WO2003040785A1 - Element optique, procede de fabrication de cet element optique, systeme optique, dispositif d'exposition et procede de fabrication de microdispositif - Google Patents

Element optique, procede de fabrication de cet element optique, systeme optique, dispositif d'exposition et procede de fabrication de microdispositif Download PDF

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Publication number
WO2003040785A1
WO2003040785A1 PCT/JP2002/011478 JP0211478W WO03040785A1 WO 2003040785 A1 WO2003040785 A1 WO 2003040785A1 JP 0211478 W JP0211478 W JP 0211478W WO 03040785 A1 WO03040785 A1 WO 03040785A1
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WO
WIPO (PCT)
Prior art keywords
light transmitting
transmitting member
optical element
annular member
optical
Prior art date
Application number
PCT/JP2002/011478
Other languages
English (en)
Japanese (ja)
Inventor
Yuichi Shibazaki
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2003542368A priority Critical patent/JPWO2003040785A1/ja
Publication of WO2003040785A1 publication Critical patent/WO2003040785A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/02—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of crystals, e.g. rock-salt, semi-conductors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/026—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using retaining rings or springs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature

Definitions

  • the present invention relates to an optical element, a method for manufacturing the same, an optical system, an exposure apparatus, and a method for manufacturing a micro device, and particularly to an exposure apparatus used when manufacturing a micro device such as a semiconductor element or a liquid crystal display element in a photolithography process.
  • the present invention relates to a projection optical system suitable for the present invention.
  • the pattern of a reticle as a mask is used as a substrate via a projection optical system in the photolithographic process for manufacturing semiconductor devices, imaging devices (such as CCDs), liquid crystal display devices, or thin-film magnetic heads.
  • a projection exposure apparatus is used to transfer the image onto each exposure area (each shot area) of a wafer (or glass plate, etc.).
  • the resolving power (resolution) required of the projection optical system has been increasing more and more, and the wavelength of the exposure light used has tended to become shorter and shorter. .
  • the present invention has been made in view of the above-described problems, and is an optical element capable of canceling out the influence of rotationally symmetric birefringence remaining in an optical system using a birefringent crystal material such as fluorite. And a method for producing the same.
  • the present invention includes an optical element capable of canceling the influence of rotationally symmetric birefringence, and can maintain good optical performance even when a birefringent crystal material such as fluorite is used, for example. It is an object to provide an optical system.
  • the present invention provides an exposure apparatus which has an optical system having good optical performance even when a birefringent crystal material such as fluorite is used, and is capable of performing high-resolution and high-precision exposure.
  • the purpose is to provide.
  • the present invention provides a microdevice manufacturing method capable of manufacturing a high-performance microdevice according to a high-resolution exposure technique using an exposure apparatus capable of performing high-resolution and high-precision exposure.
  • the purpose is to:
  • a light transmitting member In order to solve the above problems, in a first invention of the present invention, a light transmitting member,
  • An annular member having a coefficient of thermal expansion different from the coefficient of thermal expansion of the light transmitting member, and being disposed on the outer periphery of the light transmitting member;
  • a stress generating member that is disposed between the light transmitting member and the annular member and that generates stress on the light transmitting member due to a difference between a coefficient of thermal expansion of the light transmitting member and a coefficient of thermal expansion of the annular member;
  • the stress generating member fixes the outer periphery of the light transmitting member and the inner periphery of the annular member in an environment at a predetermined temperature different from the actual use temperature of the light transmitting member.
  • the annular member includes an inner ring fixed to the light transmitting member via the stress generating member, and a connecting member having flexibility in a radial direction of the inner ring. It is preferable to have a connected outer ring.
  • the stress generating member is an adhesive for fixing an outer periphery of the light transmitting member and an inner periphery of the annular member
  • the inner ring has an outer periphery of the light transmitting member and an inner periphery of the annular member.
  • Through hole for injecting adhesive between Is preferably formed.
  • a holding portion projecting outward from an outer peripheral surface of the outer ring with respect to a center of the outer ring is formed on an outer periphery of the outer ring.
  • the connecting member has a plurality of flexible members extending so as to circumscribe the inner ring.
