WO2002078397A1 - Keramik-kochfeld - Google Patents
Keramik-kochfeld Download PDFInfo
- Publication number
- WO2002078397A1 WO2002078397A1 PCT/EP2002/001751 EP0201751W WO02078397A1 WO 2002078397 A1 WO2002078397 A1 WO 2002078397A1 EP 0201751 W EP0201751 W EP 0201751W WO 02078397 A1 WO02078397 A1 WO 02078397A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- ceramic
- intermediate layer
- electrically conductive
- hotplate
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 42
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 239000002241 glass-ceramic Substances 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 239000011195 cermet Substances 0.000 claims abstract description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 6
- 239000001301 oxygen Substances 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims abstract description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 22
- 238000007751 thermal spraying Methods 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 239000011159 matrix material Substances 0.000 claims description 10
- 239000002318 adhesion promoter Substances 0.000 claims description 8
- 239000010941 cobalt Substances 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 229910052878 cordierite Inorganic materials 0.000 claims description 4
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 4
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052863 mullite Inorganic materials 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- UFGZSIPAQKLCGR-UHFFFAOYSA-N chromium carbide Chemical compound [Cr]#C[Cr]C#[Cr] UFGZSIPAQKLCGR-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910003470 tongbaite Inorganic materials 0.000 claims description 3
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 15
- 239000012790 adhesive layer Substances 0.000 claims 1
- 238000010411 cooking Methods 0.000 abstract description 7
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 4
- 238000010285 flame spraying Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000005507 spraying Methods 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 230000035882 stress Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
- H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
Definitions
- the invention relates to a ceramic hob with a hotplate made of glass ceramic or glass, with an electrical heating conductor layer, with an insulating layer between the hotplate and the heating conductor layer, and with an electrically conductive intermediate layer between the hotplate and the insulating layer.
- Such a ceramic hob is known from DE 31 05 065 C2 and from US 6 037 572.
- the hotplate according to DE 31 05 065 C2 consists of glass ceramic, on the underside of which a metallic layer is applied, for example by a spraying process, on which in turn a ceramic insulating layer is also applied by a spraying process, on which a heating conductor element is finally vapor-deposited or in a spraying process is applied.
- glass ceramics used for hobs have an NTC characteristic, i.e. the electrical conductivity increases noticeably as the temperature rises.
- NTC characteristic i.e. the electrical conductivity increases noticeably as the temperature rises.
- an electrical insulation layer is therefore a prerequisite for operating such a cooking system.
- the system must have a dielectric strength of 3,750 volts at operating temperatures.
- dielectric strength can be reduced if, according to DE 31 05 065 C2 or according to US 6 037 572, an electrically conductive layer is applied between the insulating layer and the hotplate, which is earthed. In such a case, a dielectric strength of around 1500 volts is sufficient for the ceramic insulation layer to ensure the necessary operational safety in accordance with VDE.
- the layer thickness of the ceramic insulating layer can be significantly reduced, which causes problems. be reduced due to the different thermal expansions.
- the invention is therefore based on the object of improving a ceramic cooktop in accordance with the type mentioned at the outset in such a way that the operational safety of the ceramic cooktop is improved and good long-term stability in rough everyday operation is ensured.
- the intermediate layer is a thermally sprayed layer made of an electrically conductive ceramic or of a cermet.
- the intermediate layer By forming the intermediate layer in the form of an electrically conductive ceramic, a considerably better adaptation of the coefficient of expansion of the intermediate layer to the coefficient of expansion of the hotplate is achieved, which is almost zero, since the coefficient of expansion of suitable ceramic materials is significantly lower than the coefficient of expansion of metals. Even when using a As a result of the ceramic particles embedded in a metallic matrix, the cermet layer has a reduced thermal expansion, as a result of which the thermal stresses are reduced.
- an electrically conductive ceramic as an intermediate layer has the further advantage that the ceramic can be better matched to the glass ceramic of the hotplate in terms of the choice of material, with particularly good adhesion and low thermal stresses in use being able to be achieved through a targeted choice of material.
- the intermediate layer is an oxide layer which is electrically conductive due to the loss of oxygen during thermal spraying.
- the intermediate layer can in particular be made of Ti0 2 , from a mixture of Al 2 0 3 with a Ti0 2 content of at least 50% by weight, preferably at least 90% by weight, of Zr0 2 , from a mixture of Al 2 0 3 with Zr0 2 with a proportion of Zr0 2 of at least 50% by weight, preferably of at least 90% by weight, from a mixture of Ti0 2 and Zr0 2 , or from a mixture of Al 2 0 3 with Ti0 2 and Zr0 2 with a proportion of at least 50% by weight, preferably at least 90% by weight, of Ti0 2 and Zr0 2 (be prepared.
