WO2003018703A1 - Feuille adhesive et dispositif semi-conducteur; procede de fabrication - Google Patents

Feuille adhesive et dispositif semi-conducteur; procede de fabrication Download PDF

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Publication number
WO2003018703A1
WO2003018703A1 PCT/JP2002/008616 JP0208616W WO03018703A1 WO 2003018703 A1 WO2003018703 A1 WO 2003018703A1 JP 0208616 W JP0208616 W JP 0208616W WO 03018703 A1 WO03018703 A1 WO 03018703A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive layer
adhesive sheet
radiation
Prior art date
Application number
PCT/JP2002/008616
Other languages
English (en)
French (fr)
Inventor
Hiroyuki Kawakami
Teiichi Inada
Takashi Masuko
Keisuke Ookubo
Keiichi Hatakeyama
Toshiyuki Yanagawa
Shigeki Katogi
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Priority to JP2003523555A priority Critical patent/JP4075801B2/ja
Priority to KR1020037017280A priority patent/KR100647132B1/ko
Publication of WO2003018703A1 publication Critical patent/WO2003018703A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/JP2002/008616 2001-08-27 2002-08-27 Feuille adhesive et dispositif semi-conducteur; procede de fabrication WO2003018703A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003523555A JP4075801B2 (ja) 2001-08-27 2002-08-27 接着シートならびに半導体装置およびその製造法
KR1020037017280A KR100647132B1 (ko) 2001-08-27 2002-08-27 접착시트 및 반도체장치 및 그 제조방법

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
JP2001256286 2001-08-27
JP2001-256285 2001-08-27
JP2001-256286 2001-08-27
JP2001256285 2001-08-27
JP2001262662 2001-08-31
JP2001-262662 2001-08-31
JP2001-269013 2001-09-05
JP2001269013 2001-09-05
JP2002-35488 2002-02-13
JP2002035488 2002-02-13
JP2002037032 2002-02-14
JP2002-37032 2002-02-14
JP2002076577 2002-03-19
JP2002-76577 2002-03-19
JP2002083818 2002-03-25
JP2002083777 2002-03-25
JP2002-83844 2002-03-25
JP2002083844 2002-03-25
JP2002-83777 2002-03-25
JP2002137252 2002-05-13
JP2002-137252 2002-05-13
JP2002-83818 2003-03-25

Publications (1)

Publication Number Publication Date
WO2003018703A1 true WO2003018703A1 (fr) 2003-03-06

Family

ID=27582333

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008616 WO2003018703A1 (fr) 2001-08-27 2002-08-27 Feuille adhesive et dispositif semi-conducteur; procede de fabrication

Country Status (4)

Country Link
JP (1) JP4075801B2 (ja)
KR (1) KR100647132B1 (ja)
CN (1) CN100473704C (ja)
WO (1) WO2003018703A1 (ja)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004352855A (ja) * 2003-05-29 2004-12-16 Toray Ind Inc 半導体用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置
JPWO2005004216A1 (ja) * 2003-07-08 2006-08-17 リンテック株式会社 ダイシング・ダイボンド用粘接着シートおよび半導体装置の製造方法
WO2006126761A1 (en) * 2005-05-25 2006-11-30 Ls Cable Ltd. Adhesive film for semiconductor
WO2007018120A1 (ja) * 2005-08-05 2007-02-15 Hitachi Chemical Co., Ltd. 接着フィルム及びこれを用いた半導体装置
JPWO2005036633A1 (ja) * 2003-10-07 2007-11-22 長瀬産業株式会社 電子部材の製造方法、及び、接着材付ｉｃチップ
EP1894980A1 (en) * 2006-08-31 2008-03-05 National Starch and Chemical Investment Holding Corporation Dicing die bonding film
US7578891B2 (en) 2004-05-18 2009-08-25 Hitachi Chemical Company, Ltd. Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
JP2009215456A (ja) * 2008-03-11 2009-09-24 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
WO2010136086A1 (de) * 2009-05-28 2010-12-02 Henkel Ag & Co. Kgaa Klebefolie oder klebeband auf basis von epoxiden
JP2012082264A (ja) * 2010-10-07 2012-04-26 Dainippon Printing Co Ltd 粘接着剤組成物及び粘接着シート
CN102460655A (zh) * 2009-06-15 2012-05-16 Lg化学株式会社 晶片处理薄片
JP4952585B2 (ja) * 2006-01-23 2012-06-13 日立化成工業株式会社 接着剤組成物、フィルム状接着剤、接着シート、並びにそれを用いた半導体装置
WO2014058056A1 (ja) * 2012-10-11 2014-04-17 日立化成株式会社 粘着剤組成物、積層体及び剥離方法
US8715454B2 (en) 2007-01-26 2014-05-06 Hitachi Chemical Company, Ltd. Sealing film and a semiconductor device using the same
WO2014084357A1 (ja) * 2012-11-30 2014-06-05 リンテック株式会社 硬化性樹脂膜形成層付シートおよび該シートを用いた半導体装置の製造方法
US10947428B2 (en) 2010-11-19 2021-03-16 Ppg Industries Ohio, Inc. Structural adhesive compositions
US11479621B2 (en) 2018-06-27 2022-10-25 3M Innovative Properties Company UV-curable composition and adhesive film, adhesive tape and bonding member containing the same