  • the inner ring, the outer ring, and the plurality of flexible members are integrally formed.
  • the light transmitting member is a crystal optical member formed of a crystal belonging to a cubic system.
  • a light transmitting member and a positioning step of positioning the annular member having a thermal expansion coefficient different from the coefficient of thermal expansion of the light transmitting member and arranged on the outer periphery of the light transmitting member at predetermined positions,
  • the light transmitting member and the annular member are respectively floated and positioned using an air bearing.
  • the fixing step when the predetermined temperature is higher than the actual use temperature, an internal stress related to tension is generated in the light transmitting member.
  • an internal stress relating to compression is generated in the light transmitting member.
  • an optical system including a crystal optical member formed of a crystal belonging to a cubic system and the optical element of the first aspect.
  • an optical system according to a third aspect of the present invention for forming an image of a pattern formed on the mask on a photosensitive substrate.
  • the optical system according to the third aspect of the present invention for illuminating a mask, and a projection optical system for forming an image of a pattern formed on the mask on a photosensitive substrate.
  • An exposure apparatus is provided.
  • FIG. 1 is a diagram schematically showing a configuration of an exposure apparatus equipped with a projection optical system incorporating an optical element according to an embodiment of the present invention.
  • FIG. 2A is a diagram schematically showing a configuration of the optical element according to the present embodiment, and is a plan view.
  • FIG. 2B is a diagram schematically showing the configuration of the optical element according to the present embodiment, and shows a cross-sectional view along line A_A in FIG. 2A.
  • FIG. 3 is a view showing a state in which the light transmitting member and the inner ring are fixed to each other with an adhesive in the present embodiment.
  • FIG. 4A and FIG. 4B are views for explaining a method of manufacturing the optical element of the present embodiment.
  • FIG. 5 is a perspective view schematically showing an entire configuration of a mounting member for holding the optical element of the present embodiment and mounting the optical element on a lens barrel of a projection optical system.
  • FIG. 6 is a top view of the mounting member of FIG.
  • FIG. 7 is a sectional view taken along line BB of FIG.
  • FIG. 8 is a flowchart of a method for obtaining a semiconductor device as a micro device.
  • FIG. 9 is a flowchart of a method for obtaining a liquid crystal display element as a micro device.
  • Burnett et al. In the above-mentioned publication disclosed a technique for reducing the effects of fluorite birefringence.
  • the optical axis of a pair of fluorite lenses is aligned with the crystal axis [1 1 1], and the pair of fluorite lenses are relatively rotated about the optical axis by about 60 degrees.
  • a birefringent region in which the refractive index for circumferentially polarized light is smaller than that for radially polarized light remains (in other words, rotationally symmetric with respect to the optical axis). Birefringence remains), but the effect of birefringence can be considerably reduced.
  • the present applicant discloses that the optical axis and the crystal axis [100] (or the crystal axis [100]) of a pair of fluorite lenses And a method in which a pair of fluorite lenses are relatively rotated about the optical axis by about 45 degrees.
  • birefringence that is rotationally symmetric with respect to the optical axis will remain to some extent due to the action of the pair lens of the crystal axis [100], but the effect of the birefringence can be considerably reduced. .
  • Japanese Patent Application Laid-Open Publication No. 2000-331927 discloses that a metal belt (a correction member) is provided around a parallel flat plate (correction member) in order to correct the influence of birefringence inherent in a crystal material.
  • a technique is disclosed in which a stress adjusting means is attached and a belt is tightened via screws to generate an internal stress in a parallel plane plate in an inward direction.
  • the friction between the parallel flat plate and the belt, the manufacturing error or processing accuracy of the outer peripheral surface of the parallel flat plate, or the manufacturing error or processing of the inner peripheral surface of the belt Due to accuracy and other factors, it is impossible to generate internal stress in a parallel flat plate that is rotationally symmetric and uniform with respect to the optical axis. Further, in the prior art, internal stress cannot be generated in the outward direction in the plane parallel plate.
  • An optical element includes a light transmitting member and an annular member disposed around the light transmitting member.
  • the coefficient of thermal expansion of the light transmitting member is set to be different from the coefficient of thermal expansion of the annular member.