- These intermediate layers made of Ti0 2 from a mixture of Al 2 0 3 with a Ti0 2 content of at least 50% by weight, preferably at least 90% by weight, of Zr0 2 , from a mixture of Al 2 0 3 with Zr0 2 with a proportion of Zr0 2 of at least 50% by weight, preferably of at least 90% by weight, of Ti0 2 and
- Ti0 2 _ x For example, for Ti0 2 _ x with x - 0.1, a volume conductivity of about 10 3 ohm x cm to about 5 x 10 2 ohm x cm (at room temperature) results. As a result of the relatively low thermal expansion of Ti0 2 _ x and the particularly good affinity of Ti0 2 _ x for glass ceramics, Ti0 2 _ x appears to be particularly suitable for use as a conductive intermediate layer.
- the intermediate layer can also be produced from a cermet with a metal matrix.
- the metal matrix preferably has at least one of the constituents nickel, cobalt and chromium.
- the intermediate layer is made of a cermet with a metal matrix, which is an alloy of the main components nickel, cobalt and chromium.
- a metal matrix which is an alloy of the main components nickel, cobalt and chromium.
- particles of carbide such as tungsten carbide, chromium carbide or the like, can also be embedded in the metal matrix.
- the intermediate layer there is good electrical conductivity of the intermediate layer, and at the same time the thermal expansion coefficient is considerably reduced compared to a pure metal matrix due to the ceramic inclusions.
- the metal matrix in question also has good adhesion to a glass ceramic surface and, owing to the increased ductility, is suitable for absorbing or reducing certain thermal stresses which occur during operation.
- a ceramic adhesion promoter layer is provided between the electrically conductive intermediate layer and the hotplate.
- This adhesion promoter layer preferably consists of aluminum oxide, titanium oxide or mixtures thereof and is preferably applied by thermal spraying.
- an adhesion promoter layer leads to a further improvement in adhesion to the glass ceramic surface, resulting overall in an extremely stable layer composite which has very good temperature resistance and resistance to temperature changes.
- the insulating layer which is applied to the intermediate layer preferably consists of cordierite or mullite and is preferably applied by thermal spraying.
- the use of these ceramics to produce the insulating layer has the advantage of a relatively low coefficient of thermal expansion which is between approximately 4.3 and 5.0 ⁇ 10 " 6 K -1 for mullite and between approximately 2.2 and 2.4 x 10 " 6 K _1 for cordierite. As a result of the low coefficient of thermal expansion, there are lower stresses in connection with the hotplate made of glass ceramic.
- Fig. 1 shows a cross section through an inventive ceramic hob in a first embodiment
- Fig. 2 shows a cross section through an inventive ceramic hob in a modified version compared to FIG. 1.
- a ceramic hob according to the invention is shown in cross section and generally designated by the number 10.
- the ceramic cooktop comprises a cooking plate 12 of glass ceramics, for example, from ceramic ®.
- This hotplate 12 is used to hold cooking vessels.
- a hotplate is generated at different locations. For household purposes, typically four or possibly five hotplates are provided on a ceramic hob. Only one hotplate is shown in FIGS. 1 and 2.
- An intermediate layer of TiO 2 was applied to the underside of the hotplate 12 by thermal spraying. This can be done, for example, by atmospheric plasma spraying (APS) with a layer thickness of approximately 50-250 ⁇ m.
- APS atmospheric plasma spraying
- the respective layers are preferably applied only in the area of the respective hotplates in order to keep the total voltages as low as possible.
- the glass ceramic is cleaned, e.g. degreased with acetone.
- the pretreatment by sandblasting, which is otherwise customary in thermal spraying, is dispensed with, since this would damage the glass ceramic.
- an insulating layer 16 which preferably consists of cordierite (2MgO »2Al 2 0 3 « 5Si0 2 ) or mullite (3Al 2 0 3 «2Si0 2 ), is sprayed onto it again by atmospheric plasma spraying.
- the layer thickness of the insulating layer 16 depends on the desired dielectric strength and the material used and is between approximately 100 and 500 ⁇ m, preferably between approximately 150 and 300 ⁇ m.
- the heating conductor 20 can be applied, for example, in a known manner by a screen printing process, the flow temperatures during the baking of the layers being able to be reduced by a glassy fraction of usually more than 5% in such a way that baking temperatures between about 500 and 850 ° C. result, a dense, closed conductor layer is created.
- the heating conductor layer 18 can also be produced by thermal spraying.
- the part not to be coated is first masked using a customary masking method and then the exposed parts are coated with the heating conductor material by thermal spraying.
