WO2003100111A1 - Method for producing porous metal by composite physical vapour deposition and the equipment thereof - Google Patents

Method for producing porous metal by composite physical vapour deposition and the equipment thereof Download PDF

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Publication number
WO2003100111A1
WO2003100111A1 PCT/CN2003/000393 CN0300393W WO03100111A1 WO 2003100111 A1 WO2003100111 A1 WO 2003100111A1 CN 0300393 W CN0300393 W CN 0300393W WO 03100111 A1 WO03100111 A1 WO 03100111A1
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WO
WIPO (PCT)
Prior art keywords
plating
coating chamber
vapor deposition
coating
physical vapor
Prior art date
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PCT/CN2003/000393
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English (en)
French (fr)
Inventor
Faping Zhong
Xianqi Hu
Weizheng Tao
Gang Sheng
Yiwu Tang
Fensheng Liang
Xiaohua Tan
Canzhong Zhang
Chihuan He
Hongyu Xie
Original Assignee
Changsha Lyrun Materials Co., Ltd.
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Application filed by Changsha Lyrun Materials Co., Ltd. filed Critical Changsha Lyrun Materials Co., Ltd.
Priority to AU2003242164A priority Critical patent/AU2003242164A1/en
Publication of WO2003100111A1 publication Critical patent/WO2003100111A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/70—Carriers or collectors characterised by shape or form
    • H01M4/80—Porous plates, e.g. sintered carriers
    • H01M4/808—Foamed, spongy materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/24—Alkaline accumulators
    • H01M10/30—Nickel accumulators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a physical vapor deposition technology, and in particular, to a method and a device for continuously conducting an organic porous strip by using a combined physical vapor deposition technology in a process of producing a continuous strip-shaped porous metal.
  • Evaporation plating, sputtering plating, and ion plating under vacuum conditions are generally referred to as physical vapor deposition (Physical Vapor Deposition) technology, and are referred to as PVD for short.
  • Evaporation plating includes resistance evaporation plating, electron beam evaporation plating, laser evaporation plating, ion beam evaporation plating, induction evaporation plating, hollow cathode plasma electron beam evaporation plating, hot cathode plasma electron beam evaporation plating, arc evaporation plating, and the like.
  • Sputter plating includes DC secondary sputtering, asymmetric AC sputtering, bias sputtering, tertiary sputtering, ion beam sputtering, radio frequency sputtering, magnetron sputtering, etc. Including DC secondary ion plating, two
  • Porous metal is a new type of functional material. Due to its porous three-dimensional network structure, it has a large specific surface area, good tensile strength and flexibility, high porosity, strong permeability, light weight, and good energy absorption. Uses Very extensive.
  • nickel foam which is widely used as a material for the electrode substrates of nickel-metal hydride and nickel-cadmium batteries in the world, is made of non-metallic polyurethane sponges (including polyester and polyether sponges, which are also called "foams") as the core , Named after electroformed metal nickel molding.
  • the manufacturing technology of nickel foam mainly includes three parts: electrical conductivity, electrodeposition (also known as electroforming or electroplating), and heat treatment of polyurethane sponge.
  • polyurethane sponge conductivity is further divided into chemical nickel plating method, conductive conductive coating method, nickel carbonyl nickel decomposition and deposition one-step method, and single magnetron sputtering method or vacuum evaporation method.
  • the above processes have their own advantages and disadvantages. From the end of the 1980s to the present, they have successively confirmed the costs for several large-scale production of foamed nickel companies in the world. Used. Among them, Japan's Sumitomo Company, Katayama Company, China's Lyrun Company, China's Shenyang Gold Champower Company, and the former US Retec Company, etc.
  • the nickel production process and equipment include a conductive treatment method, that is, a one-step method of nickel carbonyl decomposition and deposition of nickel.
  • the chemical nickel plating process is mature, the investment in production equipment is small, the product quality is stable and the coating is good, and the thick and small pore size polyurethane sponge has a good conductive treatment effect; however, it requires a large environmental protection cost.
  • foam nickel Contains a small amount of phosphorus.
  • the method of applying conductive glue is simple, the investment in production equipment is small, it is environmentally friendly, and the foamed nickel does not contain phosphorus; but the product has poor plating properties, high carbon content, thicker and smaller pores, and has a poor conductive treatment effect. Therefore, it is not suitable to produce thick nickel with small pore size.
  • PVD processing of polyurethane sponge is not as thick as the electroless nickel plating method, product quality and uniformity are slightly lower than the chemical nickel plating method, and the PVD method is not suitable for thicker sponges with small pore diameters; but the PVD process is environmentally friendly and basic There are no three waste emissions, and the foamed nickel contains no phosphorus and carbon.
  • magnetron sputtering and arc evaporation plating in PVD technology also have their own advantages and disadvantages.
  • magnetron sputtering has the advantages of low-temperature sputtering deposition, fine film particles, and low temperature rise of organic porous bodies, there are still low deposition rates. , Higher production costs, polyurethane sponges are prone to aging and reduce tensile strength.
  • a single magnetron sputtering process is limited by the fact that the sputtering time should not be too long, and the sponge's uniform plating ability is poor. Even low-speed electrodeposition production lines are not easy to directly match with continuous operation.
  • the domestic technology close to the present invention is the invention patent of "a method for preparing sponge-like foamed nickel" by Jilin University, patent number: ZL 95 102640.2; the utility model patent "Vacuum Magnetron Sputtering Foam” of Changchun Information Technology Development Co., Ltd. Metallization Machine ", Patent No .: ZL 002 12809.8; Xia Zhengxun's Utility Model Patent” Magnetron Sputtering Bulb " Nickel coil coating machine ", patent number: ZL 00246953.7.
  • the above patents all belong to a single magnetron sputtering method for conducting nickel plating on the sponge, which is not compatible with the subsequent electrodeposition process.
  • the sponge is a three-dimensional complex surface, the deposition rate of a single magnetron sputtering is low, and the uniform plating ability is poor; on the other hand, the sponge is subjected to thermal radiation, particle incident bombardment, and nickel particle aggregation during the coating process. Heat and other adverse effects on the strength of the sponge, the sputtering time should not be too long, otherwise the tensile strength of the sponge will be significantly reduced. Due to the short nickel plating time and low deposition rate, the nickel layer on some sponges is extremely thin. When it is matched with the subsequent high-speed electrodeposition production line, it often happens that the plating is missing.
  • the electrodeposition transport speed is 0.2m / min, it is difficult to achieve continuous uniform hook electrodeposition on the sponge. Therefore, the single magnetron sputtering technology currently used in the world, including the above patented equipment and the patented equipment of China Jinchangpu and Nitech of France, can only be used with low-speed electrodeposition equipment. It is difficult to achieve large-scale production of continuous band-shaped sponge nickel foam, and the uniformity of the product is not ideal.
  • Shenyang Jinchangpu New Material Co., Ltd. issued a patent for "A Equipment and Process for Producing Porous Sponge Metals", application number: 01 128040.9, publication number: CN 1341773A.