  • the light transmitting member and the annular member are fixed to each other while being held in an environment at a predetermined temperature different from the actual use temperature.
  • the light transmitting member when the light transmitting member and the annular member fixed to each other return to the actual use temperature, the light transmitting member has an optical axis due to the difference between the thermal expansion coefficient of the light transmitting member and the thermal expansion coefficient of the annular member.
  • a substantially rotationally symmetric internal stress is generated.
  • the direction of the generated rotationally symmetric internal stress depends on the magnitude relationship between the coefficient of thermal expansion of the light transmitting member and the coefficient of thermal expansion of the annular member and the relationship between the predetermined temperature for fixing and the actual use temperature. I do.
  • the magnitude of the rotationally symmetric internal stress depends on the temperature difference between the predetermined fixing temperature and the actual operating temperature. Dependent.
  • the optical element of the present invention by appropriately setting the magnitude relationship of the coefficient of thermal expansion, the magnitude relationship of the temperature, and the temperature difference, the optical element is substantially rotationally symmetric with respect to the optical axis and has a desired direction and a desired size.
  • the internal stress having the light transmission member can be generated.
  • the effect of rotationally symmetric birefringence remaining in an optical system using a birefringent crystal material such as fluorite can be canceled.
  • the optical element of the present invention which can cancel the influence of rotationally symmetric birefringence, into an optical system, good optical performance can be ensured even when a birefringent crystal material such as fluorite is used. can do.
  • a birefringent crystal material such as fluorite
  • high-resolution and high-precision exposure can be performed.
  • a high-performance micro device can be manufactured according to a high-resolution exposure technique by using the exposure apparatus of the present invention capable of performing high-resolution and high-precision exposure.
  • FIG. 1 is a diagram schematically showing a configuration of an exposure apparatus equipped with a projection optical system incorporating an optical element according to an embodiment of the present invention.
  • the Z-axis is parallel to the reference optical axis AX of the projection optical system PL
  • the Y-axis is parallel to the plane of FIG. 1 in the plane perpendicular to the reference optical axis AX
  • the Z-axis is the reference optical axis AX.
  • the X axis is set perpendicular to the plane of Fig. 1 in a vertical plane.
  • the exposure apparatus shown in FIG. 1 as a light source LS for supplying illumination light in the ultraviolet region includes an F 2 laser light source (wavelength 1 5 7 nm).
  • the light emitted from the light source LS illuminates a reticle (mask) R on which a predetermined pattern is formed via an illumination optical system IL.
  • the optical path between the light source LS and the illumination optical system IL is sealed by a casing (not shown), and the space from the light source LS to the optical member closest to the reticle in the illumination optical system IL is exposed. It has been replaced with an inert gas such as helium gas or nitrogen, which is a gas with a low light absorption rate, or is kept almost in a vacuum state.
  • Reticle R is placed on reticle stage RS via reticle holder RH. It is held parallel to the XY plane.
  • the pattern to be transferred is formed on the reticle R. For example, a rectangular pattern having a long side along the X direction and a short side along the Y direction in the entire pattern area by the illumination optical system IL. The area is illuminated.
  • the reticle stage RS can be moved two-dimensionally along the reticle plane (that is, the XY plane) by the action of a drive system (not shown), and its position coordinates are determined by an interferometer RIF using a reticle moving mirror RM. It is configured to be measured and position controlled.
  • a reticle pattern image on the wafer W as a photosensitive substrate via the projection optical system PL Light from the pattern formed on the reticle R forms a reticle pattern image on the wafer W as a photosensitive substrate via the projection optical system PL.
  • the wafer W is held in parallel with the XY plane on the wafer stage WS via a wafer table (wafer holder) WT. Then, on the wafer W, a rectangular exposure area having a long side along the X direction and a short side along the Y direction so as to optically correspond to the rectangular illumination area on the reticle R.
  • a pattern image is formed on the substrate.
  • the wafer stage WS can be moved two-dimensionally along the wafer surface (that is, the XY plane) by the action of a drive system (not shown), and its position coordinates are determined by an interferometer WIF using a wafer moving mirror WM. It is configured to be measured and position controlled.
