) | 2005-09-14 |
CN1320057C (zh) | 2007-06-06 |
US20050272835A1 (en) | 2005-12-08 |
EP1533341B1 (en) | 2014-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4101632B2 (ja) | 硬化性組成物および復元性、クリープ性改善方法 | |
JP5744759B2 (ja) | 硬化性組成物 | |
JP4874650B2 (ja) | 耐熱性の改善された硬化性組成物 | |
JP4814733B2 (ja) | 硬化性組成物 | |
WO2004031299A1 (ja) | 1液型硬化性組成物 | |
WO2004011553A1 (ja) | 硬化性組成物およびサイジングボードのシーリング方法 | |
WO2005121255A1 (ja) | 硬化性組成物 | |
US7297743B2 (en) | Curable composition | |
JP5479862B2 (ja) | 硬化性組成物 | |
JP4970793B2 (ja) | 加水分解性珪素基含有オキシアルキレン重合体の製造方法およびその硬化性組成物 | |
JP2007091931A (ja) | オルガノシロキサン変性ポリオキシアルキレン系重合体、および、該重合体を含有するパネル用接着剤 | |
JP2004002494A (ja) | 硬化性組成物 | |
JP2004091770A (ja) | 硬化性組成物 | |
JP2004002604A (ja) | 硬化性組成物 | |
JP4405745B2 (ja) | 硬化性接着剤組成物 | |
JP2004091771A (ja) | 硬化性組成物 | |
JP2004099877A (ja) | 硬化性組成物 | |
JP5564312B2 (ja) | 硬化性組成物 | |
JP4275925B2 (ja) | サイジングボードのシーリング方法 | |
JP2004224985A (ja) | 硬化性組成物 | |
JP4197257B2 (ja) | 硬化性組成物およびシーリング方法 | |
JP2006348209A (ja) | 硬化性組成物 | |
JP2004107607A (ja) | 硬化性組成物 | |
JP2004002603A (ja) | 硬化性組成物 | |
JP2004124073A (ja) | 硬化性組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2003771261 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 20038171619 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10522028 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 2003771261 Country of ref document: EP |