- the part previously covered can then be removed, so that a winding heating conductor 20 is formed, the individual heating conductor tracks of which are insulated from one another.
- FIG. 2 A modification of the ceramic cooktop is shown in FIG. 2 and generally designated by the number 10 '.
- this intermediate layer 14 ′ which is a cermet layer, is separated by an adhesion promoter layer 24 sprayed onto the hotplate 12.
- the adhesion promoter layer 24 preferably consists of Al 2 0 3 or a mixture of Al 2 0 3 and Ti0 2 , for example 97% by weight Al 2 0 3 and 3% by weight Ti0 2 .
- the adhesion promoter layer 24 is thermally sprayed with a layer thickness of approximately 10 to 150 ⁇ m, preferably by APS. The preferred layer thickness is on the order of approximately 30 to 100 ⁇ m.
- a cermet layer consisting of a nickel / cobalt / chromium alloy with embedded carbide particles (tungsten carbide, chromium carbide etc.) is then sprayed onto the adhesion promoter layer 24.
- the intermediate layer 14 ' is produced with a layer thickness of approximately 50 to 250 ⁇ m, preferably approximately 50 to 100 ⁇ m.
- the insulating layer 16 and the heat conductor layer 18 are then applied in the manner already described with reference to FIG. 1.
- the individual layers lying one above the other gradually run out at the edge region and thus continuously pass to the layer below them.
- the total area of the individual layers decreases toward the heating conductor layer. This results in favorable stress conditions in the edge regions of the respective layers in order to counteract delamination of the layers.
- annular depression 26 which surrounds the intermediate layer 14 in an annular manner at the edge region thereof.
- This slight depression allows stresses that arise between the hotplate 12 and the intermediate layer 14 to be absorbed and partially reduced.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Coating By Spraying Or Casting (AREA)
- Cookers (AREA)
- Baking, Grill, Roasting (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Inorganic Insulating Materials (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK02702359T DK1366641T3 (da) | 2002-02-20 | 2002-02-20 | Keramikkogefelt |
AT02702359T ATE284123T1 (de) | 2001-03-06 | 2002-02-20 | Keramik-kochfeld |
CA002439177A CA2439177A1 (en) | 2001-03-06 | 2002-02-20 | Ceramic cooktop |
EP02702359A EP1366641B1 (de) | 2001-03-06 | 2002-02-20 | Keramik-kochfeld |
DE50201676T DE50201676D1 (de) | 2001-03-06 | 2002-02-20 | Keramik-kochfeld |
US10/647,806 US20040104212A1 (en) | 2001-03-06 | 2003-08-25 | Ceramic cooktop |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10112235A DE10112235C2 (de) | 2001-03-06 | 2001-03-06 | Keramik-Kochfeld |
DE10112235.7 | 2001-03-06 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/647,806 Continuation US20040104212A1 (en) | 2001-03-06 | 2003-08-25 | Ceramic cooktop |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002078397A1 true WO2002078397A1 (de) | 2002-10-03 |
Family
ID=7677416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2002/001751 WO2002078397A1 (de) | 2001-03-06 | 2002-02-20 | Keramik-kochfeld |
Country Status (8)
Country | Link |
---|---|
US (1) | US20040104212A1 (de) |
EP (1) | EP1366641B1 (de) |
CN (1) | CN1494816A (de) |
AT (1) | ATE284123T1 (de) |
CA (1) | CA2439177A1 (de) |
DE (2) | DE10112235C2 (de) |
ES (1) | ES2232733T3 (de) |
WO (1) | WO2002078397A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3331319A1 (de) * | 2016-12-02 | 2018-06-06 | E.G.O. ELEKTRO-GERÄTEBAU GmbH | Kochgerät mit einer kochplatte und einer heizeinrichtung darunter |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITMI20041363A1 (it) * | 2004-07-08 | 2004-10-08 | Cedil Sa | Elettrodomestico per cucine e simili |
US20100015354A1 (en) * | 2008-07-16 | 2010-01-21 | Lee Tai-Cheung | Method of making rollers with a fine pattern |
CN101979998B (zh) * | 2010-09-17 | 2012-07-25 | 九江学院 | 一种对热喷涂制备碳化铬金属陶瓷涂层中碳化物损失的定量表征方法 |