  • the inside of the projection optical system PL is interposed between the optical member arranged closest to the reticle and the optical member arranged closest to the wafer among the optical members constituting the projection optical system PL.
  • the gas inside the projection optical system PL is replaced by an inert gas such as helium gas or nitrogen, or is maintained in a substantially vacuum state.
  • a reticle R and a reticle stage RS are disposed in a narrow optical path between the illumination optical system IL and the projection optical system PL, but a casing (not shown) that hermetically surrounds the reticle R and the reticle stage RS. ) Is filled with an inert gas such as nitrogen or helium gas, or is kept almost in a vacuum state. Note that a configuration may be adopted in which an inert gas is locally supplied only to an optical path portion between the illumination optical system IL and the projection optical system PL without providing a casing.
  • the narrow optical path between the projection optical system PL and the wafer W includes the wafer W and the wafer W.
  • a housing WS etc. is placed, but an inert gas such as nitrogen or helium gas is filled in a casing (not shown) that encloses the wafer W and the wafer stage WS etc. It is kept in a vacuum state.
  • an inert gas such as nitrogen or helium gas is filled in a casing (not shown) that encloses the wafer W and the wafer stage WS etc. It is kept in a vacuum state.
  • an inert gas is locally supplied only to the optical path portion between the projection optical system PL and the wafer W without providing casing is also possible.
  • an atmosphere in which the exposure light is hardly absorbed is formed over the entire optical path from the light source LS to the wafer W.
  • the illumination area on the reticle R and the exposure area on the wafer W (that is, the effective exposure area) defined by the projection optical system PL are rectangular with short sides along the Y direction. Therefore, while controlling the position of reticle R and wafer W using a drive system and an interferometer (RIF, WIF), etc., the reticle stage along the short side direction of the rectangular exposure area and illumination area, that is, along the Y direction.
  • RIF interferometer
  • the wafer W has a width equal to the long side of the exposure area and the wafer W
  • the reticle pan is scanned and exposed to an area having a length corresponding to the scanning amount (moving amount).
  • the projection optical system PL since one F 2 laser beam is used as the exposure light, the projection optical system PL includes a large number of fluorite lenses, but the paired lens with the crystal axis [1 1 1] and the crystal axis [1 [0 0], the effect of the birefringence of fluorite is significantly reduced. However, even if the crystal orientation of each fluorite lens is appropriately controlled, birefringence that is rotationally symmetric with respect to the optical axis will remain.By incorporating the optical element according to the present invention into the projection optical system PL, Excellent imaging performance is achieved by offsetting the effects of the remaining rotationally symmetric birefringence by the effects of rotationally symmetric birefringence generated by the internal stress of the optical element.
  • FIG. 2A is a diagram schematically showing a configuration of the optical element according to the present embodiment, and is a plan view.
  • FIG. 2B shows a cross-sectional view along the line AA in FIG. 2A.
  • the optical element of this embodiment includes a light transmissive member 1 having the property of transmitting F 2 laser light, the light transmitting member 1 And an annular member 2 disposed on the outer periphery of the ring.
  • the shape of the light transmitting member 1 is not limited to a biconcave shape as shown, but may be, for example, a meniscus shape, a biconvex shape, or a parallel plane shape.
  • the optical material forming the light transmitting member 1 is not limited to fluorite, but may be other suitable crystalline materials or quartz glass depending on the wavelength of light.
  • the annular member 2 includes an inner ring 2a fixed to the light transmitting member 1 and an outer ring connected to the inner ring 2a via a radially flexible connecting member of the inner ring 2a.
  • the connecting member has three plate-shaped flexible members 2c extending so as to circumscribe the inner ring 2a.
  • the flexible member 2c has both ends connected to the outer ring 2b, and a central portion connected to the inner ring 2a. Further, on the outer periphery of the outer ring 2b, a holding portion 2d protruding outward from the outer peripheral surface of the outer ring 2b is formed with respect to the center of the outer ring 2b.
  • the inner ring 2a, the outer ring 2b, and the three flexible members 2c are integrally formed of a suitable material such as aluminum or an alloy thereof, stainless steel, titanium, or brass. Is formed.
