WO2003028970A1 - Procede de production d'un produit moule en resine - Google Patents

Procede de production d'un produit moule en resine Download PDF

Info

Publication number
WO2003028970A1
WO2003028970A1 PCT/JP2002/009931 JP0209931W WO03028970A1 WO 2003028970 A1 WO2003028970 A1 WO 2003028970A1 JP 0209931 W JP0209931 W JP 0209931W WO 03028970 A1 WO03028970 A1 WO 03028970A1
Authority
WO
WIPO (PCT)
Prior art keywords
molded product
resin molded
resist layer
metal structure
resist
Prior art date
Application number
PCT/JP2002/009931
Other languages
English (en)
French (fr)
Inventor
Taiji Nishi
Shigeru Kawahara
Yukihiro Yanagawa
Original Assignee
Kuraray Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co., Ltd. filed Critical Kuraray Co., Ltd.
Priority to JP2003532263A priority Critical patent/JP4217619B2/ja
Priority to EP02777795.2A priority patent/EP1431018B1/en
Priority to US10/490,036 priority patent/US20040245669A1/en
Priority to KR1020047003834A priority patent/KR100573241B1/ko
Publication of WO2003028970A1 publication Critical patent/WO2003028970A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/203—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
PCT/JP2002/009931 2001-09-28 2002-09-26 Procede de production d'un produit moule en resine WO2003028970A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003532263A JP4217619B2 (ja) 2001-09-28 2002-09-26 樹脂成形品の製造方法及び金型の製造方法
EP02777795.2A EP1431018B1 (en) 2001-09-28 2002-09-26 Method of producing resin molded product
US10/490,036 US20040245669A1 (en) 2001-09-28 2002-09-26 Method of producing resin molded product
KR1020047003834A KR100573241B1 (ko) 2001-09-28 2002-09-26 수지성형품의 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-299059 2001-09-28
JP2001299059A JP3754337B2 (ja) 2001-09-28 2001-09-28 樹脂成形品の製造方法、樹脂成形品及び金型の製造方法

Publications (1)

Publication Number Publication Date
WO2003028970A1 true WO2003028970A1 (fr) 2003-04-10

Family

ID=19119866

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009931 WO2003028970A1 (fr) 2001-09-28 2002-09-26 Procede de production d'un produit moule en resine

Country Status (7)

Country Link
US (1) US20040245669A1 (ja)
EP (1) EP1431018B1 (ja)
JP (2) JP3754337B2 (ja)
KR (1) KR100573241B1 (ja)
CN (1) CN100425420C (ja)
TW (1) TW592925B (ja)
WO (1) WO2003028970A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1462859A2 (en) * 2003-03-24 2004-09-29 Kuraray Co., Ltd. Resin molded product production process, metal structure production process, and resin molded product
JP2006006287A (ja) * 2004-06-29 2006-01-12 Yamatake Corp マイクロチップの製造方法及び当該製造方法によって製造されたマイクロチップ。
JP2006006286A (ja) * 2004-06-29 2006-01-12 Yamatake Corp 細胞観察用チップの製造方法及び当該製造方法によって製造された細胞観察用チップ
WO2006095615A1 (ja) * 2005-03-07 2006-09-14 Kuraray Co., Ltd. マイクロチャネルアレイ及び製造方法、並びにこれを用いた血液測定方法
JP2009274445A (ja) * 2003-07-11 2009-11-26 Kuraray Co Ltd 燃料電池の流路部材用スタンパの製造方法、燃料電池用流路部材の製造方法、燃料電池用流路部材及び燃料電池
US8980625B2 (en) 2006-02-24 2015-03-17 National Food Research Institute Cell culture plate and method of manufacturing the same