  • the invention is also a single magnetron sputtering equipment and process, which is used for the conductive treatment of polyurethane sponge as a process for producing sponge-like metals.
  • the casing of the vacuum equipment involved in the invention the vacuum pumping system connected to the casing, the push-pull trolley for transporting the rolled strip, the two rows of magnetron sputtering cathode targets installed in parallel, and the servo motor or stepper motor
  • the process parameters, such as coating power and voltage, selected by the moving retractable and retractable roll, traction roll, transition roll, pressure roll, linear speed sensor, and sputtering power source are all combinations of conventional magnetron sputtering roll-on coating machines. technology. With this equipment and process, the polyurethane sponge nickel-plated with nickel can not meet the requirements of high-speed electrodeposition nickel equipment, as mentioned above.
  • the substrate can be felt, fabric, sponge.
  • the conductive method is vacuum cathode sputtering or ion plating.
  • 2An intermediate step of chemical and / or electrochemical treatment is also included between electroconductivity and electrodeposition.
  • the conductive treatment can be copper or nickel deposition, and the deposition thickness is 0.05-1 m.
  • the conductive treatment can be copper first. 4Before the PVD conductivity, the substrate must be removed.
  • the chemical nickel plating method requires a large environmental protection cost, and the foamed nickel contains a small amount of phosphorus; the products coated with the conductive adhesive method have poor plating properties, high carbon content, thicker and A sponge with a smaller pore size has a poor conductive treatment effect; a single magnetron sputter deposition rate is low, a polyurethane sponge is easy to age, and the uniform plating ability is poor, so it cannot be matched with a high-speed electrodeposition equipment; and a single arc evaporation plating The deposition rate is fast, but the metal particles of the coating are large, the coating is uneven, and the sponge is easy to burn. The single arc ion plating has good adhesion and diffraction performance, but the surface of the coating is rough and the porosity is caused by the presence of particles in the plasma. Increased defects. Summary of the Invention
  • the purpose of the present invention is to provide a method and a device for producing porous metal by a combined physical vapor deposition technology that can achieve uniform plating of metal and realize high-speed continuous conduction on both sides of a strip-shaped substrate in order to overcome the defects in the prior art. .
  • the object of the present invention can be achieved by the following technical solutions: '' A method for producing porous metal by combined physical vapor deposition technology, characterized in that: in a roll-type vacuum coating machine, a combination of magnetron sputtering plating, evaporation plating, and ion plating is used, or any two of them
  • the combined combined physical vapor deposition technology performs continuous conductive treatment on the organic porous strip.
  • the organic porous strip is uniformly plated with metal on both sides at one time, and the organic vapor strip is omitted before the physical vapor deposition is conducted.
  • the porous strip is subjected to a pre-film removal step by a chemical method, and a chemical and / or electrochemical pre-plating treatment step is omitted between the physical vapor deposition and electrodeposition processes, and the speed is directly 0.6 to 2 m / Min's subsequent electrodeposition lines are matched.
  • the combined physical vapor deposition technology particularly relates to a technology combining magnetron sputtering plating and arc evaporation plating, and a technology combining magnetron sputtering plating and arc ion plating.
  • the organic porous tape includes a single-layer or multi-layer non-woven fabric with an average pore diameter of 2 mm, a polyurethane sponge, a cotton or chemical fiber fabric, a felt, and a fiber web.
  • the polyurethane sponge has a length of 30-300m and a width of 0.3-1.5m.
  • the combined physical vapor deposition technology has a strip speed of 2—
  • the plating metal includes nickel, copper, tin, zinc, aluminum, titanium, silver, gold, or a composite plating layer of the above metals, that is, one kind of metal is used as a bottom layer and then the other is coated.
  • the said composite coating layer particularly relates to a composite coating layer with aluminum as a base layer.
  • a device for producing porous metal by combined physical vapor deposition technology which is characterized in that: the host device is a roll-type vacuum coating machine, which adopts a vertical main body design and a micro-tension rewinding and unwinding device; Unwinding room, rewinding room is equipped with rewinding roller, unwinding room is equipped with unwinding roller, combined coating room, partition, cooling water jacket, special processing room are connected between rewinding room and unwinding room, Guide roller and measuring roller;
  • the combined coating chamber can be one of the following four combinations: the combination of a magnetron sputtering coating chamber and an arc evaporation coating chamber, the combination of a magnetron sputtering coating chamber and an arc ion coating chamber A combination of an arc evaporation coating chamber and an arc ion coating chamber, a combination of a magnetron sputtering coating chamber, an arc ion coating chamber, and an arc evaporation coating chamber, and particularly relates to
  • the combination of a sputtering coating chamber and an arc ion coating chamber; an organic porous strip material passes through the middle of the combined coating chamber, and continuously receives the deposition of target particles in the coating chamber.
  • Form metal conductive film; 2 ⁇ 1 2 groups are installed in the magnetron sputtering chamber
  • 1-3 sets of arc evaporation targets are installed in the arc evaporation coating room, and 1-3 sets of arc ion targets are installed in the arc ion coating room.
  • the arrangement of the magnetron sputtering coating, the arc evaporation coating, or the arc ion coating chamber may be two or three coating methods arranged alternately, or each of the coating methods may be continuously arranged and then combined.
  • a target spacing structure is adopted, that is, the middle of the upper and lower targets is separated by a cooling water jacket perpendicular to the target surface to form a plurality of relatively independent coating sections.
  • the magnetron sputtering target adopts a magnetron-embedded target structure, and the target plate is fixed on the partition plate by an intermediate bead and a side bead.
  • the target plate is etched to the extent that it needs to be replaced, the bead can be released. Replace the target board with the same specification.
  • the PVD technology of the present invention is called a combined PVD technology because it is different from the single form of PVD technology commonly used. Due to the multiple inventions and innovations of the combined PVD technology, it is not necessary to chemically perform a so-called uncapping pretreatment on the substrate before implementing PVD conductivity; the equipment used to produce the porous metal material has an even coating power ratio that uses a single.
  • the physical vapor deposition technology has strong uniform plating ability, which not only meets the requirements for the thickness, uniformity, and permeability of the plating required for the subsequent process of high-speed electrodeposition, but also does not cause the strip The intensity is affected. Therefore, it can be directly matched with the subsequent electrodeposition production line with a speed of 0.6-2m / min, which improves the production efficiency.
  • the produced porous metal contains no phosphorus and no carbon.
  • the material has excellent physical properties and low resistance during high current discharge. It is especially suitable for electrode substrate materials of power batteries, including power tools, pure electric vehicles (PEV), and hybrid electric vehicles. Power battery for automobile (HEV). Therefore, it has a good industrial application prospect.
  • the process flow of the combined PVD method of the present invention is as follows: organic porous strip-unwinding-guide roller-special treatment-combined PVD coating-measuring roller-winding. The entire process is performed under vacuum.