  • the coefficient of thermal expansion of the light transmitting member 1 and the coefficient of thermal expansion of the inner ring 2a (and the coefficient of thermal expansion of the annular member 2) are set to be different.
  • the light transmitting member 1 and the inner ring 2a (and, consequently, the annular member 2) are held in an environment at a predetermined temperature (for example, a high temperature or a low temperature relative to the normal temperature) different from the actual use temperature (for example, the normal temperature) of the optical element.
  • a predetermined temperature for example, a high temperature or a low temperature relative to the normal temperature
  • the adhesive is made of a material that suppresses the generation of organic substances and moisture that absorb exposure light.
  • FIG. 3 is a view showing a state in which the light transmitting member and the inner ring are fixed to each other with an adhesive in the present embodiment.
  • a through hole 3 for injecting an adhesive is provided between the outer periphery of the light transmitting member 1 and the inner periphery of the annular member 2 (therefore, the inner periphery of the inner ring 2a). 1 are formed at a predetermined pitch (that is, at equal angular intervals) along the circumferential direction of the inner ring 2a. Therefore, By injecting the adhesive through each through hole 31, the light transmitting member 1 and the annular member 2 can be evenly fixed in the circumferential direction.
  • the difference between the thermal expansion coefficient of the light transmitting member 1 and the thermal expansion coefficient of the annular member 2 causes A substantially rotationally symmetric internal stress is generated in the light transmitting member 1 with respect to the optical axis AX.
  • the thermal expansion coefficient of the light transmitting member 1 is higher than that of the annular member 2. The rate increases.
  • the thermal expansion coefficient of the annular member 2 is larger than that of the light transmitting member 1. growing.
  • the adhesive is disposed between the light transmitting member 1 and the annular member 2, and due to the difference between the coefficient of thermal expansion of the light transmitting member 1 and the coefficient of thermal expansion of the annular member 2, the adhesive is applied to the light transmitting member 1.
  • it constitutes a stress generating member that generates internal stress.
  • the fluctuation of the internal stress generated in the light transmitting member 1 does not become too large, and thus the fluctuation of the optical characteristics of the projection optical system PL becomes too large.
  • the circumferential rigidity (the product of the cross-sectional area and the elastic modulus) of the inner ring 2a must be kept small.
  • the inner ring 2a has a very thin annular plate shape, and it is preferable to provide a holding portion (projection) to be gripped when holding the optical element on the outer periphery of the inner ring 2a. Absent.
  • a structure for connecting the inner ring 2a and the outer ring 2b via a connecting member 2c having flexibility in the radial direction of the inner ring 2a Is adopted.
  • the contraction or expansion of the outer ring 2b causes the inner ring 2a (therefore, the light transmitting member). 1) is not substantially affected. Therefore, it is not necessary to keep the cross-sectional area of the outer ring 2b small, and as a result, it is possible to form the holding portion 2d on the outer periphery of the outer ring 2b.
  • FIG. 4A and FIG. 4B are diagrams illustrating the method for manufacturing the optical element of the present embodiment.
  • an air bearing having a support surface 41 a having a complementary surface shape to one optical surface 1 a of the light transmitting member 1 is used.
  • the unit 41 the light transmitting member 1 is floated and positioned.
  • the annular member 2 is lifted using an air bearing unit 42 having a supporting surface 42a having a complementary surface shape with respect to one side surface 2ba of the outer ring 2b constituting the annular member 2.
  • Position
  • the optical axis AX of the light transmitting member 1 and the center axis of the annular member 2 are aligned so that the light transmitting member 1 and the annular member 2 are aligned along the optical axis AX.
  • the light transmitting member 1 and the annular member 2 are positioned at predetermined positions in a non-contact manner.
  • the light transmitting member 1 and the annular member 2 positioned at predetermined positions are held in an environment at a predetermined temperature (for example, higher or lower than normal temperature) different from the actual use temperature.
  • a predetermined temperature for example, higher or lower than normal temperature
  • the outer periphery of the light transmitting member 1 and the inner periphery of the annular member 2 positioned at a predetermined position and held in an environment of a predetermined temperature are bonded through a through hole 31 formed in the inner ring 2a. It is fixed by injecting the agent.
