WO2003018276A1 - Procede de traitement d'un materiau fragile et dispositif de traitement - Google Patents

Procede de traitement d'un materiau fragile et dispositif de traitement Download PDF

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Publication number
WO2003018276A1
WO2003018276A1 PCT/JP2002/008538 JP0208538W WO03018276A1 WO 2003018276 A1 WO2003018276 A1 WO 2003018276A1 JP 0208538 W JP0208538 W JP 0208538W WO 03018276 A1 WO03018276 A1 WO 03018276A1
Authority
WO
WIPO (PCT)
Prior art keywords
brittle material
processing
laser light
cooling liquid
laser beam
Prior art date
Application number
PCT/JP2002/008538
Other languages
English (en)
Japanese (ja)
Other versions
WO2003018276B1 (fr
Inventor
Yasuhide Otsu
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Publication of WO2003018276A1 publication Critical patent/WO2003018276A1/fr
Publication of WO2003018276B1 publication Critical patent/WO2003018276B1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a processing method and processing apparatus for brittle materials such as glass, ceramics, and semiconductor wafers.
  • a brittle material is formed by guiding a crack formed at the processing start point of a brittle material along the planned processing line by thermal stress caused by laser light irradiation.
  • a cutting method for cutting is disclosed.
  • Japanese Patent No. 3 0 2 7 7 6 8 Japanese Patent Publication No. 8-5 0 9 9 4 7 discloses a predetermined depth from the surface of the material due to a thermal stress change caused by laser beam irradiation on the brittle material.
  • a processing method is disclosed in which a crack that reaches the maximum is formed and the brittle material is divided using the crack.
  • a brittle material to be processed is placed on a table, and the brittle material on the table is irradiated with laser light from a laser light source, and the irradiation position of the laser light is determined by laser. Machining is performed by moving along the line to be machined by relative movement between the light and the table.
  • a brittle material at room temperature is heated by irradiating it with a laser beam, and then, by cooling, a thermal strain is generated, and the crack propagates along the planned processing line. It has been.
  • a nozzle 13 for spraying the cooling liquid f is provided on the surface of the brittle material W, and the surface of the brittle material W is irradiated with the laser beam L from the laser light source 12 and the laser beam is irradiated.
  • the thermal strain is generated by spraying the coolant f behind the position. The cracks are caused to propagate along the planned processing line from the end of the brittle material W by the relative movement between the laser beam L and the brittle material W due to the thermal strain.
  • the present invention has been made in view of such a situation, and an object of the present invention is to provide a processing method and a processing apparatus for a brittle material capable of efficiently developing cracks generated by laser light irradiation. Disclosure of the invention
  • the processing method of the present invention processes a brittle material by irradiating a brittle material with laser light from a laser light source and relatively moving the irradiation position on the surface of the brittle material along a planned processing line.
  • a brittle material is formed in a state where a cooling liquid film is formed on the entire surface of the brittle material to cool the brittle material, and then a gas is blown to the surface of the brittle material to make a hole in the cooling liquid film. While irradiating the surface of the laser beam with the laser beam, the laser beam irradiation position and the gas spray position are moved along the planned processing line for processing.
  • the processing method of the present invention processes a brittle material by irradiating the brittle material with laser light from a laser light source and relatively moving the irradiation position on the surface of the brittle material along the planned processing line.
  • this method in a state where a cooling liquid film is formed on the entire surface of the brittle material and the brittle material is cooled, the surface of the brittle material is irradiated with laser light while being irradiated through the cooling liquid film. It is characterized by irradiating the surface of the brittle material with a laser beam having a wavelength that has a low absorptivity with respect to the cooling liquid when the position is moved along the planned processing line.
  • the temperature change at the time of crack occurrence is as follows: room temperature-> laser light irradiation temperature-> coolant temperature, as shown in Fig. 7 (B) .
  • the difference between the temperature difference before irradiation of the brittle material with laser light that is, the difference between the room temperature and the coolant temperature. Only the temperature change is different, and the processing method of the present invention becomes larger. In addition, the temperature difference becomes more prominent as the temperature of the coolant used is lower.
  • a temperature change larger than that of the conventional processing method can be obtained, so that the crack can be efficiently propagated with an increased thermal strain effect. As a result, a crack extending to a deep region of the material can be advanced at high speed, and high-speed machining can be realized.