  • the invention particularly relates to a combination technology of arc evaporation plating and magnetron sputtering plating, and a combination technology of arc ion plating and magnetron sputtering plating for continuous band-shaped polyurethane sponge plating of metallic nickel, and the foamed nickel produced is a continuous band Shape, each roll area can reach more than 150m 2 , it has become a more perfect method for conducting conductive treatment of polyurethane sponge in the large-scale production of foamed nickel.
  • the “double-sided uniform high-travel plating metal” in the present invention refers to: one-time double-sided metal plating on organic porous strips that are transported at high speed, and particularly relates to one-time double-sided plating of polyurethane sponge nickel plating Due to the use of combined PVD technology, the equipment has a good uniform coating ability. When coating, the strip travel speed can reach 2-20m / min, which can be directly connected to high-speed (travel speed 0.6-2m / min). The deposition production line is matched, and no other chemical and / or electrochemical treatment is required between PVD and electrodeposition; there is no need to chemically remove (cavate) or roughen the substrate before performing PVD conductivity, so this The invention simplifies the process and avoids the problems of wastewater treatment.
  • the device according to the present invention comprises a host part and a supporting part.
  • the main part includes the unwinding room, the winding room, the combined coating room, and the control cabinet.
  • the supporting parts include the vacuum system, the cooling system, and the power supply system.
  • the host part is one of the examples of the combined PVD technology, and particularly relates to the combined structure of the arc ion coating chamber, the magnetron sputtering coating chamber, the unwinding chamber, and the winding chamber, as shown in FIG. 1.
  • the characteristics of this technology are: 2 to 12 sets of magnetron sputtering targets 5 and 1 to 3 sets of arc ion targets 7 are arranged on each side of the magnetron coating chamber 4 and the arc ion coating chamber 6, and the middle of the upper and lower targets is perpendicular to The cooling water jackets 9 on the target surface are separated to form a plurality of coating sections.
  • a magnetic filter device is installed on the arc evaporation source, so that the disadvantages of evaporating particles burning the sponge can be effectively overcome.
  • An efficient cooling system a cooling water jacket, is used between each relatively independent coating chamber to ensure that organic porous substrates will not be affected by thermal effects during the coating process, and escape small molecular organic gases, which will affect the smooth progress of the coating process As a result, the physical and chemical properties of the substrate are changed, which effectively improves the aging and reduced tensile strength of the organic porous strip due to the long plating time and the high temperature of the coating chamber.
  • the polyurethane sponge passes through the middle of the coating chamber, and continuously receives the particle deposition of the magnetron sputtering target and the arc ion target to form a metal conductive film. Due to the use of a micro-tension unwinding device and a vertical body design, the tensile state of the sponge after plating the metal can be controlled to the state of the raw material sponge.
  • FIG. 2 is a schematic diagram of the structure of a magnetron-mounted target, which includes a target plate 14, a partition plate 15, a middle magnet 16, a middle bead 17, a pole shoe 18, a side magnet 19, a side bead 20, a target frame 21, and a target base plate 22.
  • Water pipe 23, O-ring 24; target plate 14 through middle bead 17 and side bead 20 It is fixed on the partition plate 15.
  • the "preparation method and equipment” in the present invention also particularly relates to the following technologies:
  • An arc source can be ignited.
  • One method that can be used is gap triggering, that is, by supplying a current pulse to an auxiliary trigger electrode to make it conductive, so as to ignite the arc between the main electrodes.
  • Another method is mechanical triggering. That is, the ignition and ignition are achieved by the instantaneous contact and pulling of the arc starting electrode and the cathode surface.
  • the cathode material of the arc evaporation source can be made into a cylindrical block or a flat rectangular plate;
  • the cathode sputtering material of the magnetron sputtering coating can be made into a circular plane or a rectangular plane or a cylinder;
  • Sputter plating can be DC sputtering or RF sputtering.
  • the invention is environmentally friendly, and does not require any pretreatment of the organic porous strip before plating, and can realize one-time double-sided conductivity of the continuous porous strip.
  • the produced porous continuous metal strip and foamed metal are phosphorus-free. No carbon, uniform and delicate coating, good binding force and tensile strength, high metal deposition rate, high target utilization rate, continuous operation, can be directly matched with the electrodeposition process of high-speed transport, is produced by electrodeposition method
  • the porous metal strip is an ideal conductive treatment process.
  • the porous metal strip manufactured by the present invention is also used to manufacture porous metal materials that prevent electromagnetic and radio frequency interference; high-temperature filter media porous metal materials; excellent Conductive and thermally conductive porous metal material.
  • FIG. 1 is a schematic diagram of an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a magnetron mosaic target in FIG. 1. detailed description
  • the organic porous substrate to be plated with metal is a strip-shaped polyurethane sponge with a width of 0.96 m, a length of 1 70 m, and an average pore diameter of 0.5 mm.
  • the physical vapor deposition technology of a combination of magnetron sputtering and arc ion plating is used to conduct conductive treatment on the polyurethane sponge continuous strip.
  • the host device is vertical. Refer to Figure 1 for the principle of the device. Under vacuum conditions, the polyurethane sponge without any pre-treatment process is continuously unrolled from the unwinding roller 13 in the unwinding chamber 12, and the guide roller 11 prevents the sponge strip from deviating during the plating process. After the processing chamber 10 passes, it enters the arc ion coating chamber 6, a set of arc ion nickel targets 7 is installed in the coating chamber, and then the strip enters the magnetron sputtering coating chamber 4, and 8 sets of magnetron sputtering nickel targets 5 are installed in the coating chamber.
  • the magnetron sputtering nickel target adopts the structure of the magnetron mosaic target shown in FIG. 2.
  • Each target is separated by a cooling water jacket 9 perpendicular to the target surface to form a plurality of coating sections.
  • the separator 8 is magnetron sputtered.
  • the coating chamber is separated from the arc ion coating chamber.
  • the strip material passes through the middle of the coating chamber.
  • the metal nickel particles provided by each target are deposited on the polyurethane sponge that continuously passes through the middle of the coating chamber to form a metal nickel conductive film.
  • the sponge is continuously rolled by the measuring roller 3 in the winding room 1 with the winding roller 2. During the entire plating process, a micro-tension transmission system is used, and the travel speed of the polyurethane sponge is 2 m / min.
  • the polyurethane sponge used as the substrate to be plated here is not limited to its width, length, and average pore diameter. Generally, the width is 0.3-1.5m, the length is 30-300m, and the average pore diameter is 0.2-2.0mm. Can be adopted.
  • a non-woven fabric with a width of 0.3m, a length of 200m, and an average pore diameter of 1 mm was used as the plateable substrate.
  • a physical vapor deposition technique using a combination of magnetron sputtering and arc evaporation plating was used to conduct conductive treatment of the substrate.
  • the host equipment is placed in a vertical position. Under vacuum conditions, the non-woven fabric without any pre-treatment process is continuously unrolled from the unwinding roller in the unwinding room.