  • FIG. 4B when the light transmitting member 1 and the annular member 2 fixed to each other return to the actual use temperature, the thermal expansion coefficients of the light transmitting member 1 and the annular member 2 are reduced.
  • FIG. 5 is a perspective view schematically showing an entire configuration of a mounting member for holding the optical element of the present embodiment and mounting the optical element on a lens barrel of a projection optical system.
  • FIG. 6 is a top view of the mounting member of FIG.
  • FIG. 7 is a cross-sectional view taken along line BB in FIG. Referring to FIGS. 5 to 7, the optical element of this embodiment (light transmitting member) 1 and the annular member 2) are held by a mounting member 50 and mounted on a lens barrel (not shown) of the projection optical system PL.
  • the attachment member 50 has a generally ring-shaped body 51.
  • the optical element (1, 2) of the present embodiment includes three spring groups arranged at a predetermined pitch (specifically, at equal angular intervals of 120 degrees) along the circumferential direction of the main body 51. It is attached to the attachment member 50 by the action of the solids 52a to 52c. Specifically, small seats (not shown) are provided at the positions of the three spring assemblies 52a to 52c, and formed on the outer ring 2b of the optical element on these three seats. The holder 2d is placed. At this time, the outer ring 2b and thus the optical element are prevented from being excessively restrained by the planar contact between the seat and the holding portion 2d.
  • the seat has a structure that allows the optical element to expand in the radial direction (horizontal direction), but has a predetermined rigidity in both the vertical and tangential directions, and has a high mounting rigidity with respect to the optical element. Have maintained.
  • the spring assemblies 52a to 52c directly and mechanically tighten the holding portion 2d of the optical element onto the seat, and a moment that may be generated due to a difference between the tightening force and the force of the seat. Are all removed.
  • This type of tightening mechanism includes a spring assembly
  • the light transmitting member 1 and the annular member 2 having different coefficients of thermal expansion are held in a high or low temperature environment different from the actual use temperature. They are fixed to each other. Therefore, when the light transmitting member 1 and the annular member 2 fixed to each other return to the actual use temperature, the thermal expansion coefficient of the light transmitting member 1 is reduced. Due to the difference between the thermal expansion coefficient of the annular member 2 and the thermal expansion coefficient, a substantially rotationally symmetric stress is generated in the light transmitting member 1 with respect to the optical axis AX.
  • an internal stress that is substantially rotationally symmetric with respect to the optical axis AX can be generated in the light transmitting member 2, so that the rotationally symmetric birefringence remaining in the projection optical system PL using fluorite is used.
  • a good imaging performance optical performance
  • An exposure apparatus equipped with a projection optical system PL that has good optical performance even when fluorite is used can perform high-resolution and high-precision exposure.
  • a calcium fluoride crystal (fluorite) is used as the birefringent optical material.
  • the present invention is not limited to this, and other uniaxial crystals, for example, a barium fluoride crystal (fluorite) may be used.
  • B aF 2 lithium fluoride crystal (L i F), sodium fluoride crystal (NaF), strontium fluoride crystal (S r F 2 ), beryllium fluoride crystal (B e F 2 ), etc.
  • other transparent crystal materials can be used.
  • barium fluoride crystals have already been developed for large crystal materials with diameters exceeding 20 Omm and are promising as lens materials.
  • the crystal axis orientation of the barium fluoride (BaF 2 ) or the like is also determined according to the present invention.
  • the light transmitting member 1 and the annular member 2 are fixed to each other with an adhesive.
  • the present invention is not limited to this.
  • the annular member 2 can be fixed.
  • the adhesive is injected through the plurality of through holes 31 provided at equal angular intervals in the inner ring 2a, but the number, shape, and arrangement of the through holes 31 Various modifications are possible. Further, an adhesive can be injected between the light transmitting member 1 and the annular member 2 without using the through hole 31.
  • the inner ring 2a, the outer ring 2b, and the three flexible members 2c are integrally formed of a metal material.
  • the inner ring 2a, the outer ring 2b, and the three flexible members 2c can also be formed separately.
  • a flexible member Various modifications are possible for the number and shape of 2 c and the material for forming the annular member 2.