  • the temperature-controlled cooling liquid has a large heat capacity, so the temperature is stable, so the brittle material should be cooled with the cooling liquid before laser light irradiation.
  • a stable thermal strain effect can be always obtained.
  • the pressure of the gas blown to the brittle material, the intensity of the laser beam, etc. the cooling environment can be maintained relatively easily and the stability of the thermal strain effect can be further enhanced. .
  • the processing apparatus of the present invention is an apparatus suitable for carrying out a processing method of a brittle material having the above characteristics, and forms a cooling liquid film on the entire material surface by supplying a cooling liquid to the surface of the brittle material.
  • the cooling liquid supply system, the nozzle for blowing gas to the laser beam irradiation position, and the laser beam irradiation position and the gas blowing position to the brittle material are relatively moved on the material surface along the planned processing line. Characterized by having scanning means (eg XY table).
  • the irradiation of the laser beam from the laser light source completely cuts the brittle material to the left and right of the processing line (scribe line) by cutting the deep brittle material into the brittle material, or only by the laser beam irradiation. It can be applied to any cutting process.
  • FIG. 1 is a diagram schematically showing a configuration of an embodiment of the present invention.
  • FIG. 2 is a diagram schematically showing a tip portion of a nozzle used in the embodiment of the present invention.
  • FIG. 3 is an explanatory view of the positional relationship between the laser beam irradiation position and the hole in the cooling liquid film.
  • FIG. 4 is a diagram showing an example of the hole in the cooling liquid film.
  • FIG. 5 is a diagram schematically showing the configuration of another embodiment of the present invention.
  • FIG. 6 is a diagram schematically showing the configuration of another embodiment of the present invention.
  • FIG. 7 is a schematic diagram for explaining the operation of the present invention and the prior art.
  • FIG. 8 is a diagram schematically showing an example of a conventional processing method. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 is a diagram schematically showing the configuration of the embodiment of the present invention.
  • FIG. 2 is a diagram schematically showing the tip of the nozzle 3.
  • the processing apparatus includes an X—Y table 1 on which the brittle material W to be processed is placed, and a laser light source 2 that irradiates the brittle material W placed on the X—Y table 1 with laser light L from above. And a nozzle 3 for spraying gas a (for example, air) to the laser beam irradiation position, and supplying a cooling liquid (for example, water) to the surface of the brittle material W on the X—Y table 1 to the entire surface of the material
  • the cooling liquid supply system 4 that forms the cooling liquid film t is mainly configured.
  • various laser devices such as HF laser, CO laser, C02 laser, or YAG laser are applied.
  • the brittle material W to be processed is placed on the XY table 1 and fixed by, for example, a suction means (not shown).
  • a coolant is supplied from the coolant supply system 4 to the surface of the brittle material W, and a coolant liquid film t is formed on the entire surface of the brittle material W, whereby a part or the whole of the brittle material W is cooled to the coolant temperature. Allow to cool.
  • the nozzle Jet of gas a from 3 is sprayed on the surface of brittle material W, and the coolant around the processing start point is blown off to make holes h in the coolant film t.
  • the laser beam L from the laser light source 2 is irradiated onto the surface of the brittle material W (in the hole h), and the X—Y table 1 is driven to position the laser beam L on the brittle material W.
  • the spray position of gas a is moved along the planned processing line C, and the surface of the brittle material W is sequentially irradiated with the holes h in the cooling liquid film t. Cracks are generated by such laser light irradiation, and the cracks propagate along the planned machining line C.
  • both of the cutting process for cracking deep inside the brittle material W or the cleaving process for completely separating the brittle material W by irradiation with the laser beam L from the laser light source 2 are performed. Is possible.
  • a part or the whole of the brittle material W before laser beam irradiation is covered with the cooling liquid so as to have the temperature of the cooling liquid, and after heating by laser light irradiation, the cooling liquid temperature is again cooled. Therefore, a large temperature change can be obtained. As a result, the thermal strain effect is increased, and a crack extending to a deep region can be advanced at high speed.
  • this embodiment as shown in FIG.
  • Japanese Patent No. 3 0 2 7 7 6 8 Japanese National Publication No. Hei 8-0 9 9 4 7 discloses the 5th page, 9th column, 4th line, 8th column to 10th column.