  • the guide roller prevents the non-woven strip from deviating during the plating process.
  • the coating chamber is installed with 12 sets of magnetron sputtering copper targets and 3 sets of arc evaporation copper targets arranged in phases.
  • the magnetron sputtering uses the magnetron mosaic target shown in Figure 2.
  • each target is separated by a cooling water jacket perpendicular to the target surface to form several coating sections, and metal copper particles are continuously deposited on a non-woven fabric that continuously passes through the middle of the coating chamber to form a metal copper conductive film.
  • the spinning fabric is continuously wound by the measuring roller in the winding room with a winding roller. Throughout the plating, a micro tension transmission system is used. The travel speed of the non-woven fabric is
  • the non-woven fabrics coated with metallic copper by PVD are not subjected to any chemical and / or electrochemical pre-plating steps, and the metallic copper is further electrodeposited directly on the electrodeposition equipment with a transport speed of 2.0 m / min.
  • a multi-layer fiber web with a width of 0.8m, a length of 30m, and an average pore diameter of 2mm was used as the substrate to be plated.
  • a physical vapor deposition technique combining arc evaporation and arc ion plating was used to conduct the substrate.
  • the multi-layer fiber web without any pre-treatment process is continuously unrolled from the unwinding roller in the unwinding chamber.
  • the guide roller prevents the non-woven tape during the plating process. The material deviates.
  • the continuous strip passes through the special processing chamber, it enters the arc evaporation coating chamber.
  • Two sets of arc evaporation aluminum targets are installed in the coating chamber, and then it enters the arc ion coating chamber.
  • Three sets of arc ion nickel targets are installed in the coating chamber.
  • the plate separates the two coating chambers. Each target in the coating chamber is separated by a cooling water jacket perpendicular to the target surface to form several coating sections.
  • Metal particles are continuously deposited on the multi-layer fiber network in the middle of the coating chamber to form a complex.
  • Metal conductive film, the multi-layered fiber web after coating is continuously rolled by the winding roller in the winding room through the measuring roller. During the whole plating, the micro-tension transmission system is used, and the travel speed of the multilayer fiber web is 1 0m / min
  • the multi-layered web with PVD-coated composite metal does not go through any chemical and / or electrochemical pre-plating steps, and continues to electrodeposit metal nickel directly on an electrodeposition equipment with a transport speed of 1 m / miti.
  • the cotton cloth without any pretreatment process is continuously unrolled from the unwinding roller in the unwinding room.
  • the guide roller prevents the cotton cloth from deviating during the plating process.