  • the optical surface may be slightly deformed under the influence of the internal stress generated in the light transmitting member 1. Therefore, it is preferable to correct the optical surface by measuring the surface shape of the optical surface if necessary after manufacturing the optical element of the present embodiment, and performing polishing based on the measurement result.
  • the reticle (mask) is illuminated by the illumination device (illumination step), and the transfer pattern formed on the mask is exposed on the photosensitive substrate using the projection optical system (exposure step).
  • microdevices semiconductor devices, imaging devices, liquid crystal display devices, thin-film magnetic heads, etc.
  • FIG. 8 shows an example of a method for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a wafer or the like as a photosensitive substrate using the exposure apparatus of the present embodiment. It will be described with reference to FIG.
  • a metal film is deposited on one lot of wafers.
  • a photoresist is applied on the metal film on the one lot of wafers.
  • the pattern image on the mask is sequentially exposed and transferred to each shot area on the one-port wafer via the projection optical system. Is done.
  • step 304 after the photoresist on the one lot of wafers is developed, in step 305, etching is performed on the one lot of wafers using the resist pattern as a mask. As a result, a circuit pattern corresponding to the pattern on the mask is formed in each shot area on each wafer.
  • a device such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer and the like.
  • a semiconductor device manufacturing method a semiconductor device having an extremely fine circuit pattern can be obtained with good throughput.
  • steps 301 to 305 a metal is vapor-deposited on the wafer, a resist is applied on the metal film, and the respective steps of exposure, development, and etching are performed.
  • a resist may be applied on the silicon oxide film of the first step, and each step of exposure, development, etching and the like may be performed.
  • a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate).
  • a predetermined pattern circuit pattern, electrode pattern, etc.
  • a photosensitive substrate eg, a glass substrate coated with a resist
  • a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate.
  • the exposed substrate is subjected to various processes such as a developing process, an etching process, a resist stripping process, etc., whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming process 402. I do.
  • a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or R, A color filter in which a set of three stripe filters of G and B are arranged in the horizontal scanning line direction is formed.
  • a cell assembling step 403 is performed.
  • the liquid crystal is formed using the substrate having the predetermined pattern obtained in the pattern forming step 401, the color filter obtained in the color filter forming step 402, and the like. Assemble the panel (liquid crystal cell).
  • the substrate having the predetermined pattern obtained in the pattern forming step 401 and the color filter set obtained in the color filter forming step 402 are formed. Liquid crystal is injected between them to manufacture liquid crystal panels (liquid crystal cells).
  • a liquid crystal display element having an extremely fine circuit pattern can be obtained with high throughput.
  • the present invention is applied to the projection optical system mounted on the exposure apparatus.
  • the present invention is not limited to this, and the illumination optical system mounted on the exposure apparatus, The present invention can be applied to a general optical system.
  • the F 2 laser and one light source that supplies the light of the wavelength of 157 nm are used.
  • the present invention is not limited to this.
  • the light of the wavelength of 193 nm is supplied.
  • the wavelength of a r F excimer laser primary light source and 1 2 6 nm may be used as a r 2 laser light source for supplying.
  • the light transmitting member and the annular member set so as to have different coefficients of thermal expansion are fixed to each other in a state where they are held in an environment of a predetermined temperature different from the actual use temperature. Therefore, when the light transmitting member and the annular member fixed to each other return to the actual use temperature, the difference between the coefficient of thermal expansion of the light transmitting member and the coefficient of thermal expansion of the annular member causes the light transmitting member to have a different shape. A substantially rotationally symmetric stress is generated with respect to the optical axis. As a result, in the optical element of the present invention, the influence of rotationally symmetric birefringence remaining in an optical system using a birefringent crystal material such as fluorite can be canceled.
  • an optical system incorporating the optical element of the present invention which can cancel the influence of rotationally symmetric birefringence, good optical performance is ensured even when a birefringent crystal material such as fluorite is used. be able to.
  • an exposure apparatus equipped with the optical system of the present invention which has good optical performance even when a birefringent crystal material such as fluorite is used, can perform high-resolution and high-precision exposure.