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4848494B2 (ja) * 2005-04-06 2011-12-28 株式会社プロセス・ラボ・ミクロン 金型の製造方法及び金型
JP2007000964A (ja) * 2005-06-23 2007-01-11 Tohoku Univ 樹脂製マイクロマシン部品の製造方法
US7767126B2 (en) * 2005-08-22 2010-08-03 Sipix Imaging, Inc. Embossing assembly and methods of preparation
JP2007159658A (ja) * 2005-12-09 2007-06-28 Fujifilm Corp 採血針
US20070202560A1 (en) * 2006-02-24 2007-08-30 National Food Research Institute Resin microchannel array, method of manufacturing the same and blood test method using the same
JP2007244671A (ja) * 2006-03-16 2007-09-27 Fujifilm Corp 採血針、注射針、翼付針、検査キットおよび採血キット
US7862756B2 (en) * 2006-03-30 2011-01-04 Asml Netherland B.V. Imprint lithography
EP1938937B1 (en) * 2006-12-29 2012-05-16 Samsung SDI Co., Ltd. Method of manufacturing soft mold for shaping barrier rib, method of manufacturing barrier rib and lower panel, and plasma display panel
JP4972015B2 (ja) * 2008-03-10 2012-07-11 富士フイルム株式会社 金型の加工方法および製造方法
JP5579605B2 (ja) * 2008-08-07 2014-08-27 株式会社クラレ 成形金型および成形金型の製造方法
WO2011111609A1 (ja) * 2010-03-09 2011-09-15 Jsr株式会社 微細構造体、微細構造体成形用型、及び微細構造体の製造方法
KR101201106B1 (ko) * 2010-11-02 2012-11-13 이상현 생화학 분석칩 내부의 나노 미세전극 가공방법
WO2013077077A1 (ja) * 2011-11-22 2013-05-30 株式会社アドバンテスト 生体光計測用ファントム、ファントム積層体およびファントムの製造方法
US9399926B2 (en) 2013-08-23 2016-07-26 Siemens Energy, Inc. Belly band seal with circumferential spacer

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4088490A (en) 1976-06-14 1978-05-09 International Business Machines Corporation Single level masking process with two positive photoresist layers
EP0024515A1 (de) 1979-08-18 1981-03-11 Kernforschungszentrum Karlsruhe Gmbh Verfahren zum Herstellen von Trenndüsenelementen zur Trennung gas-oder dampfförmiger Gemische, insbesondere Isotopengemische, und nach diesem Verfahren hergestellte Trenndüsenelemente
JPH04256393A (ja) * 1991-02-08 1992-09-11 Nec Corp 混成集積回路基板の製造方法
EP0607680A2 (en) 1992-12-22 1994-07-27 Wisconsin Alumni Research Foundation Formation of microstructures using a preformed photoresist sheet
US5716741A (en) 1993-03-30 1998-02-10 Microparts Gesellschaft Fur Mikrostrukturtechnik Mbh High-precision stepped microstructure bodies
US5722162A (en) * 1995-10-12 1998-03-03 Fujitsu Limited Fabrication procedure for a stable post
JP2001338444A (ja) * 2000-05-25 2001-12-07 Mitsubishi Chemicals Corp 原盤、スタンパ及び情報記録媒体の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60231388A (ja) * 1984-04-25 1985-11-16 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 基板の活性化方法
DE3574418D1 (en) * 1984-05-30 1989-12-28 Fujitsu Ltd Pattern-forming material and its production and use
US5209688A (en) * 1988-12-19 1993-05-11 Narumi China Corporation Plasma display panel
US5580511A (en) * 1990-01-25 1996-12-03 Dai Nippon Insatsu Kabushiki Kaisha Method of forming thick film pattern and material for forming thick film pattern
SE470347B (sv) * 1990-05-10 1994-01-31 Pharmacia Lkb Biotech Mikrostruktur för vätskeflödessystem och förfarande för tillverkning av ett sådant system
DE4018427A1 (de) * 1990-06-14 1992-01-16 Samsung Electronics Co Ltd Fotolitographie-verfahren zur ausbildung eines feinlinigen musters
US5407782A (en) * 1991-09-06 1995-04-18 Kawasaki Steel Corporation Method of forming resist pattern in a multilayer resist
US5656414A (en) * 1993-04-23 1997-08-12 Fujitsu Limited Methods of forming tall, high-aspect ratio vias and trenches in photo-imageable materials, photoresist materials, and the like
JP2924664B2 (ja) * 1994-09-28 1999-07-26 住友電気工業株式会社 微細セラミックス構造体の形成方法
US6814897B2 (en) * 1998-03-27 2004-11-09 Discovision Associates Method for manufacturing a molding tool used for substrate molding
US6245849B1 (en) * 1999-06-02 2001-06-12 Sandia Corporation Fabrication of ceramic microstructures from polymer compositions containing ceramic nanoparticles
US6881358B1 (en) * 1999-07-06 2005-04-19 Mems Optical Inc. Mold apparatus and method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4088490A (en) 1976-06-14 1978-05-09 International Business Machines Corporation Single level masking process with two positive photoresist layers
EP0024515A1 (de) 1979-08-18 1981-03-11 Kernforschungszentrum Karlsruhe Gmbh Verfahren zum Herstellen von Trenndüsenelementen zur Trennung gas-oder dampfförmiger Gemische, insbesondere Isotopengemische, und nach diesem Verfahren hergestellte Trenndüsenelemente
JPH04256393A (ja) * 1991-02-08 1992-09-11 Nec Corp 混成集積回路基板の製造方法
EP0607680A2 (en) 1992-12-22 1994-07-27 Wisconsin Alumni Research Foundation Formation of microstructures using a preformed photoresist sheet
US5716741A (en) 1993-03-30 1998-02-10 Microparts Gesellschaft Fur Mikrostrukturtechnik Mbh High-precision stepped microstructure bodies
US5722162A (en) * 1995-10-12 1998-03-03 Fujitsu Limited Fabrication procedure for a stable post
JP2001338444A (ja) * 2000-05-25 2001-12-07 Mitsubishi Chemicals Corp 原盤、スタンパ及び情報記録媒体の製造方法