  • the treatment chamber After the treatment chamber passes, it enters the arc evaporation coating chamber.
  • One set of arc evaporation nickel targets is installed in the coating chamber, and the strip enters the magnetron sputtering coating chamber.
  • Two sets of magnetron sputtering nickel targets are installed in the coating chamber.
  • the nickel target adopts the structure of the magnetron mosaic target shown in Fig. 2 and then enters the arc ion coating chamber.
  • Two sets of arc ion nickel targets are installed in the coating chamber.
  • the partitions separate the coating chambers, and the targets are perpendicular to the target.
  • the cooling water jackets on the surface are separated to form several coating sections.
  • the strip material passes through the middle of the coating chamber.
  • the metal nickel particles provided by each target are deposited on the cotton cloth that continuously passes through the middle of the coating chamber to form a metal nickel conductive film.
  • the cotton cloth is continuously wound by the measuring roller in the winding room with a winding roller. During the entire plating process, a micro-tension transmission system is used, and the walking speed of the cotton cloth is 5 m / min.
  • the continuous strip cotton cloth coated with metallic nickel by PVD is not subjected to any chemical and / or electrochemical pre-plating step, and the metallic nickel is continuously electrodeposited directly on the plating equipment with a feeding speed of 0.8 m / min.

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Description

一种组合式物理气相沉积技术生产多孔金属的方法及设备 技术领域
本发明涉及一种物理气相沉积技术， 尤其涉及一种在生产连续 带状多孔质金属过程中， 采用组合式物理气相沉积技术， 对有机多 孔质带材进行连续导电化处理的方法及设备。 背景技术
通常把真空条件下的蒸发镀、 溅射镀、 离子镀统称为物理气相 沉积 （Physical Vapor Deposition ) 技术， 简称 PVD。 蒸发镀包括电 阻蒸发镀 、 电子束蒸发镀、 激光蒸发镀 、 离子束蒸发镀、 感应蒸发 镀、 空心阴极等离子电子束蒸发镀 、 热阴极等离子电子束蒸发镀 、 电弧蒸发镀等。 溅射镀包括直流二级溅射镀 、 不对称交流溅射镀 、 偏压溅射镀、 三级溅射镀、 离子束溅射镀、 射频溅射镀、 磁控溅射 镀等 □ 离子镀包括直流二级离子镀 、 二
级离子镀 、 射频离子镀、 反 应离子镀、 电弧离子镀、 空心阴极放电离子镀等。
在此之前， 除本发明之外还有其它方法用于对有机多孔质带材 进行连续导电化处理， 如化学镀镍法、 涂覆导电胶法、 羰基镍分解 沉积镍一步法以及采用单一 PVD 技术的磁控溅射法或真空蒸镀法 等。
多孔质金属是一种新型的功能材料， 由于具有多孔的三维网状 结构， 比表面积大、 抗拉强度和柔韧性好、 孔隙率高、 可透性强、 重量轻、 能量吸收性佳， 用途十分广泛。 目前世界上广泛用作镍氢、 镍镉电池电极基板的材料——泡沫镍， 因用非金属材料聚氨酯海绵 (包括聚酯和聚醚型海绵， 海绵又称作 "泡沬"） 作模芯， 电铸金属 镍成型而得名。 泡沫镍的制造技术主要包括聚氨酯海绵的导电化、 电沉积 （又称电铸或电镀）、 热处理三部分。 其中聚氨酯海绵导电化 又分为化学镀镍法、 涂覆导电胶法、 羰基镍分解沉积镍一步法以及 采用单一的磁控溅射法或真空蒸镀法等。 上述工艺各有利弊， 从上 个世纪 80年代末至今， 陆续为世界上几家规模化生产泡沫镍的企业 确认本 所采用。 其中日本的住友 （Sumitomo ) 公司、 片山（Katayama)公司、 中国长沙力元（Lyrun)公司、 中国沈阳金昌普（Gold Champower)公司、 美国原瑞太克 （ Retec ) 公司等采用化学镀镍法和 /或涂覆导电胶法 工艺； 法国原尼太克 （Nitech ) 公司采用磁控溅射法工艺； 加拿大 英可 （ Inco ) 公司利用 自身的镍生产技术， 采用了与上述技术路线 完全不同的泡沫镍生产工艺及设备， 包括导电化处理方式， 即羰基 镍分解沉积镍一步法。
化学镀镍法工艺成熟、 生产设备投资较小、 产品质量稳定且均 镀性好、 较厚和孔径很小的聚氨酯海绵导电化处理效果好； 但须投 入较大的环保费用，. 且泡沫镍中含少量的磷。 涂覆导电胶法工艺简 单、 生产设备投资小、 对环境友好、 泡沫镍中不含磷； 但产品均镀 性差、 含碳量较高、 较厚和孔径较小的海绵导电化处理效果差， 因 此不适宜制造厚而孔径小的泡沬镍。 PVD 技术处理聚氨酯海绵不如 化学镀镍法的镀层厚， 产品质量和均镀性略低于化学鍍镍法， 且 PVD 法不宜处理较厚和孔径很小的海绵； 但是 PVD 工艺对环境友好、 基 本无三废排放， 且泡沫镍中不含磷、 不含碳。
PVD 技术中的磁控溅射和电弧蒸发镀也各有优缺点， 磁控溅射 虽然有低温溅射沉积、 膜层颗粒细腻、 有机多孔体升温不高等优点， 但是仍然存在着沉积速率较低、 生产成本较高、 聚氨酯海绵易老化 而使抗拉强度降低等缺陷。 单一的磁控溅射工艺， 因受溅射时间不 宜过长的限制， 对海绵的均镀能力较差， 即使低走速的电沉积生产 线， 也不易直接与之匹配连续作业， 磁控溅射之后， 尚须在另外的 预镀设备上作辅助处理， 才能顺利进入电沉积生产线； 而对于高走 速的电沉积生产线， 预镀更是必不可少。 单一的电弧蒸发镀虽然沉 积速率较高， 但是金属颗粒较大， 镀膜常常不均匀， 且阴极弧斑粒 子易灼伤海绵。