  • a high-performance microdevice can be manufactured according to a high-resolution exposure technique.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

La présente invention concerne un élément optique capable de supprimer l'effet de réfraction double de symétrie de rotation restant dans un système optique utilisant un matériau cristal à double réfraction tel que du fluor. Cet élément optique comprend un élément de transmission de lumière (1) et un élément annulaire (2) possédant un coefficient de dilatation thermique différent de celui de l'élément de transmission de lumière et situé sur le côté périphérique extérieur de l'élément de transmission de lumière. Cet élément annulaire (2) comprend aussi un anneau intérieur (2a) fixé à l'élément de transmission de lumière (2) et un anneau extérieur (2b) connecté à l'anneau intérieur via des éléments de connexion (2c) possédant une souplesse dans leur sens radial. L'élément de transmission de lumière est fixé à l'élément annulaire dans un environnement d'une température spécifiée différente de la température réelle de l'élément de transmission de lumière utilisée.
PCT/JP2002/011478 2001-11-07 2002-11-01 Element optique, procede de fabrication de cet element optique, systeme optique, dispositif d'exposition et procede de fabrication de microdispositif WO2003040785A1 (fr)

Priority Applications (1)

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JP2003542368A JPWO2003040785A1 (ja) 2001-11-07 2002-11-01 光学素子、その製造方法、光学系、露光装置およびマイクロデバイスの製造方法

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JP2001341932 2001-11-07
JP2001-341932 2001-11-07

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EP1577693A3 (fr) * 2004-02-26 2006-10-11 Carl Zeiss SMT AG Objectif avec au moins un élément optique
WO2007096250A1 (fr) * 2006-02-21 2007-08-30 Carl Zeiss Smt Ag Dispositif d'éclairage pour une installation d'exposition par projection microlithographique
EP1901101A1 (fr) * 2006-09-14 2008-03-19 Carl Zeiss SMT AG Unité à élément optique et procédé de support d'un élément optique
JP2013506978A (ja) * 2009-09-30 2013-02-28 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィ投影露光装置の光学構成体
JP2013074089A (ja) * 2011-09-28 2013-04-22 Topcon Corp 光学素子保持装置への光学素子の接着方法及びこの方法に用いる光学素子保持装置及びこの光学素子を備えた露光装置
WO2017130579A1 (fr) * 2016-01-29 2017-08-03 富士フイルム株式会社 Unité de lentille de projection pour projecteur, et projecteur

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US7420725B2 (en) * 2004-09-27 2008-09-02 Idc, Llc Device having a conductive light absorbing mask and method for fabricating same

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JPH07191248A (ja) * 1993-12-27 1995-07-28 Chinon Ind Inc レンズ構体
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US7239462B2 (en) 2004-02-26 2007-07-03 Carl Zeiss Smt Ag Objective with at least one optical element
EP1577693A3 (fr) * 2004-02-26 2006-10-11 Carl Zeiss SMT AG Objectif avec au moins un élément optique
WO2007096250A1 (fr) * 2006-02-21 2007-08-30 Carl Zeiss Smt Ag Dispositif d'éclairage pour une installation d'exposition par projection microlithographique
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EP1901101A1 (fr) * 2006-09-14 2008-03-19 Carl Zeiss SMT AG Unité à élément optique et procédé de support d'un élément optique
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JP2013074089A (ja) * 2011-09-28 2013-04-22 Topcon Corp 光学素子保持装置への光学素子の接着方法及びこの方法に用いる光学素子保持装置及びこの光学素子を備えた露光装置
WO2017130579A1 (fr) * 2016-01-29 2017-08-03 富士フイルム株式会社 Unité de lentille de projection pour projecteur, et projecteur
JPWO2017130579A1 (ja) * 2016-01-29 2018-10-11 富士フイルム株式会社 プロジェクタの投射レンズユニット及びプロジェクタ
JP2019015986A (ja) * 2016-01-29 2019-01-31 富士フイルム株式会社 プロジェクタの投射レンズユニット及びプロジェクタ
US10401720B2 (en) 2016-01-29 2019-09-03 Fujifilm Corporation Projection lens unit of projector and projector capable of suppressing image deterioration
US10591696B2 (en) 2016-01-29 2020-03-17 Fujifilm Corporation Projection lens unit of projector and projector

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