WO2002084713A3 - Implanteur ionique a ligne de faisceau d'occlusion - Google Patents
Implanteur ionique a ligne de faisceau d'occlusion Download PDFInfo
- Publication number
- WO2002084713A3 WO2002084713A3 PCT/US2002/011292 US0211292W WO02084713A3 WO 2002084713 A3 WO2002084713 A3 WO 2002084713A3 US 0211292 W US0211292 W US 0211292W WO 02084713 A3 WO02084713 A3 WO 02084713A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- workpiece
- ion
- occluder
- scanning
- ion implanter
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/09—Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electron Sources, Ion Sources (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28304401P | 2001-04-11 | 2001-04-11 | |
US60/283,044 | 2001-04-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002084713A2 WO2002084713A2 (fr) | 2002-10-24 |
WO2002084713A3 true WO2002084713A3 (fr) | 2003-03-13 |
Family
ID=23084247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/011292 WO2002084713A2 (fr) | 2001-04-11 | 2002-04-10 | Implanteur ionique a ligne de faisceau d'occlusion |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW552629B (fr) |
WO (1) | WO2002084713A2 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10325752B1 (en) * | 2018-03-27 | 2019-06-18 | Varian Semiconductor Equipment Associates, Inc. | Performance extraction set |
CN111063600B (zh) * | 2019-12-26 | 2022-10-28 | 华虹半导体(无锡)有限公司 | 一种实时监控离子注入剂量的装置及使用方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05128997A (ja) * | 1991-11-06 | 1993-05-25 | Nissin Electric Co Ltd | イオン注入装置 |
JPH09245722A (ja) * | 1996-03-14 | 1997-09-19 | Fujitsu Ltd | 多分割イオン注入装置 |
JPH11126577A (ja) * | 1997-10-23 | 1999-05-11 | Sony Corp | イオン注入装置 |
JPH11339711A (ja) * | 1998-05-29 | 1999-12-10 | Ulvac Corp | イオン注入装置 |
JPH11339706A (ja) * | 1998-05-26 | 1999-12-10 | Sony Corp | イオン注入装置及び方法 |
-
2002
- 2002-04-10 WO PCT/US2002/011292 patent/WO2002084713A2/fr not_active Application Discontinuation
- 2002-04-11 TW TW91107286A patent/TW552629B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05128997A (ja) * | 1991-11-06 | 1993-05-25 | Nissin Electric Co Ltd | イオン注入装置 |
JPH09245722A (ja) * | 1996-03-14 | 1997-09-19 | Fujitsu Ltd | 多分割イオン注入装置 |
JPH11126577A (ja) * | 1997-10-23 | 1999-05-11 | Sony Corp | イオン注入装置 |
JPH11339706A (ja) * | 1998-05-26 | 1999-12-10 | Sony Corp | イオン注入装置及び方法 |
JPH11339711A (ja) * | 1998-05-29 | 1999-12-10 | Ulvac Corp | イオン注入装置 |
Non-Patent Citations (4)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 017, no. 501 (E - 1429) 9 September 1993 (1993-09-09) * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 01 30 January 1998 (1998-01-30) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 10 31 August 1999 (1999-08-31) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 03 30 March 2000 (2000-03-30) * |
Also Published As
Publication number | Publication date |
---|---|
WO2002084713A2 (fr) | 2002-10-24 |
TW552629B (en) | 2003-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2003038879A3 (fr) | Procedes et appareils de dopage par plasma et d'implantation ionique dans un systeme de traitement integre | |
EP2026640B1 (fr) | Système de thérapie par faisceau de particules | |
WO2001088949A3 (fr) | Balayage de grande efficacité pour implanteurs d'ions | |
TWI622080B (zh) | Ion implantation device and ion implantation method | |
US10283326B2 (en) | Ion generator and method of controlling ion generator | |
CN102007564A (zh) | 具有可调整孔径的离子源 | |
US20020109106A1 (en) | Hybrid scanning system and methods for ion implantation | |
US6777695B2 (en) | Rotating beam ion implanter | |
US6521895B1 (en) | Wide dynamic range ion beam scanners | |
US20030122088A1 (en) | Scan methods and apparatus for ion implantation | |
US6555825B1 (en) | Ion implanter | |
EP0377298A3 (fr) | Système à faisceau d'ions de section uniforme | |
WO2002084713A3 (fr) | Implanteur ionique a ligne de faisceau d'occlusion | |
US20060145095A1 (en) | Methods and apparatus for ion implantation with control of incidence angle by beam deflection | |
GB2315919A (en) | An ion-implantation system | |
US6528804B1 (en) | Method and apparatus for low energy ion implantation | |
KR20040041707A (ko) | 애노드 펄스에 의한 플라즈마 도핑을 위한 방법 및 장치 | |
JPH11288681A (ja) | イオン注入装置およびイオン注入方法 | |
KR102558798B1 (ko) | 작업물의 선택적 프로세싱을 위한 시스템 및 방법 | |
CN110047739B (zh) | 一种离子注入机台的返工方法 | |
JPH0834093B2 (ja) | イオン注入方法 | |
US5731593A (en) | Ion implantation method and ion implantation system used therefor | |
JP2916325B2 (ja) | イオン注入装置及びイオン注入方法 | |
JPH06132006A (ja) | イオン注入と同時に電子シャワーを照射するイオン注入装置 | |
JP6964716B2 (ja) | スキャン後の湾曲電極のイオン注入システムの装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): CN JP KR |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
AK | Designated states |
Kind code of ref document: A3 Designated state(s): CN JP KR |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR |
|
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: JP |