与本发明接近的国内技术是吉林大学的 《 一种海绵状泡沫镍的 制备方法 》 发明专利， 专利号： ZL 95 102640.2； 长春信息技术发 展有限责任公司的实用新型专利 《 真空磁控溅射泡沫金属化机 》， 专利号： ZL 002 12809.8 ； 夏正勋的实用新型专利 《 磁控溅射泡沬 镍卷绕镀膜机 》 ，专利号： ZL 00246953.7 等。 上述专利均属于用 单一的磁控溅射方法对海绵作镀镍导电化处理， 与后续的电沉积工 序匹配性不好。 这是由于： 一方面海绵是三维复杂表面， 单一的磁 控溅射的沉积速率低， 均镀能力较差； 而另一方面海绵在镀膜过程 中又受到热辐射、 粒子入射轰击、 镍粒子凝聚热等对海绵强度的不 良影响， 溅射时间不宜过长， 否则海绵的抗拉强度将显著降低。 由 于溅射镀镍的时间短， 沉积速率低， 部分海绵上的镍层极薄， 与随 后的高走速的电沉积生产线匹配时， 常常会出现漏镀的情况。 因而 当电沉积走带速度 0.2m/min,在海绵上电沉积镍就很难做到连续均 勾。 因此目前世界上采用的单一的磁控溅射技术， 包括上述专利设 备和下述的中国金昌普、 法国尼太克 （Nitech ) 公司的专利设备， 均只能与低走速的电沉积设备配套， 较难实现连续带状海绵泡沫镍 的大规模生产， 而且产品的均镀性不理想。
沈阳金昌普新材料股份有限公司的 《一种生产多孔海绵类金属 的设备和工艺》 发 明专利 ， 申请号 ： 01 128040.9,公开号 ： CN 1341773A。 该发明也是一种单一的磁控溅射设备和工艺， 用于聚氨 酯海绵的导电化处理，作为生产海绵类金属的一个工序。 发明中涉及 的真空设备的壳体， 与壳体相连的抽真空系统， 装运卷式带材的推 拉式小车， 两列平行安装的磁控溅射阴极靶， 以及由伺服电机或步 进电机拖动的收放料辊、 牵引辊、 过渡辊、 压力辊、 线速度传感器、 以及溅射电源所选择的工艺参数， 如镀膜功率、 电压等均为常规磁 控溅射卷绕式镀膜机的组合技术。 以该设备和工艺镀镍的聚氨酯海 绵， 如上所述， 也达不到与高速电沉积镍设备匹配的要求。
目前世界上生产泡沫镍用的高速电沉积镍的典型设备， 是与发 明人钟发平的专利相类似的设备， 该专利名为 《连续化带状泡沬镍 整体电镀槽》 ，专利授权公告号 CN2337160Y , 授权公告日 1999年 9月 8曰。
其它相关的用 PVD 法生产泡沫镍的专利， 还有深圳市坦达尼真 空表面技术有限公司的发明专利 《有机泡沫导电化处理的真空蒸镀 法及设备》 （发明专利申请号： 01 1 19666.1， 公开号： CN 1327081 A )。 该发明也因存在上述单一 PVD 技术类似的缺点而未达到规模化生产 的程度。 采用单一的 PVD 技术真空蒸鍍法作导电化处理生产泡沫镍 的还有日本的片山公司 （Katayama )。
与本发明较为接近的国外发明专利之一是 1985年法国原尼太克
( Nitech ) 公司在日本申请的专利， 专利号： 昭 61 -76686 ; 其美国专 利号为： US4, 882,232 ; 其本土专利号为： EP 0 1 51 064 B l。 该专利 名称为： 《多孔质金属构造物的制造方法》， 其技术特征涉及下述内 容： ①是一种用于制造镍电极或镉电极的多孔金属骨架材料的方法。 其制造方法包括基材的导电化、 电沉积、 热处理。 基材可以是毡、 织物、 海绵。 导电化方法为真空阴极溅射或离子镀。 ②在导电化和 电沉积之间还包括一个化学和 /或电化学处理的中间步骤。 ③其导电 化处理可以是沉积铜或镍， 沉积厚度为 0.05- 1 m , 导电化处理可以 是先以铜作底层。 ④在实施 PVD 导电化之前必须对基材进行去膜
( Uncapping ) 的前处理， 即用氢氧化钠或氢氧化钾溶液对基材进行 处理。
以上现有技术中存在的诸多问题： 例如化学镀镍法须投入较大 环保费用， 且泡沫镍中含少量的磷； 涂覆导电胶法产品均镀性差、 含碳量较高、 较厚和孔径较小的海绵导电化处理效果差； 单一的磁 控溅射沉积速率低、 聚氨酯海绵易老化、 均镀能力较差， 因此不能 与高走速的电沉积设备匹配； 而单一的电弧蒸发镀沉积速度快， 但 镀层的金属颗粒较大、 镀膜不均匀、 易灼伤海绵； 单一的电弧离子 镀附着性能和绕射性能良好， 但由于在等离子体中存在微粒而造成 镀覆表面粗糙和孔隙率增加等缺陷。 发明内容
本发明的目的就是为了克服上述现有技术存在的缺陷而提供一 种可达到均匀镀覆金属、 实现带状基材双面高速连续导电化的组合 式物理气相沉积技术生产多孔金属的方法及设备。
本发明的目的可以通过以下技术方案来实现： ' 一种组合式物理气相沉积技术生产多孔金属的方法， 其特征在 于： 在卷绕式真空镀膜机内， 采用磁控溅射镀、 蒸发镀、 离子镀三 者相组合或其中任意两者相组合的组合式物理气相沉积技术对有机 多孔质带材进行连续导电化处理， 所述的有机多孔质带材上一次性 双面均匀镀覆金属， 在实施物理气相沉积导电化之前省略了对有机 多孔质带材用化学方法进行去膜前处理的步骤， 在物理气相沉积与 电沉积工序之间省略了进行化学和 /或电化学的预镀处理步骤， 直接 与走带速度为 0.6— 2m/min的后续电沉积生产线匹配。
所述的组合式物理气相沉积技术特别涉及磁控溅射镀与电弧蒸 发镀相组合的技术， 磁控溅射镀与电弧离子镀相组合的技术。
所述的有机多孔质带材包括平均孔径 2mm 的单层或多层无纺 布、 聚氨酯海绵、 棉布或化纤织物、 毡、 纤维网。
所述的聚氨酯海绵长度为 30— 300m， 幅宽为 0.3— 1 .5m。
所述的组合式物理气相沉积技术镀膜时带材的走速为 2—
20m/min。
所述的镀覆金属包括镍、 铜、 锡、 锌、 铝、 钛、 银、 金或上述 金属的复合镀层， 即以其中的一种金属作底层再镀覆另一种金属。
' 所述的复合镀层特别涉及以铝为底层的复合镀层。
一种组合式物理气相沉积技术生产多孔金属的设备， 其特征在 于： 主机设备为卷绕式真空镀膜机， 采用立式主体设计和微张力收 放卷装置， 上下两端分别为收卷室和放卷室， 收卷室内安装有收卷 辊， 放卷室内安装有放卷辊， 收卷室和放卷室之间连接安装有组合 式镀膜室、 隔板、 冷却水套、 特殊处理室、 导向辊、 测量辊； 其中 组合式镀膜室可以是以下四种组合方式中的一种： 磁控溅射镀膜室 和电弧蒸发镀膜室的组合， 磁控溅射镀膜室和电弧离子镀膜室的组 合， 电弧蒸发镀膜室和电弧离子镀膜室的组合， 磁控溅射镀膜室、 电弧离子镀膜室和电弧蒸发镀膜室的组合， 特别涉及磁控溅射镀膜 室和电弧蒸发镀膜室的组合， 磁控溅射镀膜室和电弧离子镀膜室的 组合； 有机多孔质带材从组合式镀膜室的中间通过， 连续接受镀膜 室中靶材粒子沉积而形成金属导电膜； 磁控溅射室内安装有 2~ 1 2组 磁控溅射靶， 电弧蒸发镀膜室内安装有 1 ~3组电弧蒸发靶， 电弧离子 鍍膜室内安装有 1〜3组电弧离子靶。
所述的磁控溅射镀膜、 电弧蒸发镀膜或电弧离子镀膜室的排列方式， 可 以是两种或三种镀膜方式相间排列， 也可以是每种镀膜方式连续排列后再组 合。 所述的镀膜室中采用靶间隔结构， 即上下靶中间用垂直于靶面 的冷却水套相隔， 形成若干个相对独立的镀膜区间。