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010113759A1 (ja) * 2009-03-31 2010-10-07 住友ベークライト株式会社 樹脂スペーサー用フィルム、受光装置及びその製造方法、並びにｍｅｍｓデバイス及びその製造方法
WO2010131655A1 (ja) * 2009-05-13 2010-11-18 日立化成工業株式会社 接着シート
JP2011018804A (ja) * 2009-07-09 2011-01-27 Sumitomo Bakelite Co Ltd 半導体用フィルムおよび半導体装置の製造方法
WO2012111964A2 (ko) * 2011-02-14 2012-08-23 주식회사 엘지화학 무용제형 조성물 및 그의 제조방법
WO2013119976A1 (en) * 2012-02-08 2013-08-15 Brewer Science Inc. Fluorinated silane coating compositions for thin wafer bonding and handling
JP6101492B2 (ja) * 2013-01-10 2017-03-22 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
CN105026510B (zh) * 2013-01-22 2017-03-15 东丽株式会社 粘合剂组合物、粘合剂片材以及使用它们的固化物及半导体器件
CN103627338A (zh) * 2013-11-19 2014-03-12 常熟市长江胶带有限公司 减震胶带
DE102014208109A1 (de) * 2014-04-29 2015-10-29 Tesa Se Spaltbares Klebend mit dosierfähigen spaltbaren Flüssigklebstoff
CN103980830B (zh) * 2014-05-06 2015-08-26 昆山龙腾光电有限公司 胶带、液晶显示模组及拆解液晶面板与背光板的方法
JP6431343B2 (ja) * 2014-11-21 2018-11-28 日東電工株式会社 接着シート、ダイシングシート付き接着シート、積層シート及び半導体装置の製造方法
JP6524972B2 (ja) * 2015-09-28 2019-06-05 Jsr株式会社 対象物の処理方法、仮固定用組成物、半導体装置及びその製造方法
JP7088023B2 (ja) * 2016-12-08 2022-06-21 日産化学株式会社 剥離層の製造方法
WO2018180999A1 (ja) * 2017-03-29 2018-10-04 日東電工株式会社 粘着剤層付片保護偏光フィルム、画像表示装置およびその連続製造方法
CN107760221A (zh) * 2017-10-25 2018-03-06 上海固柯胶带科技有限公司 一种uv胶带及其制备方法
JP2018115332A (ja) * 2018-03-20 2018-07-26 リンテック株式会社 粘着テープおよび半導体装置の製造方法
KR102480379B1 (ko) 2019-01-29 2022-12-23 주식회사 엘지화학 반도체 패키지의 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188642A (ja) * 1983-04-11 1984-10-26 Nitto Electric Ind Co Ltd トランスフア−性感圧接着テ−プまたはシ−ト
JP2002180021A (ja) * 2000-12-19 2002-06-26 Hitachi Chem Co Ltd 接着剤組成物、これを用いた接着フィルム、半導体チップ搭載用基板及びこれを用いた半導体装置
JP2002226796A (ja) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd ウェハ貼着用粘着シート及び半導体装置
JP2002226801A (ja) * 2001-02-05 2002-08-14 Hitachi Chem Co Ltd 接着シート、その使用方法及び半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59188642A (ja) * 1983-04-11 1984-10-26 Nitto Electric Ind Co Ltd トランスフア−性感圧接着テ−プまたはシ−ト
JP2002180021A (ja) * 2000-12-19 2002-06-26 Hitachi Chem Co Ltd 接着剤組成物、これを用いた接着フィルム、半導体チップ搭載用基板及びこれを用いた半導体装置
JP2002226796A (ja) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd ウェハ貼着用粘着シート及び半導体装置
JP2002226801A (ja) * 2001-02-05 2002-08-14 Hitachi Chem Co Ltd 接着シート、その使用方法及び半導体装置