  • Japanese Patent No. 3 0 2 7 7 6 8 Japanese National Publication No. Hei 8-0 9 9 4 7 discloses the 5th page, 9th column, 4th line, 8th column to 10th column.
  • the seventh line the following contents are disclosed with reference to FIG.
  • V k X a (b + 1) / ⁇
  • Length of beam spot 1 Distance from the rear edge of the beam spot to the front edge of the cooling zone
  • the hole in the cooling liquid film t may be an elongated elliptical hole I! 'As shown in FIG.
  • the spot S may be an elongated elliptical shape.
  • the moving speed can be increased from the relational expression disclosed in the prior patent application.
  • the nozzle 3 coaxial with the laser light source 2 is used.
  • the present invention is not limited to this.
  • this nozzle 3 'force or jet of gas a is blown onto the brittle material W surface.
  • the moving speed or crack depth satisfying the relational expression disclosed in the earlier patent is given among the numerical parameters given in the arrangement of FIG.
  • the gas is blown from the nozzle to make a hole in the cooling liquid film.
  • the surface of the material W may be irradiated through the cooling liquid film t.
  • the wavelength of the laser beam L used in the embodiment of FIG. It is necessary to examine in advance whether or not it is appropriate in relation to the absorption rate with the coolant used in the embodiment shown in the figure.
  • the laser light wavelength which has a low absorptivity with respect to the coolant, depends on conditions such as the type and film thickness of the coolant, so specific numerical values are not shown, but the laser light wavelength in the coolant film The wavelength may be selected so that the absorption loss does not adversely affect the processing. Also, instead of selecting the laser beam wavelength, a coolant with low laser beam absorption may be selected.
  • Japanese Patent Laid-Open No. 7-3 2 3 3 8 2 discloses a technique of cooling and cleaving from the back side of a workpiece.
  • heat transfer time corresponding to the thickness of the material is required, and cooling is inefficient.
  • the present invention can have the following advantages compared to the conventional example.
  • the cooling capacity is large, and the laser processing surface is directly cooled, so that the cooling efficiency is good. As a result, machining efficiency increases.
  • the above publication discloses that a crack is induced by irradiating a laser in a state where an object is locally cooled by blowing cold air in the vicinity of a laser beam irradiation position as a second prior art.
  • the cooling capacity is small because the heat capacity of air is small.
  • the present invention is characterized in that the immediate vicinity of the heating part is cooled and the parts other than the laser irradiation part are cooled in a wide range. As a result, a large thermal stress can be generated in the processed material, and the processing speed can be increased.
  • the above publication discloses a method in which the material to be treated is cooled in advance as another embodiment, but the cooling effect is diminished if heated during processing. There is a problem.
  • a liquid having a low laser absorptance is selected and the material is heated via the liquid film, so that it can be cooled by the action of both the heat of vaporization and conduction heat immediately near the irradiated part. . Therefore, in this embodiment, the temperature gradient between the irradiation part and the cooling part can be increased, and a large stress can be generated in the immediate vicinity of the heating part, so that high-speed machining is possible.
  • the brittle material processing method and processing apparatus is brittle only by laser beam irradiation, cutting processing that deeply cracks the brittle material, or laser beam irradiation alone. High-speed processing can be realized for both cutting processes that completely separate the material on the left and right of the processing line, which is beneficial.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un procédé de traitement d'un matériau fragile et un dispositif de traitement, permettant aux fissures causées par le rayonnement d'un faisceau laser de progresser efficacement. Le procédé de traitement d'un matériau fragile consiste à irradier le matériau fragile (W) à l'aide d'un faisceau laser d'une source de faisceau laser tout en déplaçant de manière relative sa position de rayonnement le long d'une ligne (C) de traitement programmé sur la surface du matériau afin de traiter le matériau fragile. Un film liquide réfrigérant (t) est formé sur toute la surface du matériau fragile (W) afin de refroidir le matériau (W) et, à l'aide d'un trou (h) formé dans le film liquide réfrigérant (t) par pulvérisation d'un gaz (a) sur la surface du matériau (W) maintenue ouverte, pendant que le faisceau laser (L) est appliqué sur la surface du matériau (W) exposé dans ledit trou (h), la position de rayonnement d'un faisceau laser (L) et la position de pulvérisation du gaz (a) sont déplacées le long de la ligne (C) de traitement programmé afin de compléter le traitement.
PCT/JP2002/008538 2001-08-23 2002-08-23 Procede de traitement d'un materiau fragile et dispositif de traitement WO2003018276A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-252461 2001-08-23
JP2001252461A JP2005231035A (ja) 2001-08-23 2001-08-23 脆性材料の加工方法及び加工装置