ES2401890B1 (es) * | 2011-06-29 | 2014-04-10 | BSH Electrodomésticos España S.A. | Dispositivo de aparato doméstico |
CN104254151A (zh) * | 2014-08-25 | 2014-12-31 | 常熟市董浜镇华进电器厂 | 安全可靠的电热管 |
KR102111109B1 (ko) * | 2017-02-21 | 2020-05-14 | 엘지전자 주식회사 | 면상 발열장치, 이를 포함하는 전기 레인지 및 그 제조방법 |
CN207869432U (zh) * | 2018-03-07 | 2018-09-14 | 东莞市国研电热材料有限公司 | 一种多温区陶瓷发热体 |
EP3627671A1 (de) | 2018-09-21 | 2020-03-25 | Siemens Aktiengesellschaft | Verfahren zur herstellung einer wickelkopfanordnung für eine elektrische rotierende maschine |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3978315A (en) * | 1975-09-19 | 1976-08-31 | Corning Glass Works | Electrical heating units |
DE3105065A1 (de) * | 1981-02-12 | 1982-08-19 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Kochplatte aus glaskeramik |
EP0954201A2 (de) * | 1998-04-27 | 1999-11-03 | White Consolidated Industries, Inc. | Zirkuläres Schichtsheizelement und Kochherd aus Porzellan-Email |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3110571A (en) * | 1958-07-01 | 1963-11-12 | Du Pont | Ceramic material bonded to metal having refractory oxide dispersed therein |
US3610888A (en) * | 1970-01-30 | 1971-10-05 | Westinghouse Electric Corp | Oxide resistor heating element |
US4764341A (en) * | 1987-04-27 | 1988-08-16 | International Business Machines Corporation | Bonding of pure metal films to ceramics |
US5227345A (en) * | 1990-05-03 | 1993-07-13 | The Dow Chemical Company | Powder mixtures including ceramics and metal compounds |
FR2665184B1 (fr) * | 1990-07-24 | 1993-10-15 | Centre Nal Recherc Scientifique | Poudres composites alumine/metal, cermets realises a partir desdites poudres et procedes de fabrication. |
US5728638A (en) * | 1996-08-21 | 1998-03-17 | Bfd, Inc. | Metal/ceramic composites containing inert metals |
US6037572A (en) * | 1997-02-26 | 2000-03-14 | White Consolidated Industries, Inc. | Thin film heating assemblies |
DE29824031U1 (de) * | 1998-04-17 | 2000-02-24 | Bsh Bosch Siemens Hausgeraete | Kochplatte mit elektrisch leitfähiger Keramikplatte |
DE19855481A1 (de) * | 1998-12-01 | 2000-06-08 | Siceram Gmbh | Elektrisches Kochfeld |
-
2001
- 2001-03-06 DE DE10112235A patent/DE10112235C2/de not_active Expired - Fee Related
-
2002
- 2002-02-20 WO PCT/EP2002/001751 patent/WO2002078397A1/de not_active Application Discontinuation
- 2002-02-20 CN CNA028059999A patent/CN1494816A/zh active Pending
- 2002-02-20 CA CA002439177A patent/CA2439177A1/en not_active Abandoned
- 2002-02-20 EP EP02702359A patent/EP1366641B1/de not_active Expired - Lifetime
- 2002-02-20 AT AT02702359T patent/ATE284123T1/de not_active IP Right Cessation
- 2002-02-20 DE DE50201676T patent/DE50201676D1/de not_active Expired - Fee Related
- 2002-02-20 ES ES02702359T patent/ES2232733T3/es not_active Expired - Lifetime
-
2003
- 2003-08-25 US US10/647,806 patent/US20040104212A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3978315A (en) * | 1975-09-19 | 1976-08-31 | Corning Glass Works | Electrical heating units |
DE3105065A1 (de) * | 1981-02-12 | 1982-08-19 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Kochplatte aus glaskeramik |
EP0954201A2 (de) * | 1998-04-27 | 1999-11-03 | White Consolidated Industries, Inc. | Zirkuläres Schichtsheizelement und Kochherd aus Porzellan-Email |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3331319A1 (de) * | 2016-12-02 | 2018-06-06 | E.G.O. ELEKTRO-GERÄTEBAU GmbH | Kochgerät mit einer kochplatte und einer heizeinrichtung darunter |
US10798786B2 (en) | 2016-12-02 | 2020-10-06 | E.G.O. Elektro-Geraetebau Gmbh | Cooking appliance with a cooking plate and with a heating device thereunder |
Also Published As
Publication number | Publication date |
---|---|
CA2439177A1 (en) | 2002-10-03 |
EP1366641A1 (de) | 2003-12-03 |
US20040104212A1 (en) | 2004-06-03 |
EP1366641B1 (de) | 2004-12-01 |
CN1494816A (zh) | 2004-05-05 |
DE10112235C2 (de) | 2003-04-03 |
DE10112235A1 (de) | 2002-10-10 |
ES2232733T3 (es) | 2005-06-01 |
DE50201676D1 (de) | 2005-01-05 |
ATE284123T1 (de) | 2004-12-15 |
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