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
A. SCHMIDT ET AL.: "deal with aligned double exposure in deep X-ray lithography", MICROELECTRONIC ENGINEERING, vol. 30, 1996, pages 235 - 238
G. CALDERON, PROCEEDINGS OF SPIE, vol. 2880, 1996, pages 231 - 235
L. DELLMANN, SOLID-STATE SENSORS AND ACTUATORS, vol. 1, 1997, pages 641 - 644
See also references of EP1431018A4

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1462859A2 (en) * 2003-03-24 2004-09-29 Kuraray Co., Ltd. Resin molded product production process, metal structure production process, and resin molded product
EP1462859A3 (en) * 2003-03-24 2012-06-20 Kuraray Co., Ltd. Resin molded product production process, metal structure production process, and resin molded product
JP2009274445A (ja) * 2003-07-11 2009-11-26 Kuraray Co Ltd 燃料電池の流路部材用スタンパの製造方法、燃料電池用流路部材の製造方法、燃料電池用流路部材及び燃料電池
JP2006006287A (ja) * 2004-06-29 2006-01-12 Yamatake Corp マイクロチップの製造方法及び当該製造方法によって製造されたマイクロチップ。
JP2006006286A (ja) * 2004-06-29 2006-01-12 Yamatake Corp 細胞観察用チップの製造方法及び当該製造方法によって製造された細胞観察用チップ
JP4549755B2 (ja) * 2004-06-29 2010-09-22 株式会社山武 マイクロチップの製造方法及び当該製造方法によって製造されたマイクロチップ。
WO2006095615A1 (ja) * 2005-03-07 2006-09-14 Kuraray Co., Ltd. マイクロチャネルアレイ及び製造方法、並びにこれを用いた血液測定方法
KR100895228B1 (ko) 2005-03-07 2009-05-04 가부시키가이샤 구라레 마이크로 채널 어레이 및 제조 방법, 그리고 이것을 사용한혈액 측정 방법
US8980625B2 (en) 2006-02-24 2015-03-17 National Food Research Institute Cell culture plate and method of manufacturing the same

Also Published As

Publication number Publication date
CN1599659A (zh) 2005-03-23
EP1431018B1 (en) 2015-11-11
JP4217619B2 (ja) 2009-02-04
KR20040047832A (ko) 2004-06-05
JPWO2003028970A1 (ja) 2005-01-13
EP1431018A1 (en) 2004-06-23
CN100425420C (zh) 2008-10-15
US20040245669A1 (en) 2004-12-09
KR100573241B1 (ko) 2006-04-24
TW592925B (en) 2004-06-21
JP3754337B2 (ja) 2006-03-08
EP1431018A4 (en) 2007-05-16
JP2004291234A (ja) 2004-10-21

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