Publications (2)

Publication Number Publication Date
WO2003018276A1 true WO2003018276A1 (fr) 2003-03-06
WO2003018276B1 WO2003018276B1 (fr) 2003-04-10

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JP (1) JP2005231035A (fr)
TW (1) TW536438B (fr)
WO (1) WO2003018276A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005062230A1 (de) * 2005-12-21 2007-06-28 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Trennen von Scheiben aus sprödem Material, insbesondere von Wafern

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200621661A (en) * 2004-10-25 2006-07-01 Mitsuboshi Diamond Ind Co Ltd Method and device for forming crack
TWI341242B (en) * 2007-07-31 2011-05-01 Nat Applied Res Laboratories Device for cutting brittle material
CN101462822B (zh) 2007-12-21 2012-08-29 鸿富锦精密工业（深圳）有限公司 具有通孔的脆性非金属工件及其加工方法
TWI382907B (zh) * 2007-12-31 2013-01-21 Hon Hai Prec Ind Co Ltd 具有通孔之脆性非金屬工件及其加工方法
JP5554158B2 (ja) * 2010-06-28 2014-07-23 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0249199A (ja) * 1988-08-11 1990-02-19 Toshiba Corp 中空糸膜モジュールの切断方法
JPH07256479A (ja) * 1994-03-23 1995-10-09 Nippondenso Co Ltd レーザ加工装置およびレーザ加工方法
JP2000015467A (ja) * 1998-07-01 2000-01-18 Shin Meiwa Ind Co Ltd 光による被加工材の加工方法および加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0249199A (ja) * 1988-08-11 1990-02-19 Toshiba Corp 中空糸膜モジュールの切断方法
JPH07256479A (ja) * 1994-03-23 1995-10-09 Nippondenso Co Ltd レーザ加工装置およびレーザ加工方法
JP2000015467A (ja) * 1998-07-01 2000-01-18 Shin Meiwa Ind Co Ltd 光による被加工材の加工方法および加工装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005062230A1 (de) * 2005-12-21 2007-06-28 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Trennen von Scheiben aus sprödem Material, insbesondere von Wafern
US7816626B2 (en) 2005-12-21 2010-10-19 Jenoptik Automatisierungstechnik Gmbh Method and apparatus for severing disks of brittle material, in particular wafers

Also Published As

Publication number Publication date
WO2003018276B1 (fr) 2003-04-10
TW536438B (en) 2003-06-11
JP2005231035A (ja) 2005-09-02

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