所述的磁控溅射靶采用磁控镶嵌靶结构， 其靶板通过中间压条 和边压条固定在隔板上， 在靶板刻蚀到需要更换的程度时， 只要将 压条松开， 即可更换相同规格的靶板。
本发明 PVD 技术因不同于通常采用的单一形式的 PVD 技术， 故称组合式 PVD 技术。 由于组合式 PVD 技术的多项发明和创新， 在实施 PVD 导电化之前不必对基材用化学方法进行所谓的去膜 ( Uncapping ) 前处理； 采用的设备生产多孔金属材料的均镀能力比 使用单一的物理气相沉积技术的均镀能力强， 既达到了顺利进行后 续工序一高速电沉积所需要的镀层厚度、 均勾性和鍍透性要求， 又 不致于因处理时间过长而使带材的强度受到影响。 因此可与后续走 速为 0.6— 2m/min 的电沉积生产线直接匹配， 提高了生产效率。 并 且生产的多孔金属中不含磷、 不含碳， 材料的物理性能优异， 大电 流放电时电阻小， 尤其适用作动力电池的电极基板材料， 包括电动 工具、 纯电动汽车 （PEV )、 混合电动汽车 （HEV ) 用的动力电池。 因此具有良好的工业应用前景。
本发明组合式 PVD 方法的工艺流程为： 有机多孔质带材一放卷 —导向辊一特殊处理一组合式 PVD 镀膜一测量辊一收卷。 整个过程 均在真空状态下进行。
本发明特别涉及电弧蒸发镀和磁控溅射镀相组合的技术、 电弧 离子镀和磁控溅射镀相组合的技术用于连续带状聚氨酯海绵镀覆金 属镍， 生产的泡沫镍为连续带状，每卷面积可达 150m2以上，成为规模 化生产泡沫镍过程中对聚氨酯海绵进行导电化处理比较完善的方 法。 本发明所述 "双面均匀高走速镀覆金属 " 是指： 在高速走带的 有机多孔质带材上一次性双面镀覆金属， 特别涉及聚氨酯海绵镀镍 的一次性双面镀覆， 由于采用了组合式 PVD 技术， 设备具有很好的 均镀能力， 镀膜时带材走速可达 2— 20m/min， 可直接与高速 （走速 为 0.6— 2m/min ) 走带的电沉积生产线匹配， 在 PVD 与电沉积之间 可不经其他化学和 /或电化学处理； 在实施 PVD 导电化之前也不必 对基材用化学方法进行去膜 （Uncapping ) 或粗化前处理， 因此本发 明简化了工艺过程和避免了废水处理问题。
. 本发明所述的设备包括主机部分和配套部分。 主机部分包括放 卷室、 收卷室、 组合镀膜室、 控制柜， 配套部分包括抽真空系统、 冷却系统、 电源系统等。 主机部分作为组合式 PVD技术的实例之一， 特别涉及由电弧离子镀膜室、 磁控溅射镀膜室、 放卷室、 收卷室的 组合结构， 如图 1。 该技术的特征是： 磁控镀膜室 4和电弧离子镀膜 室 6的两侧各配置有 2~ 12组的磁控溅射靶 5和 1 ~3组电弧离子靶 7， 上 下靶中间用垂直于靶面的冷却水套 9相隔， 形成若干个镀膜区间。 在 电弧蒸发源上安装了磁过滤装置， 使蒸发粒子灼伤海绵的弊端得到 了有效的克服。 每个相对独立的镀膜室之间采用了高效的冷却系 统——冷却水套， 保证有机多孔质基材在镀膜过程中不致因热效应 的影响， 逸出小分子有机气体， 影响镀膜过程的顺利进行和导致基 材物理化学性能的改变， 有效改善了有机多孔质带材因镀覆时间长 和镀膜室温度过高而造成的老化、 抗拉强度降低的状况。 聚氨酯海 绵从镀膜室的中间通过， 连续接受磁控溅射靶材和电弧离子靶材的 粒子沉积而形成金属导电膜。 由于采用了微张力收放卷装置和立式 主体设计， 使海绵镀覆金属后的拉伸状态可以控制在原材料海绵的 状态。
本发明所述 "设备 " ，还特别涉及磁控镶嵌靶的结构设计。 该设 计既提高了靶材利用率和沉积速率； 又方便换靶， 节省了换靶的时 间。 图 2为磁控镶嵌靶结构示意图， 图中包括靶板 14， 隔板 15 , 中间 磁铁 16， 中间压条 17， 极靴 1 8， 边磁铁 19， 边压条 20， 靶框 2 1， 靶 底板 22， 水管 23， O型密封圈 24 ; 靶板 14通过中间压条 17和边压条 20 固定在隔板 1 5上， 在靶板刻蚀到需要更换的程度时， 只要将压条松 开.， 更换相同规格的靶板即可。
本发明所述 "制备方法及设备" 还特别涉及下述技术：
电弧源的引燃方法， 可采用的一种方法是间隙触发， 即通过向 一辅助触发电极提供电流脉冲使其导通， 从而引燃主电极之间的电 弧； 另一种方法是机械触发， 即依靠引弧电极与阴极表面瞬间的接 触与拉开来实现引燃。
电弧蒸发源的阴极材料可制成圆柱体块状， 也可以为平面矩形 的板状； 磁控溅射镀膜的阴极溅射材料可制成圆形平面或矩形平面 或圆柱形；
溅射镀可采用直流溅射， 也可采用射频溅射。
本发明对环境友好， 镀覆前不需要对有机多孔质带材做任何前 处理，能实现连续多孔质带材的一次性双面导电化， 生产的多孔质连 续金属带材、 泡沫金属无磷无碳， 镀膜均匀、 细腻， 结合力和抗拉 强度强好， 金属沉积速率高， 靶材利用率高， 可连续作业， 能直接 与高速走带的电沉积工序相匹配，是电沉积法生产多孔体金属带材理 想的导电化处理工序。
采用本发明制造的多孔质金属带材除用作镍氢、 镍镉电池极板 的基板外， 还用于制造防止电磁波和射频波干扰的多孔质金属材料； 高温过滤介质多孔质金属材料； 优良导电、 导热多孔质金属材料。 附图说明
图 1为本发明实施例示意图；
图 2为图 1中磁控镶嵌靶的结构示意图。 具体实施方式
实施例 1
待镀覆金属的有机多孔基材采用幅宽为 0.96m， 长度为 1 70m , 平 均孔径为 0.5 mm的带状聚氨酯海绵。 采用磁控溅射鍍和电弧离子镀相组合的物理气相沉积技术对聚 氨酯海绵连续带材进行导电化处理。
' 主机设备呈立式， 设备原理参见图 1。 在真空条件下， 不经过任 何前处理过程的聚氨酯海绵在放卷室 12里从放卷辊 13连续放卷， 导 向辊 1 1防止在施镀过程中海绵带材走偏， 连续带材从特殊处理室 10 经过后， 进入电弧离子镀膜室 6， 镀膜室内安装有 1组电弧离子镍靶 7， 然后带材进入磁控溅射镀膜室 4， 镀膜室内安装有 8组磁控溅射镍靶 5， 磁控溅射镍靶采用图 2所示的磁控镶嵌靶的结构， 各靶之间用垂 直于靶面的冷却水套 9相隔， 形成若干个镀膜区间， 隔板 8将磁控溅 射镀膜室和电弧离子镀膜室隔开， 带材从镀膜室中间通过， 由各靶 材提供的金属镍粒子在连续通过镀膜室中间的聚氨酯海绵上沉积，形 成金属镍导电膜， 经过镀膜后的聚氨酯海绵通过测量辊 3在收卷室 1 中用收卷辊 2连续收卷， 在整个镀覆过程中， 采用微张力传动系统， 聚氨酯海绵的走速为 2m/min。
经 PVD镀覆了金属镍的连续带状聚氨酯海绵不通过任何化学和 / 或电化学预镀步骤， 直接在走带速度为 0.6m/min 的电沉积设备上继 续电沉积金属镍。
这里采用的待镀覆基材——聚氨酯海绵并不限定其幅宽、 长度 和平均孔径， 通常幅宽为 0.3— 1 .5m，长度为 30— 300m， 平均孔径为 0.2 一 2.0mm的聚氨酯海绵都能被采用。
实施例 2
采用幅宽为 0.3m，长度为 200m， 平均孔径为 l mm 的无纺布做为可 镀覆基材。
采用磁控溅射镀和电弧蒸发镀相组合的物理气相沉积技术对基 林进行导电化处理。