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004352855A (ja) * 2003-05-29 2004-12-16 Toray Ind Inc 半導体用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置
JP4547866B2 (ja) * 2003-05-29 2010-09-22 東レ株式会社 半導体用接着剤付きテープおよび半導体接続用基板ならびに半導体装置
JP4536660B2 (ja) * 2003-07-08 2010-09-01 リンテック株式会社 ダイシング・ダイボンド用粘接着シートおよび半導体装置の製造方法
JPWO2005004216A1 (ja) * 2003-07-08 2006-08-17 リンテック株式会社 ダイシング・ダイボンド用粘接着シートおよび半導体装置の製造方法
JPWO2005036633A1 (ja) * 2003-10-07 2007-11-22 長瀬産業株式会社 電子部材の製造方法、及び、接着材付ｉｃチップ
US8012580B2 (en) 2004-05-18 2011-09-06 Hitachi Chemical Company, Ltd. Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
US8003207B2 (en) 2004-05-18 2011-08-23 Hitachi Chemical Company, Ltd. Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device
US7578891B2 (en) 2004-05-18 2009-08-25 Hitachi Chemical Company, Ltd. Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
WO2006126761A1 (en) * 2005-05-25 2006-11-30 Ls Cable Ltd. Adhesive film for semiconductor
JPWO2007018120A1 (ja) * 2005-08-05 2009-02-19 日立化成工業株式会社 接着フィルム及びこれを用いた半導体装置
WO2007018120A1 (ja) * 2005-08-05 2007-02-15 Hitachi Chemical Co., Ltd. 接着フィルム及びこれを用いた半導体装置
JP4952585B2 (ja) * 2006-01-23 2012-06-13 日立化成工業株式会社 接着剤組成物、フィルム状接着剤、接着シート、並びにそれを用いた半導体装置
EP1894980A1 (en) * 2006-08-31 2008-03-05 National Starch and Chemical Investment Holding Corporation Dicing die bonding film
US8715454B2 (en) 2007-01-26 2014-05-06 Hitachi Chemical Company, Ltd. Sealing film and a semiconductor device using the same
US8771828B2 (en) 2007-01-26 2014-07-08 Hitachi Chemical Company, Ltd. Sealing film and a semiconductor device using the same
JP2009215456A (ja) * 2008-03-11 2009-09-24 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
WO2010136086A1 (de) * 2009-05-28 2010-12-02 Henkel Ag & Co. Kgaa Klebefolie oder klebeband auf basis von epoxiden
CN102460655A (zh) * 2009-06-15 2012-05-16 Lg化学株式会社 晶片处理薄片
JP2012082264A (ja) * 2010-10-07 2012-04-26 Dainippon Printing Co Ltd 粘接着剤組成物及び粘接着シート
US10947428B2 (en) 2010-11-19 2021-03-16 Ppg Industries Ohio, Inc. Structural adhesive compositions
US11629276B2 (en) 2010-11-19 2023-04-18 Ppg Industries Ohio, Inc. Structural adhesive compositions
WO2014058056A1 (ja) * 2012-10-11 2014-04-17 日立化成株式会社 粘着剤組成物、積層体及び剥離方法
JPWO2014058056A1 (ja) * 2012-10-11 2016-09-05 日立化成株式会社 粘着剤組成物、積層体及び剥離方法
WO2014084357A1 (ja) * 2012-11-30 2014-06-05 リンテック株式会社 硬化性樹脂膜形成層付シートおよび該シートを用いた半導体装置の製造方法
JPWO2014084357A1 (ja) * 2012-11-30 2017-01-05 リンテック株式会社 硬化性樹脂膜形成層付シートおよび該シートを用いた半導体装置の製造方法
US11479621B2 (en) 2018-06-27 2022-10-25 3M Innovative Properties Company UV-curable composition and adhesive film, adhesive tape and bonding member containing the same

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CN1633487A (zh) 2005-06-29
CN100473704C (zh) 2009-04-01
KR20040030724A (ko) 2004-04-09
JPWO2003018703A1 (ja) 2004-12-09
JP4075801B2 (ja) 2008-04-16
KR100647132B1 (ko) 2006-11-17

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