主机设备呈立式放置， 在真空条件下.， 不经过任何前处理过程 的无纺布在放卷室从放卷辊连续放卷， 导向辊防止在施镀过程中无 紡布带材走偏， 连续带材从特殊处理室经过后， 进入磁控溅射镀膜 室和电弧蒸发镀膜室， 镀膜室内安装有相间排列的 12组磁控溅射铜 靶和 3组电弧蒸发铜靶， 磁控溅射铜靶采用图 2所示的磁控镶嵌靶的 结构， 各靶之间用垂直于靶面的冷却水套相隔， 形成若干个镀膜区 间， 金属铜粒子在连续通过镀膜室中间的无紡布上连续沉积形成金 属铜导电膜， 经过镀膜后的无纺布通过测量辊在收卷室中用收卷辊 连续收卷， 在整个镀覆中， 采用微张力传动系统， 无纺布的走速为
20m/min o
经 PVD镀覆了金属铜的无纺布不通过任何化学和 /或电化学预镀 步骤， 直接在走带速度为 2.Om/min 的电沉积设备上继续电沉积金属 铜。
实施例 3
采用幅宽为 0.8m,长度为 30m， 平均孔径为 2mm '的多层纤维网做 为待镀覆基材。
采用电弧蒸发镀和电弧离子镀相组合的物理气相沉积技术对基 材进行导电化处理。
. 在真空呈立式放置的卷绕式镀膜机内， 不经过任何前处理过程 的多层纤维网在放卷室从放卷辊连续放卷， 导向辊防止在施镀过程 中无纺布带材走偏， 连续带材从特殊处理室经过后， 进入电弧蒸发 镀膜室， 镀膜室内安装有 2组电弧蒸发铝靶， 然后进入电弧离子镀膜 室， 镀膜室内安装有 3组电弧离子镍靶， 隔板将两个镀膜室隔开， 镀 膜室内的各靶之间用垂直于靶面的冷却水套相隔， 形成若干个镀膜 区间 ， 金属粒子在连续通过镀膜室中间的多层纤维网上连续沉积形 成复 金属导电膜， 经过镀膜后的多层纤维网通过测里辊在收卷室 中用收卷辊连续收卷 ， 在整个镀覆中， 采用微张力传动系统， 多层 纤维网的走速为 1 0m/min
经 PVD镀覆了复合金属的多层纤维网不通过任何化学和 /或电化 学预镀步骤， 直接在走带速度为 l m/miti 的电沉积设备上继续电沉积 金属镍。
实施例 4
有机多孔质基材采用幅宽为 1 .5m，长度为 300m，平均孔径为 0. 1 mm 的棉布。 采用磁控溅射镀、 电弧蒸发镀和电弧离子镀相组合的物理气相 沉积技术对棉布进行导电化处理。
在真空条件下， 呈立式放置的镀膜机内， 不经过任何前处理过 程的棉布在放卷室里从放卷辊连续放卷， 导向辊防止在施镀过程中 棉布走偏， 棉布从特殊处理室经过后， 进入电弧蒸发镀膜室， 镀膜 室内安装有 1组电弧蒸发镍靶， 然后带材进入磁控溅射镀膜室， 鍍膜 室内安装有 2组磁控溅射镍靶， 磁控溅射镍靶采用图 2所示的磁控镶 嵌靶的结构， 然后进入电弧离子镀膜室， 镀膜室内安装有 2组电弧离 子镍靶， 隔板将各镀膜室隔开， 各靶之间用垂直于靶面的冷却水套 相隔， 形成若干个镀膜区间， 带材从镀膜室中间通过， 各靶材提供 的金属镍粒子在连续通过镀膜室中间的棉布上沉积，形成金属镍导电 膜， 经过镀膜后的棉布通过测量辊在收卷室中用收卷辊连续收卷， 在整个镀覆过程中， 采用微张力传动系统， 棉布的走速为 5m/min。
经 PVD镀覆了金属镍的连续带状棉布不通过任何化学和 /或电化 学预镀步骤， 直接在走带速 0.8m/min 的电镀设备上继续电沉积金属 镍。

Claims

权利要求
1 . 一种组合式物理气相沉积技术生产多孔金属的方法， 其特征 在于： 在卷绕式真空镀膜机内， 采用磁控溅射镀、 蒸发镀、 离子镀 三者相组合或其中任意两者相组合的组合式物理气相沉积技术对有 机多孔质带材进行连续导电化处理， 所述的有机多孔质带材上一次 性双面均匀镀覆金属， 在实施物理气相沉积导电化之前省略了对有 机多孔质带材用化学方法进行去膜前处理的步骤， 在物理气相沉积 与电沉积工序之间省略了进行化学和 /或电化学的预镀处理步骤， 直 接与走带速度为 0.6— 2m/min的后续电沉积生产线匹配。
2 . 根据权利要求 1所述的组合式物理气相沉积技术生产多孔金 属的方法， 其特征在于： 所述的组合式物理气相沉积技术特别涉及 磁控溅射镀与电弧蒸发镀相组合的技术， 磁控溅射镀与电弧离子镀 相组合的技术。
,
3 . 根据权利要求 1所述的组合式物理气相沉积技术生产多孔金 属的方法， 其特征在于： 所述的有机多孔质带材包括平均孔径 2mm 的单层或多层无纺布、 聚氨酯海绵、 棉布或化纤织物、 毡、 纤维网。
4 . 根据权利要求 3所述的组合式物理气相沉积技术生产多孔金 属的方法， 其特征在于： 所述的聚氨酯海绵长度为 30— 300m， 幅宽 为 0.3— 1 .5m。
5 . 根据权利要求 1所述的组合式物理气相沉积技术生产多孔金 属的方法， 其特征在于： 所述的组合式物理气相沉积技术镀膜时带 材的走速为 2— 20m/min。
6 . 根据权利要求 1所述的组合式物理气相沉积技术生产多孔金 属的方法， 其特征在于： 所述的镀覆金属包括镍、 铜、 锡、 锌、 铝、 钛.、 银、 金或上述金属的复合镀层， 即以其中的一种金属作底层再 镀覆另一种金属。
7 . 根据权利要求 6所述的组合式物理气相沉积技术生产多孔金 属的方法， 其特征在于： 所述的复合镀层特别涉及以铝为底层的复 合镀层。
8 . 一种组合式物理气相沉积技术生产多孔金属的设备， 其特征 在于： 主机设备为卷绕式真空镀膜机， 采用立式主体设计和微张力 收放卷装置， 上下两端分别为收卷室和放卷室， 收卷室内安装有收 卷.辊， 放卷室内安装有放卷辊， 收卷室和放卷室之间连接安装有组 合式镀膜室、 隔板、 冷却水套、 特殊处理室、 导向辊、 测量辊； 其 中组合式镀膜室可以是以下四种组合方式中的一种： 磁控溅射镀膜 室和电弧蒸发镀膜室的组合， 磁控溅射镀膜室和电弧离子镀膜室的 组合， 电弧蒸发镀膜室和电弧离子镀膜室的组合， 磁控溅射镀膜室、 电弧离子鍍膜室和电弧蒸发镀膜室的组合， 特别涉及磁控溅射镀膜 室和电弧蒸发镀膜室的组合， 磁控溅射镀膜室和电弧离子镀膜室的 组合； 有机多孔质带材从组合式镀膜室的中间通过， 连续接受镀膜 室中靶材粒子沉积而形成金属导电膜； 磁控溅射室内安装有 2〜1 2组 磁控溅射靶， 电弧蒸发镀膜室内安装有 1 ~3组电弧蒸发靶， 电弧离子 镀膜室内安装有 1 ~3组电弧离子靶。
9 . 根据权利要求 8所述的组合式物理气相沉积技术生产多孔金属 的设备， 其特征在于： 所述的磁控溅射镀膜、 电弧蒸发鍍膜或电弧离子镀膜 室的排列方式， 可以是两种或三种镀膜方式相间排列， 也可以是每种镀膜方 式连续排列后再组合。
1 0 . 根据权利要求 8所述的组合式物理气相沉积技术生产多孔金 属的设备， 其特征在于： 所述的镀膜室中采用靶间隔结构， 即上下 靶中间用垂直于靶面的冷却水套相隔， 形成若干个相对独立的镀膜 区间。
1 1 . 根据权利要求 8所述的组合式物理气相沉积技术'生产多孔金 属的设备， 其特征在于： 所述的磁控溅射靶采用磁控镶嵌靶结构， 其靶板通过中间压条和边压条固定在隔板上， 在靶板刻蚀到需要更 换的程度时， 只要将压条松开， 即可更换相同规格的靶板。
PCT/CN2003/000393 2002-05-27 2003-05-26 Method for producing porous metal by composite physical vapour deposition and the equipment thereof WO2003100111A1 (en)

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